CN209283510U

CN209283510U - A kind of anti-air blowing MEMS microphone

Info

Publication number: CN209283510U
Application number: CN201920100033.1U
Authority: CN
Inventors: 郭桥生; 康良军; 郭奕君; 郭智华
Original assignee: Chaoyang Jushengtai Xinfeng Technology Co Ltd
Current assignee: Chaoyang Jushengtai Xinfeng Technology Co Ltd
Priority date: 2019-01-22
Filing date: 2019-01-22
Publication date: 2019-08-20
Anticipated expiration: 2029-01-22

Abstract

The utility model discloses a kind of anti-air blowing MEMS microphones, including PCB substrate, MEMS chip ontology and asic chip, shell is fixedly connected at the top of the PCB substrate, acoustic aperture is offered at the top of the PCB substrate, left side at the top of the PCB substrate is fixedly connected with fixing pipe, the fixing pipe is located at the inner cavity of shell, and the top and bottom of the fixing pipe offer through-hole.The utility model passes through fixing pipe, through-hole, rigid back pole plate, first stomata, washer, annular through hole, flexible membrane, second stomata and third stomata are used cooperatively, it solves the anti-insufflation potential of existing MEMS microphone and depends primarily on MEMS chip itself, the problem of being unable to control outer gas stream size, the anti-air blowing MEMS microphone has the advantages of anti-air blowing, it joined the element of the control to outer gas stream size, in a certain range the pressure control inside arrival MEMS chip, fabulous protects inside chip, improve the anti-insufflation potential of microphone.

Description

A kind of anti-air blowing MEMS microphone

Technical field

The utility model relates to microphone techniques field, specially a kind of anti-air blowing MEMS microphone.

Background technique

Microphone scientific name is microphone, is the energy conversion device that voice signal is converted to electric signal, also referred to as microphone, micro- Sound device, microphone are converted by initially converting acoustic-electric development by resistance into inductance, condenser type, and a large amount of new microphone techniques are gradually Grow up, includes among these the microphones such as aluminium strip, moving-coil, and be currently being widely used capacitance microphone and electret mike Wind.

MEMS microphone is the microphone based on MEMS technology manufacture, based on the need that terminal device is lightening and minimizes It asks, MEMS microphone application at present is very extensive, since MEMS chip is directly bonded on PCB by conventional package, air-flow It is entered directly into the inner cavity of MEMS chip by PCB acoustic aperture, if air-flow is excessive, the diaphragm of MEMS chip can be made in impact force Under the action of breakage lead to product failure, so as to cause terminal function exception；The anti-insufflation potential of traditional design mode is main Depending on MEMS chip itself, it is unable to control outer gas stream size, reduces the practicability of MEMS microphone.

Utility model content

The purpose of this utility model is to provide a kind of anti-air blowing MEMS microphones, have the advantages of anti-air blowing, solve The problem of existing anti-insufflation potential of MEMS microphone depends primarily on MEMS chip itself, is unable to control outer gas stream size.

To achieve the above object, the utility model provides the following technical solutions: a kind of anti-air blowing MEMS microphone, including PCB substrate, MEMS chip ontology and asic chip are fixedly connected with shell at the top of the PCB substrate, the PCB substrate Top offers acoustic aperture, and the left side at the top of the PCB substrate is fixedly connected with fixing pipe, and the fixing pipe is located at the interior of shell Chamber.

The top and bottom of the fixing pipe offer through-hole, are fixedly connected with rigidity at the top of the fixed tube cavity Back pole plate offers the first stomata at the top of the rigidity back pole plate, and the quantity of first stomata is no less than five, it is described just The bottom of property back pole plate is fixedly connected with washer, and annular through hole is offered at the center of the bead top, the washer Bottom is fixedly connected with flexible membrane, and the second stomata is offered at the center at the top of the flexible membrane, the flexible membrane Top offers third stomata, and the third stomata is located at the surrounding of the second stomata, and the quantity of the third stomata is four, institute The top that MEMS chip ontology is located at fixing pipe is stated, the asic chip is located at the right side at the top of PCB substrate.

Preferably, the two sides of the MEMS chip ontology are fixedly connected to mounting plate, and the side of the mounting plate is fixed It is connected with support frame, the bottom of support frame as described above is fixedly connected with PCB substrate.

Preferably, the inner wall of the acoustic aperture is fixedly connected with antistatic copper band, and the wall thickness of the antistatic copper band is not less than 0. 3 millimeters.

Preferably, the surface of the shell is provided with corrosion-resistant finishes, and the thickness of corrosion-resistant finishes is not less than 0. 1 millis Rice.

Preferably, the model SPH0641LM4H of the MEMS chip ontology.

Preferably, the model MAX13430E of the asic chip.

Preferably, connection is realized by bond technology between the acoustic aperture, through-hole and PCB substrate.

Compared with prior art, the beneficial effects of the utility model are as follows:

1, the utility model passes through fixing pipe, through-hole, rigid back pole plate, the first stomata, washer, annular through hole, flexibility Diaphragm, the second stomata and third stomata are used cooperatively, and are solved the anti-insufflation potential of existing MEMS microphone and are depended primarily on MEMS chip itself, the problem of being unable to control outer gas stream size, which has the advantages of anti-air blowing, adds Enter the element of the control to outer gas stream size, it is in a certain range the pressure control inside arrival MEMS chip, fabulous Protect inside chip, improve the anti-insufflation potential of microphone.

2, the utility model passes through the setting of mounting plate and support frame, can provide support to MEMS chip ontology, improve The stability of MEMS chip ontology by the setting of antistatic copper band is improved the antistatic effect of MEMS microphone, is passed through The setting of corrosion-resistant finishes extends the service life of shell.

Detailed description of the invention

FIG. 1 is a schematic structural view of the utility model；

Fig. 2 is the utility model fixing pipe structure main view sectional view；

Fig. 3 is the utility model rigid back electrode plate structure perspective view；

Fig. 4 is the utility model flexible membrane structural perspective；

Fig. 5 is the utility model gasket construction perspective view.

In figure: 1, PCB substrate；2, shell；3, acoustic aperture；4, fixing pipe；5, through-hole；6, rigid back pole plate；7, the first stomata； 8, washer；9, annular through hole；10, flexible membrane；11, the second stomata；12, third stomata；13, MEMS chip ontology；14, Asic chip；15, mounting plate；16, support frame；17, antistatic copper band.

Specific embodiment

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work Every other embodiment obtained, fall within the protection scope of the utility model.

Fig. 1-5 is please referred to, the utility model provides a kind of technical solution: a kind of anti-air blowing MEMS microphone, including PCB base Material 1, MEMS chip ontology 13 and asic chip 14, the top of PCB substrate 1 are fixedly connected with shell 2, and the top of PCB substrate 1 is opened Equipped with acoustic aperture 3, the left side at 1 top of PCB substrate is fixedly connected with fixing pipe 4, and fixing pipe 4 is located at the inner cavity of shell 2.

The top and bottom of fixing pipe 4 offer through-hole 5, and fixing pipe is fixedly connected with rigid backplane at the top of 4 inner cavity Plate 6, the top of rigid back pole plate 6 offer the first stomata 7, and the quantity of the first stomata 7 is no less than five, rigid back pole plate 6 Bottom is fixedly connected with washer 8, offers annular through hole 9 at the center at 8 top of washer, the bottom of washer 8 is fixedly connected with Flexible membrane 10 offers the second stomata 11 at the center at the top of flexible membrane 10, and the top of flexible membrane 10 offers third Stomata 12, third stomata 12 are located at the surrounding of the second stomata 11, and the quantity of third stomata 12 is four, MEMS chip ontology 13 In the top of fixing pipe 4, asic chip 14 is located at the right side at 1 top of PCB substrate.

In the utility model: the two sides of MEMS chip ontology 13 are fixedly connected to mounting plate 15, the side of mounting plate 15 It is fixedly connected with support frame 16, the bottom of support frame 16 is fixedly connected with PCB substrate 1, passes through mounting plate 15 and support frame 16 Setting can provide support to MEMS chip ontology 13, improve the stability of MEMS chip ontology 13.

In the utility model: the inner wall of acoustic aperture 3 is fixedly connected with antistatic copper band 17, and the wall thickness of antistatic copper band 17 is not small In 0. 3 millimeters, by the setting of antistatic copper band 17, the antistatic effect of MEMS microphone is improved.

In the utility model: the surface of shell 2 is provided with corrosion-resistant finishes, and the thickness of corrosion-resistant finishes is not less than 0. 1 Millimeter, by the setting of corrosion-resistant finishes, extends the service life of shell 2.

In the utility model: the model SPH0641LM4H of MEMS chip ontology 13.

In the utility model: the model MAX13430E of asic chip 14.

In the utility model: realizing connection by bond technology between acoustic aperture 3, through-hole 5 and PCB substrate 1.

Working principle: when the utility model is used, the air inflow by controlling acoustic aperture 3 reaches protection MEMS chip ontology 13 The effect of internal structure, the special designing of this patent are that the inner cavity of fixing pipe 4 has mounted rigid back pole plate 6, washer 8 and flexibility Diaphragm 10, the top of rigid back pole plate 6 are provided with the first stomata 7, the second stomata 11 are again provided on corresponding flexible membrane With third stomata 12, wherein the position of opening on rigid back pole plate 6 and flexible membrane 10 is not quite identical, rigid 6 He of back pole plate It is connected between flexible membrane 10 by washer 8, when the air-flow for entering acoustic aperture 3 is little, air-flow passes sequentially through 10 He of flexible membrane Rigid back pole plate 6 enters in 13 operatic tunes of MEMS chip ontology, and when the air-flow for entering acoustic aperture 3 becomes larger, flexible membrane 10 is in air pressure The lower generation deformation of effect is fitted on rigid back pole plate 6, since the position of opening of rigid back pole plate 6 and flexible membrane 10 is incomplete The reason of contraposition, the most of venthole of rigid back pole plate 6 is covered, and the air-flow into 13 inside cavity of MEMS chip ontology can be with Control is in lesser range, it is ensured that air blast, which impacts lower microphone, has good anti-insufflation potential.

In summary: the anti-air blowing MEMS microphone, by fixing pipe 4, through-hole 5, rigid back pole plate 6, the first stomata 7, Washer 8, annular through hole 9, flexible membrane 10, the second stomata 11 and third stomata 12 are used cooperatively, and are solved existing The problem of anti-insufflation potential of MEMS microphone depends primarily on MEMS chip itself, is unable to control outer gas stream size.

It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment Intrinsic element.

While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art, It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.

Claims

1. a kind of anti-air blowing MEMS microphone, including PCB substrate (1), MEMS chip ontology (13) and asic chip (14), special Sign is: being fixedly connected with shell (2) at the top of the PCB substrate (1), offers acoustic aperture at the top of the PCB substrate (1) (3), the left side at the top of the PCB substrate (1) is fixedly connected with fixing pipe (4), and the fixing pipe (4) is located at the interior of shell (2) Chamber；

The top and bottom of the fixing pipe (4) offer through-hole (5), are fixedly connected at the top of fixing pipe (4) inner cavity Have rigid back pole plate (6), is offered the first stomata (7) at the top of the rigidity back pole plate (6), the number of first stomata (7) Amount no less than five, the bottom of the rigidity back pole plate (6) is fixedly connected with washer (8), at the center at the top of the washer (8) It offers annular through hole (9), the bottom of the washer (8) is fixedly connected with flexible membrane (10), the flexible membrane (10) It offers at the center at top the second stomata (11), is offered third stomata (12) at the top of the flexible membrane (10), it is described Third stomata (12) is located at the surrounding of the second stomata (11), and the quantity of the third stomata (12) is four, the MEMS chip Ontology (13) is located at the top of fixing pipe (4), and the asic chip (14) is located at the right side at the top of PCB substrate (1).

2. a kind of anti-air blowing MEMS microphone according to claim 1, it is characterised in that: the MEMS chip ontology (13) Two sides be fixedly connected to mounting plate (15), the side of the mounting plate (15) is fixedly connected with support frame (16), the branch The bottom of support (16) is fixedly connected with PCB substrate (1).

3. a kind of anti-air blowing MEMS microphone according to claim 1, it is characterised in that: the inner wall of the acoustic aperture (3) is solid Surely it is connected with antistatic copper band (17), the wall thickness of the antistatic copper band (17) is not less than 0. 3 millimeters.

4. a kind of anti-air blowing MEMS microphone according to claim 1, it is characterised in that: the surface of the shell (2) is set It is equipped with corrosion-resistant finishes, the thickness of corrosion-resistant finishes is not less than 0. 1 millimeters.

5. a kind of anti-air blowing MEMS microphone according to claim 1, it is characterised in that: the MEMS chip ontology (13) Model SPH0641LM4H.

6. a kind of anti-air blowing MEMS microphone according to claim 1, it is characterised in that: the type of the asic chip (14) Number be MAX13430E.

7. a kind of anti-air blowing MEMS microphone according to claim 1, it is characterised in that: the acoustic aperture (3), through-hole (5) Connection is realized by bond technology between PCB substrate (1).