CN104902409A - MEMS microphone acoustic structure - Google Patents
MEMS microphone acoustic structure Download PDFInfo
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- CN104902409A CN104902409A CN201410077477.XA CN201410077477A CN104902409A CN 104902409 A CN104902409 A CN 104902409A CN 201410077477 A CN201410077477 A CN 201410077477A CN 104902409 A CN104902409 A CN 104902409A
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Abstract
The invention relates to the technical field of voice processing equipment and specifically to a microphone. A MEMS microphone acoustic structure comprises a first layer structure and a second layer structure on the first layer structure. The first layer structure and the second layer structure constitute a microphone acoustic cavity. The microphone acoustic cavity is equipped with a first acoustic through hole used for acquiring an acoustical signal. An acoustic member is arranged in the microphone acoustic cavity and is provided with at least two second acoustic through holes. On the basis of available technology, the MEMS microphone acoustic structure processes the acoustical signal for the second time so as to effectively inhibit high-frequency warping and obtain a flat frequency response. Further, the volume of a single microphone is not changed such that a peripheral sound guiding rubber sleeve is not required to be changed. The MEMS microphone acoustic structure is easy to produce.
Description
Technical field
The present invention relates to speech processing device technical field, be specifically related to a kind of microphone.
Background technology
Along with the development of Technology of Mobile Multimedia, the requirement of people to speech quality is also more and more higher, in transfer voice design, MEMS(Micro Electro Mechanical System Microphone, MEMS condenser microphone) microphone techniques compared with the microphone of conventional art owing to having the size of Bao Er little, high reliability, high temperature resistantly wait excellent characteristic and being widely used, but existing MEMS microphone structure in use, voice signal occurs to enter microphone acoustic cavity after a diffraction through acoustics through hole, namely realized electricity after the receive MUT of microphone acoustic inside cavity to export, above-mentioned acoustic construction adopts single order acoustic model, its frequency response is uneven, there is high frequency to tilt, hope is obtained to the application scenario of flat frequency response, the MEMS microphone acoustic construction of prior art is restricted.
Summary of the invention
The object of the invention is to, a kind of MEMS microphone acoustic construction is provided, solves above technical problem.
Technical problem solved by the invention can realize by the following technical solutions:
A kind of MEMS microphone acoustic construction, it is characterized in that, comprise ground floor structure and be positioned at the structural second layer structure of described ground floor, described ground floor structure and described second layer Structure composing one microphone acoustic cavity, described microphone acoustic cavity is provided with one for obtaining the first acoustics through hole of voice signal, be provided with an acoustic member in described microphone acoustic cavity, described acoustic member is provided with at least two the second acoustics through holes.
The present invention by arranging acoustic member in microphone acoustic cavity, and voice signal, through the first acoustics through hole and the second acoustics through hole, realizes re-diffraction, on the basis of existing technology, aftertreatment is carried out to voice signal, can effectively suppress high frequency to tilt, obtain flat frequency response.The present invention simultaneously can not change microphone monomer volume, and peripheral hardware leading note gum cover need not be changed, and is easy to realize.
Preferably, described acoustic member is provided with multiple described second acoustics through hole, and multiple described second acoustics through hole forms one array architecture on described acoustic member.
Preferably, described first acoustics through hole is positioned at the side of described microphone acoustic cavity, is formed by described ground floor structure and described second layer textural association.
Preferably, described acoustic member is mounted in the interior surface of described microphone acoustic cavity.
Preferably, described acoustic member adopts the acoustic member that silica-base material is made.
Preferably, described acoustic member is positioned at described first acoustics through hole, is mounted in the interior surface of described microphone acoustic cavity.
Preferably, being covered by described acoustic member at least partially of described first acoustics through hole.
Preferably, described acoustic member is connected rear ground connection with described ground floor structure or described second layer cubic.
Preferably, described first acoustics through hole adopts circular or square structure.
Preferably, be provided with a transducer and application-specific integrated circuit (ASIC) module in described microphone acoustic cavity, the signal output part of described transducer connects described application-specific integrated circuit (ASIC) module, and described transducer and application-specific integrated circuit (ASIC) module installation are in described ground floor structure.
Preferably, the present invention is applied in portable mobile termianl.
Beneficial effect: owing to adopting above technical scheme, the present invention by arranging acoustic member in microphone acoustic cavity, voice signal is through the first acoustics through hole and the second acoustics through hole, realize re-diffraction, on the basis of existing technology, aftertreatment is carried out to voice signal, can effectively suppress high frequency to tilt, obtain flat frequency response; The present invention simultaneously can not change microphone monomer volume, and peripheral hardware leading note gum cover need not be changed, and is easy to realize.
Accompanying drawing explanation
Fig. 1 is system configuration schematic diagram of the present invention;
Fig. 2 is the structural representation of acoustic member of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under the prerequisite of not making creative work, all belongs to the scope of protection of the invention.
It should be noted that, when not conflicting, the embodiment in the present invention and the feature in embodiment can combine mutually.
Below in conjunction with the drawings and specific embodiments, the invention will be further described, but not as limiting to the invention.
With reference to Fig. 1, a kind of MEMS microphone acoustic construction, the second layer structure 2 comprising ground floor structure 1 and be positioned in ground floor structure 1, ground floor structure 1 and second layer structure 2 form a microphone acoustic cavity, microphone acoustic cavity is provided with one for obtaining the first acoustics through hole 3 of voice signal, be provided with an acoustic member 4 in microphone acoustic cavity, acoustic member 4 is provided with at least two the second acoustics through holes 14.
The present invention by arranging acoustic member 4 in microphone acoustic cavity, and voice signal, through the first acoustics through hole 3 and the second acoustics through hole 14, realizes re-diffraction, on the basis of existing technology, aftertreatment is carried out to voice signal, can effectively suppress high frequency to tilt, obtain flat frequency response.The present invention simultaneously can not change microphone monomer volume, and peripheral hardware leading note gum cover need not be changed, and is easy to realize.
As a further improvement on the present invention, acoustic member 4 can being provided with multiple second acoustics through hole 14, according to needing, multiple second acoustics through hole 14 being formed one array architecture or other particular arrangement forms on acoustic member 4.Along with ANC(Active Noise Control in mobile phone, active noise controls) application of technology, require that microphone bandwidth is limited in very narrow spectral range, thus the second acoustics through hole 14 should be little as far as possible, to ensure to obtain frequency response as well as possible.
The acoustic member 4 that acoustic member 4 of the present invention adopts silica-base material or semi-conducting material to make.
As a further improvement on the present invention, the first acoustics through hole 3 is positioned at the side of microphone acoustic cavity, and form the microphone of side sound inlet, the first acoustics through hole 3 can adopt circle or square structure.First acoustics through hole 3 is combined by ground floor structure 1 and second layer structure 2.Or microphone acoustic cavity is a multiple-layer stacked structure, the first acoustics through hole 3 is formed by multiple-layer stacked textural association or in multiple-layer stacked mechanism, perforate is formed.Namely, when microphone acoustic cavity comprises third layer structure and four-layer structure, the first acoustics through hole 3 can be formed by ground floor structure, second layer structure and third layer mechanism and the 4th layer of mechanism's common combination.
As a kind of preferred embodiment, acoustic member 4 is positioned at the first acoustics through hole 3 place, is mounted in the interior surface of microphone acoustic cavity; Being covered by acoustic member 4 at least partially of first acoustics through hole 3.
As a kind of preferred embodiment, acoustic member 4 is electrically connected rear ground connection with ground floor structure 1 or second layer structure 2.
As a kind of preferred embodiment, be provided with a transducer 5 and application-specific integrated circuit (ASIC) module 6 in microphone acoustic cavity, the signal output part of transducer 5 connects application-specific integrated circuit (ASIC) module 6, and transducer 5 and application-specific integrated circuit (ASIC) module 6 are arranged in ground floor structure 1.Microphone acoustic cavity of the present invention is the external shell of MEMS microphone.
The present invention can be applied to portable mobile termianl, as smart mobile phone, panel computer etc. require in higher place voice signal.Acoustics intercepts does not affect voice signal in passband, can solve and install the indeterminable phase difference problem of low pass filter additional on electrically.Frequency spectrum can be made to reach demand by changing acoustic member 4 of the present invention, suppressing high-frequency information, avoiding uttering long and high-pitched sounds.
The foregoing is only preferred embodiment of the present invention; not thereby embodiments of the present invention and protection range is limited; to those skilled in the art; should recognize and all should be included in the scheme that equivalent replacement done by all utilizations specification of the present invention and diagramatic content and apparent change obtain in protection scope of the present invention.
Claims (10)
1. a MEMS microphone acoustic construction, it is characterized in that, comprise ground floor structure and be positioned at the structural second layer structure of described ground floor, described ground floor structure and described second layer Structure composing one microphone acoustic cavity, described microphone acoustic cavity is provided with one for obtaining the first acoustics through hole of voice signal, be provided with an acoustic member in described microphone acoustic cavity, described acoustic member is provided with at least two the second acoustics through holes.
2. a kind of MEMS microphone acoustic construction according to claim 1, is characterized in that, described acoustic member is provided with multiple described second acoustics through hole, and multiple described second acoustics through hole forms one array architecture on described acoustic member.
3. a kind of MEMS microphone acoustic construction according to claim 1, is characterized in that, described first acoustics through hole is positioned at the side of described microphone acoustic cavity, is formed by described ground floor structure and described second layer textural association.
4. a kind of MEMS microphone acoustic construction according to claim 1, is characterized in that, the acoustic member that described acoustic member adopts silica-base material to make.
5. a kind of MEMS microphone acoustic construction according to claim 1, is characterized in that, described acoustic member is positioned at described first acoustics through hole, is mounted in the interior surface of described microphone acoustic cavity.
6. a kind of MEMS microphone acoustic construction according to claim 5, is characterized in that, being covered by described acoustic member at least partially of described first acoustics through hole.
7. a kind of MEMS microphone acoustic construction according to claim 1, is characterized in that, ground connection after described acoustic member is connected with described ground floor structure or described second layer cubic.
8. a kind of MEMS microphone acoustic construction according to claim 3, is characterized in that, described first acoustics through hole adopts circular or square structure.
9. a kind of MEMS microphone acoustic construction according to claim 1, it is characterized in that, a transducer and application-specific integrated circuit (ASIC) module is provided with in described microphone acoustic cavity, the signal output part of described transducer connects described application-specific integrated circuit (ASIC) module, and described transducer and described application-specific integrated circuit (ASIC) module installation are in described ground floor structure.
10. a kind of MEMS microphone acoustic construction according to claim 1 to 9 any one, is characterized in that, be applied in portable mobile termianl.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410077477.XA CN104902409A (en) | 2014-03-04 | 2014-03-04 | MEMS microphone acoustic structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410077477.XA CN104902409A (en) | 2014-03-04 | 2014-03-04 | MEMS microphone acoustic structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104902409A true CN104902409A (en) | 2015-09-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410077477.XA Pending CN104902409A (en) | 2014-03-04 | 2014-03-04 | MEMS microphone acoustic structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107948781A (en) * | 2017-11-27 | 2018-04-20 | 钰太芯微电子科技（上海）有限公司 | A kind of Novel microphone structure and flip-type electronic equipment |
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|---|---|---|---|---|
| US20080232630A1 (en) * | 2007-03-19 | 2008-09-25 | National Chung-Hsing University | Condenser microphone package |
| CN103152683A (en) * | 2013-04-09 | 2013-06-12 | 歌尔声学股份有限公司 | MEMS (Micro-Electromechanical System) microphone |
| CN103220610A (en) * | 2013-03-28 | 2013-07-24 | 山东共达电声股份有限公司 | MEMS (micro-electromechanical system) microphone and sound receiving device |
| CN203193890U (en) * | 2013-04-09 | 2013-09-11 | 歌尔声学股份有限公司 | MEMS (micro-electromechanical systems) microphone |
| CN203368747U (en) * | 2013-05-28 | 2013-12-25 | 上海耐普微电子有限公司 | Micro-machine microphone and electronic equipment comprising micro-machine microphone |
| CN203407016U (en) * | 2013-08-22 | 2014-01-22 | 歌尔声学股份有限公司 | Micro-electro-mechanic system (MEMS) microphone |
| CN203813960U (en) * | 2014-03-04 | 2014-09-03 | 钰太芯微电子科技（上海）有限公司 | MEMS microphone acoustic structure |
-
2014
- 2014-03-04 CN CN201410077477.XA patent/CN104902409A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080232630A1 (en) * | 2007-03-19 | 2008-09-25 | National Chung-Hsing University | Condenser microphone package |
| CN103220610A (en) * | 2013-03-28 | 2013-07-24 | 山东共达电声股份有限公司 | MEMS (micro-electromechanical system) microphone and sound receiving device |
| CN103152683A (en) * | 2013-04-09 | 2013-06-12 | 歌尔声学股份有限公司 | MEMS (Micro-Electromechanical System) microphone |
| CN203193890U (en) * | 2013-04-09 | 2013-09-11 | 歌尔声学股份有限公司 | MEMS (micro-electromechanical systems) microphone |
| CN203368747U (en) * | 2013-05-28 | 2013-12-25 | 上海耐普微电子有限公司 | Micro-machine microphone and electronic equipment comprising micro-machine microphone |
| CN203407016U (en) * | 2013-08-22 | 2014-01-22 | 歌尔声学股份有限公司 | Micro-electro-mechanic system (MEMS) microphone |
| CN203813960U (en) * | 2014-03-04 | 2014-09-03 | 钰太芯微电子科技（上海）有限公司 | MEMS microphone acoustic structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107948781A (en) * | 2017-11-27 | 2018-04-20 | 钰太芯微电子科技（上海）有限公司 | A kind of Novel microphone structure and flip-type electronic equipment |
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Application publication date: 20150909 |
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