CN214177530U - Earphone, communication equipment and terminal - Google Patents
Earphone, communication equipment and terminal Download PDFInfo
- Publication number
- CN214177530U CN214177530U CN202120246394.4U CN202120246394U CN214177530U CN 214177530 U CN214177530 U CN 214177530U CN 202120246394 U CN202120246394 U CN 202120246394U CN 214177530 U CN214177530 U CN 214177530U
- Authority
- CN
- China
- Prior art keywords
- sound inlet
- hole
- sound
- earphone
- present application
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Headphones And Earphones (AREA)
Abstract
The application discloses an earphone, a communication device and a terminal. The earphone of the present application includes: the microphone comprises a shell, a buffer piece and a micro-electromechanical system microphone, wherein the shell defines a cavity and is provided with a through hole; the buffer piece is embedded in the through hole; the micro-electromechanical system microphone is arranged in the cavity and is provided with a first sound inlet; wherein, the first sound inlet hole is arranged opposite to the through hole. The buffer piece is arranged on the shell, so that the air flow is attenuated when entering the earphone, the air flow is buffered, and the aim of reducing wind noise is fulfilled; the earphone of the embodiment of the application uses the micro-electromechanical system microphone as the call microphone, has certain noise elimination capability and excellent characteristics of radio frequency resistance and electromagnetic interference resistance, and has good consistency.
Description
Technical Field
The application relates to the technical field of earphones, in particular to an earphone, communication equipment and a terminal.
Background
In the related art, a multi-MIC algorithm is often adopted to reduce the wind noise of the earphone, or a bone conduction technology is used, however, the multi-MIC algorithm is used to reduce the noise, the circuit design is complex, and the earphone which utilizes the bone conduction technology to reduce the noise has no universality.
SUMMERY OF THE UTILITY MODEL
The present application is directed to solving at least one of the problems in the prior art. Therefore, the earphone is provided, wind noise can be reduced, the using method is simple, the earphone is easy to achieve, and good consistency is achieved.
The application also provides communication equipment with the earphone.
The application also provides a terminal with the earphone.
A headset according to an embodiment of the first aspect of the application, comprising:
the shell defines a cavity and is provided with a through hole;
the buffer piece is embedded in the through hole;
the micro-electromechanical system microphone is arranged in the cavity and is provided with a first sound inlet;
wherein the first sound inlet hole is arranged opposite to the through hole.
According to the earphone of the embodiment of the application, at least the following beneficial effects are achieved: the earphone is provided with the buffer piece on the shell, so that the air flow is attenuated when entering the earphone, the air flow is buffered, and the aim of reducing wind noise is fulfilled; the earphone of the embodiment of the application uses the micro-electromechanical system microphone as the call microphone, has certain noise elimination capability and excellent characteristics of radio frequency resistance and electromagnetic interference resistance, and has good consistency.
According to some embodiments of the present application, at least two second sound inlet holes are opened on a surface of the buffer member.
According to some embodiments of the present application, the second sound inlet hole has one of a circular shape and a rectangular shape.
According to some embodiments of the present application, the surface of the buffer member is provided with a plurality of second sound inlet holes, and the second sound inlet holes are arranged in an array.
According to some embodiments of the application, the headset further comprises: and the organic component is arranged between the shell and the micro-electromechanical system microphone, and is provided with a third sound inlet hole which is connected with the first sound inlet hole.
According to some embodiments of the application, the headset further comprises: inhale the sound cotton, set up in the casing with between the organic subassembly.
According to some embodiments of the application, the headset further comprises: and the sound adjusting net is arranged between the sound absorbing cotton and the organic component.
According to some embodiments of the present application, an area of the second sound inlet hole is larger than an area of the first sound inlet hole.
A communication device according to an embodiment of the second aspect of the present application comprises a headset according to an embodiment of the first aspect of the present application described above.
According to the communication equipment of the embodiment of the application, at least the following beneficial effects are achieved: the communication equipment comprises the earphone, and the earphone is provided with the buffer piece on the shell, so that airflow is attenuated when entering the earphone, the airflow is buffered, and the aim of reducing wind noise is fulfilled; the earphone of the embodiment of the application uses the micro-electromechanical system microphone as the call microphone, has certain noise elimination capability and excellent characteristics of radio frequency resistance and electromagnetic interference resistance, and has good consistency.
A terminal according to an embodiment of the third aspect of the present application comprises a headset according to the above-described first aspect of the present application.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The present application is further described with reference to the following figures and examples, in which:
fig. 1 is a front view of a headset according to an embodiment of the present application;
FIG. 2 is a cross-sectional view of section A-A of FIG. 1;
fig. 3 is a schematic diagram of the earphone housing 100 according to the embodiment of the present application.
Reference numerals:
the sound-absorbing structure comprises a shell 100, a through hole 110, a buffer member 200, a second sound inlet hole 210, a micro electromechanical system microphone 300, a first sound inlet hole 310, an organic component 400, a third sound inlet hole 410, sound-absorbing cotton 500 and a tuning net 600.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
In the description of the present application, it is to be understood that the positional descriptions, such as the directions of up, down, front, rear, left, right, etc., referred to herein are based on the directions or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, and do not indicate or imply that the referred device or element must have a specific direction, be constructed and operated in a specific direction, and thus, should not be construed as limiting the present application.
In the description of the present application, the meaning of a plurality is one or more, the meaning of a plurality is two or more, and the above, below, exceeding, etc. are understood as excluding the present number, and the above, below, within, etc. are understood as including the present number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present application, unless otherwise expressly limited, terms such as set, mounted, connected and the like should be construed broadly, and those skilled in the art can reasonably determine the specific meaning of the terms in the present application by combining the detailed contents of the technical solutions.
In the description of the present application, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
An earphone according to an embodiment of the present application is described below with reference to fig. 1 to 3.
As shown in fig. 1 to 3, the earphone according to the embodiment of the present application includes a case 100, a buffer 200, and a mems microphone 300.
The housing 100 defines a cavity and is provided with a through hole 110; the buffer member 200 is embedded in the through hole 110; the micro-electromechanical system microphone 300 is arranged in the cavity, and the micro-electromechanical system microphone 300 is provided with a first sound inlet hole 310; wherein the first sound inlet hole 310 is disposed opposite to the through hole 110.
For example, as shown in fig. 1 to 3, the upper half of the housing 100 has a circular structure, the lower half has a circular arc structure, and the interior of the housing 100 has a cavity structure for accommodating the buffer 200, the mems microphone 300, and the like. A ventilation hole is formed in the circular structure of the upper half of the casing 100 for adjusting the air pressure inside the casing 100, and the other side of the casing 100 is of a planar structure for facilitating the installation of devices in the headset. The surface of the housing 100 is provided with a through hole 110, the shape of the through hole 110 is approximately elliptical, and the through hole 110 is used for mounting the buffer member 200, wherein the shape and the size of the through hole 110 can be set according to requirements.
The shape of the buffer member 200 is the same as the through hole 110 formed on the surface of the housing 100, and the buffer member 200 is embedded in the through hole 110, so that the buffer member 200 can buffer and inhibit the airflow entering the earphone housing 100, and the airflow can reach the mems microphone 300 after being attenuated for multiple times, thereby achieving the effect of improving wind noise. The buffer member 200 and the housing 100 may be connected and fixed by welding, or may be connected and fixed by glue.
The micro electro mechanical system microphone 300 is further disposed inside the housing 100, the micro electro mechanical system microphone 300 is provided with a first sound inlet 310, and the micro electro mechanical system microphone 300 acquires sound information through the first sound inlet 310 and transmits sound signals through internal processing. The position of the first sound inlet hole 310 is opposite to the position of the casing 100 with the through hole 110, so that the sound information buffered by the buffer 200 can be better received, and the accuracy of the user identification information is improved.
According to the earphone, the buffering piece is arranged on the shell, so that air flow is attenuated when entering the earphone, the air flow is buffered, and the aim of reducing wind noise is fulfilled; the earphone of the embodiment of the application uses the micro-electromechanical system microphone as the call microphone, has certain noise elimination capability and excellent characteristics of radio frequency resistance and electromagnetic interference resistance, and has good consistency.
In some embodiments of the present application, at least two second sound inlet holes are formed on the surface of the buffer member. For example, as shown in fig. 1, twenty-four second sound inlet holes 210 are opened on the surface of the buffer 200, and the shape and size of each second sound inlet hole 210 are the same. The air flow enters from the through hole 110, and the second sound inlet holes 210 are communicated with each other, so that the air flow is buffered and inhibited, and the noise reduction performance of the earphone is improved. The number of the second sound inlet holes 210 can be set according to design requirements, and in principle, the more the second sound inlet holes 210 are, the better the noise reduction effect is.
In some embodiments of the present application, the shape of the second sound inlet hole is one of circular and rectangular. The shape of the second sound inlet hole can be designed to be circular or rectangular, and it is understood that the shape of the second sound inlet hole can also be set to be any shape such as diamond, ellipse, irregular figure, etc. For example, as shown in fig. 1, twenty-four second sound inlet holes 210 opened on the surface of the buffer member 200 are all circular, and have a diameter of 0.8 mm. The air flow enters the inside of the casing 100 through the second sound inlet hole of the damper 200, and is damped and suppressed, thereby reducing the influence of wind noise on the sound transmission effect of the earphone.
In some embodiments of the present application, the surface of the buffer member is provided with a plurality of second sound inlet holes, and the second sound inlet holes are arranged in an array. For example, as shown in fig. 1, the number of the second sound inlet holes 210 is twenty-four, and the twenty-four second sound inlet holes 210 are arranged in an array and divided into five rows. Wherein, the third row is provided with six second sound inlet holes 210, and the corresponding position between every two second sound inlet holes 210 in the third row is provided with five second sound inlet holes 210 in the second and fourth rows; at the corresponding position between every two second sound inlet holes 210 of the second or fourth column, four second sound inlet holes 210 of the first or fifth column are provided. It is understood that the arrangement of the second sound inlet holes 210 may also be four rows, six in each row, and both the arrangement and the number may be set according to requirements.
In some embodiments of the present application, the headset further comprises: the organic component is arranged between the shell and the microphone of the micro-electromechanical system, and is provided with a third sound inlet hole which is connected with the first sound inlet hole. For example, as shown in fig. 2, an organic element 400 is disposed between the housing 100 and the mems microphone 300, a third sound inlet 410 is formed on the organic element 400, the third sound inlet 410 is connected to the first sound inlet 310, and the third sound inlet 410 is used for introducing the sound or air flow processed by the buffer 200 into the mems microphone 300. The organic module 400 has one side tightly connected to the housing 100 and the other side tightly connected to the mems microphone 300 for sealing, and the organic module 400 in this application is made of ethylene-vinyl acetate copolymer, which has good waterproof property and corrosion resistance, and other materials with sealing effect can be used as the organic module 400.
In some embodiments of the present application, the headset further comprises: inhale the sound cotton, inhale the sound cotton and set up between casing and organic subassembly. For example, as shown in fig. 2, a sound absorbing cotton 500 is disposed between the housing 100 and the organic component, and sound enters through the second sound inlet 210 of the buffer 200, then enters the sound absorbing cotton 500 for further noise reduction, and finally enters the first sound inlet of the mems microphone 300 through the third sound inlet 410 for transmission to the user. The sound-absorbing cotton 500 is an artificial inorganic fiber, and the fiber are mutually wound together to form a plurality of tiny gaps, so that on one hand, the transmission of noise can be greatly reduced, on the other hand, the dustproof effect is achieved, and the influence on the normal work of the earphone caused by the dust entering the micro-electromechanical system microphone 300 is prevented.
In some embodiments of the present application, the headset further comprises: and the tuning net is arranged between the sound absorption cotton and the organic component. For example, as shown in fig. 2, a tuning net 600 is further disposed between the sound-absorbing cotton 500 and the organic component, and the tuning net 600 is adhered or otherwise fixed to one side of the through-hole 110 by glue. The sound enters the tuning net 600 after passing through the buffer member 200 and the noise reduction treatment of the sound absorption cotton 500, the tuning net 600 is used for realizing the tuning effect, and finally the sound enters the micro-electromechanical system microphone 300 through the third sound inlet 410. The tuning net 600 plays a role in tuning sound and also has a certain dustproof function.
In some embodiments of the present application, the area of the second sound inlet hole is larger than the area of the first sound inlet hole. The larger the area of the second sound inlet hole is, the more external signals can be captured. The second sound inlet holes communicated with each other can play a good role in buffering air flow, and the noise reduction effect is achieved. And the area of the second sound inlet hole is larger than that of the first sound inlet hole, so that the influence of external noise on sound signals can be reduced while more signals are captured.
In some embodiments, the present application provides a communication device, including the headset in any of the above embodiments.
In some embodiments, the present application provides a terminal including the earphone in any of the above embodiments.
The embodiments of the present application have been described in detail with reference to the drawings, but the present application is not limited to the embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present application. Furthermore, the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
Claims (10)
1. A headset, comprising:
the shell defines a cavity and is provided with a through hole;
the buffer piece is embedded in the through hole;
the micro-electromechanical system microphone is arranged in the cavity and is provided with a first sound inlet;
wherein the first sound inlet hole is arranged opposite to the through hole.
2. The earphone according to claim 1, wherein at least two second sound inlet holes are opened on the surface of the buffer member.
3. The earphone according to claim 2, wherein the second sound inlet hole has one of a circular shape and a rectangular shape.
4. The earphone according to claim 2 or 3, wherein the surface of the buffer member is provided with a plurality of second sound inlet holes, and the second sound inlet holes are arranged in an array.
5. The headset of claim 2, further comprising:
and the organic component is arranged between the shell and the micro-electromechanical system microphone, and is provided with a third sound inlet hole which is connected with the first sound inlet hole.
6. The headset of claim 5, further comprising:
inhale the sound cotton, set up in the casing with between the organic subassembly.
7. The headset of claim 6, further comprising:
and the sound adjusting net is arranged between the sound absorbing cotton and the organic component.
8. The earphone according to claim 7, wherein the area of the second sound inlet hole is larger than the area of the first sound inlet hole.
9. Communication device, characterized in that it comprises a headset according to any of claims 1 to 8.
10. Terminal, characterized in that it comprises an earphone according to any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120246394.4U CN214177530U (en) | 2021-01-28 | 2021-01-28 | Earphone, communication equipment and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120246394.4U CN214177530U (en) | 2021-01-28 | 2021-01-28 | Earphone, communication equipment and terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214177530U true CN214177530U (en) | 2021-09-10 |
Family
ID=77594258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120246394.4U Active CN214177530U (en) | 2021-01-28 | 2021-01-28 | Earphone, communication equipment and terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214177530U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116939428A (en) * | 2023-09-18 | 2023-10-24 | 歌尔股份有限公司 | Headset device, wind noise suppression method, and computer-readable storage medium |
| WO2024008188A1 (en) * | 2022-07-08 | 2024-01-11 | 安克创新科技股份有限公司 | Wind noise reduction structure and earphones |
-
2021
- 2021-01-28 CN CN202120246394.4U patent/CN214177530U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024008188A1 (en) * | 2022-07-08 | 2024-01-11 | 安克创新科技股份有限公司 | Wind noise reduction structure and earphones |
| CN116939428A (en) * | 2023-09-18 | 2023-10-24 | 歌尔股份有限公司 | Headset device, wind noise suppression method, and computer-readable storage medium |
| CN116939428B (en) * | 2023-09-18 | 2023-12-22 | 歌尔股份有限公司 | Headset device, wind noise suppression method, and computer-readable storage medium |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN214177530U (en) | Earphone, communication equipment and terminal | |
| US10715899B2 (en) | Wind noise prevention microphone and earphone cable control apparatus | |
| US11317191B2 (en) | Acoustic input and output apparatus | |
| CN204929255U (en) | Microphone encapsulation | |
| CN109451384B (en) | MEMS microphone and electronic device | |
| CN109413554A (en) | A kind of directive property MEMS microphone | |
| CN212115606U (en) | Microphone structure and earphone | |
| CN212876084U (en) | Noise reduction earphone | |
| CN214675591U (en) | Wind noise resistant earphone | |
| WO2021004394A1 (en) | Terminal device | |
| CN209861104U (en) | Microphone damping device and electronic equipment | |
| CN215217808U (en) | Vibration sensor and electronic device | |
| CN217935902U (en) | Wind noise reduction structure and earphone | |
| CN214177521U (en) | Earphone, communication equipment and terminal | |
| CN203193890U (en) | MEMS (micro-electromechanical systems) microphone | |
| CN213305751U (en) | Prevent wind microphone structure and earphone of making an uproar | |
| CN112954561B (en) | MEMS microphone with air leakage switch structure | |
| CN205946167U (en) | Two directional pickup silicon microphone | |
| CN215187186U (en) | Loudspeaker and electronic equipment | |
| CN115159439A (en) | MEMS device and electronic apparatus | |
| CN221043161U (en) | Noise reduction microphone for portable immersion type sound collection equipment | |
| CN112637723A (en) | Earphone, communication equipment and terminal | |
| CN217133995U (en) | Wind noise reduction module and electronic product | |
| CN216600003U (en) | Low wind noise earphone assembly and earphone | |
| JP3896546B2 (en) | Microphone unit holding structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |