WO2020186884A1

WO2020186884A1 - Microphone and electronic device

Info

Publication number: WO2020186884A1
Application number: PCT/CN2019/130082
Authority: WO
Inventors: 庞胜利; 袁兆斌; 王顺; 衣明坤; 齐利克
Original assignee: 潍坊歌尔微电子有限公司
Priority date: 2019-03-15
Filing date: 2019-12-30
Publication date: 2020-09-24
Also published as: CN109963244A

Abstract

The present invention relates to a microphone and an electronic device. The microphone comprises an encapsulation housing having an inner cavity, and a MEMS microphone chip and an ASIC chip provided in the inner cavity of the encapsulation housing; the microphone further comprises a support layer supported in the encapsulation housing by a spacing layer, and a sealed buffer cavity is formed by being enclosed by the support layer, the spacing layer, and the encapsulation housing; a first sound hole in communication with the outside and the buffer cavity is provided on the encapsulation housing; a second sound hole in communication with the buffer cavity and the inner cavity of the encapsulation housing is provided on the support layer or the spacing layer; the microphone further comprises at least one blocking block, the blocking block is provided in the buffer cavity, a gap is formed between the blocking block and an inner wall of the buffer cavity, and projections of the first sound hole and the second sound hole on the support layer are distributed at two sides of the blocking block and do not pass an edge of the blocking block; the blocking block is configured to block a part of an airflow flowing through the buffer cavity. One technical effect of the present invention is to effectively reduce an impact force applied by an external airflow to a diagram inside the MEMS microphone chip.

Description

Microphone and electronic equipment

Technical field

The present invention relates to the field of electroacoustic technology, and more specifically, the present invention relates to a microphone and electronic equipment.

Background technique

Acoustic devices are used in many electronic devices. Acoustic devices can be used to convert electrical energy into sound energy. In recent years, as people's requirements for the performance of acoustic devices have become higher and higher, acoustic devices have shown a trend of rapid development. Among them, for the more commonly used microphone devices, people have put forward higher requirements for their signal-to-noise ratio, sensitivity, and acoustic performance. In recent years, the structural design of the microphone device has become the research focus of those skilled in the art.

Micro-Electro-Mechanical System (MEMS) is a miniaturized mechanical and electronic mechanical component made by micro-manufacturing technology. Generally, the MEMS chip and the Application Specific Integrated Circuit (ASIC) chip are packaged in the microphone device using corresponding technologies. The MEMS chip can sense acoustic signals through the vibration of the diaphragm, thereby converting the acoustic signals into electrical signals. Currently, MEMS microphone devices can be assembled into various forms of electronic products such as mobile phones, tablet computers, portable computers, VR devices, smart wearable devices, etc., and their applications are very wide.

Judging from the prior art, the MEMS chip and the ASIC chip are arranged in a package shell surrounded by a substrate and a cover, and the package shell is provided with a sound hole for external sound to enter (the sound hole can be as required Designed on the substrate or cover). However, the diaphragm in the existing MEMS chip is generally thin, and the ability of the diaphragm to resist airflow impact is weak. At this time, when a strong external airflow enters the packaging structure through the sound hole and acts on the diaphragm, the instantaneous impact force received by the diaphragm is relatively large, which can easily cause the diaphragm to rupture, damage and other undesirable phenomena. The acoustic performance of the microphone is impaired.

It can be seen that it is very necessary to propose a new technical solution for microphones to solve the problems existing in the existing technology.

Summary of the invention

An object of the present invention is to provide a new technical solution for the microphone.

According to a first aspect of the present invention, there is provided a microphone, including a packaging shell having an inner cavity, and a MEMS microphone chip and an ASIC chip arranged in the inner cavity of the packaging shell; and further comprising being supported in the packaging shell through a spacer layer The supporting layer, the supporting layer, the spacer layer, and the packaging shell enclose a closed buffer cavity; the packaging shell is provided with a first sound hole connecting the outside and the buffer cavity; the supporting layer or the spacing layer Is provided with a second sound hole communicating with the buffer cavity and the inner cavity of the packaging shell; further comprising at least one blocking block, the blocking block is arranged in the buffer cavity and has a gap with the inner wall of the buffer cavity, the first sound hole The projections of the second sound holes on the support layer are distributed on both sides of the blocking block, and do not cross the edge of the blocking block; the blocking block is configured to partially block the airflow flowing through the buffer cavity.

Optionally, the packaging shell includes a substrate and a cover that encapsulates the MEMS microphone chip and the ASIC chip together with the substrate;

Wherein, the sound hole is provided on the substrate or the cover.

Optionally, the MEMS microphone chip is fixedly arranged on the support layer, and the ASIC chip is fixedly arranged on the spacer layer.

Optionally, the MEMS microphone chip is fixedly arranged on the support layer, and the ASIC chip is fixedly arranged on the packaging shell.

Optionally, the spacer layer and the supporting layer are integrally formed; the MEMS microphone chip is arranged on the supporting layer; or the supporting layer extends into a part of the back cavity of the MEMS microphone chip.

Optionally, the thickness of the barrier block does not exceed the thickness of the spacer layer; the gap is formed at least between the barrier block and the supporting layer, or/and at least between the barrier block and the packaging shell.

Optionally, the blocking block is laminated between the packaging shell and the supporting layer, and the gap is formed between the end of the blocking block and the side wall of the buffer cavity.

Optionally, the side of the blocking block facing the first sound hole is a concave arc-shaped surface; the airflow flowing in from the first sound hole is buffered at both ends of the blocking block through the curved surface.

Optionally, the spacer layer is any one of a PCB substrate layer, a PCB copper-clad layer, and a PCB solder resist layer; or, the spacer layer is a PCB substrate layer, a PCB copper-clad layer, or a PCB solder resist layer Stacked in sequence.

According to a second aspect of the present invention, there is provided an electronic device including any of the microphones described above.

In the microphone provided by the embodiment of the present invention, the structure of the sound hole portion is improved, and a structure that has a certain buffering and blocking effect on airflow is formed here. When the external airflow flows to the diaphragm of the MEMS microphone chip, the structure can appropriately buffer and block the airflow to weaken the strength of the airflow and reduce the fluctuation of the airflow, thereby weakening the effect on the diaphragm when the airflow acts on the diaphragm. Impact force to avoid damage to the diaphragm. Moreover, it can also prevent foreign objects from entering the MEMS microphone chip to a certain extent. Since sound is transmitted in the air in the form of sound waves, the sound waves can easily pass through the structure to reach the MEMS microphone chip, so the structure does not affect the acoustic effect of the MEMS microphone chip.

Through the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings, other features and advantages of the present invention will become clear.

Description of the drawings

The drawings constituting a part of the specification describe the embodiments of the present invention, and together with the specification are used to explain the principle of the present invention.

FIG. 1 is a schematic structural diagram of a microphone provided by an embodiment of the present invention.

Fig. 2 is a schematic structural diagram of a microphone provided by another embodiment of the present invention.

Fig. 3 is an exploded view of the structure of a microphone provided by an embodiment of the present invention.

Description of reference signs:

1-MEMS microphone chip, 11-diaphragm, 12-substrate, 13-back cavity, 2-substrate, 21-first sound hole, 3-cover, 4-ASIC chip, 5-block, 6-space Layer, 61-buffer cavity, 7-support layer, 71-second sound hole.

detailed description

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless specifically stated otherwise, the relative arrangement of components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention.

The following description of at least one exemplary embodiment is actually only illustrative, and in no way serves as any limitation to the present invention and its application or use.

The technology and equipment known to those of ordinary skill in the relevant fields may not be discussed in detail, but where appropriate, the technology and equipment should be regarded as part of the specification.

In all the examples shown and discussed herein, any specific value should be interpreted as merely exemplary and not as limiting. Therefore, other examples of the exemplary embodiment may have different values.

It should be noted that similar reference numerals and letters indicate similar items in the following drawings, so once a certain item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

The microphone provided by the embodiment of the present invention can be used in various electronic products such as mobile phones, notebook computers, tablet computers, VR devices, smart wearable devices, etc., and can effectively avoid the instantaneous impact force of the diaphragm of the MEMS microphone chip due to external airflow. The phenomenon of being too large and being destroyed can extend the service life of the microphone. Moreover, the microphone can maintain excellent acoustic performance.

The specific structure of the microphone provided by the embodiment of the present invention will be further described below. Referring to the embodiment shown in FIG. 1, the microphone of the present invention includes a substrate 2 and a cover 3, and the substrate 2 and the cover 3 together form a package housing with an inner cavity; it also includes a cavity provided in the package housing MEMS microphone chip 1 and ASIC chip 4 in.

In addition, the microphone of the present invention further includes a support layer 7 supported on the substrate 2 via a spacer layer 6. The supporting layer 7, the spacer layer 6 and the substrate 2 enclose a closed buffer cavity 61. The base plate 2 is provided with a first sound hole 21 which communicates with the outside and the buffer cavity 61. The support layer 7 or the spacer layer 6 is provided with a second sound hole 71 that communicates the buffer cavity 61 and the inner cavity of the packaging shell. Among them, the first sound hole 21 and the second sound hole 71 are in communication with the buffer cavity 61, and the two can be staggered. In the present invention, the positional relationship between the first sound hole 21, the buffer cavity 61, and the second sound hole 71 can achieve a certain buffering and blocking effect on the incoming air flow while realizing the inflow of external airflow. The sound hole structure. Moreover, it can also prevent foreign objects from entering the inside of the MEMS microphone chip 1 to a certain extent. Since sound is transmitted in the air in the form of sound waves, the sound waves can easily pass through the above-mentioned sound hole structure to reach the MEMS microphone chip 1, so the above-mentioned structure will not affect the acoustic effect of the MEMS microphone chip 1.

In addition, the microphone of the present invention further includes a blocking block 5, the blocking block 5 is disposed in the buffer cavity 61, and there is a gap between the blocking block 5 and the inner wall of the buffer cavity 61. Referring to FIG. 3, the projections of the first sound hole 21 and the second sound hole 71 on the support layer 7 are distributed on both sides of the blocking block 5 and do not cross the edge of the blocking block 5. The blocking block 5 is configured to partially block the airflow flowing through the buffer cavity 61.

When the external airflow enters the buffer cavity 61 through the first sound hole 21, most of the airflow is blocked by the blocking block 5, and the airflow passes through the gap between the blocking block and the buffer cavity 61, and finally reaches the microphone through the second sound hole 71 The diaphragm.

Wherein, the position where the sound hole is opened on the substrate 2 may be a multilayer structure. In this embodiment, a spacer layer 6 and a supporting layer 7 are sequentially stacked on the substrate 2, and the substrate 2, the spacer layer 6 and the supporting plate 7 are arranged horizontally. Wherein, the spacer layer 6 and the support layer 7 may be integrally formed; or, the spacer layer 6 and the support layer 7 are bonded together by an adhesive. Of course, the spacer layer 6 and the support layer 7 can also be combined in other ways known in the art to achieve a fixed connection between the two, which is not limited in the present invention. Wherein, the spacer layer 6 and the substrate 2 may be integrally formed. Of course, the spacer layer 6 and the substrate 2 can also be combined in other ways known in the art to achieve a fixed connection between the two, which is not limited by the present invention.

Among them, the substrate 2 can be a circuit board (such as a PCB board), a glass board, a metal board, a plastic board, or a wood board, which is well known in the art. At this time, the spacer layer 6 can be any one of a PCB substrate layer, a PCB copper-clad layer, and a PCB solder resist layer; or the spacer layer 6 adopts a PCB substrate layer, a PCB copper-clad layer, and a PCB solder resist layer stacked in sequence Become. At this time, the supporting layer 7 is provided on the spacer layer 6. Optionally, the supporting layer 7 may also be a glass plate, a metal plate, a plastic plate, a wooden plate, or a circuit board. In fact, at least one of the substrate 2, the spacer layer 6 and the support layer 7 is a circuit board for implementing the circuit design of the microphone, which is not limited by the present invention.

The structure of the cover 3 is that it may include a top opposite to the substrate 2 and a side wall extending from the peripheral edge of the top toward the substrate 2. The side wall and the top part enclose a semi-enclosing structure of the cover 3, and the substrate 2 is fixedly arranged at the opening end of the cover 3, and the two together form a packaging structure with a closed space. Wherein, the MEMS microphone chip 1 and the ASIC chip 4 are packaged in the enclosed space together. In this embodiment, the cover 3 can be made of metal materials to ensure that the formed packaging structure has an electromagnetic shielding effect, and that the working performance of the MEMS microphone chip 1 and the ASIC chip 4 inside will not be affected by the outside world. So as to ensure that the entire microphone packaging structure can work normally. Of course, the cover 3 can also be made of other materials well-known in the art, which is not limited by the present invention.

In the microphone of the present invention, the external airflow and sound waves can reach the inside of the MEMS microphone chip 1 through the first sound hole 21, the buffer cavity 61 and the second sound hole 71 in sequence, and act on the diaphragm 11, thereby realizing the MEMS microphone chip 1 Collection of sound wave information. Among them, the MEMS microphone chip 1 is a transducer component that converts sound signals into electrical signals. The MEMS microphone chip 1 is manufactured using MEMS (Micro Electro Mechanical System) technology. Among them, the ASIC chip 4 and the MEMS microphone chip 1 are connected together, so that the electrical signal output by the MEMS microphone chip 1 can be transmitted to the ASIC chip 4 and processed and output by the ASIC chip 4. In this embodiment, the MEMS microphone chip 1 and the ASIC chip 4 may be electrically connected through metal wires (bonding wires) to realize the conduction between the two. Of course, the MEMS microphone chip 1 and the ASIC chip 4 can also be turned on through the circuit layout in the substrate 2 in a flip-chip manner, which belongs to the common knowledge of those skilled in the art, and the present invention will not be described in detail here.

The MEMS microphone chip 1 and the ASIC chip 4 are packaged in the inner cavity of the package housing together. In this embodiment, referring to FIG. 1, the MEMS microphone chip 1 can be fixedly arranged on the support layer 7 by an adhesive, and the ASIC chip 4 can be fixedly arranged on the spacer layer 6 by an adhesive. It should be noted that the specific fixing method of the MEMS microphone chip 1 and the ASIC chip 4 is not limited in the present invention. In addition to the adhesive fixing described above, other fixing methods well known in the art can also be used. When the ASIC chip 4 is arranged on the spacer layer 6, the size of the spacer layer 6 can be designed to be the same as the size of the substrate 2 to facilitate the installation of the ASIC chip 4. At this time, the spacer layer 6 and the substrate 2 may both have a flat structure, the spacer layer 6 and the substrate 2 are integrally formed, and the cover 3 and the spacer layer 6 are attached together.

In the alternative embodiment shown in FIG. 2, the size of the spacer layer 6 is designed to be smaller than the size of the substrate 2, so that the substrate 2 is partially exposed, and the substrate 12 of the MEMS microphone chip 1 is fixedly arranged on the support layer 7. , And the ASIC chip 4 is arranged on the substrate 2.

As shown in FIG. 1, the structure of the MEMS microphone chip 1 is as follows: a substrate 12 with a back cavity 13 and a diaphragm 11 and a back plate provided on the substrate 12, and a plurality of Vias. When the MEMS microphone chip 1 is fixed on the support layer 7, the end of the substrate 12 away from the diaphragm 11 is actually fixed on the support layer 7. At this time, the support layer 7 may have a flat structure.

The support layer 7 and the spacer layer 6 can be integrally formed, or they can be bonded together with an adhesive to achieve a stable combination of the two. In addition, the support layer 7 can also be extended into a part of the back cavity 13 of the MEMS microphone chip 1 as a whole. That is to say, the space in the back cavity 13 can be used to accommodate the support layer 7 with a certain height. This design can appropriately reduce the size of the entire microphone in the height direction. When it is applied to electronic products, it is beneficial to realize electronic Lightweight and thin products. Moreover, this method does not affect the volume of the entire package cavity, and can ensure the acoustic performance of the microphone package structure.

In addition, it should be noted that this embodiment is only a specific implementation of the microphone of the present invention. In a specific application, the sound hole can be provided on the cover 3, and the spacer layer 6, the support layer 7 and the cover 3 surround It became a closed buffer chamber. The present invention does not limit this.

In this embodiment, the projections of the first sound hole 21 and the second sound hole 71 on the support layer 7 are located on both sides of the blocking block and do not cross the edge of the blocking block. When the external air flows through the sound hole structure to the diaphragm 11 of the MEMS microphone chip 1, the sound hole structure can buffer and block the air flow to a certain extent, thereby weakening the intensity of the instantaneous air flow entering the MEMS microphone chip 1 , And weaken the fluctuation of the airflow, thereby preventing the diaphragm 11 of the MEMS microphone chip 1 from being impacted by the instantaneous strong airflow, and preventing the diaphragm 11 of the MEMS microphone chip 1 from being damaged due to excessive external airflow. That is to say: this structural design can improve the ability of the microphone diaphragm 11 to resist the impact of external airflow. Moreover, since sound is usually transmitted in the air in the form of sound waves, the sound can easily penetrate the above-mentioned structure, so the structural design does not affect the acoustic effect of the microphone. Compared with the conventional sound hole, the sound hole structure of the present invention has a certain dust-proof effect, which can reduce the risk of foreign matter entering the MEMS microphone chip 1 and the ASIC chip 4.

It should be noted that the first acoustic hole 21 may have a through-hole structure or another structure that penetrates the substrate 2. Similarly, the buffer cavity 61 may have a through hole structure or other structures that penetrate the spacer layer 6. Similarly, the second acoustic hole 71 may be a through hole structure, or another structure that penetrates the support layer 7, which is not limited in the present invention.

Referring to FIG. 1 and FIG. 3, in this embodiment, the first sound hole 21 may be provided as one. Of course, the number of the first sound holes 21 can also be set as multiple as needed, and the present invention does not limit this. The first sound hole 21 penetrates the upper and lower surfaces of the substrate 2 and communicates with the outside and the buffer cavity 61. The projection of the first sound hole 21 falls into the area where the buffer cavity 61 is located, and can be used to introduce airflow and sound waves. Among them, the first sound hole 21 can be a round hole, a square hole, a rectangular hole, an oval hole, a triangular hole, a rhombus hole or a parallelogram hole and other hole types well known in the art, which can be flexibly adjusted according to the actual situation. This is not limited. Various forms of the first sound hole 21 can achieve the technical effects of the present invention, which is more conducive to processing and manufacturing, and has higher practicability and reliability. However, it should be noted that the size of the first sound inlet hole 21 is not easy to be too large, otherwise the effect of buffering and blocking the airflow will be significantly reduced, and the effect of reducing the intensity of the instantaneous airflow entering the MEMS microphone chip 1 will be reduced.

Referring to FIG. 1 and FIG. 3, in this embodiment, the second sound hole 71 may be provided as one. Of course, the second sound hole 71 can also be provided in multiples as required, which is not limited in the present invention. The second sound hole 71 penetrates the upper and lower surfaces of the support layer 7 and communicates with the buffer cavity 61 and the MEMS microphone chip 1. The projection of the second sound hole 71 falls into the area where the buffer cavity 61 is located, and can be used to realize the introduction Air currents and sound waves. Among them, the second sound hole 71 can be a round hole, a square hole, a rectangular hole, an oval hole, a triangular hole, a rhombus hole or a parallelogram hole and other hole types well known in the art, which can be flexibly adjusted according to the actual situation. This is not limited. Various forms of the second sound hole 71 can achieve the technical effects of the present invention, which is more conducive to processing and manufacturing, and has higher practicability and reliability. However, it should be noted that the size of the second sound hole 71 is not easy to be too large, otherwise the buffering and blocking effect of the air flow will be significantly reduced, and the effect of reducing the intensity of the instantaneous air flow entering the MEMS microphone chip 1 will be reduced.

The shape of the first sound hole 21 and the second sound hole 71 may be the same or different. In addition, the number of the first sound holes 21 and the second sound holes 71 may be the same or different.

For the spacer layer 6 and the supporting layer 7, the thickness should be selected reasonably. If the thickness of the spacer layer 6 and the support layer 7 is too thick, it is not conducive to the packaging of the MEMS microphone chip 1 and the ASIC chip 4, which will increase the difficulty of the packaging process and increase the cost. At the same time, it is not conducive to miniaturization and miniaturization of the microphone. Therefore, it should be adjusted reasonably according to the actual situation.

In this embodiment, referring to FIG. 3, one blocking block 5 may be provided. Of course, the blocking block 5 can also be provided in multiples as required, which is not limited in the present invention.

Wherein, the blocking block 5 is disposed in the buffer cavity 61, and the blocking block 5 is laminated between the substrate 2 and the support layer 7, and a gas flow is provided between the end of the blocking block 5 and the side wall of the buffer cavity 61. Clearance. At this time, when the external airflow enters the buffer chamber 61 through the first sound hole 21, the blocking block 5 can be used to block most of the airflow and allow the airflow to flow to the second sound hole 71 through the gap, and then the second sound hole 71 The hole 71 flows into the MEMS microphone chip 1 and contacts the diaphragm 11. This design can prevent the airflow from the outside from directly acting on the diaphragm 11, and cause excessive instantaneous impact on the diaphragm 11, which can effectively buffer and block the airflow to achieve the protection of the diaphragm 11 .

The thickness of the blocking block 5 can be designed to not exceed the thickness of the spacer layer 6. At this time, when the blocking block 5 is disposed in the buffer cavity 61, a gap may be formed between the blocking block 5 and the supporting layer 7, or/and, a gap may also be formed between the blocking block 5 and the substrate 2. At this time, the air flow can also flow into the MEMS microphone chip 1 to contact the diaphragm 11 through these gaps.

In order to enable the blocking block 5 to be stably arranged in the buffer cavity 61, the blocking block 5 and the substrate 2 may be integrally arranged, or the blocking block 5 and the supporting layer 7 may be integrally arranged, or the blocking block 5 and the spacer layer 6 may be directly arranged. One set. It should be noted that the specific method of the blocking block 5 is not further limited in the present invention, and can be flexibly adjusted according to actual conditions.

Wherein, referring to FIG. 3, the side of the blocking block 5 facing the first sound hole 21 is a concave arc surface. The effect of this design is that the air flow flowing in from the first sound hole 21 is buffered on both sides of the blocking block 5 through the arc-shaped surface.

In another aspect, the present invention also provides an electronic device, which includes the microphone as described above. For the specific structure of the microphone, refer to Embodiment 1 and Embodiment 2 described above.

Among them, the electronic device may be a mobile phone, a notebook computer, a tablet computer, a VR device, a smart wearable device, etc., which is not limited in the present invention.

Although some specific embodiments of the present invention have been described in detail through examples, those skilled in the art should understand that the above examples are only for illustration and not for limiting the scope of the present invention. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present invention. The scope of the invention is defined by the appended claims.

Claims

A microphone, characterized in that it comprises a packaging shell with an inner cavity, and a MEMS microphone chip and an ASIC chip arranged in the inner cavity of the packaging shell;

It also includes a support layer supported in the packaging shell through a spacer layer. The support layer, the spacer layer, and the packaging shell enclose a closed buffer cavity; the packaging shell is provided with a first sound connecting the outside and the buffer cavity. Hole; the support layer or the spacer layer is provided with a second sound hole communicating the buffer cavity and the inner cavity of the packaging shell;

It also includes at least one blocking block, the blocking block is arranged in the buffer cavity and has a gap with the inner wall of the buffer cavity, and the projections of the first sound hole and the second sound hole on the support layer are distributed on the block On both sides, and does not go over the edge of the blocking block; the blocking block is configured to partially block the airflow flowing through the buffer cavity.
The microphone according to claim 1, wherein the package housing comprises a substrate and a cover that encapsulates the MEMS microphone chip and the ASIC chip together with the substrate;

Wherein, the sound hole is provided on the substrate or the cover.
The microphone of claim 1, wherein the MEMS microphone chip is fixedly arranged on the supporting layer, and the ASIC chip is fixedly arranged on the spacer layer.
The microphone according to claim 1, wherein the MEMS microphone chip is fixedly arranged on the supporting layer, and the ASIC chip is fixedly arranged on the packaging shell.
The microphone of claim 1, wherein the spacer layer and the support layer are integrally formed;

The MEMS microphone chip is arranged on the support layer; or, the support layer extends into a part of the back cavity of the MEMS microphone chip.
The microphone according to claim 1, wherein the thickness of the blocking block does not exceed the thickness of the spacer layer;

The gap is formed at least between the barrier block and the support layer, or/and at least between the barrier block and the packaging shell.
The microphone according to claim 1, wherein the blocking block is laminated between the packaging shell and the supporting layer, and the gap is formed between the end of the blocking block and the side wall of the buffer cavity.
8. The microphone according to claim 7, wherein the side of the blocking block facing the first sound hole is a concave arc surface; the airflow flowing in from the first sound hole passes through the arc facing both ends of the blocking block buffer.
The microphone according to claim 1, wherein the spacer layer is any one of a PCB substrate layer, a PCB copper layer, and a PCB solder resist layer;

or,

The spacer layer is formed by stacking a PCB substrate layer, a PCB copper-clad layer, and a PCB solder resist layer in sequence.
An electronic device, characterized by comprising the microphone according to any one of claims 1-9.