CN211531329U

CN211531329U - Dustproof structure, microphone packaging structure and electronic equipment

Info

Publication number: CN211531329U
Application number: CN201922493867.6U
Authority: CN
Inventors: 林育菁; 佐佐木宽充; 畠山庸平
Original assignee: Weifang Goertek Microelectronics Co Ltd
Current assignee: Weifang Goertek Microelectronics Co Ltd
Priority date: 2019-12-31
Filing date: 2019-12-31
Publication date: 2020-09-18
Anticipated expiration: 2029-12-31

Abstract

The utility model discloses a dustproof construction, microphone packaging structure and electronic equipment. The dustproof structure comprises a carrier and a grid part; the carrier is of a hollow structure; the grid part comprises a filter screen and a fixing part arranged around the filter screen; wherein a mesh structure is formed on the filter screen; defining the ratio of the sum of the areas of all meshes on the mesh structure to the area of the grid part as the opening rate of the grid part, wherein the opening rate of the grid part is more than or equal to 75 percent; the grid part is arranged at one end of the carrier and covers the hollow structure, the filter screen is opposite to the hollow structure, and the fixing part is connected with the carrier. The technical effects of the utility model reside in that: the dustproof structure is beneficial to improving the signal-to-noise ratio (SNR) of the microphone, and can also prevent external particles from entering the microphone packaging structure.

Description

Dustproof structure, microphone packaging structure and electronic equipment

Technical Field

The utility model relates to an electroacoustic conversion technology field, more specifically, the utility model relates to a dustproof construction, microphone packaging structure and electronic equipment.

Background

With the rapid development of electroacoustic technology, various electroacoustic products are developed. A microphone, as a transducer for converting sound into an electrical signal, is one of the very important devices in electro-acoustic products. Nowadays, microphones have been widely applied to various types of electronic products such as mobile phones, tablet computers, notebook computers, VR devices, AR devices, smartwatches, and smart wearing. In recent years, for a microphone packaging structure, the design of the structure thereof has become an important point and a focus of research by those skilled in the art.

The existing microphone package structure is generally: the chip package comprises a shell with a containing cavity, and components such as a chip assembly (for example, a MEMS chip and an ASIC chip) are contained and fixed in the containing cavity; and a sound pickup hole is also arranged on the shell. However, in long-term application, it is found that external particles and foreign matters such as dust and impurities are easily introduced into the accommodating cavity of the microphone through the sound pickup hole, and the external particles and foreign matters cause certain damage to components such as a chip assembly in the accommodating cavity, and finally affect the acoustic performance and the service life of the microphone.

In view of the above problems, the prior art generally adopts a solution that an isolation component for blocking the entry of external particles, foreign matters, etc. is disposed on a sound pickup hole of a microphone package structure. Existing insulation assemblies typically include a carrier and an insulation mesh. In order to ensure that the separation net has sufficient rigidity, the number of holes formed therein is generally small, which results in a low opening ratio in the separation net. When the existing isolation assembly is applied to a microphone packaging structure, the signal-to-noise ratio (SNR) of the microphone is greatly reduced due to the low aperture ratio on the isolation net, so that the acoustic performance of the microphone is affected.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a dustproof construction, microphone packaging structure and electronic equipment's new technical scheme.

According to a first aspect of the present invention, there is provided a dustproof structure, comprising a carrier and a mesh part;

the carrier is of a hollow structure;

the grid part comprises a filter screen and a fixing part arranged around the filter screen; wherein a mesh structure is formed on the filter screen; defining the ratio of the sum of the areas of all meshes on the mesh structure to the area of the grid part as the opening rate of the grid part, wherein the opening rate of the grid part is more than or equal to 75 percent;

the grid part is arranged at one end of the carrier and covers the hollow structure, the filter screen is opposite to the hollow structure, and the fixing part is connected with the carrier.

Optionally, the mesh structure is in the shape of a double helix.

Optionally, the mesh structure comprises a plurality of meshes arranged in a matrix, the matrix being a hexagonal structure;

wherein each mesh is hexagonal.

Optionally, the mesh structure is in the shape of an archimedes spiral.

Optionally, the mesh structure comprises a plurality of first mesh openings and a plurality of second mesh openings;

wherein, first mesh with the second mesh all is oval or runway shape, and the first mesh with the aperture size of second mesh is different.

Optionally, the mesh structure is spider web shaped.

Optionally, the mesh structure comprises a plurality of meshes connected together to form a wave-like structure.

Optionally, the boundary of each mesh in the length direction is L-shaped.

Optionally, the mesh structure comprises a plurality of rows of mesh cells arranged in concentric rings;

wherein each column of the mesh units comprises a plurality of arc-shaped meshes.

Optionally, the central angles of the plurality of arcuate mesh openings are equal.

Optionally, the mesh structure comprises a central hole and a plurality of first mesh holes uniformly arranged around the central hole, a second mesh hole is arranged between any two adjacent first mesh holes, the second mesh hole extends to the edge position of the mesh structure, and a plurality of third mesh holes are uniformly arranged between any two adjacent second mesh holes.

Optionally, the area within 20 μm from the edge of the mesh structure is less than 25 μm flat.

According to a second aspect of the present invention, a microphone package structure is provided. The microphone packaging structure comprises a shell with an accommodating cavity, wherein a sound pickup hole is formed in the shell and is used for communicating the inside with the outside of the shell;

the microphone device is fixedly arranged in the accommodating cavity;

the dustproof structure is arranged on the sound pickup hole.

Optionally, the dust-proof structure is located outside the housing.

Optionally, the housing includes a substrate and an encapsulation cover, and the substrate and the encapsulation cover enclose the accommodation cavity;

the dustproof structure is accommodated in the accommodating cavity;

the microphone device includes a MEMS chip and a signal amplifier.

Optionally, the pickup hole is located on the encapsulation cover, and the dust-proof structure is fixedly connected with the encapsulation cover.

Optionally, the pickup hole is located on the package cover, and the dust-proof structure is fixedly connected to the substrate to cover the MEMS chip.

Optionally, the sound pickup hole is located on the substrate, and the dust-proof structure is fixedly arranged on the substrate at a position corresponding to the sound pickup hole.

Optionally, the pickup hole is located on the substrate, the dustproof structure is fixedly arranged on the substrate at a position corresponding to the pickup hole, and the MEMS chip is arranged on the dustproof structure.

According to a third aspect of the present invention, there is provided an electronic apparatus. The electronic equipment comprises the microphone packaging structure.

The embodiment of the utility model provides a dustproof construction has designed the mesh structure of predetermined shape on the filter screen, has effectively improved the aperture opening ratio of net portion through improving its opening design, can also guarantee simultaneously that the filter screen has good rigidity. The utility model discloses a dustproof construction helps improving the SNR of microphone, makes the microphone have good acoustic performance, can also the outside particulate matter of separation etc. enter into microphone packaging structure's inside, can protect each components and parts of microphone inside. The technical task to be achieved or the technical problems to be solved by the present invention are never thought or not expected by the skilled in the art, so the present invention is a new technical solution.

Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments of the invention, which proceeds with reference to the accompanying drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.

Fig. 1 is a side view of a dustproof structure according to an embodiment of the present invention.

Fig. 2 is a schematic structural diagram of a filter screen according to a first embodiment of the present invention.

Fig. 3 is a schematic structural diagram of a filter screen according to a second embodiment of the present invention.

Fig. 4 is a schematic structural diagram of a filter screen according to a third embodiment of the present invention.

Fig. 5 is a schematic structural diagram of a filter screen according to a fourth embodiment of the present invention.

Fig. 6 is a schematic structural diagram of a filter screen according to a fifth embodiment of the present invention.

Fig. 7 is a schematic structural diagram of a filter screen according to a sixth embodiment of the present invention.

Fig. 8 is a schematic structural diagram of a filter screen according to a seventh embodiment of the present invention.

Fig. 9 is a schematic structural diagram of a filter screen according to an eighth embodiment of the present invention.

Fig. 10 is a schematic structural diagram of a microphone package structure according to a first embodiment of the present invention.

Fig. 11 is a schematic structural diagram of a microphone package structure according to a second embodiment of the present invention.

Fig. 12 is a schematic structural diagram of a microphone package structure according to a third embodiment of the present invention.

Fig. 13 is a schematic structural diagram of a microphone package structure according to a fourth embodiment of the present invention.

Fig. 14 is a schematic structural diagram of a microphone package structure according to a fifth embodiment of the present invention.

Description of reference numerals:

1-carrier, 11-hollow structure, 2-grid part, 21-filter screen, 211-mesh structure, 2111-mesh, 2112-first mesh, 2113-second mesh, 2114-third mesh, 2115-center hole, 22-fixing part, 3-shell, 31-packaging cover, 32-substrate, 4-sound-picking hole, 5-MEMS chip and 6-signal amplifier.

Detailed Description

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: unless specifically stated otherwise, the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention.

The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.

In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

According to an embodiment of the utility model, a dustproof construction is provided. The dustproof structure can be applied to a microphone packaging structure. This dustproof construction can the separation particulate matters such as external dust, impurity through the microphone packaging structure on pick up the sound hole and enter into microphone packaging structure's inside, can protect each components and parts of microphone inside. More importantly, the utility model provides a dustproof construction, its net portion has higher aperture ratio, and this helps improving the SNR of microphone, makes the microphone have good acoustic performance.

The specific structure of the dustproof structure according to the embodiment of the present invention will be further described below. The embodiment of the utility model provides a dustproof construction, as shown in fig. 1, including carrier 1 and net portion 2. The carrier 1 is a hollow structure. The mesh part 2 includes a filter mesh 21 and a fixing part 22 disposed around the filter mesh 21. As shown in fig. 2 to 9, a mesh structure 211 is formed on the filter screen 21. The utility model discloses in define the area sum of each mesh on the mesh structure 211 with the area ratio of net portion 2 does the aperture ratio of net portion 2, the aperture ratio of net portion 2 is more than or equal to 75%. The mesh part 2 is disposed at one end of the carrier 1 and covers the hollow structure 11. The filter screen 21 is opposite to the hollow structure 11, and the fixing portion 22 is connected to the carrier 1.

The embodiment of the utility model provides a dustproof construction has improved the aperture opening ratio of net portion 2 to improve the aperture opening ratio of net portion 2. Specifically, the special mesh structure 211 is designed on the filter screen 21 of the mesh part 2, so that the opening ratio of the mesh part 2 can be increased to 75% or even higher, which is much higher than the opening ratio of the isolation mesh in the prior art. At the same time, the mesh structure 211 can ensure good rigidity and mechanical strength of the mesh part 2. Based on the characteristics that net portion 2 has higher aperture opening ratio, will the utility model discloses a dustproof construction is applied to behind the microphone packaging structure, can not reduce the SNR of microphone, helps improving the SNR of microphone on the contrary to make the microphone have good acoustic performance.

The embodiment of the utility model provides a dustproof construction can protect microphone packaging structure effectively. Have filter screen 21 on net portion 2, this filter screen 21 can make the air current pass through, and this filter screen 21 can also effectively obstruct outside particulate matter, foreign matter (for example, dust and impurity) and enter into microphone packaging structure's inside to can protect inside each components and parts of microphone packaging structure, in order to avoid influencing the life of microphone.

In the present invention, the carrier 1 may be made of, for example, a metal material, an alloy material or an organic non-metal material, which are well known to those skilled in the art. The skilled person can flexibly select the material for making the carrier 1 according to specific needs, without limitation.

In the present invention, the grid part 2 includes a filter screen 21 and a fixing part 22 surrounding the filter screen 21. The fixing portion 22 is used to connect the mesh portion 2 with the carrier 1, so that the mesh portion 2 can stably cover the carrier 1. Note that, when the fixing portion 22 of the mesh portion 2 is connected to the carrier 1, the fixing portion 22 is actually connected to the edge portion of the carrier 1. Specifically, the fixing portion 22 of the mesh portion 2 and the edge portion of the carrier 1 may be connected together by, for example, adhesive bonding, or may be connected together by fastening, welding, or hot pressing, which can be flexibly selected by a person skilled in the art according to specific needs, and the present invention is not limited thereto.

The filter screen 21 is made of a metal material with a mesh opening size not greater than 10 μm, for example, so as to allow air to pass through smoothly and prevent particles (usually particles with a particle size greater than 10 μm) such as external dust and impurities from entering. The filter screen made of metal has the characteristic of good durability, does not need to be frequently replaced, and has longer service life. Of course, the filter screen 21 may also be mesh cloth with other aperture sizes and other materials. The shape of the mesh on the filter screen 21 may be, for example, circular, square, triangular, etc. The person skilled in the art can flexibly adjust the device according to specific needs, without limitation.

In the mesh portion 2, the shape of the filter screen 21 itself may be a regular shape such as a circle, a regular hexagon, a square, or an ellipse. Of course, as shown in fig. 5, the filter screen 21 may have other irregular shapes. The person skilled in the art can flexibly adjust the device according to the actual needs, and the device is not limited to this.

In an example of the present invention, as shown in fig. 2, a mesh structure 211 is formed on the filter screen 21, and the mesh structure 211 has a double spiral shape. The width of the mesh openings in this mesh structure 211 should be controlled to be 3 μm or less and the length of the mesh openings should be controlled to be 10 μm or less. This design not only contributes to an increase in the aperture ratio of the mesh portion 2, but also prevents entry of particles having a particle size of more than 10 μm. Also, the mesh structure 211 does not affect the rigidity of the entire mesh portion 2.

In one example of the present invention, as shown in fig. 3, a mesh structure including a plurality of meshes 2111 in a matrix arrangement is formed on the filter screen 21. The matrix formed by the arrangement of the plurality of meshes 2111 is a hexagonal structure. Also, each mesh 2111 is hexagonal. Wherein the aperture of the mesh 2111 is not more than 10 μm. In this example, the mesh structure of the filter screen 21 is formed relatively simply, and the opening ratio of the filter screen can be flexibly adjusted according to the number, size, and the like of the meshes 2111. The whole mesh structure is equivalent to a honeycomb form, and has good stability, so that the whole mesh part 2 has good mechanical strength.

In one example of the present invention, as shown in fig. 4, a mesh structure is formed on the filter screen 21, and the mesh structure 211 is in the shape of an archimedes spiral. Designing the mesh structure 211 in this shape is also advantageous in increasing the opening ratio of the mesh portion 2. In this mesh structure 211, the width of the mesh should be controlled to 3 μm or less and the length of the mesh should be controlled to 10 μm or less, which can be used to prevent the entry of particles having a particle size of more than 10 μm.

In one example of the present invention, as shown in fig. 5, a mesh structure is formed on the filter screen 21, and the mesh structure includes a plurality of first meshes 2112 and a plurality of second meshes 2113, wherein the first meshes 2112 and the second meshes 2113 are each in an elliptical shape or a racetrack shape, and the first meshes 2112 and the second meshes 2113 have different pore sizes. It should be noted that in this example, the mesh openings of only the two sizes are not limited, and more mesh openings may be designed as required, but the maximum aperture of the mesh openings should not exceed 10 μm. The setting number of the meshes can be adjusted according to specific requirements, so that the filter screen 21 has a large opening ratio and sufficient rigidity, and is prevented from being easily damaged in the manufacturing or using process.

In one example of the present invention, as shown in fig. 6, a mesh structure 211 is formed on the filter screen 21, and the mesh structure 211 is formed in a spider-web shape. With this mesh structure 211, the filter net 2 can have a high opening ratio and also have a good mechanical strength.

In one example of the present invention, as shown in fig. 7, a mesh structure is formed on the filter screen 21, the mesh structure includes a plurality of meshes 2111, and the plurality of meshes 2111 are connected together to form a wave structure. Wherein, the boundary portion of each mesh 2111 in the length direction is L-shaped. Under the mesh structure, the filter screen 2 has good mechanical strength while keeping a high opening ratio.

In one example of the present invention, as shown in fig. 8, a mesh structure is formed on the filter screen 21, and the mesh structure includes a plurality of rows of mesh units arranged in a concentric ring shape. Wherein each column of the mesh cells includes a plurality of arc-shaped mesh 2111. Wherein the central angles of all the arc-shaped meshes 2111 are equal. With this mesh structure, the filter net 2 can have a high opening ratio and also have good mechanical strength.

In an example of the present invention, as shown in fig. 9, a mesh structure is formed on the filter screen 21, the mesh structure includes a center hole 2115 and a plurality of first mesh holes 2112 uniformly arranged around the center hole 2115, a second mesh hole 2113 is arranged between any two adjacent first mesh holes 2112, the second mesh hole 2113 extends to an edge position of the mesh structure, and a plurality of third mesh holes 2114 is uniformly arranged between any two adjacent second mesh holes 2113. In this example, the respective meshes form a central symmetrical structure with respect to the center of the filter screen 21. Wherein, the setting number, shape and size of the first mesh 2112, the second mesh 2113 and the third mesh 2114 can be flexibly adjusted according to the requirement of the opening ratio, and the utility model discloses do not do the restriction to this.

It should be noted that in each of the above examples, the maximum pore size of the mesh in the mesh structure should not exceed 10 μm. For a mesh of arc or strip shape, the width should not exceed 3 μm and the length should not exceed 10 μm. So as to ensure that the external particles and foreign matters exceeding 10 mu m can be blocked.

In the utility model, the distance is less than 25 μm within 20 μm of the edge of the mesh structure.

In the present invention, the thickness of the mesh part 2 may be, for example, about 0.5 μm. The height of the carrier 1 may be, for example, about 40 μm. This size is suitable for most microphone packages. Of course, the size of the assembly can be adjusted by those skilled in the art according to the specific assembly requirement, and the assembly is not limited to this.

According to the utility model discloses another embodiment, still provide a microphone packaging structure. The microphone packaging structure can be applied to various electronic products such as mobile phones, notebook computers, Ipad and VR equipment and intelligent wearable equipment, and is widely applied.

The following further describes a specific structure of the microphone package structure provided in the embodiments of the present invention.

As shown in fig. 10-14, a microphone package structure provided by an embodiment of the present invention includes a housing 3 having a receiving cavity, and a sound pickup hole 4 is disposed on the housing 3. The sound pickup hole 4 is used to communicate the inside and outside of the housing 3. A microphone device is accommodated and fixed in the accommodation chamber of the housing 3. The utility model provides a microphone packaging structure still includes as above dustproof construction, dustproof construction is fixed mounting be in pick up on the sound hole 4.

In the utility model, the sound pickup hole 4 can be, for example, circular, square, triangular, oval, etc. The pickup hole 4 may be provided in one or more as required. The concrete position that sets up of sound picking-up hole 4 also can adjust in a flexible way according to microphone packaging structure's particular case, the utility model discloses do not do the restriction to this.

In an alternative example of the present invention, as shown in fig. 10, the dust-proof structure may be located outside the housing 3. That is, the sound pickup hole 4 is protected from the outside. In this example, the dust-proof structure is mounted outside the microphone package to cover the sound pickup hole 4, and does not occupy the space inside the microphone package. When the dustproof structure is installed, the dustproof structure can be reasonably installed according to the position of the sound pickup hole 4, so that the dustproof structure can be aligned to the sound pickup hole 4, and external particles and foreign matters can be prevented from being introduced into the microphone packaging structure through the sound pickup hole 4.

Of course, the present invention is not limited to the dustproof structure disposed outside the housing 3, and the dustproof structure may be disposed in the accommodating cavity of the housing 3. The technical personnel in the field can flexibly adjust the arrangement position of the dustproof structure according to specific needs.

The utility model discloses a microphone packaging structure, its shell 3's structure is: the substrate 32 and the packaging cover 31 are included, and the substrate 32 and the packaging cover 31 together enclose the accommodating cavity. The dust-proof structure is accommodated in the accommodating cavity of the housing 3. The microphone device comprises a MEMS chip 5 and a signal amplifier 6.

In an alternative example of the present invention, as shown in fig. 11, the sound-collecting hole 4 is located on the package cover 31, and the dust-proof structure is fixedly connected to the package cover 32. Dustproof construction's position corresponds to pickup hole 4, can avoid outside particulate matter, foreign matter to introduce inside microphone packaging structure through pickup hole 4.

In an alternative example of the present invention, as shown in fig. 12, the sound pickup hole 4 is located on the package cover 31, the dust-proof structure is fixedly connected to the substrate 32 at a position corresponding to the sound pickup hole 4, and at the same time, the dust-proof structure also covers the MEMS chip 5, so as to effectively protect the chip in the microphone package structure.

In the present invention, the sound collecting hole 4 is not limited to be provided in the sealing cover 31 of the housing 3, and may be provided in the base plate 32. For example, as shown in fig. 13, the sound collecting hole 4 is located on the substrate 32, and the dust-proof structure is fixedly provided on the substrate 32 at a position corresponding to the sound collecting hole 4. For another example, as shown in fig. 14, the sound collecting hole 4 is located on the substrate 32, the dust-proof structure is fixedly provided on the substrate 32 at a position corresponding to the sound collecting hole 4, and the MEMS chip 5 is provided on the dust-proof structure. It should be noted that, when the sound-collecting hole 4 is formed in the substrate 32, a person skilled in the art may adjust the installation position of the dust-proof structure according to specific situations, as long as the person can prevent external particles and foreign matters from entering or can protect the internal chip, and the invention is not limited thereto.

Wherein the package cover 31 has a dish-shaped structure with an open end. The material of the package cover 31 may be, for example, a metal material, a plastic material, or a PCB. The shape of the sealing cap 31 may be, for example, a cylindrical shape or a rectangular parallelepiped shape. The person skilled in the art can flexibly adjust the device according to the actual needs without limitation.

The substrate 32 may be a circuit board known in the art, such as a PCB, without limitation. The package cover 31 and the substrate 32 may be fixed together by, for example, adhesive bonding or solder paste welding, and those skilled in the art can flexibly select the combination according to the needs without limitation.

The utility model provides a microphone packaging structure is fixed in the chamber that holds of shell 3 and is acceptd the microphone device. Specifically, as shown in fig. 10 to 14, the microphone device may include, for example, a MEMS chip 5 and a signal amplifier 6.

The MEMS chip 5 includes a substrate and an inductive film. The substrate is also a hollow structure. The sensing film is, for example, a piezoelectric element, a capacitive element, a piezoresistive element, or the like. The sensing film is arranged at one end of the substrate and covers the hollow structure of the substrate. The hollow structure forms a back cavity. When the MEMS chip 5 is fixed in the housing chamber, the MEMS chip 5 may be attached to the substrate 32. Of course, the MEMS chip 5 may also be attached to the package cover 31, for example, a special adhesive may be used to adhere the MEMS chip 5 to the package cover 31. The MEMS chip 5 can also be turned on by a circuit pattern in the substrate 32 in a flip-chip manner, which is common knowledge of those skilled in the art, and the present invention is not described in detail herein.

The signal amplifier 6 may be mounted on the package cover 31, or may be mounted on the substrate 32. The signal amplifier 6 may be, for example, an ASIC chip. The ASIC chip is connected to the MEMS chip 5. The electrical signal output by the MEMS chip 5 can be transmitted to the ASIC chip, processed by the ASIC chip, and output. The MEMS chip 5 and the ASIC chip 6 may be electrically connected through a metal wire (bonding wire) to realize mutual conduction therebetween.

Further, the MEMS chip 5 and/or the signal amplifier 6 may be embedded in the substrate 32 or may be semi-embedded in the substrate 32. For example, a conductor is provided in the substrate 32, and a pad is provided on the substrate 32. The conductors are, for example, metallized through holes provided in the substrate 32. The pad is electrically connected to the MEMS chip 5 and the signal amplifier 6 via a conductor. The design in which the MEMS chip 5 and the signal amplifier 6 are embedded in the substrate 32 contributes to miniaturization of the microphone.

When the MEMS chip 5 and the signal amplifier 6 are embedded in the substrate 32, at least one metal layer needs to be provided above and below the MEMS chip 5 and the signal amplifier 6. The metal layer is grounded as a shield. A plurality of metal conductors are arranged in the area around the MEMS chip 5 and the signal amplifier 6 for constituting a shielding structure together with the above-mentioned metal layers. The design of embedding the MEMS chip 5 and the signal amplifier 6 in the substrate 32 makes it unnecessary to coat protective glue on the surface of the signal amplifier 6, thus simplifying the process and improving the optical noise resistance of the product.

On the other hand, the utility model also provides an electronic equipment. The electronic device comprises the microphone packaging structure.

Wherein, electronic equipment can be cell-phone, notebook computer, panel computer, VR equipment, intelligent wearing equipment etc. the utility model discloses do not do the restriction to this.

Although certain specific embodiments of the present invention have been described in detail by way of example, it should be understood by those skilled in the art that the foregoing examples are for purposes of illustration only and are not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A dustproof construction which characterized in that: comprises a carrier and a grid part;

the carrier is of a hollow structure;

2. The dustproof structure according to claim 1, characterized in that: the mesh structure is in a double helix shape.

3. The dustproof structure according to claim 1, characterized in that: the mesh structure comprises a plurality of meshes arranged in a matrix, and the matrix is a hexagonal structure;

wherein each mesh is hexagonal.

4. The dustproof structure according to claim 1, characterized in that: the mesh structure is in the shape of an Archimedes spiral.

5. The dustproof structure according to claim 1, characterized in that: the mesh structure comprises a plurality of first mesh openings and a plurality of second mesh openings;

6. The dustproof structure according to claim 1, characterized in that: the mesh structure is in a spider-web shape.

7. The dustproof structure according to claim 1, characterized in that: the mesh structure includes a plurality of mesh openings that are connected together to form a wave-like structure.

8. The dustproof structure according to claim 7, characterized in that: the boundary part of each mesh along the length direction is L-shaped.

9. The dustproof structure according to claim 1, characterized in that: the mesh structure comprises a plurality of rows of mesh units which are arranged in a concentric ring shape;

10. The dustproof structure according to claim 9, characterized in that: the central angles of the arc-shaped meshes are equal.

11. The dustproof structure according to claim 1, characterized in that: the mesh structure includes centre bore and centers on a plurality of first meshs that the centre bore evenly set up are provided with the second meshs between arbitrary two adjacent first meshs, the second meshs extend to the border position of mesh structure evenly is provided with a plurality of third meshs between arbitrary two adjacent second meshs.

12. The dustproof structure according to claim 1, characterized in that: the area within 20 μm from the edge of the mesh structure has a flatness of less than 25 μm.

13. A microphone packaging structure is characterized in that: the shell is provided with a sound pickup hole, and the sound pickup hole is used for communicating the inside with the outside of the shell;

the microphone device is fixedly arranged in the accommodating cavity;

further comprising the dust-proof structure of any one of claims 1-12, the dust-proof structure being disposed over the sound pick-up aperture.

14. The microphone package structure of claim 13, wherein: the dust-proof structure is located outside the housing.

15. The microphone package structure of claim 13, wherein: the shell comprises a substrate and an encapsulation cover, and the substrate and the encapsulation cover enclose the accommodating cavity;

the dustproof structure is accommodated in the accommodating cavity;

the microphone device includes a MEMS chip and a signal amplifier.

16. The microphone package structure of claim 15, wherein: the pickup hole is located on the encapsulation cover, the dustproof construction with encapsulation cover fixed connection.

17. The microphone package structure of claim 15, wherein: the pickup hole is located on the packaging cover, and the dustproof structure is fixedly connected to the substrate so as to cover the MEMS chip.

18. The microphone package structure of claim 15, wherein: the sound pickup hole is positioned on the substrate, and the dustproof structure is fixedly arranged on the substrate corresponding to the position of the sound pickup hole.

19. The microphone package structure of claim 15, wherein: the pickup hole is positioned on the substrate, the dustproof structure is fixedly arranged on the substrate corresponding to the pickup hole, and the MEMS chip is arranged on the dustproof structure.

20. An electronic device, characterized in that: comprising a microphone package according to any of claims 13-19.