CN203193890U - MEMS (micro-electromechanical systems) microphone - Google Patents
MEMS (micro-electromechanical systems) microphone Download PDFInfo
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- CN203193890U CN203193890U CN 201320175039 CN201320175039U CN203193890U CN 203193890 U CN203193890 U CN 203193890U CN 201320175039 CN201320175039 CN 201320175039 CN 201320175039 U CN201320175039 U CN 201320175039U CN 203193890 U CN203193890 U CN 203193890U
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- 239000000758 substrate Substances 0.000 claims abstract description 48
- 230000000630 rising effect Effects 0.000 claims description 39
- 239000002184 metal Substances 0.000 claims description 24
- 239000003292 glue Substances 0.000 claims description 23
- 239000003990 capacitor Substances 0.000 claims description 10
- 238000000151 deposition Methods 0.000 claims description 4
- 230000002035 prolonged effect Effects 0.000 abstract description 5
- 230000001681 protective effect Effects 0.000 abstract description 5
- 230000003139 buffering effect Effects 0.000 abstract 1
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 230000003116 impacting effect Effects 0.000 description 4
- 230000001771 impaired effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Abstract
The utility model belongs to the technical field of electroacoustic products, and in particular to an MEMS (micro-electromechanical systems) microphone. The MEMS microphone comprises a housing, and a circuit board integrally combined with the housing, wherein one side combined with the housing, of the circuit board, is defined to be the inner side of the circuit board, an MEMS chip is arranged at the inner side of the circuit board in a covering manner, and at least two first sound holes are formed in the circuit board covered by the MEMS chip; and a substrate is compounded on the outer side surface of the circuit board, second sound holes are formed at positions corresponding to the first sound holes, on the substrate, the aperture size of each first sound hole is less than the aperture size of each second sound hole, and each first sound hole is formed in the positive projection area of each second sound hole on the circuit board. During use, airflow enters in the MEMS microphone via the second sound holes, and then acts on the diaphragm of the MEMS chip via the action of the first sound holes; and a plurality of the first sound holes are formed, and capable of performing flow-splitting and buffering on the strong airflow entering form the second sound holes, so that the direct impact of the strong airflow on the diaphragm of the MEMS chip is avoided, a protective effect is acted on the MEMS chip, the damage probability of the MEMS chip is decreased, and the service life of the MEMS microphone is prolonged.
Description
Technical field
The utility model belongs to the electro-acoustic product technical field, relates in particular to a kind of MEMS microphone.
Background technology
Along with the fast development of electronic technology, MEMS(microelectromechanical systems) microphone little with its volume, be convenient to the SMT(surface mounting technology) install, high temperature resistant, good stability, automaticity is high and be fit to advantage such as production in enormous quantities has obtained application more and more widely.The wiring board that MEMS microphone of the prior art generally includes shell and is combined as a whole with shell, wiring board is provided with hole, in the inboard of wiring board the position in hole at the sound is provided with the MEMS chip.The structure of MEMS chip as shown in Figure 7, comprise substrate 41, substrate 41 is provided with diaphragm 42, diaphragm 42 is provided with support ring 44, support ring 44 is provided with back pole plate 43, and back pole plate 43 is provided with pole plate hole 431, leaves oscillation space between back pole plate 43 and the diaphragm 42, form back pole plate last, diaphragm under the MEMS chip structure.
The weak point of the MEMS microphone of this structure is: because the structure of MEMS chip is that diaphragm is following, back pole plate is last, do not block between diaphragm and the sound hole, damage diaphragm easily when the air-flow that enters when the sound hole is strong, thereby damage the MEMS chip, cause the MEMS microphone can't operate as normal, shortened the useful life of MEMS microphone.
The utility model content
The purpose of this utility model is to provide a kind of MEMS microphone, is intended to solve the air-flow that enters that has the MEMS microphone now and directly impacts the MEMS chip, damages diaphragm easily, damages the problem of MEMS chip.
The utility model is achieved in that a kind of MEMS microphone, and described MEMS microphone comprises: shell; The wiring board that is combined as a whole with described shell, defining the side that described wiring board combines with described shell is the inboard of described wiring board, the inboard of described wiring board is covered with the MEMS chip, and the described wiring board that described MEMS chip is covered with is provided with at least two first holes; Lateral surface at described wiring board is compounded with substrate, described substrate is provided with rising tone hole, the aperture size in described first hole is less than the aperture size in described rising tone hole, and described each first hole is arranged in the orthographic projection zone of described rising tone hole on described wiring board.
As a kind of improvement, described MEMS chip is by a substrate and be arranged on suprabasil capacitor and constitute, described capacitor comprise a rigid back pole plate, a flexible sheet and be arranged on back pole plate and diaphragm between support ring, described diaphragm end face links to each other with described substrate, described back pole plate end is away from described substrate, and described MEMS chip is installed on the described wiring board by described substrate.
As a kind of improvement, described wiring board inboard is provided be used to the division board that prevents the mutual interference of air-flow phase, and described division board is between two adjacent described first holes.
As a kind of improvement, the aperture in described first hole is 0.25 ± 0.05mm; The aperture in described rising tone hole is 0.01～0.1mm.
As a kind of improvement, the aperture size in described rising tone hole is between 0.03～0.05mm.
As a kind of improvement, combine with the described wiring board wiring board of position of described MEMS chip is provided be used to the excessive glue groove of depositing glue.
Based on a total inventive concept, the utility model can also realize that so described MEMS microphone comprises: shell; The wiring board that is combined as a whole with described shell, defining the side that described wiring board combines with described shell is the inboard of described wiring board, the inboard of described wiring board is covered with the MEMS chip, it is characterized in that, described wiring board comprises the wiring board substrate and is compounded in metal level on the described wiring board substrate inboard, described metal level is provided with at least two first holes, described wiring board substrate is provided with rising tone hole, the aperture size in described first hole is less than the aperture size in described rising tone hole, and described each first hole is arranged in the orthographic projection zone of described rising tone hole on described metal level; Described MEMS chip is covered with first hole on the described metal level.
As a kind of improvement, described MEMS chip is by a substrate and be arranged on suprabasil capacitor and constitute, described capacitor comprise a rigid back pole plate, a flexible sheet and be arranged on back pole plate and diaphragm between support ring, described diaphragm end face links to each other with described substrate, described back pole plate end is away from described substrate, and described MEMS chip is installed on the described wiring board by described substrate.
As a kind of improvement, described metal level is provided be used to the division board that prevents the mutual interference of air-flow phase, and described division board is between two adjacent described first hole.
As a kind of improvement, be positioned at the position that described MEMS chip combines with described metal level on the described metal level and be provided be used to the excessive glue groove of depositing glue.
After having adopted technique scheme, the beneficial effects of the utility model are: a kind of MEMS microphone, and described MEMS microphone comprises shell; The wiring board that is combined as a whole with described shell, defining the side that described wiring board combines with described shell is the inboard of described wiring board, the inboard of described wiring board is covered with the MEMS chip, and the described wiring board that described MEMS chip is covered with is provided with at least two first holes; Lateral surface at described wiring board is compounded with substrate, place, corresponding described first hole is provided with rising tone hole on the described substrate, the aperture size in first hole is less than the aperture size in rising tone hole, and each first hole is arranged in the orthographic projection zone in the circuit board, rising tone hole; During use; air-flow enters the MEMS microphone by rising tone hole; act on the diaphragm of MEMS chip by first hole then; a plurality of first hole are set; can carry out streaming buffer than air blast to what enter from rising tone hole, avoid directly impacting the diaphragm of MEMS chip, the MEMS chip has been played protective effect; effectively reduce the impaired probability of MEMS chip, prolonged the useful life of MEMS microphone.
Description of drawings
Fig. 1 is the cross-sectional view of the MEMS microphone that provides of the utility model first embodiment;
Fig. 2 is the cross-sectional view of the MEMS microphone that provides of the utility model second embodiment;
Fig. 3 is the cross-sectional view of the MEMS microphone that provides of the utility model the 3rd embodiment;
Fig. 4 is the cross-sectional view of the MEMS microphone that provides of the utility model the 4th embodiment;
Fig. 5 is the cross-sectional view of the MEMS microphone that provides of the utility model the 5th embodiment;
Fig. 6 is the cross-sectional view of the MEMS microphone that provides of the utility model the 6th embodiment;
Fig. 7 is the structural representation of the MEMS chip of the MEMS microphone that provides of the utility model first embodiment;
Wherein, 1, wiring board, 11, first holes, 12, metal level, 13, the wiring board substrate, 2, substrate, 3, shell, 4, the MEMS chip, 41, substrate, 42, diaphragm, 43, back pole plate, 431, pole plate hole, 44, support ring, 5, division board, 6, the glue groove that overflows, 7, rising tone hole.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explaining the utility model, and be not used in restriction the utility model.
First embodiment:
By Fig. 1, and Fig. 7 as can be known, this MEMS microphone comprises: by the shell 3 that metal material or wiring board material make, shell 3 is the tubular structure of an end opening one end sealing; The openend of shell 3 is provided with wiring board 1, and the side that definition wiring board 1 combines with shell 3 is the inboard of wiring board 1; This wiring board 1 is provided with at least two first holes 11, the aperture in first hole 11 is 0.01～0.1mm, be preferably 0.03～0.05mm, in the present embodiment, first hole 11 on the wiring board 1 is provided with two, in concrete the application, the quantity in first hole 11 can be set as the case may be, as three, four, five or six etc., for the consideration to the air-flow equilibrium, the number in first hole 11 is preferably even numbers; Be compounded in the substrate 2 on the outside of wiring board 1,11 places, corresponding first hole are provided with rising tone hole 7 on this substrate 2, the aperture in rising tone hole 7 is 0.25 ± 0.05mm, the aperture size in first hole 11 is less than the aperture size in rising tone hole 7, and each first hole 11 is arranged in the orthographic projection zone of rising tone hole 7 on wiring board 1; Be arranged on the MEMS chip 4 on wiring board 1 inboard, this MEMS chip 4 is located on first hole 11.
MEMS chip 4 is made of a substrate 41 and the capacitor that is arranged in the substrate 41, capacitor comprise a rigid back pole plate 43, a flexible sheet 42 and be arranged on back pole plate 43 and diaphragm 42 between support ring 44, diaphragm 42 end faces link to each other with substrate 41, back pole plate 43 ends are away from substrate 41, back pole plate 43 is provided with pole plate hole 431, leaves oscillation space between back pole plate 43 and the diaphragm 42.MEMS chip 4 is installed on the wiring board 1 by substrate 41.
In the present embodiment; air-flow enters the MEMS microphone by rising tone hole 7; act on the diaphragm of MEMS chip 4 by first hole 11 then; finish the conversion of acoustic-electric, be provided with rising tone hole 7 and a plurality of first hole 11, can be to carrying out streaming buffer than air blast; avoid directly impacting the diaphragm of MEMS chip 4; MEMS chip 4 is played protective effect, effectively reduced MEMS chip 4 impaired probability, prolonged the useful life of MEMS microphone.
In the present embodiment, this substrate 2 is also made by the wiring board material.
Second embodiment:
As shown in Figure 2, present embodiment and first embodiment are basic identical, and its difference is:
Position on the wiring board 1 between per two first holes 11 is provided with division board 5, and division board 5 and MEMS chip 4 are positioned at the same side of wiring board 1, and division board 5 is positioned at the chamber of MEMS chip 4.Because wiring board 1 is provided with two first holes 11, the air-flow that two first holes 11 are passed through can interfere with each other in the chamber of MEMS chip 4, the phase mutual interference meeting of air-flow impacts the acoustical behavior of MEMS microphone, so between two first holes 11 on the wiring board 1, set up division board 5, division board 5 has effectively stoped the phase mutual interference between the air-flow, guaranteed air-flow sound pressure equalization in MEMS chip 4 chambeies, improve the sensitivity of MEMS microphone greatly, improved the acoustical behavior of MEMS microphone.
The 3rd embodiment:
As shown in Figure 3, present embodiment and first embodiment are basic identical, and its difference is:
Be positioned at the position that MEMS chip 4 combines with wiring board 1 on the wiring board 1 and be provided with the glue groove 6 that overflows.MEMS chip 4 and wiring board 1 paste in conjunction with the time, unnecessary glue is easy to obstruction sound hole, the glue groove 6 that overflows can be collected unnecessary glue, has effectively solved easily blocked problem of sound hole, has improved the product qualified rate of MEMS microphone.
The 4th embodiment:
As shown in Figure 4, present embodiment and first embodiment are basic identical, and its difference is:
Position on the wiring board 1 between per two first holes 11 is provided with division board 5, and division board 5 and MEMS chip 4 are positioned at the same side of wiring board 1, and division board 5 is positioned at the chamber of MEMS chip 4; Be positioned at the position that MEMS chip 4 combines with wiring board 1 on the wiring board 1 and be provided with the glue groove 6 that overflows.
Because wiring board 1 is provided with two first holes 11, the air-flow that two first holes 11 are passed through can interfere with each other in the chamber of MEMS chip 4, the phase mutual interference meeting of air-flow impacts the acoustical behavior of MEMS microphone, so between per two first holes 11 on the wiring board 1, set up division board 5, division board 5 has effectively stoped the phase mutual interference between the air-flow, guaranteed air-flow sound pressure equalization in MEMS chip 4 chambeies, improve the sensitivity of MEMS microphone greatly, improved the acoustical behavior of MEMS microphone.MEMS chip 4 and wiring board 1 paste in conjunction with the time, unnecessary glue is easy to obstruction sound hole, the glue groove 6 that overflows can be collected unnecessary glue, has effectively solved easily blocked problem of sound hole, has improved the product qualified rate of MEMS microphone.
The 5th embodiment:
As shown in Figure 5, this MEMS microphone comprises: by the shell 3 that metal material or wiring board material make, shell 3 is the tubular structure of an end opening one end sealing; The openend of shell 3 is provided with wiring board 1, and the side that definition wiring board 1 combines with shell 3 is the inboard of wiring board 1; This wiring board 1 comprises wiring board substrate 13 and the metal level 12 that is combined with each other with this wiring board substrate 13, this metal level 12 is provided with at least two first holes 11, the aperture in first hole 11 is 0.01～0.1mm, be preferably 0.03～0.05mm, in the present embodiment, first hole 11 on the metal level 12 is provided with two, in concrete the application, the quantity in first hole 11 can be set as the case may be, as three, four, five or six etc., for the consideration to the air-flow equilibrium, the number in first hole 11 is preferably even numbers; 11 places, corresponding first hole are provided with rising tone hole 7 on the wiring board substrate 13, the aperture in rising tone hole 7 is 0.25 ± 0.05mm, the aperture size in first hole 11 is less than the aperture size in rising tone hole 7, and each first hole 11 is arranged in the orthographic projection zone of rising tone hole 7 on wiring board 1; Be arranged on the MEMS chip 4 on the metal level 12, this MEMS chip 4 is located on first hole 11.
In the present embodiment; air-flow enters the MEMS microphone by rising tone hole 7; act on the diaphragm of MEMS chip 4 by first hole 11 then; finish the conversion of acoustic-electric, a plurality of first hole 11 are set, can carry out streaming buffer than air blast to what enter from rising tone hole 7; avoid directly impacting the diaphragm of MEMS chip 4; MEMS chip 4 is played protective effect, effectively reduced MEMS chip 4 impaired probability, prolonged the useful life of MEMS microphone.
Be positioned at the position that MEMS chip 4 combines with metal level 12 on the metal level 12 of wiring board 1 and be provided with the glue groove 6 that overflows.MEMS chip 4 and metal level 12 paste in conjunction with the time, unnecessary glue is easy to obstruction sound hole, the glue groove 6 that overflows can be collected unnecessary glue, has effectively solved easily blocked problem of sound hole, has improved the product qualified rate of MEMS microphone.
The 6th embodiment:
As shown in Figure 6, present embodiment and the 5th embodiment are basic identical, and its difference is:
Because metal level 12 is provided with two first holes 11, the air-flow that two first holes 11 are passed through can interfere with each other in the chamber of MEMS chip 4, the phase mutual interference meeting of air-flow impacts the acoustical behavior of MEMS microphone, so between per two first holes 11 on the wiring board 1, set up division board 5, division board 5 has effectively stoped the phase mutual interference between the air-flow, guaranteed air-flow sound pressure equalization in MEMS chip 4 chambeies, improve the sensitivity of MEMS microphone greatly, improved the acoustical behavior of MEMS microphone.MEMS chip 4 and wiring board 1 paste in conjunction with the time, unnecessary glue is easy to obstruction sound hole, the glue groove 6 that overflows can be collected many
The MEMS microphone that the utility model provides comprises: by the shell that metal material or wiring board material make, shell is the tubular structure of an end opening one end sealing; The openend of shell is provided with wiring board, and the side that the definition wiring board combines with shell is the inboard of wiring board; This wiring board is provided with at least two first holes, and the aperture size in first hole is less than the aperture size in rising tone hole, and each first hole is arranged in the orthographic projection zone in the circuit board, rising tone hole; Be compounded in the substrate on the outside of wiring board, place, corresponding first hole is provided with rising tone hole on this substrate; Be arranged on the MEMS chip on the wiring board inboard, this MEMS chip packet is located on first hole; During use; air-flow enters the MEMS microphone by rising tone hole; act on the diaphragm of MEMS chip by first hole then; a plurality of first hole are set; can carry out streaming buffer than air blast to what enter from rising tone hole, avoid directly impacting the diaphragm of MEMS chip, the MEMS chip has been played protective effect; effectively reduce the impaired probability of MEMS chip, prolonged the useful life of MEMS microphone.
The above only is preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of within spirit of the present utility model and principle, doing, be equal to and replace and improvement etc., all should be included within the protection range of the present utility model.
Claims (10)
1.MEMS microphone, described MEMS microphone comprises: shell; The wiring board that is combined as a whole with described shell, defining the side that described wiring board combines with described shell is the inboard of described wiring board, the inboard of described wiring board is covered with the MEMS chip, it is characterized in that, the described wiring board that described MEMS chip is covered with is provided with at least two first holes; Lateral surface at described wiring board is compounded with substrate, described substrate is provided with rising tone hole, the aperture size in described first hole is less than the aperture size in described rising tone hole, and described each first hole is arranged in the orthographic projection zone of described rising tone hole on described wiring board.
2. MEMS microphone according to claim 1, it is characterized in that, described MEMS chip is by a substrate and be arranged on suprabasil capacitor and constitute, described capacitor comprise a rigid back pole plate, a flexible sheet and be arranged on back pole plate and diaphragm between support ring, described diaphragm end face links to each other with described substrate, described back pole plate end is away from described substrate, and described MEMS chip is installed on the described wiring board by described substrate.
3. MEMS microphone according to claim 2 is characterized in that, described wiring board inboard is provided be used to the division board that prevents the mutual interference of air-flow phase, and described division board is between two adjacent described first holes.
4. MEMS microphone according to claim 3 is characterized in that, the aperture in described first hole is 0.25 ± 0.05mm; The aperture in described rising tone hole is 0.01～0.1mm.
5. MEMS microphone as claimed in claim 4 is characterized in that, the aperture size in described rising tone hole is between 0.03～0.05mm.
6. according to the described MEMS microphone of each claim of claim 1 to 5, it is characterized in that combine with the described wiring board wiring board of position of described MEMS chip is provided be used to the excessive glue groove of depositing glue.
7.MEMS microphone, described MEMS microphone comprises: shell; The wiring board that is combined as a whole with described shell, defining the side that described wiring board combines with described shell is the inboard of described wiring board, the inboard of described wiring board is covered with the MEMS chip, it is characterized in that, described wiring board comprises the wiring board substrate and is compounded in metal level on the described wiring board substrate inboard, described metal level is provided with at least two first holes, described wiring board substrate is provided with rising tone hole, the aperture size in described first hole is less than the aperture size in described rising tone hole, and described each first hole is arranged in the orthographic projection zone of described rising tone hole on described metal level; Described MEMS chip is covered with first hole on the described metal level.
8. MEMS microphone according to claim 7, it is characterized in that, described MEMS chip is by a substrate and be arranged on suprabasil capacitor and constitute, described capacitor comprise a rigid back pole plate, a flexible sheet and be arranged on back pole plate and diaphragm between support ring, described diaphragm end face links to each other with described substrate, described back pole plate end is away from described substrate, and described MEMS chip is installed on the described wiring board by described substrate.
9. MEMS microphone according to claim 8 is characterized in that, described metal level is provided be used to the division board that prevents the mutual interference of air-flow phase, and described division board is between two adjacent described first hole.
10. according to the described MEMS microphone of each claim of claim 7 to 9, it is characterized in that, be positioned at the position that described MEMS chip combines with described metal level on the described metal level and be provided be used to the excessive glue groove of depositing glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320175039 CN203193890U (en) | 2013-04-09 | 2013-04-09 | MEMS (micro-electromechanical systems) microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320175039 CN203193890U (en) | 2013-04-09 | 2013-04-09 | MEMS (micro-electromechanical systems) microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203193890U true CN203193890U (en) | 2013-09-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320175039 Expired - Lifetime CN203193890U (en) | 2013-04-09 | 2013-04-09 | MEMS (micro-electromechanical systems) microphone |
Country Status (1)
| Country | Link |
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| CN (1) | CN203193890U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104902409A (en) * | 2014-03-04 | 2015-09-09 | 钰太芯微电子科技（上海）有限公司 | MEMS microphone acoustic structure |
| CN107948781A (en) * | 2017-11-27 | 2018-04-20 | 钰太芯微电子科技（上海）有限公司 | A kind of Novel microphone structure and flip-type electronic equipment |
| WO2020186884A1 (en) * | 2019-03-15 | 2020-09-24 | 潍坊歌尔微电子有限公司 | Microphone and electronic device |
-
2013
- 2013-04-09 CN CN 201320175039 patent/CN203193890U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104902409A (en) * | 2014-03-04 | 2015-09-09 | 钰太芯微电子科技（上海）有限公司 | MEMS microphone acoustic structure |
| CN107948781A (en) * | 2017-11-27 | 2018-04-20 | 钰太芯微电子科技（上海）有限公司 | A kind of Novel microphone structure and flip-type electronic equipment |
| WO2020186884A1 (en) * | 2019-03-15 | 2020-09-24 | 潍坊歌尔微电子有限公司 | Microphone and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
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| TR01 | Transfer of patent right |
Effective date of registration: 20200610 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
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| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130911 |
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| CX01 | Expiry of patent term |