CN203845811U - Multifunctional sensor - Google Patents
Multifunctional sensor Download PDFInfo
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- CN203845811U CN203845811U CN201420224050.3U CN201420224050U CN203845811U CN 203845811 U CN203845811 U CN 203845811U CN 201420224050 U CN201420224050 U CN 201420224050U CN 203845811 U CN203845811 U CN 203845811U
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- chip
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- microphone
- pressure sensor
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- 239000000758 substrate Substances 0.000 claims description 47
- 238000002955 isolation Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 16
- 238000004806 packaging method and process Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 15
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 238000005538 encapsulation Methods 0.000 description 4
- 230000007812 deficiency Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Abstract
The utility model discloses a multifunctional sensor which comprises an external packaging structure, a pressure sensor chip, a microphone chip, two integrated circuit chips and vent holes. The pressure sensor chip and the microphone chip are arranged in the packaging structure, the two integrated circuit chips correspond to the pressure sensor chip and the microphone chip respectively, and the vent holes enable the inside and the outside of the multifunctional sensor to be communicated. At least one of the pressure sensor chip and the microphone chip is integrated with the corresponding integrated circuit chip. According to the multifunctional sensor, the number of chips in the sensor is reduced, and the multifunctional sensor has the advantage of being high in miniaturization degree, simple in manufacturing process and high in reliability.
Description
Technical field
The utility model relates to sensor field, relates in particular to a kind of degree of miniaturization high, the much higher function sensor of the simple and reliable property of manufacturing process.
Background technology
As more common sensor, pressure sensor and microphone are often installed in same electronic product.In electronic product today of miniaturization day by day, in order to reduce device volume, pressure sensor and microphone all can encapsulate based on micro-electromechanical technology (Micro-Electro-Mechanical System, MEMS), and encapsulating structure is similar, assembling procedure is similar.At present, the pressure sensor in electronic product and microphone arrange separately; When two element manufacturing, use and need two cover encapsulation materials, complete making through the similar operation of two covers, waste material, manpower, increase cost; When two devices use, need mount respectively, and occupy free space respectively, increase application product cost, increase application product volume; And two devices have air-vent, all need protection, also strengthen difficulty and the risk of application simultaneously.If by pressure sensor and microphone package in an encapsulating structure, normally work for ensureing product, enhance product performance, encapsulating structure domestic demand arranges pressure sensor chip, microphone chip and corresponding pressure sensor IC chip and microphone IC chip, integrated circuit chip is electrically connected by the mode of metal lead wire routing with sensor chip, in assembling process, routing quantity is more, wiring is complicated, manufacturing process complexity, product yield is low, simultaneously, more number of chips affects the Miniaturization Design of encapsulating structure, increase small product size.
Therefore, need to propose a kind of improvement, overcome the shortcomings and deficiencies of existing situation.
Utility model content
Technical problem to be solved in the utility model is to provide that a kind of degree of miniaturization is high, and manufacturing process is simple, the much higher function sensor of reliability.
To achieve these goals, the utility model is by the following technical solutions:
A kind of Multifunction Sensor, described Multifunction Sensor comprises outer enclosure structure, pressure sensor chip, microphone chip, two IC chips of corresponding described pressure sensor chip and microphone chip, and be communicated with the air-vent of described Multifunction Sensor inside and outside; Described outer enclosure structure comprises substrate, described pressure sensor chip, microphone chip, and two IC chips of corresponding described pressure sensor chip and microphone chip are arranged on described substrate; Described pressure sensor chip and described microphone chip have at least an IC chip corresponding with it to be wholely set.
As the preferred technical scheme of one, described outer enclosure structure also comprises shell, described shell and described substrate are fixedly installed, and so-called shell coordinates described pressure sensor chip, microphone chip and described IC chip and external isolation with described substrate.
As the preferred technical scheme of another kind, described outer enclosure structure also comprises framework and top board, and described framework and described substrate are fixedly installed, and described top board is arranged at described framework away from described substrate one end; Described substrate, framework and top board coordinate described pressure sensor chip, microphone chip and described IC chip and external isolation.
As above scheme further preferably, described microphone chip and IC chip are wholely set, described pressure sensor chip and IC chip arrange separately.
As above scheme further preferably, described pressure sensor chip and IC chip are wholely set, described microphone chip and IC chip arrange separately.
As above scheme further preferably, described microphone chip and IC chip are wholely set, described pressure sensor chip and IC chip are wholely set.
The utility model Multifunction Sensor, encapsulating structure inside is provided with pressure sensor chip, microphone chip and corresponding IC chip, pressure sensor chip and microphone chip have at least one to be wholely set with IC chip, the pressure sensor chip being wholely set with IC chip is or/and microphone chip, can effectively reduce the number of chips in encapsulating structure, be conducive to the Miniaturization Design of product, simultaneously, the chip being wholely set can be electrically connected with the pad on substrate by attachment process, do not need the mode by routing, reduce the metal lead wire in encapsulating structure, simplify production technology, avoid because of the bad product quality problem causing of metal lead wire routing, improve product reliability.Therefore, it is high that the utility model Multifunction Sensor has degree of miniaturization, and manufacturing process is simple, the advantage that reliability is high.
Brief description of the drawings
Fig. 1 is the utility model Multifunction Sensor the first embodiment cutaway view;
Fig. 2 is the utility model Multifunction Sensor the second embodiment cutaway view;
Fig. 3 is the utility model Multifunction Sensor the 3rd embodiment cutaway view;
Fig. 4 is another embodiment cutaway view of the utility model Multifunction Sensor.
Detailed description of the invention
Below in conjunction with accompanying drawing, describe the utility model Multifunction Sensor in detail.
Embodiment mono-:
As shown in Figure 1, the present embodiment Multifunction Sensor comprises substrate 1, with the common shell 2 that forms Multifunction Sensor encapsulating structure of substrate 1, substrate 1 forms the cavity of accommodating chip with shell 2, on substrate 1, be provided with sensor chip and IC chip, shell 2 is isolated from the outside sensor chip and IC chip, sensor chip is electrically connected by the mode of routing with IC chip, be electrically connected with substrate circuit afterwards, on substrate, be provided with pad sensor is electrically connected with outside mainboard.Normally work in order to ensure Multifunction Sensor, Multifunction Sensor is provided with the air-vent that is communicated with pressure sensor inside and outside, external information is entered Multifunction Sensor inside and is responded to by sensor chip by air-vent, and Multifunction Sensor is exported the corresponding signal of telecommunication.
As shown in Figure 1, on substrate 1, in sensor-packaging structure, be provided with pressure sensor chip 3, corresponding pressure sensor chip 3 is provided with pressure sensor IC chip 41, and pressure sensor chip 3 is electrically connected by metal lead wire 6 with pressure sensor IC chip 41.On substrate 1, in sensor-packaging structure, be also provided with microphone integrated chip 51, microphone integrated chip 51 is wholely set the chip forming for microphone chip and microphone IC chip.Pressure sensor chip 3 is responded to external pressure and is changed, and produces corresponding signal, and output after pressure sensor IC chip 41 is processed ensures that Multifunction Sensor realizes pressure transducer functionality; Microphone integrated chip 51 is collected external voice signal and is processed rear output, makes Multifunction Sensor realize acoustoelectric sensor function.Microphone integrated chip 51, for microphone chip and microphone IC chip are wholely set the chip forming, has reduced number of chips in Multifunction Sensor encapsulating structure, is conducive to Multifunction Sensor Miniaturization Design; Simultaneously, the setting of microphone integrated chip 51, reduce the routing process in encapsulation process, microphone chip being electrically connected with microphone IC chip, simplify production technology, reduce in the bad and work engineering of the product occurring in routing process because of bad product reliability problem and the performance issue causing that go between, improved the Performance And Reliability of product.It is high that the utility model Multifunction Sensor has degree of miniaturization, and manufacturing process is simple, the advantage that reliability is high.
Embodiment bis-
The present embodiment and embodiment mono-structure are similar, as shown in Figure 2, the present embodiment Multifunction Sensor comprises substrate 1, with the common shell 2 that forms Multifunction Sensor encapsulating structure of substrate 1, substrate 1 forms the cavity of accommodating chip with shell 2, on substrate 1, be provided with sensor chip and IC chip, shell 2 is isolated from the outside sensor chip and IC chip, sensor chip is electrically connected by the mode of routing with IC chip, be electrically connected with substrate circuit afterwards, on substrate, be provided with pad sensor is electrically connected with outside mainboard.Normally work in order to ensure Multifunction Sensor, Multifunction Sensor is provided with the air-vent that is communicated with pressure sensor inside and outside, external information is entered Multifunction Sensor inside and is responded to by sensor chip by air-vent, and Multifunction Sensor is exported the corresponding signal of telecommunication.
Different from embodiment mono-, as shown in Figure 2, on the present embodiment Multifunction Sensor substrate 1, in encapsulating structure, be provided with pressure sensor integrated chip 31, pressure sensor integrated chip 31 is wholely set the chip forming for pressure sensor chip and pressure sensor IC chip; As shown in Figure 2, on substrate 1, in encapsulating structure, be also provided with microphone chip 5, and the microphone IC chip 42 corresponding with microphone chip 5, microphone chip 5 is electrically connected by metal lead wire 6 with microphone IC chip 42.Pressure sensor integrated chip 31 is responded to external pressure and is changed generation corresponding electric signal and process output, makes Multifunction Sensor have pressure transducer functionality; Microphone chip 5 picks up external sound signal, and output after microphone IC chip 42 is processed, makes Multifunction Sensor have acoustical-electrical transducer function.The present embodiment Multifunction Sensor, pressure sensor integrated chip 31 forms for pressure sensor chip and pressure sensor IC chip are wholely set, and has reduced the interior number of chips of encapsulating structure, is conducive to the Miniaturization Design of product; Simultaneously, reduce the routing process in encapsulation process, pressure sensor chip being electrically connected with pressure sensor IC chip, simplify production technology, reduce reliability and performance issue that in the bad and course of work of the product that produces, metal lead wire loose contact causes in routing process, improve the Performance And Reliability of product.Therefore, it is high that the utility model Multifunction Sensor has degree of miniaturization, and manufacturing process is simple, the advantage that reliability is high.
Embodiment tri-
The overall package structure of the present embodiment and above two embodiment are similar, as shown in Figure 3, the present embodiment Multifunction Sensor comprises substrate 1, with the common shell 2 that forms Multifunction Sensor encapsulating structure of substrate 1, substrate 1 forms the cavity of accommodating chip with shell 2, on substrate 1, is provided with chip, and shell 2 is isolated from the outside chip, chip is electrically connected with substrate circuit by the mode of routing, is provided with pad sensor is electrically connected with outside mainboard on substrate; Normally work in order to ensure Multifunction Sensor, Multifunction Sensor is provided with the air-vent that is communicated with pressure sensor inside and outside, external information is entered Multifunction Sensor inside and is responded to by sensor chip by air-vent, and Multifunction Sensor is exported the corresponding signal of telecommunication.
Different from above two embodiment, as shown in Figure 3, on the present embodiment Multifunction Sensor substrate 1, be provided with pressure sensor integrated chip 31 and microphone integrated chip 51 in encapsulating structure; Pressure sensor integrated chip 31 forms for pressure sensor chip and pressure sensor IC chip are wholely set, and microphone integrated chip 51 is that microphone chip and microphone IC chip are wholely set and form.Pressure sensor integrated chip 31 is responded to external pressure and is changed generation corresponding electric signal and process output, and microphone integrated chip 51 picks up external voice signal processing output, ensures that Multifunction Sensor has pressure transducer functionality and microphone function.In the present embodiment Multifunction Sensor, be only provided with pressure sensor integrated chip 31 and microphone integrated chip 51, arrange without other chips, number of chips is kept to 2, is conducive to the Miniaturization Design of product; Simultaneously, in encapsulating structure, be only provided with pressure sensor integrated chip 31 and microphone integrated chip 51, simplify the production process that between sensor chip and IC chip, the mode by routing is electrically connected, simplify production technology, reduce reliability and performance issue that in the bad and course of work of the product that produces, metal lead wire loose contact causes in routing process, improve the Performance And Reliability of product.Therefore, it is high that the utility model Multifunction Sensor has degree of miniaturization, and manufacturing process is simple, the advantage that reliability is high.
Embodiment tetra-
The utility model Multifunction Sensor can also otherwise embody:
As shown in Figure 4, the present embodiment Multifunction Sensor comprises substrate 1a, with the fixing framework 2a of substrate 1a and with framework 2a away from the fixing top board 2b in substrate 1a one end, substrate 1a, framework 2a and top board 2b surround the encapsulating structure of Multifunction Sensor jointly.In encapsulating structure, be provided with sensor chip and IC chip on substrate 1a, sensor chip is electrically connected by the mode of routing with IC chip, is electrically connected afterwards with substrate circuit, is provided with pad sensor is electrically connected with outside mainboard on substrate.Normally work in order to ensure Multifunction Sensor, Multifunction Sensor is provided with the air-vent that is communicated with pressure sensor inside and outside, external information is entered Multifunction Sensor inside and is responded to by sensor chip by air-vent, and Multifunction Sensor is exported the corresponding signal of telecommunication.
As shown in Figure 4, substrate 1a is upper, be provided with pressure sensor chip 3 in sensor-packaging structure, corresponding pressure sensor chip 3 is provided with pressure sensor IC chip 41, and pressure sensor chip 3 is electrically connected by metal lead wire 6 with pressure sensor IC chip 41.Substrate 1a is upper, be also provided with microphone integrated chip 51 in sensor-packaging structure, and microphone integrated chip 51 is wholely set the chip forming for microphone chip and microphone IC chip.Pressure sensor chip 3 is responded to external pressure and is changed, and produces corresponding signal, and output after pressure sensor IC chip 41 is processed ensures that Multifunction Sensor realizes pressure transducer functionality; Microphone integrated chip 51 is collected external voice signal and is processed rear output, makes Multifunction Sensor realize acoustoelectric sensor function.Microphone integrated chip 51, for microphone chip and microphone IC chip are wholely set the chip forming, has reduced number of chips in Multifunction Sensor encapsulating structure, is conducive to Multifunction Sensor Miniaturization Design; Simultaneously, the setting of microphone integrated chip 51, reduce the routing process in encapsulation process, microphone chip being electrically connected with microphone IC chip, simplify production technology, reduce in the bad and work engineering of the product occurring in routing process because of bad product reliability problem and the performance issue causing that go between, improved the Performance And Reliability of product.It is high that the utility model Multifunction Sensor has degree of miniaturization, and manufacturing process is simple, the advantage that reliability is high.
The present embodiment is only that external structure is different from embodiment 1, and inside chip setting and operation principle are all identical, are subordinated to same mentality of designing.
In actual applications, based on the external structure of the present embodiment, similar with embodiment 2,3, Multifunction Sensor inside chip can comprise pressure sensor integrated chip and microphone chip, microphone IC chip, also can comprise pressure sensor integrated chip and microphone integrated chip, all can embody the utility model Multifunction Sensor advantage.
These are only the utility model case study on implementation, be not limited to the utility model, as long as the equivalence that those of ordinary skill in the art do according to the utility model institute disclosure is modified or changed, all should include in the protection domain of recording in claims.
Claims (6)
1. a Multifunction Sensor, it is characterized in that: described Multifunction Sensor comprises outer enclosure structure, pressure sensor chip, microphone chip, two IC chips of corresponding described pressure sensor chip and microphone chip, and be communicated with the air-vent of described Multifunction Sensor inside and outside; Described outer enclosure structure comprises substrate, described pressure sensor chip, microphone chip, and two IC chips of corresponding described pressure sensor chip and microphone chip are arranged on described substrate; Described pressure sensor chip and described microphone chip have at least an IC chip corresponding with it to be wholely set.
2. Multifunction Sensor according to claim 1, it is characterized in that: described outer enclosure structure also comprises shell, described shell and described substrate are fixedly installed, and so-called shell coordinates described pressure sensor chip, microphone chip and described IC chip and external isolation with described substrate.
3. Multifunction Sensor according to claim 1, is characterized in that: described outer enclosure structure also comprises framework and top board, and described framework and described substrate are fixedly installed, and described top board is arranged at described framework away from described substrate one end; Described substrate, framework and top board coordinate described pressure sensor chip, microphone chip and described IC chip and external isolation.
4. according to the Multifunction Sensor described in the arbitrary claim of claims 1 to 3, it is characterized in that: described microphone chip and IC chip are wholely set, described pressure sensor chip and IC chip arrange separately.
5. according to the Multifunction Sensor described in the arbitrary claim of claims 1 to 3, it is characterized in that: described pressure sensor chip and IC chip are wholely set, described microphone chip and IC chip arrange separately.
6. according to the Multifunction Sensor described in the arbitrary claim of claims 1 to 3, it is characterized in that: described microphone chip and IC chip are wholely set, described pressure sensor chip and IC chip are wholely set.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420224050.3U CN203845811U (en) | 2014-04-30 | 2014-04-30 | Multifunctional sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420224050.3U CN203845811U (en) | 2014-04-30 | 2014-04-30 | Multifunctional sensor |
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| Publication Number | Publication Date |
|---|---|
| CN203845811U true CN203845811U (en) | 2014-09-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420224050.3U Active CN203845811U (en) | 2014-04-30 | 2014-04-30 | Multifunctional sensor |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105992116A (en) * | 2015-03-18 | 2016-10-05 | 英飞凌科技股份有限公司 | System and method for an acoustic transducer and environmental sensor package |
| CN107271029A (en) * | 2017-06-06 | 2017-10-20 | 纽威仕微电子（无锡）有限公司 | A kind of hydrophone integration module and its manufacturing process |
| CN108332900A (en) * | 2016-03-24 | 2018-07-27 | 英飞凌科技股份有限公司 | Equipment for the characteristic for determining fluid |
| CN112629568A (en) * | 2020-12-04 | 2021-04-09 | 上海索迪龙自动化有限公司 | Proximity sensor circuit and distance detection method |
-
2014
- 2014-04-30 CN CN201420224050.3U patent/CN203845811U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105992116A (en) * | 2015-03-18 | 2016-10-05 | 英飞凌科技股份有限公司 | System and method for an acoustic transducer and environmental sensor package |
| CN105992116B (en) * | 2015-03-18 | 2019-07-12 | 英飞凌科技股份有限公司 | System and method for sonic transducer and environmental sensor component |
| CN108332900A (en) * | 2016-03-24 | 2018-07-27 | 英飞凌科技股份有限公司 | Equipment for the characteristic for determining fluid |
| CN107271029A (en) * | 2017-06-06 | 2017-10-20 | 纽威仕微电子（无锡）有限公司 | A kind of hydrophone integration module and its manufacturing process |
| CN112629568A (en) * | 2020-12-04 | 2021-04-09 | 上海索迪龙自动化有限公司 | Proximity sensor circuit and distance detection method |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
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| TR01 | Transfer of patent right |
Effective date of registration: 20200615 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
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| TR01 | Transfer of patent right |