CN111131984A - Dustproof structure, microphone packaging structure and electronic equipment - Google Patents

Dustproof structure, microphone packaging structure and electronic equipment Download PDF

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Publication number
CN111131984A
CN111131984A CN201911416976.6A CN201911416976A CN111131984A CN 111131984 A CN111131984 A CN 111131984A CN 201911416976 A CN201911416976 A CN 201911416976A CN 111131984 A CN111131984 A CN 111131984A
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CN
China
Prior art keywords
filter screen
mesh
dustproof
microphone
substrate
Prior art date
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Pending
Application number
CN201911416976.6A
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Chinese (zh)
Inventor
游振江
畠山庸平
佐佐木宽充
林育菁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Weifang Goertek Microelectronics Co Ltd
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Goertek Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goertek Inc filed Critical Goertek Inc
Priority to CN201911416976.6A priority Critical patent/CN111131984A/en
Publication of CN111131984A publication Critical patent/CN111131984A/en
Priority to PCT/CN2020/099195 priority patent/WO2021135115A1/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

The invention discloses a dustproof structure, a microphone packaging structure and electronic equipment. Wherein the dustproof structure comprises a carrier and a grid part; the carrier is of a hollow structure; the grid part comprises a filter screen and a fixing part arranged around the filter screen; the filter screen comprises a central hole and a plurality of rows of mesh structures which extend outwards towards the outer side of the central hole and are concentrically arranged along the circumferential direction of the central hole; the grid part is arranged at one end of the carrier and covers the hollow structure, the filter screen is opposite to the hollow structure, and the fixing part is connected with the carrier. One technical effect of the invention is that: the filter screen in net portion can keep the leveling state, and net portion can effectively the separation external particulate matter, foreign matter enter into microphone packaging structure's inside.

Description

Dustproof structure, microphone packaging structure and electronic equipment
Technical Field
The invention relates to the technical field of electroacoustic conversion, in particular to a dustproof structure, a microphone packaging structure and electronic equipment.
Background
With the rapid development of electroacoustic technology, various electroacoustic products are developed. A microphone, as a transducer for converting sound into an electrical signal, is one of the very important devices in electro-acoustic products. Nowadays, microphones have been widely applied to various types of electronic products such as mobile phones, tablet computers, notebook computers, VR devices, AR devices, smartwatches, and smart wearing. In recent years, for a microphone packaging structure, the design of the structure thereof has become an important point and a focus of research by those skilled in the art.
The existing microphone package structure is generally: the chip package comprises a shell with a containing cavity, and components such as a chip assembly (for example, a MEMS chip and an ASIC chip) are contained and fixed in the containing cavity; and a sound pickup hole is also arranged on the shell. However, in long-term application, it is found that external particles and foreign matters such as dust and impurities are easily introduced into the accommodating cavity of the microphone through the sound pickup hole, and the external particles and foreign matters cause certain damage to components such as a chip assembly in the accommodating cavity, and finally affect the acoustic performance and the service life of the microphone.
In view of the above problems, the prior art generally adopts a solution that an isolation component for blocking the entry of external particles, foreign matters, etc. is disposed on a sound pickup hole of a microphone package structure. The existing isolation assembly comprises a carrier and an isolation net. When the isolation component is used, it is mounted on the sound pick-up hole. However, in the conventional isolation assembly, because the carrier is usually an organic non-metallic material and the isolation net is made of a metal material, when the carrier and the isolation net are combined together in a hot pressing manner and cooled, the isolation net fixed on the carrier is wrinkled due to different thermal expansion coefficients of the two materials, particularly the carrier of the metal material is easy to shrink. This not only causes a reduction in the production yield of the product, but may even affect the airflow at the separation net.
Disclosure of Invention
An object of the present invention is to provide a new technical solution for a dust-proof structure, a microphone package structure, and an electronic device.
According to a first aspect of the present invention, there is provided a dustproof structure including a carrier and a mesh portion;
the carrier is of a hollow structure;
the grid part comprises a filter screen and a fixing part arranged around the filter screen; the filter screen comprises a central hole and a plurality of rows of mesh structures which extend to the outer side of the central hole and are concentrically arranged along the circumferential direction of the central hole;
the grid part is arranged at one end of the carrier and covers the hollow structure, the filter screen is opposite to the hollow structure, and the fixing part is connected with the carrier.
Optionally, on the filter net, the space S between any two adjacent rows of the mesh structures is the same, and the space S is 0.5-2 μm.
Optionally, on the filter screen, each row of the mesh structure comprises a plurality of meshes, each of the meshes having a dimension T in the radial direction of 1 to 10 μm.
Optionally, on the filter screen, defining a ratio of an area occupied by meshes and central holes on the multi-column mesh structure to a total area of the filter screen as an opening ratio of the filter screen;
wherein, the aperture opening ratio of the filter screen is 50-90%.
Optionally, on the grid part, a side of the filter screen adjacent to the central hole is defined as an inner side of the filter screen, a side of the filter screen far away from the central hole is defined as an outer side of the filter screen, and the mesh lengths on the multi-row mesh structure are gradually increased from the inner side to the outer side of the filter screen.
Optionally, on the filter screen, a part between the multiple rows of grid structures forms a first spacer, and the first spacer is radially arranged at a preset radiation angle theta relative to the central hole;
wherein the predetermined radiation angle theta is 1-20 deg.
Optionally, the mesh length on the rows of mesh structures is the same on the filter screen.
Optionally, on the filter screen, a second spacer is formed between any two adjacent rows of the grid structures, and any two adjacent second spacers are arranged in a mutually staggered manner.
Optionally, the mesh is arc-shaped, the dimension T of the mesh in the radial direction is T, and T is 1-10 μm;
the arc length of the mesh is Lan；
Then L isanThe relationship with T is: l isan/T＝1-4。
Optionally, the filter screen is circular, and the diameter of the filter screen is 500-.
Optionally, the thickness of the filter screen is 2-1500 nm.
According to a second aspect of the present invention, a microphone package structure is provided. The microphone packaging structure comprises a shell with an accommodating cavity, wherein a sound pickup hole is formed in the shell and is used for communicating the inside with the outside of the shell;
the microphone device is fixedly arranged in the accommodating cavity;
the dustproof structure is arranged on the sound pickup hole.
Optionally, the dust-proof structure is located outside the housing.
Optionally, the housing includes a substrate and an encapsulation cover, and the substrate and the encapsulation cover enclose the accommodation cavity;
the dustproof structure is accommodated in the accommodating cavity;
the microphone device includes a MEMS chip and a signal amplifier.
Optionally, the pickup hole is located on the encapsulation cover, and the dust-proof structure is fixedly connected with the encapsulation cover.
Optionally, the pickup hole is located on the package cover, and the dust-proof structure is fixedly connected to the substrate to cover the MEMS chip.
Optionally, the sound pickup hole is located on the substrate, and the dust-proof structure is fixedly arranged on the substrate corresponding to the position of the sound pickup hole
Optionally, the pickup hole is located on the substrate, the dustproof structure is fixedly arranged on the substrate at a position corresponding to the pickup hole, and the MEMS chip is arranged on the dustproof structure.
According to a third aspect of the invention, an electronic device is provided. The electronic equipment comprises the microphone packaging structure.
The dustproof structure provided by the embodiment of the invention improves the structure of the filter screen on the grid part, and the special mesh structure is designed on the filter screen, and the openings on the mesh structure can absorb the stress from the radial direction, so that the filter screen can be kept flat when the grid part is fixed on the carrier.
The dustproof structure provided by the invention can protect the pickup hole of the microphone packaging structure, and the grid part can prevent external particles and foreign matters from entering the microphone packaging structure, so that all components in the microphone can be protected, and the acoustic performance and the service life of the microphone are prevented from being influenced. The technical task to be achieved or the technical problems to be solved by the present invention are never thought or not expected by those skilled in the art, and therefore the present invention is a new technical solution.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a side view of a dust-proof structure provided according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a filter screen according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a filter screen according to another embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a microphone package structure according to a first embodiment of the present invention.
Fig. 5 is a schematic structural diagram of a microphone package structure according to a second embodiment of the invention.
Fig. 6 is a schematic structural diagram of a microphone package structure according to a third embodiment of the invention.
Fig. 7 is a schematic structural diagram of a microphone package structure according to a fourth embodiment of the invention.
Fig. 8 is a schematic structural diagram of a microphone package structure according to a fifth embodiment of the invention.
Description of reference numerals:
1-carrier, 11-hollow structure, 2-grid part, 21-filter screen, 211-central hole, 212-mesh, 213-first spacing part, 214-second spacing part, 22-fixing part, 3-shell, 31-packaging cover, 32-substrate, 4-sound pickup hole, 5-MEMS chip, 6-signal amplifier.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
According to an embodiment of the present invention, there is provided a dust-proof structure. The dustproof structure can be applied to a microphone packaging structure. This dustproof construction can the separation external particulate matter, foreign matter etc. through picking up the sound hole on the microphone packaging structure and entering into microphone packaging structure's inside to can protect each components and parts of microphone inside, in order to avoid influencing the acoustics performance and the life of microphone.
The specific structure of the dust-proof structure provided by the embodiment of the present invention is further described below. The dustproof structure provided by the embodiment of the invention, as shown in fig. 1, comprises a carrier 1 and a grid part 2. The carrier 1 is a hollow structure. The mesh part 2 includes a filter mesh 21 and a fixing part 22 disposed around the filter mesh 21. As shown in fig. 2 and 3, the filter screen 21 includes a central hole 211, and a plurality of rows of mesh structures extending to the outside of the central hole 211 and concentrically arranged along the circumference of the central hole 211. The grid part 2 is arranged at one end of the carrier 1 and covers the hollow structure 11, the filter screen 21 is opposite to the hollow structure 11, and the fixing part 22 is connected with the carrier 1.
The dustproof structure provided by the embodiment of the invention is improved aiming at the structure of the filter screen 21 on the grid part 2. Specifically, a special mesh structure is specially designed on the filter screen 21, and the openings on the mesh structure are designed to absorb the stress from the radial direction well. When the grid part 2 is fixed on the carrier 1, the filter screen 21 is very beneficial to keeping a flat state, and the defects in the prior art are overcome.
The dustproof structure provided by the embodiment of the invention can effectively protect the microphone packaging structure. Have filter screen 21 on net portion 2, this filter screen 21 can make the air current pass through, and this filter screen 21 can also effectively obstruct outside particulate matter, foreign matter (for example, dust and impurity) and enter into microphone packaging structure's inside to each components and parts inside protection microphone packaging structure that can be better, in order to avoid influencing the acoustic performance and the life of microphone. In addition, since the filter screen 21 on the mesh part 2 is in a flat state for a long time, it is also advantageous for the air flow to flow smoothly at this position, and the movement of the air flow is not adversely affected.
In the present invention, the carrier 1 may be made of, for example, a metal material, an alloy material, or an organic nonmetal material, which is well known to those skilled in the art. The skilled person can flexibly select the material for making the carrier 1 according to specific needs, without limitation.
In the present invention, as shown in fig. 2 and 3, the mesh part 2 includes a filter screen 21 and a fixing part 22 disposed around the filter screen 21. The fixing portion 22 is used to connect the mesh portion 2 with the carrier 1, so that the mesh portion 2 can stably cover the carrier 1. Note that, when the fixing portion 22 of the mesh portion 2 is connected to the carrier 1, the fixing portion 22 is actually connected to the edge portion of the carrier 1. The fixing portion 22 of the mesh portion 2 and the edge portion of the carrier 1 may be connected together by, for example, adhesive bonding, or may be connected together by a fastening member, welding, or heat pressing, which can be flexibly selected by a person skilled in the art according to specific needs, and the invention is not limited thereto.
The filter screen 21 is made of a metal material with a mesh aperture not larger than 10 μm, so that the air flow can pass through smoothly, and meanwhile, the filter screen can block the entering of particles such as external dust, impurities and the like. The filter screen made of metal has the characteristic of good durability, does not need to be frequently replaced, and has longer service life. Of course, the filter screen 21 may also be mesh cloth with other aperture sizes and other materials. The shape of the mesh on the filter screen 21 may be, for example, a circle, a square, a triangle, or the like. The person skilled in the art can flexibly adjust the device according to specific needs, without limitation.
In the mesh portion 2, the shape of the filter screen 21 itself may be a regular shape such as a circle, a square, or an ellipse. Of course, the filter screen 21 may have other irregular shapes. The person skilled in the art can flexibly adjust the device according to the actual needs, and the device is not limited to this.
For example, the filter screen 21 is circular, and the diameter of the filter screen 21 is 500 μm to 1100 μm. Within this range, a large filtration area is advantageously achieved. The thickness of the filter screen 21 is 2-1500 nm. In this range, the filter screen 21 can have sufficient mechanical strength without being excessively thick, and is not easily broken.
As shown in FIGS. 2 and 3, in the dust-proof structure provided by the present invention, on the filter screen 21, the spacing S between any two adjacent rows of mesh structures is the same, and the size range of the spacing S is 0.5 μm-2 μm. In this range, the filter screen 21 can be kept rigid to some extent, and the filter screen 21 can be made resistant to bending deformation. In addition, the situation that the filter screen 21 is broken due to insufficient strength in production can be avoided by reasonably setting the size of the gap S, and the good product rate of products can be influenced.
As shown in FIGS. 2 and 3, each row of the mesh structures on the filter screen 21 comprises a plurality of meshes 212 arranged in sequence, and the size T of each mesh 212 in the radial direction is 1-10 μm. Within this range, the entry of particles such as dust and foreign matter from the outside into the mesh 212 can be prevented, and the mechanical strength of the entire filter screen 21 is not affected by the opening.
Wherein, the filter screen 21 may comprise a 5-10-column grid structure, for example. The specific number of rows of the mesh structure may be flexibly adjusted according to the size of the mesh part 2 itself, the required aperture ratio, and the like, and is not limited thereto.
On the filter screen 21, the ratio of the area occupied by the meshes 212 and the central holes 211 on the multi-row mesh structure to the total area of the filter screen 21 is defined as the opening ratio of the filter screen 21. In the invention, the opening rate of the filter screen is 50-90%. The filter screen 21 is designed to have a high aperture ratio, so that when the filter screen is used in a microphone device, signal loss or noise can be minimized, i.e., the acoustic performance of the microphone can be improved.
The invention provides a dustproof structure, wherein a filter screen 21 is arranged on the grid part 2, and the grid structure on the filter screen 21 is actually different from the prior art. According to the invention, the design of the opening on the filter screen 21 is changed by changing the grid structure on the filter screen 21, and the specially designed opening can absorb the stress from the radial direction, so that the plane of the filter screen 21 is prevented from being deformed.
In an alternative example of the present invention, on the grid part 2, as shown in fig. 2, it is defined that a side of the filter screen 21 adjacent to the central hole 211 is an inner side of the filter screen 21, and a side away from the central hole 211 is an outer side of the filter screen 21, and the length of the cells 212 on the multi-row mesh structure is gradually increased from the inner side to the outer side of the filter screen 21. The design of the present invention prevents stress concentration and helps to disperse stress gradually, thereby keeping the filter screen 21 in a flat state.
As shown in fig. 2, on the filter screen 21, portions between the plurality of rows of the lattice structures form first spacers 213, and the first spacers 213 are radially arranged at a predetermined radiation angle θ with respect to the center hole 211. Wherein the predetermined radiation angle theta is 1-20 deg. This design can improve the rigidity of whole filter screen 21, can avoid filter screen 21 to produce bending deformation in the horizontal direction. Also, the filter net 21 can be made more robust against being torn or damaged during the manufacturing process.
In an alternative embodiment of the invention, as shown in fig. 3, the mesh 212 of the mesh structure of different rows is the same length on the filter screen 21 of the grid section 2. That is, all the meshes 212 of the filter screen 21 of the mesh unit 2 are the same length except for the center hole 211.
As shown in fig. 3, in the present example, the second spacers 214 are formed between any two adjacent rows of grid structures, and any two adjacent second spacers 214 are arranged in a staggered manner, i.e., not on the same radial line. Alternatively, the mesh cells 212 may have an arc shape, the dimension T of the mesh cells 212 in the radial direction may be 1 to 10 μm, and the arc length of the mesh cells 212 may be LanThen L isanThe relationship with T is: l isanand/T is 1-4. The inventors of the present invention have found that, by providing the mesh 212 in the above size range on the filter screen 21, it is possible to prevent the entry of particles from the outside, and to increase the rigidity of the filter screen 21 to prevent the filter screen from deforming.
In addition, the mesh 212 on the filter screen 21 may have a variety of different shapes. For example, the mesh 212 is an elliptical hole. For another example, the boundary portion of the mesh 212 in the radial direction is wavy. For another example, the mesh 212 is a race track type hole, and both ends of the mesh 212 are formed in a semicircular shape. The three structures of the mesh 212 are effective in absorbing stress from the radial direction, and do not affect the overall mechanical strength of the mesh portion 2.
When the fixing portion 22 of the mesh portion 2 is connected to the carrier 1, the two may be connected by bonding, welding, hot pressing or fastening, for example, and those skilled in the art may flexibly adjust the fixing portion according to specific needs without limitation.
In the present invention, the thickness of the mesh part 2 may be, for example, about 0.5 μm. The height of the carrier 1 may be, for example, about 40 μm. This size is suitable for most microphone packages. Of course, the size of the assembly can be adjusted by those skilled in the art according to the specific assembly requirement, and the assembly is not limited to this.
According to another embodiment of the invention, a microphone packaging structure is also provided. The microphone packaging structure can be applied to various electronic products such as mobile phones, notebook computers, Ipad and VR equipment and intelligent wearable equipment, and is widely applied. The microphone packaging structure provided by the embodiment of the invention can effectively avoid the phenomenon that components such as an internal chip assembly and the like are damaged due to the influence of particles and foreign matters such as external dust and impurities, can prolong the service life of the microphone, and can ensure that the microphone keeps excellent acoustic performance.
The following further describes a specific structure of the microphone package structure provided in the embodiment of the present invention.
As shown in fig. 4-8, a microphone package structure provided by an embodiment of the present invention includes a housing 3 having a receiving cavity, and a sound pickup hole 4 is disposed on the housing 3. The sound pickup hole 4 is used to communicate the inside and outside of the housing 3. A microphone device is accommodated and fixed in the accommodation chamber of the housing 3. The microphone packaging structure further comprises the dustproof structure, and the dustproof structure is fixedly installed on the sound pickup hole 4.
In the present invention, the sound pickup hole 4 may have a circular, square, triangular, or elliptical shape, for example. The pickup hole 4 may be provided in one or more as required. The specific setting position of the sound pickup hole 4 can also be flexibly adjusted according to the specific condition of the microphone packaging structure, which is not limited by the present invention.
In an alternative example of the present invention, as shown in fig. 4, the dust-proof structure may be located outside the housing 3. That is, the sound pickup hole 4 is protected from the outside. In this example, the dust-proof structure is mounted outside the microphone package to cover the sound pickup hole 4, and does not occupy the space inside the microphone package. When the dustproof structure is installed, the dustproof structure can be reasonably installed according to the position of the sound pickup hole 4, so that the dustproof structure can be aligned to the sound pickup hole 4, and external particles and foreign matters can be prevented from being introduced into the microphone packaging structure through the sound pickup hole 4.
Of course, the present invention is not limited to the dustproof structure provided outside the housing 3, and the dustproof structure may be provided in the housing cavity of the housing 3. The technical personnel in the field can flexibly adjust the arrangement position of the dustproof structure according to specific needs.
The microphone packaging structure of the invention, the structure of its outer cover 3 is: the substrate 32 and the packaging cover 31 are included, and the substrate 32 and the packaging cover 31 together enclose the accommodating cavity. The dust-proof structure is accommodated in the accommodating cavity of the housing 3. The microphone device comprises a MEMS chip 5 and a signal amplifier 6.
In an alternative example of the present invention, as shown in fig. 5, the sound-collecting hole 4 is located on the package cover 31, and the dust-proof structure is fixedly connected to the package cover 32. Dustproof construction's position corresponds to pickup hole 4, can avoid outside particulate matter, foreign matter to introduce inside microphone packaging structure through pickup hole 4.
In an alternative example of the present invention, as shown in fig. 6, the sound pickup hole 4 is located on the package cover 31, and the dust-proof structure is fixedly connected to the substrate 32 at a position corresponding to the sound pickup hole 4, and at the same time, the dust-proof structure also covers the MEMS chip 5, so as to effectively protect the chip in the microphone package structure.
In the present invention, the sound collecting hole 4 is not limited to be formed in the sealing cover 31 of the housing 3, and may be formed in the substrate 32. For example, as shown in fig. 7, the sound collecting hole 4 is located on the substrate 32, and the dust-proof structure is fixedly provided on the substrate 32 at a position corresponding to the sound collecting hole 4. For another example, as shown in fig. 8, the sound collecting hole 4 is located on the substrate 32, the dust-proof structure is fixedly provided on the substrate 32 at a position corresponding to the sound collecting hole 4, and the MEMS chip 5 is provided on the dust-proof structure. It should be noted that, when the sound-collecting hole 4 is formed in the substrate 32, a person skilled in the art may adjust the installation position of the dust-proof structure according to specific situations, as long as the person can prevent external particles and foreign matters from entering or can protect the internal chip, and the invention is not limited thereto.
Wherein the package cover 31 has a dish-shaped structure with an open end. The material of the package cover 31 may be, for example, a metal material, a plastic material, or a PCB. The shape of the sealing cap 31 may be, for example, a cylindrical shape or a rectangular parallelepiped shape. The person skilled in the art can flexibly adjust the device according to the actual needs without limitation.
The substrate 32 may be a circuit board known in the art, such as a PCB, without limitation. The package cover 31 and the substrate 32 may be fixed together by, for example, adhesive bonding or solder paste welding, and those skilled in the art can flexibly select the combination according to the needs without limitation.
The microphone packaging structure provided by the invention is characterized in that a microphone device is fixedly accommodated in an accommodating cavity of the shell 3. In particular, as shown in fig. 4-8, the microphone device may comprise, for example, a MEMS chip 5 and a signal amplifier 6.
The MEMS chip 5 includes a substrate and an inductive film. The substrate is also a hollow structure. The sensing film is, for example, a piezoelectric element, a capacitive element, a piezoresistive element, or the like. The sensing film is arranged at one end of the substrate and covers the hollow structure of the substrate. The hollow structure forms a back cavity. When the MEMS chip 5 is fixed in the housing chamber, the MEMS chip 5 may be attached to the substrate 32. Of course, the MEMS chip 5 may also be attached to the package cover 31, for example, a special adhesive may be used to adhere the MEMS chip 5 to the package cover 31. The MEMS chip 5 can also be turned on by a circuit pattern in the substrate 32 in a flip-chip manner, which is common knowledge of those skilled in the art, and the present invention will not be described in detail herein.
The signal amplifier 6 may be mounted on the package cover 31, or may be mounted on the substrate 32. The signal amplifier 6 may be, for example, an ASIC chip. The ASIC chip is connected to the MEMS chip 5. The electrical signal output by the MEMS chip 5 can be transmitted to the ASIC chip, processed by the ASIC chip, and output. The MEMS chip 5 and the ASIC chip 6 may be electrically connected through a metal wire (bonding wire) to realize mutual conduction therebetween.
Further, the MEMS chip 5 and/or the signal amplifier 6 may be embedded in the substrate 32 or may be semi-embedded in the substrate 32. For example, a conductor is provided in the substrate 32, and a pad is provided on the substrate 32. The conductors are, for example, metallized through holes provided in the substrate 32. The pad is electrically connected to the MEMS chip 5 and the signal amplifier 6 via a conductor. The design in which the MEMS chip 5 and the signal amplifier 6 are embedded in the substrate 32 contributes to miniaturization of the microphone.
When the MEMS chip 5 and the signal amplifier 6 are embedded in the substrate 32, at least one metal layer needs to be provided above and below the MEMS chip 5 and the signal amplifier 6. The metal layer is grounded as a shield. A plurality of metal conductors are arranged in the area around the MEMS chip 5 and the signal amplifier 6 for constituting a shielding structure together with the above-mentioned metal layers. The design of embedding the MEMS chip 5 and the signal amplifier 6 in the substrate 32 makes it unnecessary to coat protective glue on the surface of the signal amplifier 6, thus simplifying the process and improving the optical noise resistance of the product.
On the other hand, the invention also provides electronic equipment. The electronic device comprises the microphone packaging structure.
The electronic device may be a mobile phone, a notebook computer, a tablet computer, a VR device, an intelligent wearable device, and the like, which is not limited in this respect.
Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims (19)

1. A dustproof construction which characterized in that: comprises a carrier and a grid part;
the carrier is of a hollow structure;
the grid part comprises a filter screen and a fixing part arranged around the filter screen; the filter screen comprises a central hole and a plurality of rows of mesh structures which extend to the outer side of the central hole and are concentrically arranged along the circumferential direction of the central hole;
the grid part is arranged at one end of the carrier and covers the hollow structure, the filter screen is opposite to the hollow structure, and the fixing part is connected with the carrier.
2. The dustproof structure according to claim 1, characterized in that: on the filter screen, the space S between any two adjacent rows of mesh structures is the same, and the space S is 0.5-2 mu m.
3. The dustproof structure according to claim 1, characterized in that: on the filter net, each row of the mesh structure comprises a plurality of meshes, and the size T of each mesh in the radial direction is 1-10 μm.
4. The dustproof structure according to claim 1, characterized in that: on the filter screen, defining the ratio of the area occupied by the meshes and the central holes on the multi-column mesh structure to the total area of the filter screen as the opening rate of the filter screen;
wherein, the aperture opening ratio of the filter screen is 50-90%.
5. The dustproof structure according to claim 1, characterized in that: on the grid part, one side of the filter screen close to the central hole is defined as the inner side of the filter screen, one side far away from the central hole is defined as the outer side of the filter screen, and the length of meshes on the multi-row mesh structure is gradually increased from the inner side to the outer side of the filter screen.
6. The dustproof structure according to claim 5, characterized in that: on the filter screen, a first partition part is formed at the part between the multiple rows of grid structures and is radially arranged at a preset radiation angle theta relative to the central hole;
wherein the predetermined radiation angle theta is 1-20 deg.
7. The dustproof structure according to claim 1, characterized in that: the mesh length on the multi-row mesh structure is the same on the filter screen.
8. The dustproof structure according to claim 7, characterized in that: on the filter screen, a second spacing part is formed between any two adjacent rows of the grid structures, and any two adjacent second spacing parts are arranged in a staggered mode.
9. The dustproof structure according to claim 7, characterized in that: the meshes are arc-shaped, the size T of the meshes in the radial direction is T, and T is 1-10 mu m;
the arc length of the mesh is Lan；
Then L isanThe relationship with T is: l isan/T＝1-4。
10. The dustproof structure according to claim 1, characterized in that: the filter screen is circular, and the diameter of the filter screen is 500-1100 mu m.
11. The dustproof structure according to claim 1, characterized in that: the thickness of the filter screen is 2-1500 nm.
12. A microphone packaging structure is characterized in that: the shell is provided with a sound pickup hole, and the sound pickup hole is used for communicating the inside with the outside of the shell;
the microphone device is fixedly arranged in the accommodating cavity;
further comprising a dust-proof structure as claimed in any one of claims 1-11, said dust-proof structure being provided on said sound pick-up aperture.
13. The microphone package structure of claim 12, wherein: the dust-proof structure is located outside the housing.
14. The microphone package structure of claim 12, wherein: the shell comprises a substrate and an encapsulation cover, and the substrate and the encapsulation cover enclose the accommodating cavity;
the dustproof structure is accommodated in the accommodating cavity;
the microphone device includes a MEMS chip and a signal amplifier.
15. The microphone package structure of claim 14, wherein: the pickup hole is located on the encapsulation cover, the dustproof construction with encapsulation cover fixed connection.
16. The microphone package structure of claim 14, wherein: the pickup hole is located on the packaging cover, and the dustproof structure is fixedly connected to the substrate so as to cover the MEMS chip.
17. The microphone package structure of claim 14, wherein: the sound pickup hole is positioned on the substrate, and the dustproof structure is fixedly arranged on the substrate corresponding to the position of the sound pickup hole.
18. The microphone package structure of claim 14, wherein: the pickup hole is positioned on the substrate, the dustproof structure is fixedly arranged on the substrate corresponding to the pickup hole, and the MEMS chip is arranged on the dustproof structure.
19. An electronic device, characterized in that: comprising a microphone package according to any of claims 12-18.
CN201911416976.6A 2019-12-31 2019-12-31 Dustproof structure, microphone packaging structure and electronic equipment Pending CN111131984A (en)

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