CN204442602U - A kind of MEMS sensor - Google Patents
A kind of MEMS sensor Download PDFInfo
- Publication number
- CN204442602U CN204442602U CN201520110876.1U CN201520110876U CN204442602U CN 204442602 U CN204442602 U CN 204442602U CN 201520110876 U CN201520110876 U CN 201520110876U CN 204442602 U CN204442602 U CN 204442602U
- Authority
- CN
- China
- Prior art keywords
- mems sensor
- top board
- intercommunicating pore
- chain link
- link fence
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000011148 porous material Substances 0.000 claims abstract description 35
- 239000002184 metal Substances 0.000 claims description 9
- 238000010276 construction Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 11
- 230000035699 permeability Effects 0.000 abstract description 7
- 238000005538 encapsulation Methods 0.000 abstract description 6
- 239000002245 particle Substances 0.000 abstract description 5
- 238000005476 soldering Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Landscapes
- Details Of Audible-Bandwidth Transducers (AREA)
Abstract
The utility model MEMS sensor, the top board of sensor-packaging structure is provided with Chain Link Fence, and Chain Link Fence is bonded on top board by glue-line, and arrange adhesive-free area at the intercommunicating pore place of top board, intercommunicating pore is placed in adhesive-free area.Can effectively avoid in encapsulation process, extraneous foreign particles enters into MEMS sensor inside by intercommunicating pore; Prevent external air flow from easily entering into MEMS sensor cavity, cause MEMS sensor rupture of diaphragm; Can prevent MEMS sensor when by Reflow Soldering, the situation that the diaphragm of the MEMS sensor chip that intercommunicating pore cannot be discharged rapidly when gas permeability is not good and be caused shatters; Simultaneously wire netting the effect can also playing electromagnetic shielding is set; Solve the problem that terminal client easily pollutes in sensor application processing procedure.Therefore, the utility model improves the reliability of MEMS sensor.
Description
Technical field
The utility model relates to sensor technical field, especially relates to a kind of MEMS sensor.
Background technology
Along with the progress of society and the development of technology, in recent years, the volume of the electronic products such as mobile phone, panel computer, notebook computer is more and more less, and the performance requirement of people to these electronic products is also more and more higher, thus also requires that the performance of electronic component supporting with it improves constantly.In this case, based on MEMS (micro electro mechanical system) (Micro-Electro-Mechanical System, MEMS) MEMS sensor is applied in multiple electronic product, and MEMS microphone and pressure sensor are also more and more subject to people as common transducer and pay close attention to.
MEMS sensor, comprises outer enclosure structure, and the MEMS sensor chip be arranged in outer enclosure structure and asic chip, and for accept and transmission of signal to the intercommunicating pore of MEMS sensor chip.The MEMS sensor of prior art, has following problem:
In encapsulation process, extraneous foreign particles easily enters into MEMS sensor inside by intercommunicating pore as scolding tin, dust etc., causes a hidden trouble to MEMS microphone performance;
External air flow easily enters into MEMS sensor cavity and is applied directly to MEMS sensor chip, causes air pressure too high, causes MEMS rupture of diaphragm, thus causes MEMS sensor to lose efficacy;
MEMS sensor is when by Reflow Soldering, and Yin Wendu raises, gas expansion in MEMS sensor cavity, and intercommunicating pore cannot be discharged rapidly when gas permeability is not good and cause the diaphragm of MEMS sensor chip to shatter;
Anti-electromagnetic interference capability is poor;
Terminal client easily pollutes in sensor application processing procedure.
Therefore, be necessary to propose a kind of improvement, to overcome the defect of prior art MEMS sensor.
Utility model content
Technical problem to be solved in the utility model is to provide that a kind of preventing dust air-flow performance is good, intercommunicating pore permeability is good, can electromagnetism interference and the MEMS sensor that not easily contaminated reliability is high.
To achieve these goals, the utility model MEMS sensor is by the following technical solutions:
A kind of MEMS sensor, comprise outer enclosure structure, described outer enclosure structure comprises wiring board and forms hollow cavity and the top board of sidewall, described encapsulating structure inside is provided with MEMS sensor chip and asic chip, described top board is provided with intercommunicating pore, and wherein: described top board is pasted with Chain Link Fence, described Chain Link Fence is provided with the glue-line fixing with described top board, described glue-line is provided with adhesive-free area at the intercommunicating pore place of top board, and described intercommunicating pore is placed in adhesive-free area.
As preferred technical scheme, the aperture size of described intercommunicating pore is 0.2mm-0.8mm.
As preferred technical scheme, the order number of described Chain Link Fence is 300-1000 orders.
As preferred technical scheme, described MEMS sensor chip and described asic chip are arranged in the circuit board.
As preferred technical scheme, described MEMS sensor chip and described asic chip are arranged on described top board, and described MEMS sensor chip is arranged facing to described intercommunicating pore.
As preferred technical scheme, described MEMS sensor is microphone, or pressure sensor.
As preferred technical scheme, described Chain Link Fence is mounted on the described top board of described encapsulating structure outside, or on the described top board of encapsulating structure inside.
As preferred technical scheme, described hollow cavity and described top board are integrated the metal cap construction of setting, or the circuit board structure be separated.
The utility model MEMS sensor, the top board of sensor-packaging structure is provided with Chain Link Fence, and Chain Link Fence is bonded on top board by glue-line, and arrange adhesive-free area at the intercommunicating pore place of top board, intercommunicating pore is placed in adhesive-free area.Can effectively avoid in encapsulation process, extraneous foreign particles enters into MEMS sensor inside by intercommunicating pore; Prevent external air flow from easily entering into MEMS sensor cavity, cause MEMS sensor rupture of diaphragm; Can prevent MEMS sensor when by Reflow Soldering, the situation that the diaphragm of the MEMS sensor chip that intercommunicating pore cannot be discharged rapidly when gas permeability is not good and be caused shatters; Simultaneously wire netting the effect can also playing electromagnetic shielding is set; Solve the problem that terminal client easily pollutes in sensor application processing procedure.Therefore, the utility model improves the reliability of MEMS sensor.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of preferred embodiment of the utility model MEMS sensor.
Fig. 2 is the vertical view of the utility model MEMS sensor Fig. 1 embodiment.
Fig. 3 is the structural representation of the another kind of preferred embodiment of the utility model MEMS sensor.
Fig. 4 is the structural representation of another preferred embodiment of the utility model MEMS sensor.
Embodiment
Below in conjunction with accompanying drawing, describe the structure of the utility model MEMS sensor in detail.
As shown in Figure 1, the present embodiment MEMS sensor, comprise outer enclosure structure, described outer enclosure structure comprises wiring board 1 and forms hollow cavity 21 and the top board 22 of sidewall, described hollow cavity 21 is the circuit board structure be separated with top board 22, described encapsulating structure inside is provided with MEMS sensor chip 3 and asic chip 4, described MEMS sensor chip 3 is electrically connected by metal lead wire 5 with asic chip 4, described top board 22 is provided with intercommunicating pore 6, for receiving and transmitting sound wave to MEMS sensor chip 3.
As shown in Figure 1 and Figure 2, described MEMS sensor chip 3 and asic chip 4 are arranged on top board 22, the described top board 22 of described encapsulating structure outside is pasted with Chain Link Fence 7, described Chain Link Fence 7 is provided with the glue-line 71 fixing with described top board 22, described glue-line 71 is also provided with adhesive-free area 72 at intercommunicating pore 6 place of top board 22, and described intercommunicating pore 6 is placed in adhesive-free area 72 completely.The aperture size of described intercommunicating pore 6 is 0.2mm-0.8mm, and described Chain Link Fence is square, and one jiao is provided with direction signs unfilled corner wherein, and the order number of described Chain Link Fence is 300-1000 orders.
Arranging of Chain Link Fence 7 can reduce in MEMS sensor in encapsulation process, and extraneous foreign particles easily enters into MEMS sensor inside by intercommunicating pore as scolding tin, dust etc., impacts the performance of MEMS sensor; Simultaneously arranging of Chain Link Fence 7 can be avoided external air flow easily to enter into MEMS sensor cavity being applied directly to MEMS sensor chip, causing air pressure too high, cause MEMS rupture of diaphragm, thus cause MEMS sensor to lose efficacy; Chain Link Fence can also play the effect of electromagnetism interference in addition, MEMS sensor can be made not easily contaminated in terminal client application processing procedure simultaneously.
Chain Link Fence 7 is bonding by glue-line 71 with top board 22, glue-line 71 is provided with adhesive-free area 72 at intercommunicating pore 6 place of top board, the setting of adhesive-free area ensure that the gas permeability of intercommunicating pore 6, avoid occurring that MEMS sensor is when by Reflow Soldering, because temperature raises, gas expansion in MEMS sensor cavity, intercommunicating pore cannot be discharged rapidly when gas permeability is not good and cause the situation that the diaphragm of MEMS sensor chip shatters.
Based on identical mentality of designing, the utility model MEMS sensor can also embody with other packaged types.As shown in Figure 3, the MEMS sensor of this preferred embodiment, is with the difference of the preferred embodiment of Fig. 1:
1) in the preferred embodiment of Fig. 1, the hollow cavity 21 of described outer enclosure structure is the circuit board structure be separated with top board 22, the hollow cavity 21 of outer enclosure structure described in Fig. 3 preferred embodiment and top board 22 are integrated the metal cap construction of setting, the encapsulating structure of described MEMS sensor comprises wiring board 1 and metal shell 2, and described metal shell 2 is provided with intercommunicating pore 6.In MEMS sensor encapsulation, circuit board structure and the metal cap construction be wholely set of separation are the common practise of those skilled in the art, and the difference of packaged type does not affect the beneficial effect of the utility model Chain Link Fence to MEMS sensor.
2), in the preferred embodiment of Fig. 1, described MEMS sensor chip and asic chip are all arranged on top board 22, and the chip of MEMS sensor described in this preferred embodiment and asic chip are all arranged on wiring board 1.In actual application, the position of MEMS sensor chip and asic chip not to affect in the utility model Chain Link Fence to the beneficial effect played of MEMS sensor.
In practice process, the position of Chain Link Fence also can be arranged on MEMS sensor encapsulating structure inside.As shown in Figure 4, the MEMS sensor of this preferred embodiment, be with the difference of the preferred embodiment of Fig. 3: the Chain Link Fence 3 of Fig. 3 preferred embodiment is arranged on the described metal shell 2 of MEMS sensor encapsulating structure outside, the MEMS sensor of Fig. 4 preferred embodiment, described Chain Link Fence is arranged on the described metal shell 2 of described MEMS sensor encapsulating structure inside, and the position of Chain Link Fence does not affect the beneficial effect of the utility model MEMS sensor.
MEMS sensor described in the utility model can be MEMS microphone product, and described MEMS sensor chip is MEMS microphone chip; Described MEMS sensor also can be pressure sensor, and described MEMS sensor chip is pressure sensor chip.
In sum, MEMS sensor of the present utility model, the top board of MEMS sensor encapsulating structure is provided with Chain Link Fence, and Chain Link Fence is bonded on top board by glue-line, and arrange adhesive-free area at the intercommunicating pore place of top board, intercommunicating pore is placed in adhesive-free area.Can effectively avoid in encapsulation process, extraneous foreign particles enters into MEMS sensor inside by intercommunicating pore; Prevent external air flow from easily entering into MEMS sensor cavity, cause MEMS sensor rupture of diaphragm; Can prevent MEMS sensor when by Reflow Soldering, the situation that the diaphragm of the MEMS sensor chip that intercommunicating pore cannot be discharged rapidly when gas permeability is not good and be caused shatters; Simultaneously wire netting the effect can also playing electromagnetic shielding is set; Solve the problem that terminal client easily pollutes in sensor application processing procedure.The utility model improves the reliability of MEMS sensor.
These are only the utility model case study on implementation, be not limited to the utility model, as long as those of ordinary skill in the art modify or change according to the equivalence that the utility model institute disclosure is done, all should include in the protection range recorded in claims.
Claims (10)
1. a MEMS sensor, comprise outer enclosure structure, described outer enclosure structure comprises wiring board and forms hollow cavity and the top board of sidewall, described encapsulating structure inside is provided with MEMS sensor chip and asic chip, described top board is provided with intercommunicating pore, it is characterized in that: described top board is pasted with Chain Link Fence, described Chain Link Fence is provided with the glue-line fixing with described top board, described glue-line is provided with adhesive-free area at the intercommunicating pore place of top board, and described intercommunicating pore is placed in adhesive-free area.
2. MEMS sensor according to claim 1, is characterized in that: the aperture size of described intercommunicating pore is 0.2mm-0.8mm.
3. MEMS sensor according to claim 1, is characterized in that: the order number of described Chain Link Fence is 300-1000 orders.
4. MEMS sensor according to claim 1, is characterized in that: described MEMS sensor chip and described asic chip are arranged in the circuit board.
5. MEMS sensor according to claim 1, is characterized in that: described MEMS sensor chip and described asic chip are arranged on described top board, and described MEMS sensor chip is arranged facing to described intercommunicating pore.
6. MEMS sensor according to claim 1, is characterized in that: described MEMS sensor is microphone.
7. MEMS sensor according to claim 1, is characterized in that: described MEMS sensor is pressure sensor.
8. MEMS sensor according to claim 1, is characterized in that: described Chain Link Fence is mounted on the described top board of described encapsulating structure outside.
9. MEMS sensor according to claim 1, is characterized in that: described Chain Link Fence is mounted on the described top board of described encapsulating structure inside.
10. MEMS sensor according to claim 1, is characterized in that: the metal cap construction that described hollow cavity and described top board are integrated setting or the circuit board structure be separated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520110876.1U CN204442602U (en) | 2015-02-15 | 2015-02-15 | A kind of MEMS sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520110876.1U CN204442602U (en) | 2015-02-15 | 2015-02-15 | A kind of MEMS sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204442602U true CN204442602U (en) | 2015-07-01 |
Family
ID=53610412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520110876.1U Active CN204442602U (en) | 2015-02-15 | 2015-02-15 | A kind of MEMS sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204442602U (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109696264A (en) * | 2017-10-23 | 2019-04-30 | 南京开天眼无人机科技有限公司 | A kind of pressure sensor |
| CN109845294A (en) * | 2016-10-05 | 2019-06-04 | 原子能和替代能源委员会 | Pressure sensor especially has the microphone for improving layout |
| CN110574395A (en) * | 2017-05-05 | 2019-12-13 | 歌尔股份有限公司 | MEMS microphone |
| CN111131984A (en) * | 2019-12-31 | 2020-05-08 | 歌尔股份有限公司 | Dustproof structure, microphone packaging structure and electronic equipment |
| CN111147995A (en) * | 2019-12-31 | 2020-05-12 | 歌尔股份有限公司 | Dustproof structure, microphone packaging structure and electronic equipment |
| CN111344248A (en) * | 2017-11-14 | 2020-06-26 | 美商楼氏电子有限公司 | Sensor package with ingress protection |
| WO2021031498A1 (en) * | 2019-08-22 | 2021-02-25 | 歌尔微电子有限公司 | Vibration sensing apparatus |
| CN113053861A (en) * | 2021-03-09 | 2021-06-29 | 歌尔微电子股份有限公司 | Packaging module, packaging process and electronic equipment |
| WO2021135111A1 (en) * | 2019-12-31 | 2021-07-08 | 潍坊歌尔微电子有限公司 | Dustproof structure for mems device and mems microphone packaging structure |
| WO2022104930A1 (en) * | 2020-11-17 | 2022-05-27 | 瑞声声学科技(深圳)有限公司 | Mems sensor |
| CN116046254A (en) * | 2022-12-29 | 2023-05-02 | 北京自动化控制设备研究所 | Integrated isolation protection structure of air pressure sensor |
-
2015
- 2015-02-15 CN CN201520110876.1U patent/CN204442602U/en active Active
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109845294B (en) * | 2016-10-05 | 2021-04-06 | 原子能和替代能源委员会 | Pressure sensor, in particular microphone with improved layout |
| CN109845294A (en) * | 2016-10-05 | 2019-06-04 | 原子能和替代能源委员会 | Pressure sensor especially has the microphone for improving layout |
| CN110574395A (en) * | 2017-05-05 | 2019-12-13 | 歌尔股份有限公司 | MEMS microphone |
| US11109162B2 (en) | 2017-05-05 | 2021-08-31 | Goertek Inc. | MEMS microphone |
| CN110574395B (en) * | 2017-05-05 | 2020-11-13 | 潍坊歌尔微电子有限公司 | MEMS microphone |
| CN109696264A (en) * | 2017-10-23 | 2019-04-30 | 南京开天眼无人机科技有限公司 | A kind of pressure sensor |
| CN111344248A (en) * | 2017-11-14 | 2020-06-26 | 美商楼氏电子有限公司 | Sensor package with ingress protection |
| WO2021031498A1 (en) * | 2019-08-22 | 2021-02-25 | 歌尔微电子有限公司 | Vibration sensing apparatus |
| CN111131984A (en) * | 2019-12-31 | 2020-05-08 | 歌尔股份有限公司 | Dustproof structure, microphone packaging structure and electronic equipment |
| WO2021135111A1 (en) * | 2019-12-31 | 2021-07-08 | 潍坊歌尔微电子有限公司 | Dustproof structure for mems device and mems microphone packaging structure |
| CN111147995A (en) * | 2019-12-31 | 2020-05-12 | 歌尔股份有限公司 | Dustproof structure, microphone packaging structure and electronic equipment |
| WO2022104930A1 (en) * | 2020-11-17 | 2022-05-27 | 瑞声声学科技(深圳)有限公司 | Mems sensor |
| CN113053861A (en) * | 2021-03-09 | 2021-06-29 | 歌尔微电子股份有限公司 | Packaging module, packaging process and electronic equipment |
| CN116046254A (en) * | 2022-12-29 | 2023-05-02 | 北京自动化控制设备研究所 | Integrated isolation protection structure of air pressure sensor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204442602U (en) | A kind of MEMS sensor | |
| CN203883992U (en) | MEMS microphone | |
| CN104760924B (en) | A kind of MEMS microphone chip and its encapsulating structure | |
| CN101282594B (en) | Encapsulation structure for Micro-electromechanical microphone with two-sided mounting-pasted electrode | |
| CN209017322U (en) | Encapsulating structure, microphone and the electronic equipment of chip | |
| CN103108268B (en) | Speaker module and use the electronic installation of this speaker module | |
| CN204761710U (en) | MEMS microphone | |
| TWI675794B (en) | Mems microphone modules and wafer-level techniques for fabricating the same | |
| WO2020140880A1 (en) | Mems microphone and electronic device | |
| CN204442688U (en) | Mems microphone | |
| CN201138866Y (en) | Silicon microphone with improved structure | |
| CN202799144U (en) | Micro-electromechanical systems (MEMS) microphone | |
| CN201854425U (en) | Silicon microphone | |
| CN203845811U (en) | Multifunctional sensor | |
| CN211089966U (en) | MEMS microphone and electronic equipment | |
| CN103663352B (en) | A kind of MEMS microphone package structure and method for packing | |
| CN202679629U (en) | MEMS (Micro-electromechanical System) microphone | |
| WO2020186884A1 (en) | Microphone and electronic device | |
| CN204442689U (en) | Mems microphone | |
| CN202679627U (en) | MEMS (Micro-electromechanical System) microphone | |
| CN201450592U (en) | Miniature microphone with circuit board frame structure | |
| CN204206459U (en) | A kind of MEMS microphone | |
| CN107113485B (en) | The chip carrier based on lead frame used in the manufacture of MEMS transducer packaging part | |
| CN215835560U (en) | MEMS microphone | |
| CN200994191Y (en) | MEMS microphone packaging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20200616 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
| TR01 | Transfer of patent right |