CN203368747U - Micro-machine microphone and electronic equipment comprising micro-machine microphone - Google Patents
Micro-machine microphone and electronic equipment comprising micro-machine microphone Download PDFInfo
- Publication number
- CN203368747U CN203368747U CN 201320301260 CN201320301260U CN203368747U CN 203368747 U CN203368747 U CN 203368747U CN 201320301260 CN201320301260 CN 201320301260 CN 201320301260 U CN201320301260 U CN 201320301260U CN 203368747 U CN203368747 U CN 203368747U
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- Prior art keywords
- microphone chip
- supporting plate
- sound
- electronic equipment
- micromachined microphones
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Abstract
The utility model provides a micro-machine microphone and electronic equipment comprising the micro-machine microphone. The electronic equipment at least comprises the micro-machine microphone, a second sound hole which enables a first sound hole to be connected with the outside world, and a printed circuit board which is electrically connected with a supporting plate. The microphone comprises a microphone chip which is provided with a sound film, and comprises a packaging housing which packages the microphone chip, wherein the packaging housing comprises a supporting plate which is used for fixing the microphone chip, and a cover plate which is sealed with the periphery of the supporting plate and covers the microphone chip. A first cavity is disposed between the cover plate and the microphone chip. Meanwhile, a side of the cover plate which is connected with the supporting plate is provided with the first sound hole. According to the utility model, the positions of the sound holes of the microphone are changed, thereby preventing a sound flow from being directly sprayed to the microphone chip and reducing the interference on the sound film in the microphone chip from dust.
Description
Technical field
The utility model relates to a kind of micromachined microphones, the electronic equipment that particularly relates to a kind of micromachined microphones and comprise described micromachined microphones.
Background technology
Along with the fast development of electronic equipment, microminiaturized, the high-quality market demand of electronic equipment is increasing.At present, the structure of the micromachined microphones in electronic equipment as shown in Figure 1, described micromachined microphones comprises: microphone chip 12, and the package casing 11 that encapsulates described microphone chip, be provided with sound hole 111 on described package casing, wherein, described sound hole 111 is positioned at the sound film top of microphone chip, and the one side relative with pin 112.When above-mentioned micromachined microphones is arranged in electronic equipment, the space that provides one to place micromachined microphones is provided in electronic equipment, must leave the gap that can communicate with the external world between this space and described sound hole 111, for sound transmission, simultaneously, for the ease of installing, interval also must left around shell and between other elements in described space.
In order to reduce above-mentioned micromachined microphones shared space in electronic equipment, at present, common means are to utilize integrated circuit to reduce the size of micromachined microphones, and by optimizing distribution to reduce the shared space of micromachined microphones.But for micromachined microphones, aforesaid way not only makes the cost of micromachined microphones suddenly increase but also still has following problem: because the sound hole of existing micromachined microphones is arranged in the sound film top of microphone chip, the air-flow that makes people produce in use can be by dust band tone-entering hole, and block the sound film in sound hole and microphone chip, thus, the deleterious that quiets down that causes microphone chip.Therefore, need to be improved the structure of existing micromachined microphones.
The utility model content
The shortcoming of prior art in view of the above, the purpose of this utility model is the electronic equipment that a kind of micromachined microphones is provided and comprises described micromachined microphones, for solving the prior art people when speaking facing to the sound hole of micromachined microphones, air-flow is by dust band tone-entering hole, so that the problems such as the deleterious that quiets down of microphone.
Reach for achieving the above object other relevant purposes, the utility model provides a kind of micromachined microphones, and it at least comprises: the microphone chip with sound film; Encapsulate the package casing of described microphone chip, comprising: for the supporting plate of fixing described microphone chip; And with the sealing of the surrounding of described supporting plate and cover the cover plate of described microphone chip, wherein, between described cover plate and described microphone chip, there is the first cavity, simultaneously, in the side of the described cover plate joined with described supporting plate, be provided with the first sound hole.
Preferably, described micromachined microphones also comprises: be positioned at described the first cavity and be located at the dust proof member of described sound film top.
Preferably, described dust proof member is siliceous material.
Preferably, described first sound hole is less than the height of described microphone chip to the distance of described supporting plate.
Based on above-mentioned purpose, the utility model also provides a kind of electronic equipment that comprises micromachined microphones, and wherein, described micromachined microphones comprises:
Microphone chip with sound film;
Encapsulate the package casing of described microphone chip, comprising: for the supporting plate of fixing described microphone chip; With the sealing of the surrounding of described supporting plate and cover the cover plate of described microphone chip, wherein, between described cover plate and described microphone chip, there is the first cavity, simultaneously, the side joined at described cover plate and described supporting plate is provided with the first sound hole;
And the rising tone hole that described first sound hole is connected with the external world; The printed circuit board (PCB) be electrically connected to described supporting plate, exported for the audio electrical signal that described micromachined microphones is generated.
Preferably, described electronic equipment also comprises: be affixed on described cover plate and the packing ring relative with the supporting plate of described micromachined microphones.
Preferably, described electronic equipment also comprises: the second cavity between described first sound hole and rising tone hole.
Preferably, described micromachined microphones also comprises: be positioned at described the first cavity and be located at the dust proof member of described sound film top.
Preferably, described dust proof member is siliceous material.
Preferably, described first sound hole is less than the height of described microphone chip to the distance of described supporting plate.
As mentioned above, micromachined microphones of the present utility model and the electronic equipment that comprises described micromachined microphones, there is following beneficial effect: the position in the first sound hole of microphone is changed on the cover plate that is positioned at the sound film side in the face of the sound film top by forward, can avoid the sound air-flow directly to spray to microphone chip, reduce the interference of dust to sound film in microphone chip.
The accompanying drawing explanation
Fig. 1 is shown as side section, the front of micromachined microphones of the prior art and overlooks the structural representation of face.
Fig. 2 is shown as the structural representation of micromachined microphones of the present utility model.
Fig. 3 is shown as the structural representation of a kind of optimal way of micromachined microphones of the present utility model.
Fig. 4 is shown as the structural representation of the side section of the electronic equipment that comprises micromachined microphones of the present utility model.
Fig. 5 is shown as the structural representation of side section of a kind of optimal way of the electronic equipment that comprises micromachined microphones of the present utility model.
The element numbers explanation
11 existing package casings
111 existing sound holes
112 existing pins
12 existing microphone chips
2 micromachined microphones
21 package casings
211 cover plates
212 supporting plates
213 first sound holes
22 microphone chips
221 sound films
222 first cavitys
23 dust proof member
3 electronic equipments
31 printed circuit board (PCB)s
32 packing rings
33 rising tone holes
34 second cavitys
Embodiment
Below by particular specific embodiment, execution mode of the present utility model is described, person skilled in the art scholar can understand other advantages of the present utility model and effect easily by the disclosed content of this specification.
Refer to Fig. 2 to Fig. 5.Notice, appended graphic the illustrated structure of this specification, ratio, size etc., equal contents in order to coordinate specification to disclose only, understand and read for person skilled in the art scholar, not in order to limit the enforceable qualifications of the utility model, therefore the technical essential meaning of tool not, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not affecting under the effect that the utility model can produce and the purpose that can reach, all should still drop on the technology contents that the utility model discloses and obtain in the scope that can contain.Simultaneously, in this specification, quote as " on ", D score, " left side ", " right side ", " centre " reach the term of " " etc., also only for ease of understanding of narrating, but not in order to limit the enforceable scope of the utility model, the change of its relativeness or adjustment, under without essence change technology contents, when also being considered as the enforceable category of the utility model.
Embodiment mono-
As shown in Figure 2, the utility model provides a kind of micromachined microphones.Described micromachined microphones 2 comprises: microphone chip 22 and package casing 21.
Described microphone chip 22 comprises: sound film 221, described microphone chip 22 is for sound wave being converted to the variation of the polar plate spacing of described sound film 221, and the signal of telecommunication changed according to the variation output voltage between polar plate spacing.Wherein, the frequency of described sound wave is the sound wave band that people's ear can be differentiated.Described sound film 221 can be a kind of membrane type electric capacity.
The described microphone chip 22 of described package casing 21 encapsulation, it comprises: supporting plate 212 and cover plate 211.
Described supporting plate 212 is for fixing described microphone chip 22.
Particularly, the sound film 221 of described microphone chip 22 is positioned at the end face of described microphone chip 22, and the face relative with described end face is called bottom surface, and described supporting plate 212 is connected with described bottom surface, and described microphone chip 22 is fixed on described supporting plate 212.
Preferably, described supporting plate 212 is drawn and passed to the pin of described microphone chip 22 by described bottom surface.Described pin comprises: power pins, wire pin and output pin, described pin can be the aciculiform pin, can be also SMD pin.
Described cover plate 211 seals and covers described microphone chip 22 with the surrounding of described supporting plate 212, wherein, there is the first cavity 222 between described cover plate 211 and described microphone chip 22, simultaneously, in described cover plate 211 and the side that described supporting plate 212 joins, be provided with first sound hole 213.
Particularly, the cross section of described cover plate 211 can be U-shaped structure, the surrounding of its surrounding and described supporting plate 212 is tightly connected, so that described microphone chip 22 is encapsulated, wherein, the size of described supporting plate 212 is slightly larger than the size of described microphone chip 22, and when described cover plate 211 covers on described microphone chip 22, form the first cavity 222 between described cover plate 211 and described microphone chip 22, in described cover plate 211 and the side that described supporting plate 212 joins, be provided with first sound hole 213.
Preferably, described first sound hole 213 is less than the height of described microphone chip 22 to the distance of described supporting plate 212.
Particularly, sound is diffused in described the first cavity 222 by described first sound hole 213, the more described sound film 221 of acoustic vibration in being diffused in described the first cavity 222, makes it to convert sound wave to corresponding audio electrical signal.
More preferably, as shown in Figure 3, described micromachined microphones also comprises: dust proof member 23.
Described dust proof member 23 is positioned at described the first cavity 222 and is located at described sound film 221 tops.
Particularly, described dust proof member 23 can be positioned at described the first cavity 222 and is arranged on described sound film 221 tops near described first sound hole 213 1 sides and inclination; Also can be hat-shaped, be buckled in described sound film 221 tops.Described dust proof member 23 is preferably siliceous material.
Described micromachined microphones 2 is when work, introduce extraneous sound wave in described the first cavity 222 in described first sound hole 213, the sound film 221 be arranged on the microphone chip 22 of described the first cavity 222 is subject to the vibration of sound wave to change its polar plate spacing, and the electric current changed according to the variation output amplitude of polar plate spacing, described microphone chip 22 amplifies processing by described electric current and is exported by described pin.
Embodiment bis-
As shown in Figure 4, the utility model also provides a kind of electronic equipment.Described electronic equipment 3 comprises: micromachined microphones 2 as described as embodiment mono-, rising tone hole 33 and printed circuit board (PCB) 31.
Described rising tone hole 33 is connected described first sound hole 213 with the external world.
Particularly, described rising tone hole 33 is arranged on the shell of described electronic equipment 3, and described rising tone hole 33 can face first sound hole 213.Preferably, also have the second cavity 34 between described first sound hole 213 and rising tone hole 33, make sound wave import first sound hole 213 into from rising tone hole 33.
Described printed circuit board (PCB) 31 is electrically connected to described supporting plate 212, exports the audio treatment unit (as CPU, process chip etc.) of described electronic equipment 3 to for the signal of telecommunication that described micromachined microphones 2 is generated.
Particularly, described printed circuit board (PCB) 31 has the space that holds described micromachined microphones 2, wherein, the size of described micromachined microphones 2 is less than described space, described space is not sealed, after described micromachined microphones 2 is put into described space, described space forms the second cavity 34 between the first sound hole 211 of described micromachined microphones and rising tone hole, thus, extraneous sound enters electronic equipment by the rising tone hole 33 on described electronic equipment 3, and be diffused into described the second cavity 34, entered into again the first sound hole 213 of described micromachined microphones 2 by described the second cavity 34, and be diffused in the first cavity 222 in described micromachined microphones 2, make sound film 221 vibrations by the sound wave be diffused in the first cavity 222, thus extraneous sound is changed into to audio electrical signal.
Preferably, as shown in Figure 5, described electronic equipment also comprises: packing ring 32.
Described packing ring 32 is affixed on described cover plate 211 and is relative with the supporting plate 212 of described micromachined microphones 2.Wherein, described packing ring 32 is siliceous material.
Particularly, described packing ring 32 is pasting described cover plate 211 and is being fixed on described electronic equipment 3, for alleviating the vibration of outer bound pair micromachined microphones 2.
In sum, micromachined microphones of the present utility model and the electronic equipment that comprises described micromachined microphones.The position in the first sound hole of microphone is changed on the cover plate that is positioned at the sound film side in the face of the sound film top by forward, can avoid the sound air-flow directly to spray to microphone chip, reduce the interference of dust to sound film in microphone chip; In addition, the height in first sound hole, lower than the height of microphone chip, makes sound wave need to cross microphone chip and arrives sound film, thus, utilizes " height is poor " to reduce further the interference of dust to sound film; Also have, change due to the first sound hole site of micromachined microphones, make between cover plate and packing ring without retaining space, thereby dwindled the space that electronic equipment is kept for micromachined microphones, avoided packing ring to block the situation in sound hole, wherein, the aerial transmission range of sound wave has been shortened in the minimizing in described space, therefore improve the resonance frequency of sound film, effectively increased the quality of audio frequency conversion, also strengthened in addition protection when microphone is vibrated; In addition, on the first sound hole, dust proof member is set, can further reduces adhering to of dust.So the utility model has effectively overcome various shortcoming of the prior art and the tool high industrial utilization.
Above-described embodiment is illustrative principle of the present utility model and effect thereof only, but not for limiting the utility model.Any person skilled in the art scholar all can, under spirit of the present utility model and category, be modified or be changed above-described embodiment.Therefore, have in technical field under such as and usually know that the knowledgeable modifies or changes not breaking away from all equivalences that complete under spirit that the utility model discloses and technological thought, must be contained by claim of the present utility model.
Claims (10)
1. a micromachined microphones, is characterized in that, at least comprises:
Microphone chip with sound film;
Encapsulate the package casing of described microphone chip, comprising:
Supporting plate for fixing described microphone chip; And
With the sealing of the surrounding of described supporting plate and cover the cover plate of described microphone chip, wherein, between described cover plate and described microphone chip, there is the first cavity, simultaneously, in the side of the described cover plate joined with described supporting plate, be provided with the first sound hole.
2. micromachined microphones according to claim 1, is characterized in that, described micromachined microphones also comprises: be positioned at described the first cavity and be located at the dust proof member of described sound film top.
3. micromachined microphones according to claim 2, is characterized in that, described dust proof member is siliceous material.
4. micromachined microphones according to claim 1, is characterized in that, described first sound hole is less than the height of described microphone chip to the distance of described supporting plate.
5. an electronic equipment that comprises micromachined microphones, is characterized in that, at least comprises:
Described micromachined microphones comprises:
Microphone chip with sound film;
Encapsulate the package casing of described microphone chip, comprising:
Supporting plate for fixing described microphone chip;
With the sealing of the surrounding of described supporting plate and cover the cover plate of described microphone chip, wherein, between described cover plate and described microphone chip, there is the first cavity, simultaneously, the side joined at described cover plate and described supporting plate is provided with the first sound hole; And
The rising tone hole that described first sound hole is connected with the external world;
The printed circuit board (PCB) be electrically connected to described supporting plate, exported for the audio electrical signal that described micromachined microphones is generated.
6. the electronic equipment that comprises micromachined microphones according to claim 5, is characterized in that, described electronic equipment also comprises: be affixed on described cover plate and the packing ring relative with the supporting plate of described micromachined microphones.
7. the electronic equipment that comprises micromachined microphones according to claim 5, is characterized in that, described electronic equipment also comprises: the second cavity between described first sound hole and rising tone hole.
8. according to arbitrary described electronic equipment that comprises micromachined microphones in claim 5 to 7, it is characterized in that, described micromachined microphones also comprises: be positioned at described the first cavity and be located at the dust proof member of described sound film top.
9. the electronic equipment that comprises micromachined microphones according to claim 8, is characterized in that, described dust proof member is siliceous material.
10. according to arbitrary described electronic equipment that comprises micromachined microphones in claim 5 to 7, it is characterized in that, described first sound hole is less than the height of described microphone chip to the distance of described supporting plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320301260 CN203368747U (en) | 2013-05-28 | 2013-05-28 | Micro-machine microphone and electronic equipment comprising micro-machine microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320301260 CN203368747U (en) | 2013-05-28 | 2013-05-28 | Micro-machine microphone and electronic equipment comprising micro-machine microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203368747U true CN203368747U (en) | 2013-12-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320301260 Expired - Lifetime CN203368747U (en) | 2013-05-28 | 2013-05-28 | Micro-machine microphone and electronic equipment comprising micro-machine microphone |
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| Country | Link |
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| CN (1) | CN203368747U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104185099A (en) * | 2013-05-28 | 2014-12-03 | 上海耐普微电子有限公司 | Micromechanical microphone and electronic device containing same |
| CN104760924A (en) * | 2015-04-20 | 2015-07-08 | 歌尔声学股份有限公司 | MEMS microphone chip and package structure and manufacture method thereof |
| CN104768112A (en) * | 2014-01-03 | 2015-07-08 | 钰太芯微电子科技（上海）有限公司 | Novel microphone structure |
| CN104902409A (en) * | 2014-03-04 | 2015-09-09 | 钰太芯微电子科技（上海）有限公司 | MEMS microphone acoustic structure |
| CN105940682A (en) * | 2014-12-16 | 2016-09-14 | 华为技术有限公司 | Microphone kit and electronic device |
-
2013
- 2013-05-28 CN CN 201320301260 patent/CN203368747U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104185099A (en) * | 2013-05-28 | 2014-12-03 | 上海耐普微电子有限公司 | Micromechanical microphone and electronic device containing same |
| CN104768112A (en) * | 2014-01-03 | 2015-07-08 | 钰太芯微电子科技（上海）有限公司 | Novel microphone structure |
| CN104902409A (en) * | 2014-03-04 | 2015-09-09 | 钰太芯微电子科技（上海）有限公司 | MEMS microphone acoustic structure |
| CN105940682A (en) * | 2014-12-16 | 2016-09-14 | 华为技术有限公司 | Microphone kit and electronic device |
| CN104760924A (en) * | 2015-04-20 | 2015-07-08 | 歌尔声学股份有限公司 | MEMS microphone chip and package structure and manufacture method thereof |
| CN104760924B (en) * | 2015-04-20 | 2017-06-06 | 歌尔股份有限公司 | A kind of MEMS microphone chip and its encapsulating structure |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20131225 |
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| CX01 | Expiry of patent term |