CN111147994A - Dustproof structure, microphone packaging structure and electronic equipment - Google Patents

Dustproof structure, microphone packaging structure and electronic equipment Download PDF

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Publication number
CN111147994A
CN111147994A CN201911421954.9A CN201911421954A CN111147994A CN 111147994 A CN111147994 A CN 111147994A CN 201911421954 A CN201911421954 A CN 201911421954A CN 111147994 A CN111147994 A CN 111147994A
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CN
China
Prior art keywords
filter screen
dustproof
mesh
grid
microphone
Prior art date
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Pending
Application number
CN201911421954.9A
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Chinese (zh)
Inventor
林育菁
游振江
畠山庸平
佐佐木宽充
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Weifang Goertek Microelectronics Co Ltd
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Goertek Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Goertek Inc filed Critical Goertek Inc
Priority to CN201911421954.9A priority Critical patent/CN111147994A/en
Publication of CN111147994A publication Critical patent/CN111147994A/en
Priority to PCT/CN2020/099217 priority patent/WO2021135116A1/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

The invention discloses a dustproof structure, a microphone packaging structure and electronic equipment. Wherein the dustproof structure comprises a carrier and a grid part; the carrier is of a hollow structure; the grid part comprises a filter screen, a reinforcing part arranged around the filter screen and a fixing part arranged around the reinforcing part; the reinforcing part comprises a plurality of rows of first mesh structures which extend towards the outer side of the filter screen and are concentrically arranged along the circumferential direction of the filter screen; the grid part is arranged at one end of the carrier and covers the hollow structure, the filter screen is opposite to the hollow structure, and the fixing part is connected with the carrier. One technical effect of the invention is that: the filter screen in net portion can keep the leveling state, and net portion can effectively the separation external particulate matter, foreign matter enter into microphone packaging structure's inside.

Description

Dustproof structure, microphone packaging structure and electronic equipment
Technical Field
The invention relates to the technical field of electroacoustic conversion, in particular to a dustproof structure, a microphone packaging structure and electronic equipment.
Background
With the rapid development of electroacoustic technology, various electroacoustic products are developed. A microphone, as a transducer for converting sound into an electrical signal, is one of the very important devices in electro-acoustic products. Nowadays, microphones have been widely applied to various types of electronic products such as mobile phones, tablet computers, notebook computers, VR devices, AR devices, smartwatches, and smart wearing. In recent years, for a microphone packaging structure, the design of the structure thereof has become an important point and a focus of research by those skilled in the art.
The existing microphone package structure is generally: the chip package comprises a shell with a containing cavity, and components such as a chip assembly (for example, a MEMS chip and an ASIC chip) are contained and fixed in the containing cavity; and a sound pickup hole is also arranged on the shell. However, in long-term application, it is found that external particles and foreign matters such as dust and impurities are easily introduced into the accommodating cavity of the microphone through the sound pickup hole, and the external particles and foreign matters cause certain damage to components such as a chip assembly in the accommodating cavity, and finally affect the acoustic performance and the service life of the microphone.
In view of the above problems, the prior art generally adopts a solution that an isolation component is disposed on a sound pickup hole of a microphone package structure to block the entry of external particles, foreign matters, and the like. The prior art spacer assembly, as shown in fig. 1, includes a carrier 1 and a spacer web 101. When the isolation component is used, the isolation component is installed on the sound pickup hole. However, in the conventional isolation assembly, because the carrier 1 and the isolation mesh 101 have different sizes, materials, structures, and the like, a certain internal stress difference is likely to be generated at a connecting position of the carrier 1 and the isolation mesh 101, which may cause the isolation mesh 101 and the net film 102 thereon to wrinkle, that is, the net film 102 may not be in a flat state, which may cause a reduction in yield of products, and may even affect the airflow flow at the net film 102.
Disclosure of Invention
An object of the present invention is to provide a new technical solution for a dust-proof structure, a microphone package structure, and an electronic device.
According to a first aspect of the present invention, there is provided a dustproof structure including a carrier and a mesh portion;
the carrier is of a hollow structure;
the grid part comprises a filter screen, a reinforcing part arranged around the filter screen and a fixing part arranged around the reinforcing part; the reinforcing part comprises a plurality of rows of first mesh structures which extend towards the outer side of the filter screen and are concentrically arranged along the circumferential direction of the filter screen;
the grid part is arranged at one end of the carrier and covers the hollow structure, the filter screen is opposite to the hollow structure, and the fixing part is connected with the carrier.
Optionally, it is defined that a side of the reinforcing portion adjacent to the filter screen is an inner side of the reinforcing portion, a side away from the filter screen is an outer side of the reinforcing portion, and the lengths of the meshes on the multiple rows of first mesh structures are gradually reduced from the inner side to the outer side of the reinforcing portion.
Optionally, each column of the first mesh structure comprises a plurality of reinforcement holes, and the space S between any two adjacent reinforcement holes0Is 1-5 μm.
Optionally, the filter screen comprises a plurality of rows of second grid structures concentrically arranged along the circumferential direction;
wherein each row of the second grid structure comprises a plurality of meshes, and the interval S between any two adjacent meshes is less than S0。
Optionally, each of the reinforcement holes has a width T, and T is 1-10 μm;
each of the reinforcement holes has a length Lan；
LanThe relationship with T is: l isan/T＝1-10。
Optionally, the reinforcement holes are elliptical holes.
Optionally, the reinforced hole is a racetrack-shaped hole, and two ends of the reinforced hole are semicircular and have a radius of 0.5-5 μm.
Alternatively, the boundary portion of the reinforcement hole in the width direction is waved.
Optionally, on the reinforcing part, a part between any two adjacent columns of the first grid structures forms a first connecting part;
the filter screen comprises a plurality of rows of second grid structures concentrically arranged along the circumferential direction, a second connecting part is formed between any two adjacent rows of the second grid structures, and all the formed second connecting parts are radially arranged relative to the center of the grid part;
wherein a rotation angle theta is formed between a connecting line of any one first connecting part and the center of the grid part and one adjacent second connecting part, and the rotation angle theta is more than or equal to 0 degree.
Optionally, the area of all the mesh openings on the mesh part accounts for 50-90% of the total area of the mesh part.
Optionally, the first mesh structure is provided with 5-10 columns on the reinforcement.
According to a second aspect of the present invention, a microphone package structure is provided. The microphone packaging structure comprises a shell with an accommodating cavity, wherein a sound pickup hole is formed in the shell and is used for communicating the inside with the outside of the shell;
the microphone device is fixedly arranged in the accommodating cavity;
the dustproof structure is arranged on the sound pickup hole
Optionally, the dust-proof structure is located outside the housing.
Optionally, the housing includes a substrate and an encapsulation cover, and the substrate and the encapsulation cover enclose the accommodation cavity;
the dustproof structure is accommodated in the accommodating cavity;
the microphone device includes a MEMS chip and a signal amplifier.
Optionally, the pickup hole is located on the encapsulation cover, and the dust-proof structure is fixedly connected with the encapsulation cover.
Optionally, the pickup hole is located on the package cover, and the dust-proof structure is fixedly connected to the substrate to cover the MEMS chip.
Optionally, the sound pickup hole is located on the substrate, and the dust-proof structure is fixedly arranged on the substrate corresponding to the position of the sound pickup hole
Optionally, the pickup hole is located on the substrate, the dustproof structure is fixedly arranged on the substrate at a position corresponding to the pickup hole, and the MEMS chip is arranged on the dustproof structure.
According to a third aspect of the invention, an electronic device is provided. The electronic equipment comprises the microphone packaging structure.
The dustproof structure provided by the embodiment of the invention improves the structure of the grid part, and the reinforcing part is added between the filter screen on the grid part and the fixing part, has an opening structure with a special opening ratio, can absorb stress from the radial direction, and is beneficial to keeping the filter screen on the grid part flat when the grid part is fixed on the carrier. The dustproof structure provided by the embodiment of the invention can effectively protect the pickup hole of the microphone packaging structure, and the grid part can prevent external particles and foreign matters from entering the microphone packaging structure, so that all components in the microphone can be effectively protected, the acoustic performance of the microphone is prevented from being influenced, and the service life of the microphone is prolonged. The technical task to be achieved or the technical problems to be solved by the present invention are never thought or not expected by those skilled in the art, and therefore the present invention is a new technical solution.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
FIG. 1 is a side view of a prior art insulation assembly.
Fig. 2 is a partial structural view of the grid part in the dustproof structure according to an embodiment of the present invention.
Fig. 3 is a partial structural view of an inner mesh part of a dustproof structure according to another embodiment of the present invention.
Fig. 4 is a partial structural view of the inner mesh part of the dustproof structure according to still another embodiment of the present invention.
Fig. 5 is a schematic structural diagram of a microphone package structure according to a first embodiment of the present invention.
Fig. 6 is a schematic structural diagram of a microphone package structure according to a second embodiment of the invention.
Fig. 7 is a schematic structural diagram of a microphone package structure according to a third embodiment of the invention.
Fig. 8 is a schematic structural diagram of a microphone package structure according to a fourth embodiment of the invention.
Fig. 9 is a schematic structural diagram of a microphone package structure according to a fifth embodiment of the invention.
Description of reference numerals:
101-spacer mesh, 102-mesh;
1-carrier, 11-hollow structure, 2-grid part, 21-filter screen, 22-reinforcing part, 221-reinforcing hole, 23-fixing part, 3-shell, 31-packaging cover, 32-substrate, 4-sound pickup hole, 5-MEMS chip and 6-signal amplifier.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
According to an embodiment of the present invention, there is provided a dust-proof structure. The dustproof structure can be applied to a microphone packaging structure. This dustproof construction can the separation external particulate matter, foreign matter etc. enter into microphone packaging structure's inside through the sound hole of picking up on the microphone packaging structure to can protect each components and parts of microphone inside, in order to avoid influencing the acoustic performance and the life of microphone.
The specific structure of the dust-proof structure provided by the embodiment of the present invention is further described below. The dustproof structure provided by the embodiment of the invention comprises a carrier 1 and a grid part 2. The carrier 1 is a hollow structure. As shown in fig. 2 to 4, the mesh part 2 includes a filter screen 21, a reinforcing part 22 disposed around the filter screen 21, and a fixing part 23 disposed around the reinforcing part 22. The reinforcing part 22 includes a plurality of rows of first mesh structures extending to the outside of the filter screen 21 and concentrically arranged along the circumference of the filter screen 21. The grid part 2 is arranged at one end of the carrier 1 and covers the hollow structure 11, wherein the filter screen 21 is opposite to the hollow structure 11, and the fixing part 23 is connected with the carrier 1.
The dustproof structure provided by the embodiment of the invention improves the structure of the grid part 2. Specifically, a reinforcing portion 22 is added exclusively between the filter screen 21 and the fixing portion 23 on the mesh portion 2. The reinforcement part 22 has a special opening structure, and the design can absorb stress from the radial direction well, and can absorb deformation when the mesh part 2 is fixed on the carrier 1, thereby being advantageous to minimizing the wrinkle of the filter net 21, and even eliminating the possibility of generating wrinkle, so that the filter net 21 can be kept in a flat state.
The dustproof structure provided by the embodiment of the invention can effectively protect the microphone packaging structure. Have filter screen 21 on net portion 2, this filter screen 2 can make the air current pass through, and this filter screen 21 can also effectively obstruct outside particulate matter, foreign matter (for example, dust and impurity) and enter into microphone packaging structure's inside to each components and parts inside protection microphone packaging structure that can be better, in order to avoid influencing the acoustic performance and the life of microphone. In addition, since the filter screen 21 on the mesh part 2 can be in a flat state, it is also advantageous for the air to flow smoothly there, and the movement of the air flow is not adversely affected.
In the present invention, the carrier 1 has a hollow structure 11. The carrier 1 may be made of, for example, a metal material, or may be made of, for example, an alloy material or a polymer material. The skilled person can flexibly select the material according to the specific needs, without limitation.
In the present invention, as shown in fig. 2 to 4, the mesh part 2 includes a filter screen 21, a reinforcing part 22 disposed around the filter screen 21, and a fixing part 23 disposed around the reinforcing part 22. The fixing portion 23 is used to connect the mesh portion 2 with the carrier 1, so that the mesh portion 2 can stably cover the carrier 1. Note that, when the fixing portion 23 of the mesh portion 2 is connected to the carrier 1, the fixing portion 23 is connected to an edge portion of the carrier 1. Specifically, the fixing portion 23 of the mesh portion 2 and the edge portion of the carrier 1 may be connected together by, for example, adhesive bonding, or may be connected together by a fastening member or welding, and those skilled in the art may flexibly select the fixing portion according to specific needs, which is not limited by the invention.
The filter screen 21 may be made of metal mesh with a mesh aperture not greater than 10 μm, so as to allow air to pass through smoothly and effectively block particles such as dust and impurities from entering the filter screen. The filter screen made of metal has the characteristic of good durability, does not need to be frequently replaced, and has longer service life. Of course, the filter screen 21 may also be mesh cloth with other aperture sizes and other materials. The shape of the mesh on the filter screen 21 may be, for example, a circle, a square, a triangle, or the like. The person skilled in the art can flexibly adjust the device according to specific needs, without limitation.
In the mesh part 2, the shape of the filter screen 21 itself may be a regular shape such as a circle, a square, or an ellipse, for example, but the filter screen 21 may have other irregular shapes. The person skilled in the art can flexibly adjust the device according to the actual needs, and the device is not limited to this.
In the present invention, as shown in fig. 2 to 4, a side of the reinforcing portion 22 adjacent to the filter screen 21 is defined as an inner side of the reinforcing portion 22, and a side of the reinforcing portion 22 away from the filter screen 21 and adjacent to the fixing portion 23 is defined as an outer side of the reinforcing portion 22. The lengths of the meshes in the rows of the first mesh structure gradually decrease from the inside of the reinforcing portion 22 to the outside of the reinforcing portion 22. The design of the present invention can prevent stress concentration, help to disperse stress gradually, and help to keep the filter screen 21 on the mesh part 2 flat.
The reinforcing part 22 of the present invention includes a plurality of rows of first mesh structures extending to the outside of the filter screen 21 and concentrically arranged along the circumferential direction of the filter screen 21. Wherein each row of the first mesh structure comprises a plurality of reinforcing holes 221, and any two adjacent reinforcing holes 221 have a certain interval therebetween, which is set as S0And S is0In the range of 1 μm to 5 μm. The reasonable arrangement of the gaps between the reinforcement holes 221 can help to improve the rigidity of the reinforcement part 22, and avoid the occurrence of fracture due to insufficient strength of the reinforcement part 22 in production, which may affect the yield of the product.
In the mesh unit 2, the filter screen 21 has a structure in which: comprises a plurality of columns of second grid structures which are concentrically arranged along the circumferential direction. Wherein each row of the second grid structure comprises a plurality of meshes, the interval between any two adjacent meshes is S, and the interval S is less than S0. In the invention, the interval between meshes on the filter screen 21 is designed to be relatively small, which is beneficial to increasing the opening rate of the filter screen 21 and facilitating the smooth passing of air flow.
In the present invention, each of saidThe width of the reinforcement holes 221 is T, wherein T may range from 1 to 10 μm, and the length of each reinforcement hole 221 is set to LanThen L isanThe relation to T should be satisfied as follows: l isanand/T is 1-10. The inventors of the present invention have found that providing the reinforcing holes 221 having the above size range in the reinforcing portion 21 can achieve better absorption of stress from the radial direction without lowering the strength of the mesh portion 2.
The reinforcement holes 221 in the reinforcement 22 may have a variety of different shapes. For example, as shown in fig. 2, the reinforcement holes 221 are elliptical holes. For another example, as shown in fig. 3, the boundary portion of the reinforcement hole 221 in the width direction has a wave shape. For another example, as shown in fig. 4, the reinforced holes 221 are racetrack-type holes, and in this example, both ends of the reinforced holes 221 are in a semicircular structure with a radius of 0.5-5 μm. The three structures of the reinforcing holes 221 can effectively absorb the stress from the radial direction, so that the grid part 2, especially the filter screen 21 thereon, can keep flat, and the whole mechanical strength of the grid part 2 is not influenced.
It should be noted that the reinforcing holes 221 are not limited to the three hole-type structures, and those skilled in the art can flexibly design the reinforcing holes according to specific needs, and the design is not limited thereto.
As shown in fig. 2 to 4, on the reinforcing part 22, a portion between any two adjacent rows of the first mesh structures forms a first connection part. The filter screen 2 comprises a plurality of rows of second grid structures concentrically arranged along the circumferential direction, any two adjacent rows of second grid structures form second connecting parts, the second connecting parts arranged at intervals are located on the same radial line, and all the second connecting parts can be radially arranged relative to the center of the grid part 2 after being combined. A certain angle is formed between a connecting line of any one first connecting part and the center of the grid part 2 and an adjacent second connecting part, and is defined as a rotation angle theta which is not less than 0 degree.
In the present invention, the reinforcement 22 may include, for example, 5 to 10 columns of the first lattice structure. Within this range, the reinforcing portion 22 does not occupy an excessive space on the mesh portion 2, and does not affect the mechanical strength of the entire mesh portion 2. The specific number of rows of the first mesh structure may be flexibly adjusted according to the size of the mesh unit 2 itself, and the present invention is not limited thereto.
The area of all the mesh holes on the mesh part 2 accounts for 50 to 90 percent of the total area of the mesh part. I.e., equivalent to an opening ratio of 50% to 90% in the mesh portion 2, in which the rigidity of the entire mesh portion 2 is not lowered.
When the fixing portion 23 of the mesh portion 2 is connected to the carrier 1, the two may be connected by bonding, welding or fastening, for example, and those skilled in the art may flexibly adjust the fixing portion according to specific needs without limitation.
In the present invention, the thickness of the mesh part 2 may be, for example, about 0.5 μm. The height of the carrier 1 may be, for example, about 40 μm. This size is suitable for most microphone packages. Of course, the size of the assembly can be adjusted by those skilled in the art according to the specific assembly requirement, and the assembly is not limited to this.
According to another embodiment of the invention, a microphone packaging structure is also provided. The microphone packaging structure can be applied to various electronic products such as mobile phones, notebook computers, Ipad and VR equipment and intelligent wearable equipment, and is widely applied. The microphone packaging structure provided by the embodiment of the invention can effectively avoid the phenomenon that components such as an internal chip assembly and the like are damaged due to the influence of particles and foreign matters such as external dust and impurities, can prolong the service life of the microphone, and can ensure that the microphone keeps excellent acoustic performance.
The following further describes a specific structure of the microphone package structure provided in the embodiment of the present invention.
As shown in fig. 5 to 9, a microphone package structure provided by an embodiment of the present invention includes a housing 3 having a receiving cavity, and a sound pickup hole 4 is disposed on the housing 3. The sound pickup hole 4 is used to communicate the inside and outside of the housing 3. A microphone device is accommodated and fixed in the accommodation chamber of the housing 3. The microphone packaging structure further comprises the dustproof structure, and the dustproof structure is fixedly installed on the sound pickup hole 4. The dustproof structure can effectively protect components inside the microphone packaging structure.
In the present invention, the sound pickup hole 4 may have a circular, square, triangular, or elliptical shape, for example. The pickup hole 4 may be provided in one or more as required. The specific setting position of the sound pickup hole 4 can also be flexibly adjusted according to the specific condition of the microphone packaging structure, which is not limited by the present invention.
In an alternative example of the present invention, as shown in fig. 5, the dust-proof structure may be located outside the housing 3. That is, the sound pickup hole 4 is protected from the outside. In this example, the dust-proof structure is mounted outside the microphone package to cover the sound pickup hole 4, and does not occupy the space inside the microphone package. When the dustproof structure is installed, the dustproof structure can be reasonably installed according to the position of the sound pickup hole 4, so that the dustproof structure can be aligned to the sound pickup hole 4, and external particles and foreign matters can be prevented from being introduced into the microphone packaging structure through the sound pickup hole 4.
Of course, the present invention is not limited to the dustproof structure provided outside the housing 3, and the dustproof structure may be provided in the housing cavity of the housing 3. The technical personnel in the field can flexibly adjust the arrangement position of the dustproof structure according to specific needs.
The microphone packaging structure of the invention, the structure of its outer cover 3 is: the substrate 32 and the packaging cover 31 are included, and the substrate 32 and the packaging cover 31 together enclose the accommodating cavity. The dust-proof structure is accommodated in the accommodating cavity of the housing 3. The microphone device comprises a MEMS chip 5 and a signal amplifier 6.
In an alternative example of the present invention, as shown in fig. 6, the sound pickup hole 4 is located on the package cover 31, and the dust-proof structure is fixedly connected to the package cover 32. Dustproof construction's position corresponds to pickup hole 4, can avoid outside particulate matter, foreign matter to introduce inside microphone packaging structure through pickup hole 4.
In an alternative example of the present invention, as shown in fig. 7, the sound pickup hole 4 is located on the package cover 31, and the dust-proof structure is fixedly connected to the substrate 32 at a position corresponding to the sound pickup hole 4, and at the same time, the dust-proof structure also covers the MEMS chip 5, so as to effectively protect the chip in the microphone package structure.
In the present invention, the sound collecting hole 4 is not limited to be formed in the sealing cover 31 of the housing 3, and may be formed in the substrate 32. For example, as shown in fig. 8, the sound collecting hole 4 is located on the substrate 32, and the dust-proof structure is fixedly provided on the substrate 32 at a position corresponding to the sound collecting hole 4. For another example, as shown in fig. 9, the sound collecting hole 4 is located on the substrate 32, the dust-proof structure is fixedly provided on the substrate 32 at a position corresponding to the sound collecting hole 4, and the MEMS chip 5 is provided on the dust-proof structure. It should be noted that, when the sound-collecting hole 4 is formed in the substrate 32, a person skilled in the art may adjust the installation position of the dust-proof structure according to specific situations, as long as the person can prevent external particles and foreign matters from entering or can protect the internal chip, and the invention is not limited thereto.
Wherein the package cover 31 has a dish-shaped structure with an open end. The material of the package cover 31 may be, for example, a metal material, a plastic material, or a PCB. The shape of the sealing cap 31 may be, for example, a cylindrical shape or a rectangular parallelepiped shape. The person skilled in the art can flexibly adjust the device according to the actual needs without limitation.
The substrate 32 may be a circuit board known in the art, such as a PCB, without limitation. The package cover 31 and the substrate 32 may be fixed together by, for example, adhesive bonding or solder paste welding, and those skilled in the art can flexibly select the combination according to the needs without limitation.
The microphone packaging structure provided by the invention is characterized in that a microphone device is fixedly accommodated in an accommodating cavity of the shell 3. Specifically, as shown in fig. 5 to 9, the microphone device may include, for example, a MEMS chip 5 and a signal amplifier 6.
The MEMS chip 5 includes a substrate and an inductive film. The substrate is also a hollow structure. The sensing film is, for example, a piezoelectric element, a capacitive element, a piezoresistive element, or the like. The sensing film is arranged at one end of the substrate and covers the hollow structure of the substrate. The hollow structure forms a back cavity. When the MEMS chip 5 is fixed in the housing chamber, the MEMS chip 5 may be attached to the substrate 32. Of course, the MEMS chip 5 may also be attached to the package cover 31, for example, a special adhesive may be used to adhere the MEMS chip 5 to the package cover 31. The MEMS chip 5 can also be turned on by a circuit pattern in the substrate 32 in a flip-chip manner, which is common knowledge of those skilled in the art, and the present invention will not be described in detail herein.
The signal amplifier 6 may be mounted on the package cover 31, or may be mounted on the substrate 32. The signal amplifier 6 may be, for example, an ASIC chip. The ASIC chip is connected to the MEMS chip 5. The electrical signal output by the MEMS chip 5 can be transmitted to the ASIC chip, processed by the ASIC chip, and output. The MEMS chip 5 and the ASIC chip 6 may be electrically connected through a metal wire (bonding wire) to realize mutual conduction therebetween.
Further, the MEMS chip 5 and/or the signal amplifier 6 may be embedded in the substrate 32 or may be semi-embedded in the substrate 32. For example, a conductor is provided in the substrate 32, and a pad is provided on the substrate 32. The conductors are, for example, metallized through holes provided in the substrate 32. The pad is electrically connected to the MEMS chip 5 and the signal amplifier 6 via a conductor. The design in which the MEMS chip 5 and the signal amplifier 6 are embedded in the substrate 32 contributes to miniaturization of the microphone.
When the MEMS chip 5 and the signal amplifier 6 are embedded in the substrate 32, at least one metal layer needs to be provided above and below the MEMS chip 5 and the signal amplifier 6. The metal layer is grounded as a shield. A plurality of metal conductors are arranged in the area around the MEMS chip 5 and the signal amplifier 6 for constituting a shielding structure together with the above-mentioned metal layers. The design of embedding the MEMS chip 5 and the signal amplifier 6 in the substrate 32 makes it unnecessary to coat protective glue on the surface of the signal amplifier 6, thus simplifying the process and improving the optical noise resistance of the product.
On the other hand, the invention also provides electronic equipment. The electronic device comprises the microphone packaging structure.
The electronic device may be a mobile phone, a notebook computer, a tablet computer, a VR device, an intelligent wearable device, and the like, which is not limited in this respect.
Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims (19)

1. A dustproof construction which characterized in that: comprises a carrier and a grid part;
the carrier is of a hollow structure;
the grid part comprises a filter screen, a reinforcing part arranged around the filter screen and a fixing part arranged around the reinforcing part; the reinforcing part comprises a plurality of rows of first mesh structures which extend towards the outer side of the filter screen and are concentrically arranged along the circumferential direction of the filter screen;
the grid part is arranged at one end of the carrier and covers the hollow structure, the filter screen is opposite to the hollow structure, and the fixing part is connected with the carrier.
2. The dustproof structure according to claim 1, characterized in that: defining one side of the reinforcing part, which is close to the filter screen, as the inner side of the reinforcing part, one side of the reinforcing part, which is far away from the filter screen, as the outer side of the reinforcing part, and gradually reducing the mesh length on the multi-row first mesh structure from the inner side to the outer side of the reinforcing part.
3. The dustproof structure according to claim 1, characterized in that: each column of the first mesh structure includes a plurality ofReinforcement holes, the space S between any two adjacent reinforcement holes0Is 1-5 μm.
4. The dustproof structure according to claim 3, characterized in that: the filter screen comprises a plurality of rows of second grid structures which are concentrically arranged along the circumferential direction;
wherein each row of the second grid structure comprises a plurality of meshes, and the interval S between any two adjacent meshes is less than S0。
5. The dustproof structure according to claim 3, characterized in that: each of the reinforcement holes has a width T of 1-10 μm;
each of the reinforcement holes has a length Lan；
LanThe relationship with T is: l isan/T＝1-10。
6. The dustproof structure according to claim 3, characterized in that: the reinforcing holes are elliptical holes.
7. The dustproof structure according to claim 3, characterized in that: the reinforced holes are runway-shaped holes, and the two ends of each reinforced hole are semicircular and have the radius of 0.5-5 mu m.
8. The dustproof structure according to claim 3, characterized in that: the boundary portion of the reinforcing hole in the width direction is waved.
9. The dustproof structure according to claim 1, characterized in that: on the reinforcing part, a first connecting part is formed at a part between any two adjacent columns of the first grid structures;
the filter screen comprises a plurality of rows of second grid structures concentrically arranged along the circumferential direction, a second connecting part is formed between any two adjacent rows of the second grid structures, and all the formed second connecting parts are radially arranged relative to the center of the grid part;
wherein a rotation angle theta is formed between a connecting line of any one first connecting part and the center of the grid part and one adjacent second connecting part, and the rotation angle theta is more than or equal to 0 degree.
10. The dustproof structure according to claim 1, characterized in that: the area of all the mesh holes on the mesh part accounts for 50-90% of the total area of the mesh part.
11. The dustproof structure according to claim 1, characterized in that: on the reinforcement, the first mesh structure is provided with 5-10 rows.
12. A microphone packaging structure is characterized in that: the shell is provided with a sound pickup hole, and the sound pickup hole is used for communicating the inside with the outside of the shell;
the microphone device is fixedly arranged in the accommodating cavity;
further comprising a dust-proof structure as claimed in any one of claims 1-11, said dust-proof structure being provided on said sound pick-up aperture.
13. The microphone package structure of claim 12, wherein: the dust-proof structure is located outside the housing.
14. The microphone package structure of claim 12, wherein: the shell comprises a substrate and an encapsulation cover, and the substrate and the encapsulation cover enclose the accommodating cavity;
the dustproof structure is accommodated in the accommodating cavity;
the microphone device includes a MEMS chip and a signal amplifier.
15. The microphone package structure of claim 14, wherein: the pickup hole is located on the encapsulation cover, the dustproof construction with encapsulation cover fixed connection.
16. The microphone package structure of claim 14, wherein: the pickup hole is located on the packaging cover, and the dustproof structure is fixedly connected to the substrate so as to cover the MEMS chip.
17. The microphone package structure of claim 14, wherein: the sound pickup hole is positioned on the substrate, and the dustproof structure is fixedly arranged on the substrate corresponding to the position of the sound pickup hole.
18. The microphone package structure of claim 14, wherein: the pickup hole is positioned on the substrate, the dustproof structure is fixedly arranged on the substrate corresponding to the pickup hole, and the MEMS chip is arranged on the dustproof structure.
19. An electronic device, characterized in that: comprising a microphone package according to any of claims 12-18.
CN201911421954.9A 2019-12-31 2019-12-31 Dustproof structure, microphone packaging structure and electronic equipment Pending CN111147994A (en)

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Application Number Priority Date Filing Date Title
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CN111711911A (en) * 2020-06-30 2020-09-25 歌尔微电子有限公司 Miniature microphone dust keeper and MEMS microphone
CN111711906A (en) * 2020-06-30 2020-09-25 歌尔微电子有限公司 Miniature microphone dust keeper and MEMS microphone
WO2021135113A1 (en) * 2019-12-31 2021-07-08 潍坊歌尔微电子有限公司 Dustproof structure, microphone packaging structure, and electronic device
WO2021135116A1 (en) * 2019-12-31 2021-07-08 潍坊歌尔微电子有限公司 Dustproof structure, microphone packaging structure and electronic device
WO2021135128A1 (en) * 2019-12-31 2021-07-08 潍坊歌尔微电子有限公司 Dustproof structure, microphone packaging structure and electronic device

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CN204703244U (en) * 2015-05-19 2015-10-14 易暹企业股份有限公司 One clad type filter screen
CN208739163U (en) * 2018-09-25 2019-04-12 北京小米移动软件有限公司 Dust guard and terminal device
CN209105452U (en) * 2019-01-15 2019-07-12 歌尔科技有限公司 MEMS microphone and electronic equipment
CN110602602A (en) * 2019-09-18 2019-12-20 歌尔股份有限公司 Electronic equipment and audio module thereof
CN111147994A (en) * 2019-12-31 2020-05-12 歌尔股份有限公司 Dustproof structure, microphone packaging structure and electronic equipment

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Publication number Priority date Publication date Assignee Title
WO2021135113A1 (en) * 2019-12-31 2021-07-08 潍坊歌尔微电子有限公司 Dustproof structure, microphone packaging structure, and electronic device
WO2021135116A1 (en) * 2019-12-31 2021-07-08 潍坊歌尔微电子有限公司 Dustproof structure, microphone packaging structure and electronic device
WO2021135128A1 (en) * 2019-12-31 2021-07-08 潍坊歌尔微电子有限公司 Dustproof structure, microphone packaging structure and electronic device
CN111711911A (en) * 2020-06-30 2020-09-25 歌尔微电子有限公司 Miniature microphone dust keeper and MEMS microphone
CN111711906A (en) * 2020-06-30 2020-09-25 歌尔微电子有限公司 Miniature microphone dust keeper and MEMS microphone
CN111711906B (en) * 2020-06-30 2021-10-22 歌尔微电子有限公司 Miniature microphone dust keeper and MEMS microphone

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