WO2021135113A1

WO2021135113A1 - Dustproof structure, microphone packaging structure, and electronic device

Info

Publication number: WO2021135113A1
Application number: PCT/CN2020/099179
Authority: WO
Inventors: 林育菁; 池上尚克; 畠山庸平
Original assignee: 潍坊歌尔微电子有限公司
Priority date: 2019-12-31
Filing date: 2020-06-30
Publication date: 2021-07-08
Also published as: CN111147995A

Abstract

Disclosed are a dustproof structure, a microphone packaging structure, and an electronic device. The dustproof structure comprises a carrier and a grid part; the carrier is of a hollow structure; the grid part is arranged at one end of the carrier and covers the hollow structure; the grid part comprises a filter screen, a stress buffer area arranged around the filter screen, and a fixing part arranged around the stress buffer area, the filter screen is opposite to the hollow structure, the fixing part is connected to the carrier, and the filter screen and the stress buffer area are arranged in a suspended manner. One technical effect of the present invention is that the filter screen on the grid part can be kept in a flat state, so that the grid part can effectively block external particles and foreign matters from entering the microphone packaging structure.

Description

Dustproof structure, microphone packaging structure and electronic equipment

Technical field

The present invention relates to the technical field of electro-acoustic conversion, and more specifically, the present invention relates to a dustproof structure, a microphone packaging structure, and an electronic device.

Background technique

With the rapid development of electroacoustic technology, various electroacoustic products emerge in endlessly. The microphone, as a transducer that converts sound into electrical signals, is one of the most important devices in electroacoustic products. Today, microphones have been widely used in many different types of electronic products such as mobile phones, tablet computers, notebook computers, VR devices, AR devices, smart watches and smart wearables. In recent years, for the microphone packaging structure, the design of the structure has become the focus and focus of research by those skilled in the art.

The existing microphone packaging structure usually includes a housing with a accommodating cavity in which components such as chip components (for example, MEMS chips and ASIC chips) are housed and fixed; and a sound pickup hole is also provided on the housing. However, in long-term applications, it has been found that external dust, impurities and other particles and foreign objects are easily introduced into the microphone cavity through the pickup hole, and these external particles and foreign objects can affect the chip components in the cavity, etc. The components cause certain damage, which will eventually affect the acoustic performance and service life of the microphone.

In view of the above-mentioned problems, the currently adopted solution is usually to provide a corresponding isolation component on the pickup hole of the microphone packaging structure to block the entry of foreign particles, foreign objects, etc. The existing isolation assembly, as shown in FIG. 1 and FIG. 2, includes a support portion and an isolation mesh. When using the isolation component, install the isolation component on the pickup hole. However, in the existing isolation components, due to the difference in size, material, structure, etc. between the support portion 101 and the isolation mesh 102, a certain internal stress difference is likely to occur at the position where the two are connected, which will lead to isolation. The omentum 103 on the mesh cloth 102 produces wrinkles or wrinkles, which cannot guarantee that the omentum 103 is in a flat state, which will cause the quality of the product to decrease, and even affect the air flow at the omentum 103.

Summary of the invention

An object of the present invention is to provide a new technical solution for a dust-proof structure, a microphone packaging structure, and an electronic device.

According to the first aspect of the present invention, there is provided a dust-proof structure, including a carrier and a grid part;

The carrier is a hollow structure; the grid part is arranged at one end of the carrier and covers the hollow structure;

The grid portion includes a filter screen, a stress buffer area provided around the filter screen, and a fixed portion provided around the stress buffer area. The filter screen is opposite to the hollow structure, and the fixed portion is opposite to the carrier. Connected, the filter screen and the stress buffer area are suspended.

Optionally, the stress buffer area is a ring structure with a predetermined width α, and the predetermined width α>0.

Optionally, the ratio η of the width φ of the filter screen to the predetermined width α of the stress buffer area is: 0%<η<27%.

Optionally, the width of the hollow structure of the carrier is greater than the maximum width of the filter screen.

Optionally, the inner wall surface of the carrier is an inclined surface.

Optionally, the inner wall surface of the carrier is formed with at least two inclination angles.

Optionally, the inner wall surface of the carrier is a curved surface.

Optionally, the fixing portion is fixedly connected to the carrier, the filter screen and the stress buffer area are suspended, and the cross section of the stress buffer area is L-shaped.

According to a second aspect of the present invention, a microphone packaging structure is provided. The microphone packaging structure includes a housing with an accommodating cavity, and a sound pickup hole is provided on the housing, and the sound pickup hole is used to communicate the inside and the outside of the housing;

It also includes a microphone device, the microphone device is fixedly arranged in the accommodating cavity;

It also includes the dust-proof structure as described in any one of the above, the dust-proof structure is arranged on the sound pickup hole.

Optionally, the dust-proof structure is located outside the housing.

Optionally, the housing includes a substrate and a packaging cover, and the substrate and the packaging cover surround the containing cavity;

The dust-proof structure is contained in the containing cavity;

The microphone device includes a MEMS chip and a signal amplifier.

Optionally, the sound pickup hole is located on the packaging cover, and the dust-proof structure is fixedly connected to the packaging cover.

Optionally, the sound pickup hole is located on the packaging cover, and the dust-proof structure is fixedly connected to the substrate to cover the MEMS chip.

Optionally, the sound pickup hole is located on the substrate, and the dust-proof structure is fixedly provided on the substrate at a position corresponding to the sound pickup hole.

Optionally, the sound pickup hole is located on the substrate, the dustproof structure is fixedly arranged on the substrate at a position corresponding to the sound pickup hole, and the MEMS chip is arranged on the dustproof structure.

According to a third aspect of the present invention, an electronic device is provided. The electronic device includes the microphone packaging structure as described in any one of the above.

In the dust-proof structure provided by the embodiment of the present invention, a stress buffer area is specially designed in it, which can keep the filter net on the grid part in a flat state and avoid the phenomenon of wrinkles or wrinkles on the filter net. The dust-proof structure provided by the embodiment of the present invention can effectively protect the sound pickup hole of the microphone packaging structure, and the mesh part can block external particles and foreign objects from entering the inside of the microphone packaging structure, thereby effectively protecting the inside of the microphone The components in order to avoid affecting the acoustic performance and service life of the microphone. The technical task to be achieved or the technical problem to be solved by the present invention is never thought of or unexpected by those skilled in the art, so the present invention is a new technical solution.

Through the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings, other features and advantages of the present invention will become clear.

Description of the drawings

The drawings incorporated in the specification and constituting a part of the specification illustrate the embodiments of the present invention, and together with the description are used to explain the principle of the present invention.

Figure 1 is a side view of a conventional isolation assembly.

FIG. 2 is a schematic diagram of the structure of the isolation part in the existing isolation assembly.

Fig. 3 is a schematic structural diagram of a dust-proof structure according to an embodiment of the present invention.

Fig. 4 is a schematic structural diagram of a dust-proof structure according to another embodiment of the present invention.

Fig. 5 is a schematic structural diagram of a dust-proof structure according to another embodiment of the present invention.

Fig. 6 is a schematic structural diagram of a microphone packaging structure according to a first embodiment of the present invention.

Fig. 7 is a schematic structural diagram of a microphone packaging structure according to a second embodiment of the present invention.

FIG. 8 is a schematic structural diagram of a microphone packaging structure according to a third embodiment of the present invention.

Fig. 9 is a schematic structural diagram of a microphone packaging structure according to a fourth embodiment of the present invention.

Fig. 10 is a schematic structural diagram of a microphone packaging structure according to a fifth embodiment of the present invention.

Description of reference signs:

101-support, 102-isolation mesh, 103-membrane;

1-carrier, 11-inner wall surface, 12-air flow channel, 2-mesh part, 21-filter, 22-fixed part, 23-stress buffer area, 3-shell, 31-package cover, 32-substrate, 4 -Pickup hole, 5-MEMS chip, 6-signal amplifier.

Detailed ways

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless specifically stated otherwise, the relative arrangement of components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention.

The following description of at least one exemplary embodiment is actually only illustrative, and in no way serves as any limitation to the present invention and its application or use.

The technologies, methods, and equipment known to those of ordinary skill in the relevant fields may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be regarded as part of the specification.

In all examples shown and discussed herein, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of the exemplary embodiment may have different values.

It should be noted that similar reference numerals and letters indicate similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further discussed in the subsequent drawings.

According to an embodiment of the present invention, a dust-proof structure is provided. The dust-proof structure can be applied to, for example, a microphone packaging structure. The dust-proof structure can effectively block external particles and foreign objects from entering the microphone packaging structure through the pickup hole on the microphone packaging structure, thereby effectively protecting the internal components of the microphone to avoid affecting the microphone's acoustic performance and Service life.

The specific structure of the dustproof structure provided by the embodiment of the present invention will be further described below. The dust-proof structure provided by the embodiment of the present invention, as shown in FIGS. 3 to 5, includes a carrier 1 and a grid portion 2. Wherein, the carrier 1 has a hollow structure, and an air flow channel 12 is formed inside the hollow structure for air flow. The grid portion 2 is arranged at one end of the carrier 1 and covers the hollow structure. The mesh portion 2 includes a filter screen 21, a stress buffer area 23 provided around the filter screen 21, and a fixing portion 22 provided around the stress buffer area 23, and the filter screen 21 is opposite to the hollow structure The fixing portion 22 is connected to the carrier 1, and the filter mesh 21 and the stress buffer area 23 are suspended.

In the dust-proof structure provided by the embodiment of the present invention, the stress buffer area 23 is specially designed to keep the filter mesh 21 on the mesh portion 2 in a flat state and avoid the occurrence of wrinkles or wrinkles on the filter mesh 21. The dust-proof structure provided by the embodiment of the present invention can effectively protect the microphone packaging structure, and the mesh portion 2 can effectively block external particles and foreign objects from entering the microphone packaging structure, thereby effectively protecting the microphone packaging structure. The various components of the microphone to avoid affecting the acoustic performance and service life of the microphone. In addition, since the filter mesh 21 on the mesh portion 2 is in a flat state, this also facilitates the smooth flow of air here, and will not adversely affect the movement of the airflow.

In the present invention, as shown in FIG. 3, the stress buffer area 23 is a ring structure with a predetermined width α. And, the predetermined width α should be greater than zero. It should be noted that the stress buffer region 23 may be, for example, a circular ring structure with a predetermined width α, a square ring structure with a predetermined width α, or other ring structures with a predetermined width α. The technical personnel can flexibly adjust according to the specific situation, which is not limited in the present invention.

In the present invention, as shown in FIG. 3, the grid portion 2 includes a filter mesh 21, a stress buffer area 23 provided around the filter mesh 21, and a fixing portion 22 provided around the stress buffer area 23. Wherein, the filter mesh 21 and the stress buffer area 23 are suspended. Wherein, the fixing portion 22 can be used to connect the grid portion 2 and the carrier 1 so that the grid portion 2 can be stably covered on the carrier 1. It should be noted that when the fixed portion 22 of the grid portion 2 is connected to the carrier 1, the fixed portion 22 is actually connected to the edge portion of the carrier 1. Specifically, the fixing portion 22 of the grid portion 2 and the edge portion of the carrier 1 can be connected together, for example, by means of adhesive bonding. Of course, the two can also be connected by fasteners or welding. Those skilled in the art can flexibly choose according to specific needs, which is not limited by the present invention.

Wherein, the filter mesh 21 can be, for example, a metal mesh cloth with a mesh diameter of less than about 10 μm, so that the air flow can pass smoothly, and at the same time, it can effectively block the ingress of external dust, impurities and other particles. Moreover, the metal mesh cloth has the characteristics of good durability, does not need to be replaced frequently, and has a long service life. Of course, the filter mesh 21 can also be made of meshes with other pore sizes and other materials. In addition, the shape of the mesh opening of the filter mesh 21 may be, for example, a circle, a square, a triangle, or the like. Those skilled in the art can make adjustments flexibly according to specific needs, and there is no restriction on this.

In addition, it should be noted that on the mesh portion 2, the shape of the filter 21 itself can be, for example, a circle, a square, an oval, etc. Of course, the filter 21 can also have other irregular shapes. Those skilled in the art can make adjustments flexibly according to actual needs, and the present invention does not limit this.

In the present invention, the size of the stress buffer area 23 should be reasonably adjusted and set according to the size of the filter mesh 21 on the grid portion 2. For example, if the width dimension of the filter screen 21 is defined as φ, the ratio η between the width φ of the filter screen 21 and the predetermined width α of the stress buffer area 23 should satisfy the relationship: 0%<η<27%. The inventors of the present invention found that within this range, η helps to keep the filter mesh 21 in a flat state without causing wrinkles thereon.

In an optional example of the present invention, as shown in FIG. 3, the filter mesh 21 on the grid portion 2 has a circular structure. In this example, the ratio η of the diameter aa' of the filter screen 21 to the predetermined width α of the stress buffer region 23 should satisfy: 0%<η<27%. At this time, when the mesh portion 2 and the carrier 1 are connected together, the filter mesh 21 on the mesh portion 2 can be kept flat without wrinkles or wrinkles.

In the present invention, as shown in FIGS. 3 to 5, the width dimension of the hollow structure of the carrier 1 is larger than the width (or width) of the filter mesh 21. When the filter screen 21 itself has an irregular shape, the width dimension of the hollow structure of the carrier 1 should be greater than the maximum width of the filter screen 21. That is, what is designed in the present invention is that the filter mesh 21 itself cannot completely cover the hollow structure of the carrier 1. In the present invention, the carrier 1 is improved, and the wall thickness of the carrier 1 is reduced, so that the width dimension of the hollow structure becomes larger. In this way, when the grid portion 2 is fixed on the carrier 1, a stress buffer area 23 with a certain space can be formed at the edge of the connecting position of the two. The stress buffering area 23 can well improve the defect that the filter mesh 21 is prone to wrinkles in the prior art.

In an optional example of the present invention, as shown in FIG. 3, the inner wall surface 11 of the carrier 1 is an inclined surface. That is, the wall surface of the hollow structure of the carrier 1 has a slope structure. Wherein, the inner wall surface of the carrier 1 may be inclined at a predetermined angle, and the inner wall surface forms a conical surface structure. Those skilled in the art can appropriately adjust the inclination angle according to specific needs, and there is no limitation on this. In this example, as shown in FIG. 3, at the end where the carrier 1 is connected to the fixed portion 22 of the grid portion 2, the width of the carrier 1 is relatively large; the carrier 1 is far from the grid portion 2 At one end, the width of the carrier 1 is relatively small. This design makes the hollow structure of the carrier 1 form a tapered air flow channel 12. When the grid part 2 is fixedly arranged on the carrier 1, because the grid part 2 and the carrier 1 are connected, the width of the carrier 1 is larger, which helps the two to be firmly and stably combined, and the tapered structure The air flow channel 12 is conducive to air flow.

In an optional example of the present invention, as shown in FIG. 4, the inner wall surface 11 of the carrier 1 is formed with at least two inclination angles. It should be noted that when the inner wall surface of the carrier 1 forms two or more inclination angles, the slopes of the different inclination angles can be the same, of course, can also be different, and those skilled in the art can flexibly adjust according to the specific situation. , There is no restriction on this. In this example, as shown in FIG. 4, at the end where the carrier 1 is connected to the fixed portion 22 of the grid portion 2, the width of the carrier 1 is relatively large; the carrier 1 is far from the grid portion 2 At one end, the width of the carrier 1 is relatively small. When the grid portion 2 is fixed on the carrier 1, the width of the carrier 1 is also relatively large due to the connection between the grid portion 2 and the carrier 1, which also contributes to the firm and stable combination of the two.

Of course, in the present invention, the inner wall surface 11 of the carrier 1 is not limited to the above two structures. The inner wall surface 11 of the carrier 1 may also have an arc-shaped structure, that is, an arc-shaped surface, for example. This structure is relatively simple to implement.

In an optional example of the present invention, as shown in FIG. 5, the fixing portion 22 of the grid portion 2 is fixedly connected to the edge portion of the carrier 1, wherein the filter mesh 21 and the stress buffer area 23 is suspended, and the cross section of the stress buffer area 23 is L-shaped.

It should be noted that when the fixing portion 22 of the grid portion 2 is connected to the carrier 1, for example, bonding, welding, or fastener connection can be used. Those skilled in the art can flexibly adjust according to specific needs. This is not limited.

In addition, in the present invention, the thickness of the mesh portion 2 may be 0.5 μm, for example. The height of the carrier 1 may be 40 μm, for example. This size is suitable for most microphone packaging structures. Of course, those skilled in the art can also make appropriate adjustments to the size according to specific assembly requirements, and there is no limitation on this.

According to another embodiment of the present invention, a microphone packaging structure is also provided. The microphone packaging structure can be applied to various types of electronic products such as mobile phones, notebook computers, Ipads, VR devices, and smart wearable devices, and its applications are relatively wide. The microphone packaging structure provided by the embodiments of the present invention can effectively prevent internal chip components and other components from being damaged due to external dust, impurities and other particles and foreign objects, and can prolong the service life of the microphone and also make the microphone Maintain excellent acoustic performance.

The specific structure of the microphone packaging structure provided by the embodiment of the present invention will be further described below.

As shown in FIGS. 6-10, the microphone packaging structure provided by the embodiment of the present invention includes a housing 3 with a receiving cavity, and a sound pickup hole 4 is provided on the housing 3. The sound pickup hole 4 is used to communicate the inside and outside of the housing 3. A microphone device is accommodated and fixed in the accommodating cavity of the housing 3. The microphone packaging structure provided by the present invention further includes the dust-proof structure as described above, and the dust-proof structure is fixedly installed on the sound pickup hole 4. The dustproof structure can effectively protect the components inside the microphone packaging structure.

In the present invention, the shape of the sound pickup hole 4 may be, for example, a circle, a square, a triangle, an ellipse, or the like. The sound pickup hole 4 can be set to one or more according to needs. The specific location of the sound pickup hole 4 can also be flexibly adjusted according to the specific situation of the microphone packaging structure, which is not limited in the present invention.

In an optional example of the present invention, as shown in FIG. 6, the dust-proof structure may be located outside the housing 3. That is, the sound pickup hole 4 is protected from the outside. In this example, the dust-proof structure is installed on the outside of the microphone packaging structure to cover the pickup hole 4, and does not occupy the space inside the microphone packaging structure. When installing the dustproof structure, the position of the dustproof structure can be reasonably installed according to the position of the pickup hole 4, so that the dustproof structure can be aligned with the pickup hole 4, so as to prevent external particles and foreign objects from passing through the pickup hole 4. It is introduced into the microphone packaging structure.

Of course, the present invention is not limited to disposing the dust-proof structure outside the housing 3, and the dust-proof structure may also be disposed in the containing cavity of the housing 3. Those skilled in the art can flexibly adjust the location of the dust-proof structure according to specific needs.

In the microphone packaging structure of the present invention, the housing 3 has a structure including a substrate 32 and a packaging cover 31, and the substrate 32 and the packaging cover 31 are combined to form the containing cavity. The dust-proof structure is contained in the containing cavity of the housing 3. The microphone device includes a MEMS chip 5 and a signal amplifier 6.

In an optional example of the present invention, as shown in FIG. 7, the sound pickup hole 4 is located on the packaging cover 31, and the dust-proof structure is fixedly connected to the packaging cover 32. The position of the dust-proof structure corresponds to the sound pickup hole 4, which can prevent external particles and foreign objects from being introduced into the microphone packaging structure through the sound pickup hole 4.

In an optional example of the present invention, as shown in FIG. 8, the sound pickup hole 4 is located on the packaging cover 31, and the dust-proof structure is fixedly connected to the substrate 32 corresponding to the sound pickup hole 4 At the same time, the dust-proof structure also covers the MEMS chip 5, which can effectively protect the chip in the microphone packaging structure.

In the present invention, the sound pickup hole 4 is not limited to being opened on the packaging cover 31 of the housing 3, and may also be opened on the substrate 32. For example, as shown in FIG. 9, the sound pickup hole 4 is located on the substrate 32, and the dust-proof structure is fixedly provided on the substrate 32 at a position corresponding to the sound pickup hole 4. For another example, as shown in FIG. 10, the sound pickup hole 4 is located on the substrate 32, the dustproof structure is fixedly provided on the substrate 32 at a position corresponding to the sound pickup hole 4, and the MEMS chip 5 is provided On the dust-proof structure. It should be noted that when the sound pickup hole 4 is opened on the substrate 32, those skilled in the art can adjust the installation position of the dust-proof structure according to the specific situation, as long as it can prevent external particles and foreign objects from entering or can protect the internal chip Yes, there is no restriction on this.

Wherein, the packaging cover 31 has a dish-like structure as a whole, which has an open end. The material of the packaging cover 31 can be, for example, a metal material, a plastic material, or a PCB board. The shape of the packaging cover 31 may be, for example, a cylindrical shape, a rectangular parallelepiped shape, or the like. Those skilled in the art can flexibly adjust according to actual needs, and there is no restriction on this.

Wherein, the substrate 32 may be a circuit board well-known in the art, for example, a PCB board, etc., which is not limited. The packaging cover 31 and the substrate 32 can be fixed together by, for example, adhesive bonding or solder paste welding. Those skilled in the art can flexibly choose according to their needs, and there is no limitation on this.

In the microphone packaging structure provided by the present invention, a microphone device is fixedly accommodated in the accommodating cavity of the housing 3. Specifically, as shown in FIGS. 6-10, the microphone device may include, for example, a MEMS chip 5 and a signal amplifier 6.

Wherein, the MEMS chip 5 includes a substrate and a sensing film. The substrate is also a hollow structure. The sensing film is, for example, a piezoelectric element, a capacitive element, a piezoresistive element, and the like. The sensing film is arranged at one end of the substrate and covers the hollow structure of the substrate. The hollow structure forms a back cavity. When the MEMS chip 5 is fixed in the accommodating cavity, the MEMS chip 5 can be mounted on the substrate 32. Of course, the MEMS chip 5 can also be mounted on the package cover 31, for example, a special adhesive can be used to bond the MEMS chip 5 on the package cover 31. The MEMS chip 5 can also be turned on through the circuit layout in the substrate 32 in a flip-chip manner, which belongs to the common knowledge of those skilled in the art, and the present invention will not be described in detail here.

Wherein, the signal amplifier 6 can be mounted on the package cover 31, of course, can also be mounted on the substrate 32. The signal amplifier 6 can be, for example, an ASIC chip. The ASIC chip is connected to the MEMS chip 5. The electrical signal output by the MEMS chip 5 can be transmitted to the ASIC chip, processed and output by the ASIC chip. The MEMS chip 5 and the ASIC chip 6 can be electrically connected through metal wires (bonding wires) to achieve mutual conduction between the two.

In addition, the MEMS chip 5 and/or the signal amplifier 6 may also be embedded in the substrate 32 or half embedded in the substrate 32. For example, a conductor is provided in the substrate 32, and a pad is provided on the substrate 32. The conductor is, for example, a metalized through hole provided in the substrate 32. The pad is electrically connected to the MEMS chip 5 and the signal amplifier 6 through a conductor. The design of embedding the MEMS chip 5 and the signal amplifier 6 in the substrate 32 contributes to miniaturization of the microphone.

It should be noted that when the MEMS chip 5 and the signal amplifier 6 are buried in the substrate 32, at least one metal layer needs to be provided above and below the MEMS chip 5 and the signal amplifier 6 directly opposite. Ground the metal layer as a shield. A plurality of metal conductors are arranged around the MEMS chip 5 and the signal amplifier 6 to form a shielding structure together with the above-mentioned metal layer. The design of embedding the MEMS chip 5 and the signal amplifier 6 in the substrate 32 eliminates the need to cover the surface of the signal amplifier 6 with protective glue, which can simplify the process and improve the product's resistance to light noise.

On the other hand, the present invention also provides an electronic device. The electronic device includes the microphone packaging structure as described above.

Wherein, the electronic device may be a mobile phone, a notebook computer, a tablet computer, a VR device, a smart wearable device, etc., which is not limited in the present invention.

Although some specific embodiments of the present invention have been described in detail through examples, those skilled in the art should understand that the above examples are only for illustration and not for limiting the scope of the present invention. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present invention. The scope of the invention is defined by the appended claims.

Claims

A dust-proof structure, characterized in that it comprises a carrier and a grid part;

The carrier is a hollow structure; the grid part is arranged at one end of the carrier and covers the hollow structure;

The grid portion includes a filter screen, a stress buffer area provided around the filter screen, and a fixing portion provided around the stress buffer area. The filter screen is opposite to the hollow structure, and the fixed portion is opposite to the carrier. Connected, the filter screen and the stress buffer area are suspended.
The dust-proof structure according to claim 1, wherein the stress buffer area is a ring structure with a predetermined width α, and the predetermined width α>0.
The dust-proof structure according to claim 2, wherein the ratio η of the width φ of the filter screen to the predetermined width α of the stress buffer area is: 0%<η<27%.
The dust-proof structure according to claim 1, wherein the width of the hollow structure of the carrier is greater than the maximum width of the filter screen.
The dust-proof structure according to claim 1, wherein the inner wall surface of the carrier is an inclined surface.
The dust-proof structure according to claim 1, wherein the inner wall surface of the carrier is formed with at least two inclination angles.
The dust-proof structure according to claim 1, wherein the inner wall surface of the carrier is a curved surface.
The dust-proof structure according to claim 1, wherein the fixing part is fixedly connected to the carrier, the filter screen and the stress buffer area are suspended, and the cross section of the stress buffer area is L-shaped.
A microphone packaging structure, characterized in that it comprises a housing with a containing cavity, and a sound pickup hole is provided on the housing, and the sound pickup hole is used to communicate the inside and the outside of the housing;

It also includes a microphone device, the microphone device being fixedly arranged in the containing cavity;

It also includes the dust-proof structure according to any one of claims 1-8, which is arranged on the sound pickup hole.
9. The microphone packaging structure according to claim 9, wherein the dust-proof structure is located outside the housing.
The microphone packaging structure according to claim 9, wherein the housing includes a substrate and a packaging cover, and the substrate and the packaging cover surround the containing cavity;

The dust-proof structure is contained in the containing cavity;

The microphone device includes a MEMS chip and a signal amplifier.
11. The microphone packaging structure of claim 11, wherein the sound pickup hole is located on the packaging cover, and the dust-proof structure is fixedly connected to the packaging cover.
11. The microphone packaging structure of claim 11, wherein the sound pickup hole is located on the packaging cover, and the dust-proof structure is fixedly connected to the substrate to cover the MEMS chip.
The microphone packaging structure according to claim 11, wherein the sound pickup hole is located on the substrate, and the dustproof structure is fixedly provided on the substrate at a position corresponding to the sound pickup hole.
The microphone package structure according to claim 11, wherein the sound pickup hole is located on the substrate, the dustproof structure is fixedly provided on the substrate at a position corresponding to the sound pickup hole, and the MEMS chip is provided On the dust-proof structure.
An electronic device, characterized by comprising the microphone packaging structure according to any one of claims 9-15.