CN211557479U - Dustproof structure, microphone packaging structure and electronic equipment - Google Patents

Abstract

The utility model discloses a dustproof construction, microphone packaging structure and electronic equipment. The dustproof structure comprises a carrier and a grid part; the carrier is a hollow structure, the carrier comprises a plurality of supporting layers arranged along the height direction, each grid part comprises a grid structure and fixing parts arranged around the grid structure, the fixing parts are connected with the carrier, the grid structures are opposite to the hollow structures, and the thermal expansion coefficient of at least one supporting layer is different from that of other supporting layers except the supporting layer.

Description

Dustproof structure, microphone packaging structure and electronic equipment

Technical Field

The utility model relates to an electroacoustic conversion technology field, more specifically, the utility model relates to a dustproof construction, microphone packaging structure and electronic equipment.

Background

With the rapid development of electroacoustic technology, various electroacoustic products are developed. A microphone, as a transducer for converting sound into an electrical signal, is one of the very important devices in electro-acoustic products. Nowadays, microphones have been widely applied to various types of electronic products such as mobile phones, tablet computers, notebook computers, VR devices, AR devices, smartwatches, and smart wearing. In recent years, for a microphone packaging structure, the design of the structure thereof has become an important point and a focus of research by those skilled in the art.

The existing microphone package structure is generally: the chip package comprises a shell with a containing cavity, and components such as a chip assembly (for example, a MEMS chip and an ASIC chip) are contained and fixed in the containing cavity; and a sound pickup hole is also arranged on the shell. However, in long-term application, it is found that external particles and foreign matters such as dust and impurities are easily introduced into the accommodating cavity of the microphone through the sound pickup hole, and the external particles and foreign matters cause certain damage to components such as a chip assembly in the accommodating cavity, and finally affect the acoustic performance and the service life of the microphone.

In view of the above problems, the prior art generally adopts a solution that a corresponding isolation component is disposed on a sound pickup hole of a microphone package structure to block the entry of external particles, foreign matters, and the like. The conventional insulation assembly, as shown in fig. 1, includes a carrier a2 and a screen a 1. When the isolation component is used, the isolation component is installed on the sound pickup hole. However, the carrier a2 and the screen a1 are generally fabricated on a flat substrate. The purpose is to maintain flatness to prevent the mesh a1 from being damaged. After fabrication, the isolation assembly is transferred to another substrate and/or a flexible board. After fabrication, the isolation component is separated from the wafer and assembled as part of microphone a 4.

For example, a die bonding process is used and the adhesive a3 is cured at an elevated temperature. When the insulation assembly is heated, the expansion of the screen a1 and carrier a2 will vary depending on the CTE (coefficient of thermal expansion) of each material, typically resulting in warpage and/or deformation of the carrier. Before the temperature returns to room temperature, adhesive a3 has cured and prevented the insulation assembly from returning to its original dimensions, so warping and/or deformation remains. Residual warping and/or deformation may cause screen a1 to wrinkle and even cause screen a1 to fail or break.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a dustproof construction, microphone packaging structure and electronic equipment's new technical scheme.

According to the utility model discloses an aspect provides a dustproof construction. The dustproof structure comprises a carrier and a grid part; the carrier is a hollow structure, the carrier comprises a plurality of supporting layers arranged along the height direction, each grid part comprises a grid structure and fixing parts arranged around the grid structure, the fixing parts are connected with the carrier, the grid structures are opposite to the hollow structures, and the thermal expansion coefficient of at least one supporting layer is different from that of other supporting layers except the supporting layer.

Optionally, the supporting layer connected to the fixing portion is defined as a first supporting layer, the supporting layers are sequentially arranged from the first supporting layer to the outside, the outermost layer is an nth supporting layer, where N is greater than or equal to 2, and a thermal expansion coefficient of the nth supporting layer is greater than a thermal expansion coefficient of the nth-1 supporting layer.

Optionally, the number of support layers is three.

Optionally, the material of the carrier is an organic material, and the material of the mesh portion is a metal.

Optionally, the grid part further includes a stress buffer area connected between the fixing part and the grid structure, and the stress buffer area is arranged in a suspended manner.

Optionally, an elastic structure is formed in the stress buffer area through hollowing.

Optionally, at least one of the support layers is prepared from a dry film resist.

According to a second aspect of the present disclosure, a microphone package structure is provided. The packaging structure comprises a shell with an accommodating cavity, wherein a sound pickup hole is formed in the shell; still include foretell dustproof construction, dustproof construction sets up on the sound picking hole.

Optionally, the dust-proof structure is located outside the housing.

Optionally, the housing includes a substrate and an encapsulation cover, and the substrate and the encapsulation cover enclose the accommodation cavity;

the dustproof structure is accommodated in the accommodating cavity.

Optionally, the pickup hole is located on the encapsulation cover, and the dust-proof structure is fixedly connected with the encapsulation cover.

Optionally, a sound pickup hole is located on the package cover, and the dust-proof structure is fixedly connected to the substrate at a position corresponding to the sound pickup hole.

Optionally, the sound pickup hole is located on the substrate, and the dust-proof structure is fixedly arranged on the substrate at a position corresponding to the sound pickup hole.

Optionally, the pickup hole is located on the substrate, the dustproof structure is fixedly arranged on the substrate at a position corresponding to the pickup hole, and the MEMS chip is arranged on the dustproof structure.

According to a third aspect of the present disclosure, an electronic device is provided. The electronic equipment comprises the microphone packaging structure.

Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments of the invention, which proceeds with reference to the accompanying drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.

FIG. 1 is a side view of a prior art insulation assembly.

Fig. 2 is a cross-sectional view of a dust-proof structure according to an embodiment of the present disclosure.

Fig. 3 is a sectional view of a second dust-proof structure according to an embodiment of the present disclosure.

Fig. 4 is a sectional view of a third dust prevention structure according to an embodiment of the present disclosure.

Fig. 5 is a schematic diagram of a microphone package structure according to an embodiment of the disclosure.

Fig. 6 is a schematic diagram of a second microphone package structure according to an embodiment of the disclosure.

Fig. 7 is a schematic diagram of a third microphone package structure according to an embodiment of the present disclosure.

Fig. 8 is a top view of a support layer according to an embodiment of the present disclosure.

FIG. 9 is a partial view of a stress buffer according to an embodiment of the present disclosure.

Fig. 10 is a schematic diagram of a fourth microphone package structure according to an embodiment of the disclosure.

Fig. 11 is a schematic diagram of a fifth microphone package structure according to an embodiment of the disclosure.

Detailed Description

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: unless specifically stated otherwise, the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention.

The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.

In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

According to one embodiment of the present disclosure, a dust-proof structure is provided. The dustproof structure can be applied to a microphone packaging structure. This dustproof construction can effectively the outside particulate matter of separation, foreign matter enter into microphone packaging structure's inside through the sound hole of picking up on the microphone packaging structure to can protect each components and parts of microphone inside effectively, in order to avoid influencing MEMS microphone chip's acoustic performance and life.

As shown in fig. 2 to 3, the dustproof structure includes a carrier 1 and a mesh portion 2.

The carrier 11 is a hollow structure 104, and an airflow channel is formed inside the hollow structure 104 for passing through the vibrating airflow. The carrier 1 comprises a plurality of support layers arranged one above the other. For example, a first support layer 101, a second support layer 102, a third support layer 103. Of course, the number of the supporting layers is not limited herein, and can be set by those skilled in the art according to actual needs.

For example, the support layer may be in the form of a ring, such as a circular ring, a rectangular ring, a racetrack, or other shaped ring structure. A plurality of support layers are joined together to form a laminated structure.

For example, the cross-sections of the support layers are identical to form a carrier 1 with a uniform wall thickness.

For example, the support layers may be different in cross-section so long as they can be laminated together to form the hollow structure 104.

At least one supporting layer forms a stress relieving part which is made of a material different from that of other supporting layers except the supporting layer. Different materials are for example different thermal expansion coefficients of the support layer and the other support layers. The coefficient of thermal expansion refers to the change in the amount of length of the support layer per unit change in temperature. The different thermal expansion coefficients lead to that the supporting layer with higher thermal expansion coefficient can absorb more deformation in the heating and cooling processes of the carrier, so that the stress of the carrier 1 is reduced.

In the embodiment of the present disclosure, by providing the stress relief portion, the warpage and/or deformation of the carrier 1 can be effectively absorbed, thereby reducing or even avoiding the generation of wrinkles or breakage of the mesh portion 2.

The material of the support layer can be, but is not limited to, an organic material, an inorganic non-metallic material, or a metallic material. For example, the organic material includes plastic and the like. Inorganic non-metallic materials include silicon, silicon oxide, silicon nitride, and the like. The metal material includes stainless steel, copper alloy, aluminum alloy, gold, silver, and the like.

Of course, the material of the carrier 1 is not limited to the above-mentioned embodiments, and those skilled in the art can set the material according to actual needs.

The cross section of the carrier 1 is rectangular, circular, elliptical, hexagonal, etc. For example, in this example, the carrier 1 has a square cross-section with sides of 800 μm to 1500 μm. The sides of the squares are equal, and the deformation is small.

The cross-section of the hollow structure 104 is circular, oval, triangular, rectangular, hexagonal, racetrack, etc. For example, the hollow structure 104 has a circular cross-section with a diameter of 500 μm to 1200 μm.

The mesh part 2 is disposed at one end of the carrier 1 and covers the hollow structure 104. The mesh part 2 comprises a mesh structure, an edge part 110 arranged around the mesh structure. The lattice structure 21 is opposite to the hollow structure 104. The mesh structure is formed with a screen. The screen mesh has a set mesh number so that foreign substances, dust, particles, and the like can be filtered. The mesh number of the screen can be set according to actual needs by those skilled in the art.

The edge portion 110 is connected to the carrier 1. The fixing portion 22 is connected to the edge portion 110 of the carrier 1 by means of, for example, an adhesive or bonding.

In one example, the supporting layer connected to the fixing portion is defined as a first supporting layer 101, the supporting layers are sequentially arranged from the first supporting layer to the outside, the outermost layer is an nth supporting layer, where N is greater than or equal to 2, and the thermal expansion coefficient of the nth supporting layer is greater than that of the nth-1 supporting layer.

For example, as shown in fig. 3, in this example, three support layers are provided that are laminated together. The first supporting layer 101 is connected to the fixing portion. The third support layer 103 is used for connection with external devices. The third support layer 103 is bonded to the PCB of the external device by, for example, an adhesive. The thermal expansion coefficient of the second support layer 102 is larger than that of the first support layer 101. The third support layer 103 has a thermal expansion coefficient greater than that of the second support layer 102.

In this example, the thermal expansion coefficient of the support layer (e.g., the first support layer 101) connected to the mesh portion 2 is minimized, and in this way, it is ensured that the portion where the mesh portion 2 is located is minimally deformed when the external temperature changes.

In addition, the supporting layer (e.g., the third supporting layer 103) connected to the external device has the largest thermal expansion coefficient, so that the supporting layer has a stronger ability to absorb deformation, thereby reducing the stress of the carrier.

In addition, the thermal expansion coefficients of the first supporting layer 101 to the nth supporting layer are gradually increased, so that the shrinkage and expansion of different supporting layers can be more adaptive, and the carrier cannot generate plastic deformation or even fracture.

In one example, the material of the carrier 1 is an organic material, and the material of the mesh portion is a metal. For example, the support layers are made of plastics with different coefficients of thermal expansion. The grid part is made of a metal material. The elastic deformation capability of the grid part is strong, and wrinkles are not easy to form. The organic material has high elasticity and is favorable for absorbing deformation.

In one example, as shown in fig. 2, the support layers are two layers, such as a first support layer 101 and a second support layer 102. The two support layers 101,102 are connected together. The structure of the carrier 1 is simple. A stress relief portion is provided in one of the support layers (e.g., the second support layer 102); the other support layer (e.g., the first support layer 101) is a solid structure.

For example, at least one of the support layers is prepared from a dry film resist. For example, a predetermined pattern is formed by a dry film resist, and an unnecessary portion is etched to form the hollow structure 104, and the support layer is finally formed. The dry film resist has the characteristic of high molding precision.

In one example, as shown in fig. 3, at least one of the support layers has a groove 102a extending in a height direction, and at least one of the support layers has a solid structure. The grooves 102a are provided to effectively absorb the deformation of the carrier 1 and prevent the grid portion 2 from being wrinkled.

The cross-sectional shape of the groove 102a is circular, rectangular, arcuate, elliptical, triangular, or other shape. The grooves 102a can absorb deformation.

For example, the support layer (e.g., the first support layer 101) connected to the mesh part 2 is a solid structure, and the support layer (e.g., the second support layer 102) located below the support layer (e.g., the first support layer 101) has the grooves 102 a. In this example, the second support layer 102 can effectively absorb the deformation of the carrier 1.

In addition, the first supporting layer 101 can be matched with the taking and placing of a dustproof structure. For example, the dust-proof structure is transferred by means of grabbing or vacuum suction. The clamping jaw or suction nozzle of the transfer device applies force to the first supporting layer 101, and the first supporting layer 101 has a solid structure, so that the first supporting layer has high structural strength. Compared with the second supporting layer 102, the first supporting layer 101 is less prone to be damaged by a clamping jaw or a suction nozzle, so that the integrity of the dustproof structure can be maintained in the process of taking and placing.

Of course, in other examples, the positions of the first supporting layer 101 and the second supporting layer 102 are interchanged, and the dust-proof structure can be taken and placed by vacuum suction.

In one example, as shown in fig. 8, the trenches 102a are multiple and uniformly distributed on the support layer where the stress relief portion is located. For example, the second support layer 102 has a plurality of trenches 102a formed therein. A plurality of different locations distributed over the end face of the second support layer 102. In this way, the plurality of grooves 102a can absorb deformation of the carrier 1 from different orientations.

For example, a plurality of grooves 102a are evenly distributed around the hollow structure 104. In this way, the ability of the carrier 1 to absorb deformations is greater.

In one example, as shown in fig. 8, the via includes a plurality of arc-shaped grooves 102a arranged concentrically. The connecting portions 112 are formed between the adjacent arc-shaped grooves 102 a. For example, the hollow structure 104 is circular in cross-section. A plurality of arcuate channels 102a are disposed around the hollow structure 104. The arc-shaped groove 102a is concentrically arranged with respect to the center of the hollow structure 104. The arc-shaped groove 102a can effectively absorb the deformation of the edge portion 110.

For example, as shown in fig. 8, the arc-shaped grooves 102a are four and cover four corners of the square carrier 1, respectively, and have a symmetrical structure with respect to a diagonal line, or cover four sides, and have a symmetrical structure with respect to a perpendicular bisector of the side. This arrangement results in a more uniform deformation absorbing capacity of the elastic structure.

In one example, as shown in fig. 8, a plurality of layers of the arc-shaped grooves 102a are provided in the radial direction of the carrier 1. For example, the multi-layer arc-shaped grooves 102a are arranged in the radial direction. Each layer is provided with a plurality of the arc-shaped grooves 102 a. The multi-layered arc-shaped grooves 102a can absorb the deformation of the carrier 1 more effectively, reducing the stress concentration.

Furthermore, the connecting portions 112 between the multiple layers and in each layer together form a skeleton structure having a greater elastic restoring force, so that the carrier 1 has a greater ability to recover deformation.

For example, the number of layers of the arc-shaped groove 102a is less than 5. This makes the carrier 1 more structurally strong and resistant to deformation. The arc-shaped grooves 102a are 2 layers in fig. 8, thereby simplifying the structure of the carrier 1.

In one example, as shown in fig. 8, the connection portions 112 of two adjacent layers are offset. That is, the two connecting portions 112 are not located in the same diametrical direction. In this way, the connection 112 can form a grid connection with the parts of the layers up to now. Thus, if a local deformation of the carrier 1 occurs, the deformation is diffused to other parts through the mesh connection, and the deformation is dispersed at each part of the mesh connection. This results in a more balanced ability of the elastic structure to absorb deformation in all directions relative to the hollow structure 104.

Alternatively, multiple layers of the connecting portion 112 may be connected together to form a radial shape. In this example, the arc-shaped grooves 102a corresponding to the positions of the plurality of layers are distributed in the same fan-shaped structure. The radial connection provides greater strength to the spring structure.

In one example, the inside of the buffer forms a closed annular wall. The annular wall portion can form a barrier to the resilient structure, improving the durability of the resilient structure.

In one example, as shown in fig. 4, the mesh part 2 includes a mesh structure 21, a stress buffering region 23 disposed around the mesh structure, and a fixing part 22 disposed around the stress buffering region 23. The grid structure 21 and the stress buffer area 23 are suspended. The fixing portion 22 may be used to connect the mesh portion 2 with the carrier 1, for example, the fixing portion 22 is connected with an edge portion, so that the mesh portion 2 can stably cover the carrier 1. The stress buffer 23 is a region which is not provided with meshes and is not connected with the edge portion. The stress buffer 23 can further reduce the influence of the deformation of the carrier on the lattice structure.

In one example, as shown in fig. 4, a material removing process is performed on a portion of the first support layer 101 corresponding to the stress buffer area 23 to form a step structure 101a, so that the stress buffer area 23 is suspended.

The stress buffer region 23 is a ring structure having a predetermined width α. It should be noted that, the stress buffer area 23 may be, for example, a circular ring structure with a predetermined width α, a square ring structure with a predetermined width α, or another circular ring structure with a predetermined width α, and those skilled in the art can flexibly adjust the structure according to specific situations, which is not limited by the present disclosure.

In one example, as shown in fig. 9, an elastic structure is formed in the stress buffer region 23 by hollowing. For example, the stress buffering region 23 is hollowed out to form an elastic expansion structure 23 a. An annular band 23b is formed between the hollowed-out holes and the lattice structure to ensure sufficient strength of the lattice structure 21. The elastically stretchable structure 23a can be elastically deformed to absorb the deformation of the carrier 1. This is so that deformations of the carrier 1 are not transmitted to the lattice structure 21. In fig. 9, a represents a contracted state and B represents an expanded state.

Fig. 3 is a sectional view of a dust prevention structure according to another embodiment of the present disclosure. In this example, the carrier further comprises a third support layer 103. The third support layer 103 is a solid structure and is attached to the lower end surface of the second support layer 102. In this example, the third support layer 103 acts as a reinforcing structure, preventing the grooves 102a from being exposed, which makes the structural strength of the carrier higher.

In other examples, the groove 102a is provided on at least one of the first support layer 101 and the third support layer 103. This arrangement can also serve to absorb deformation of the carrier.

According to another embodiment of the present disclosure, a microphone package structure is provided. The microphone packaging structure can be applied to various electronic products such as mobile phones, notebook computers, tablet computers, game machines, interphones, VR equipment and intelligent wearable equipment.

This microphone packaging structure can effectively avoid components and parts such as inside chip module to receive particulate matter such as outside dust, impurity, foreign matter's influence and suffer the phenomenon of destruction, can prolong MEMS microphone chip's life, but also can make MEMS microphone chip keep good acoustic performance.

The specific structure of the microphone package structure provided by the embodiments of the present disclosure is further described below.

As shown in fig. 5 to 7 and 10 to 11, a microphone package structure provided by the embodiment of the present disclosure includes a housing 3 having a receiving cavity, and a sound pickup hole 4 is provided on the housing 3. The microphone packaging structure provided by the present disclosure further includes the above-mentioned dustproof structure, and the dustproof structure is fixedly installed on the sound pickup hole 2. The dustproof structure can effectively protect components inside the microphone packaging structure.

In one example, the pick-up hole may be, for example, circular, square, triangular, oval, etc. in shape. The pickup hole can be one or more according to the requirement. The specific setting position of the sound pickup hole can also be flexibly adjusted according to the specific condition of the microphone packaging structure, and the disclosure does not limit the specific setting position.

In one example, as shown in fig. 5, the dust-proof structure may be located outside the housing 3. That is, the sound pickup hole 4 is protected from the outside. In this example, the dust-proof structure is mounted outside the microphone package structure, and does not occupy the space inside the microphone package structure. When the dustproof structure is installed, the dustproof structure can be reasonably installed according to the position of the sound pickup hole 4, so that the dustproof structure can be aligned to the sound pickup hole 4, and external particles and foreign matters can be prevented from being introduced into the microphone packaging structure through the sound pickup hole 4.

Of course, the present disclosure is not limited to the dust-proof structure being provided outside the housing 3, and the dust-proof structure may be provided in the housing cavity of the housing 3. The technical personnel in the field can flexibly adjust the arrangement position of the dustproof structure according to specific needs.

In one example, the microphone package structure, the structure of the casing 3 is: the substrate 32 and the packaging cover 31 are included, and the substrate 32 and the packaging cover 31 together enclose the accommodating cavity. The dust-proof structure is accommodated in the accommodating cavity of the housing 3.

In one example, as shown in fig. 6, the sound pickup hole is located on the package cover 31, and the dust-proof structure is fixedly connected to the package cover. Dustproof construction's position corresponds to pickup hole 4, can avoid outside particulate matter, foreign matter to introduce inside microphone packaging structure through pickup hole 4.

In one example, as shown in fig. 7, the sound pickup hole is located on the package cover 31, and the dust-proof structure is fixedly connected to the substrate 32 at a position corresponding to the sound pickup hole 4. At this moment, the dustproof structure can effectively protect the chip in the microphone packaging structure.

In the present invention, the sound collecting hole 4 is not limited to be provided in the sealing cover 31 of the housing 3, and may be provided in the base plate 32. For example, as shown in fig. 10, the sound collecting hole 4 is located on the substrate 32, and the dust-proof structure is fixedly provided on the substrate 32 at a position corresponding to the sound collecting hole 4. For another example, as shown in fig. 11, the sound collecting hole 4 is located on the substrate 32, the dust-proof structure is fixedly provided on the substrate 32 at a position corresponding to the sound collecting hole 4, and the MEMS chip 5 is provided on the dust-proof structure. It should be noted that, when the sound-collecting hole 4 is formed in the substrate 32, a person skilled in the art may adjust the installation position of the dust-proof structure according to specific situations, as long as the person can prevent external particles and foreign matters from entering or can protect the internal chip, and the invention is not limited thereto.

Wherein the package cover 31 has a dish-shaped structure with an open end. The material of the package cover 31 may be, for example, a metal material, a plastic material, or a PCB. The shape of the sealing cap 31 may be, for example, a cylindrical shape or a rectangular parallelepiped shape. The person skilled in the art can flexibly adjust the device according to the actual needs without limitation.

The substrate 32 may be a circuit board known in the art, such as a PCB, without limitation. The package cover 31 and the substrate 32 may be fixed together by, for example, adhesive bonding or solder paste welding, and those skilled in the art can flexibly select the combination according to the needs without limitation.

The utility model provides a microphone packaging structure is fixed in the chamber that holds of shell 3 and is acceptd the microphone device. Specifically, as shown in fig. 5 to 7 and 10 to 11, the microphone device may include, for example, a MEMS chip 5 and a signal amplifier 6.

The MEMS chip 5 includes a substrate and an inductive film. The substrate is also a hollow structure. The sensing film is, for example, a piezoelectric element, a capacitive element, a piezoresistive element, or the like. The sensing film is arranged at one end of the substrate and covers the hollow structure of the substrate. The hollow structure forms a back cavity. When the MEMS chip 5 is fixed in the housing chamber, the MEMS chip 5 may be attached to the substrate 32. Of course, the MEMS chip 5 may also be attached to the package cover 31, for example, a special adhesive may be used to adhere the MEMS chip 5 to the package cover 31. The MEMS chip 5 can also be turned on by a circuit pattern in the substrate 32 in a flip-chip manner, which is common knowledge of those skilled in the art, and the present invention is not described in detail herein.

The signal amplifier 6 may be mounted on the package cover 31, or may be mounted on the substrate 32. The signal amplifier 6 may be, for example, an ASIC chip. The ASIC chip is connected to the MEMS chip 5. The electrical signal output by the MEMS chip 5 can be transmitted to the ASIC chip, processed by the ASIC chip, and output. The MEMS chip 5 and the ASIC chip 6 may be electrically connected through a metal wire (bonding wire) to realize mutual conduction therebetween.

Further, the MEMS chip 5 and/or the signal amplifier 6 may be embedded in the substrate 32 or may be semi-embedded in the substrate 32. For example, a conductor is provided in the substrate 32, and a pad is provided on the substrate 32. The conductors are, for example, metallized through holes provided in the substrate 32. The pad is electrically connected to the MEMS chip 5 and the signal amplifier 6 via a conductor. The design in which the MEMS chip 5 and the signal amplifier 6 are embedded in the substrate 32 contributes to miniaturization of the microphone.

When the MEMS chip 5 and the signal amplifier 6 are embedded in the substrate 32, at least one metal layer needs to be provided above and below the MEMS chip 5 and the signal amplifier 6. The metal layer is grounded as a shield. A plurality of metal conductors are arranged in the area around the MEMS chip 5 and the signal amplifier 6 for constituting a shielding structure together with the above-mentioned metal layers. The design of embedding the MEMS chip 5 and the signal amplifier 6 in the substrate 32 makes it unnecessary to coat protective glue on the surface of the signal amplifier 6, thus simplifying the process and improving the optical noise resistance of the product.

The embodiment of the disclosure also provides an electronic device. The electronic device comprises the microphone packaging structure.

The electronic device may be a mobile phone, a notebook computer, a tablet computer, a VR device, an intelligent wearable device, and the like, which is not limited by the present disclosure.

Although certain specific embodiments of the present invention have been described in detail by way of example, it should be understood by those skilled in the art that the foregoing examples are for purposes of illustration only and are not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims (15)

1. A dustproof construction which characterized in that: comprises a carrier and a grid part;

the carrier is of a hollow structure and comprises a plurality of supporting layers arranged along the height direction,

the grid part comprises a grid structure and fixing parts arranged around the grid structure, the fixing parts are connected with the carrier, the grid structure is opposite to the hollow structure, and the thermal expansion coefficient of at least one supporting layer is different from that of other supporting layers except the supporting layer.

2. The dustproof structure according to claim 1, characterized in that: defining the supporting layer connected with the fixing part as a first supporting layer, wherein the supporting layers are arranged outwards in sequence from the first supporting layer, the outermost layer is an Nth supporting layer, N is greater than or equal to 2, and the thermal expansion coefficient of the Nth supporting layer is greater than that of the (N-1) th supporting layer.

3. The dustproof structure according to claim 2, characterized in that: the number of the supporting layers is three.

4. The dustproof structure according to claim 1, characterized in that: the carrier is made of organic materials, and the grid part is made of metal.

5. The dustproof structure according to claim 1, characterized in that: the grid part further comprises a stress buffer area connected between the fixing part and the grid structure, and the stress buffer area is arranged in a suspension mode.

6. The dustproof structure according to claim 5, characterized in that: and forming an elastic structure in the stress buffer area through hollowing.

7. The dustproof structure according to claim 1, characterized in that: at least one of the support layers is prepared from a dry film resist.

8. A microphone packaging structure is characterized in that: the device comprises a shell with an accommodating cavity, wherein a sound pickup hole is formed in the shell;

further comprising a dust-proof structure as claimed in any one of claims 1 to 7, the dust-proof structure being provided on the sound pickup aperture.

9. The microphone package structure of claim 8, wherein: the dust-proof structure is located outside the housing.

10. The microphone package structure of claim 8, wherein: the shell comprises a substrate and an encapsulation cover, and the substrate and the encapsulation cover enclose the accommodating cavity;

the dustproof structure is accommodated in the accommodating cavity.

11. The microphone package structure of claim 10, wherein: the pickup hole is located on the encapsulation cover, the dustproof construction with encapsulation cover fixed connection.

12. The microphone package structure of claim 10, wherein: the pickup hole is positioned on the packaging cover, and the dustproof structure is fixedly connected to the position, corresponding to the pickup hole, on the substrate.

13. The microphone package structure of claim 10, wherein: the sound pickup hole is positioned on the substrate, and the dustproof structure is fixedly arranged on the substrate corresponding to the position of the sound pickup hole.

14. The microphone package structure of claim 10, wherein: the pickup hole is positioned on the substrate, the dustproof structure is fixedly arranged on the substrate corresponding to the pickup hole, and the MEMS chip is arranged on the dustproof structure.

15. An electronic device, characterized in that: comprising a microphone package according to any of claims 8-14.

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