CN110351618A - A kind of microfilter and acoustic equipment - Google Patents
A kind of microfilter and acoustic equipment Download PDFInfo
- Publication number
- CN110351618A CN110351618A CN201910577035.4A CN201910577035A CN110351618A CN 110351618 A CN110351618 A CN 110351618A CN 201910577035 A CN201910577035 A CN 201910577035A CN 110351618 A CN110351618 A CN 110351618A
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- Prior art keywords
- metallic film
- film
- microfilter
- layer
- substrate
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
- B01D46/54—Particle separators, e.g. dust precipitators, using ultra-fine filter sheets or diaphragms
- B01D46/543—Particle separators, e.g. dust precipitators, using ultra-fine filter sheets or diaphragms using membranes
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/08—Mouthpieces; Microphones; Attachments therefor
- H04R1/083—Special constructions of mouthpieces
Abstract
The invention discloses a kind of microfilter and acoustic equipments, including the substrate with back chamber, and the metallic film for being arranged in substrate and being suspended on back chamber；And the outer surface of the metallic film is coated with antistick layer；Viscosity between the antistick layer and particle is lower than the viscosity between metallic film and particle；There is the through-hole of arrangement on the metallic film and antistick layer.It, can be to avoid the problem being adhered to for a long time using rear particle on the metallic film with through-hole, to ensure that the sensitivity of sensor by the way that antistick layer is arranged on metallic film according to one embodiment of the disclosure.
Description
Technical field
The present invention relates to microfilters, can be a kind of microfilter suitable for acoustic equipment, to filter powder
Dirt particle or/and water etc. are not intended to enter the substance inside acoustic equipment.
Background technique
The portable computing device of such as laptop, tablet computer etc is ubiquitous, such as smart phone etc
Portable communication device be also generally existing.However, these equipment do not have enough spaces to accommodate relatively large wheat
Gram wind or loudspeaker.Therefore, microphone and speaker size become more and more compacter and size reduces.In addition, these are portable
Microphone and loudspeaker in formula setting usually require associated acoustic input or output port close to terminal, so that particle and water
It is easily accessible microphone, in loudspeaker, and causes the failure of these acoustic equipments.
Filter membrane is disposed sometimes in pervious equipment, to prevent certain form of clast from entering in component.Unfortunately,
These filters often have an adverse effect to the operation of microphone.For example, when using these previous methods, microphone
Performance significant reduction sometimes.Since performance declines, microphone client often selects to use such Mike not in its application
Wind.
When manufacturing filtration membrane, common metal film has the limiting range of stress.When the stress of common metal film shows pressure
After contracting and forming fold, automatic optical detection equipment can not detect pressure.In order to manufacture filtrating chip structure, will be suitable
When thin metal film is deposited on substrate, need to obtain the film of low tensile stress.There is no the film of low tensile stress to tend to removing, break
It splits, wrinkle or is detached from from its substrate in other ways, therefore PB chip must not be abandoned infrequently after putting into operation.
In addition, this filtration membrane is when in use, pollutant may adhere to membrane surface and set to reduce acoustics
Standby performance.
Summary of the invention
It is an object of the present invention to provide a kind of new solutions of microfilter.
According to the first aspect of the invention, a kind of microfilter is provided, including having the substrate of back chamber, and setting
In substrate and it is suspended at the metallic film carried on the back on chamber；And the outer surface of the metallic film is coated with antistick layer；It is described not
Viscosity between adhesion coating and particle is lower than the viscosity between metallic film and particle；There is row on the metallic film and antistick layer
The through-hole of cloth.
Optionally, the antistick layer is silicone compounds coating or fluoropolymer coating.
Optionally, the antistick layer selects teflon coating.
Optionally, the coating is provided with two layers, is located at the opposite two sides of metallic film.
Optionally, the metallic film is configured with compression；The antistick layer is configured with tensile stress；Or
Person, the metallic film are configured with tensile stress；The antistick layer is configured with compression；
The metallic film, antistick layer are configured as reducing the stress of entire film layer.
Optionally, the stress of the film layer is in -300 MPa between 300 MPa.
Optionally, the metallic film uses glassy metal.
Optionally, the substrate uses polymer material, metal, silicon or SiO2.
According to another aspect of the present invention, a kind of acoustic equipment is additionally provided, including above-mentioned microfilter.
Optionally, the acoustic equipment is microphone mould group or microphone chip.
It, can be to avoid using for a long time by the way that antistick layer is arranged on metallic film according to one embodiment of the disclosure
Particle is adhered to the problem on the metallic film with through-hole afterwards, to ensure that the sensitivity of sensor.
By referring to the drawings to the detailed description of exemplary embodiment of the present invention, other feature of the invention and its
Advantage will become apparent.
Detailed description of the invention
It is combined in the description and the attached drawing for constituting part of specification shows the embodiment of the present invention, and even
With its explanation together principle for explaining the present invention.
Fig. 1 is the cross-sectional view of microfilter first embodiment of the present invention.
Fig. 2 is the cross-sectional view of microfilter second embodiment of the present invention.
Fig. 3 is the cross-sectional view (having through-hole) of microfilter second embodiment of the present invention.
Fig. 4 is the cross-sectional view of microfilter third embodiment of the present invention.
Fig. 5 is the cross-sectional view at another visual angle in microfilter third embodiment of the present invention.
Fig. 6 is the cross-sectional view of the 4th embodiment of microfilter of the present invention.
Specific embodiment
Carry out the various exemplary embodiments of detailed description of the present invention now with reference to attached drawing.It should also be noted that unless in addition having
Body explanation, the unlimited system of component and the positioned opposite of step, numerical expression and the numerical value otherwise illustrated in these embodiments is originally
The range of invention.
Be to the description only actually of at least one exemplary embodiment below it is illustrative, never as to the present invention
And its application or any restrictions used.
Technology, method and apparatus known to person of ordinary skill in the relevant may be not discussed in detail, but suitable
In the case of, the technology, method and apparatus should be considered as part of specification.
It is shown here and discuss all examples in, any occurrence should be construed as merely illustratively, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, then in subsequent attached drawing does not need that it is further discussed.
The present invention provides a kind of acoustic equipments of this microfilter of microfilter and application.The acoustic equipment is for example
It can be microphone chip, be also possible to microphone mould group.Such as when acoustic equipment is microphone chip, microfilter is set
It sets on microphone chip；When acoustic equipment is in microphone mould group, the sound of the shell in mould group is can be set in microfilter
Hole site.Certainly, to those skilled in the art, which is also possible to other types of sonic transducer, herein
Type is no longer illustrated.
Microfilter provided by the invention, including substrate and the film layer being arranged in substrate.Substrate has hollow
The marginal position of back cavity structure, film layer is connected in substrate, and the central region of film layer is suspended at the top of back chamber, so that film layer
Constitute cantilever bridge structure.
Fig. 1 shows the structural schematic diagram of one embodiment of microfilter of the present invention.Embodiment shown in Fig. 1
In, unlike Fig. 4, Fig. 5, embodiment illustrated in fig. 6, metallic film 6a is arranged on substrate 5, and it is hollow to be suspended at substrate 5
Carry on the back the top of chamber 7.Metallic film 6a can use amorphous metal film, such as glassy metal etc..Substrate 5 can be using polymerization
Object material, metal, silicon or SiO2。
Antistick layer 6b is coated in the outer surface of metallic film 6a.Viscosity between antistick layer 6b and particle is lower than metal
Viscosity between film 6a and particle；There is the through-hole of arrangement on metallic film 6a and antistick layer 6b (view does not provide).
In an optional embodiment of the invention, antistick layer 6b is silicone compounds coating or fluoropolymer
Coating.
In an optional embodiment of the invention, antistick layer 6b selects teflon coating.Teflon has high temperature special
Property, and coefficient of friction is low.
It, can be to avoid being adhered to the gold with through-hole using rear particle for a long time by the way that antistick layer is arranged on metallic film
Belong to the problem on film, to ensure that the sensitivity of sensor.The antistick layer also has the function of corrosion-resistant simultaneously, improves micro-
The service life of type filter.
In an optional embodiment of the invention, metallic film 6a is configured with compression；Antistick layer 6b quilt
It is configured to tensile stress；Metallic film 6a is combined with each other with antistick layer 6b, can reduce the stress of entire film layer.Certainly,
It is also possible to metallic film 6a and is configured with tensile stress, antistick layer 6b is configured with compression.Concrete principle and figure
5, embodiment illustrated in fig. 6 is identical, no longer illustrates herein.
For example, the Stress Control for the film layer being combined with each other in -300 MPa, (answer by pressure in an optional embodiment
Power) between 300 MPa (tensile stress).
For example, the Stress Control for the film layer being combined with each other (is drawn in 0 to 300 MPa in an optional embodiment
Stress) between.
Fig. 2 shows the structural schematic diagrams of microfilter another embodiment of the present invention.Not with embodiment illustrated in fig. 1
With the film layer in substrate 50 includes trilamellar membrane piece, which is suspended on the hollow back chamber 70 of substrate 50.This three
Tunic piece includes one layer of metallic film 60a, two layers of antistick layer 60b with tensile stress with compression.Metallic film 60a
Between two layers of antistick layer 60b, three layers are combined with each other.It is offset by antistick layer 60b of the two sides with tensile stress in being located at
Between metallic film compression；It is not glued conversely, being located in the middle the metallic film 60a with compression also and can offset its two sides
The compression of layer 60b, no longer illustrates herein.
In addition, antistick layer 60b is respectively set in the two sides of metallic film 60a, can to avoid or reduce metallic film 60a
Granular absorption, ensure that the performance of microfilter.There is the through-hole of arrangement, reference on metallic film 60a and antistick layer 60b
Fig. 3 is covered by antistick layer 60b around through-hole.
Fig. 4, Fig. 5 show the structural schematic diagram of the one of embodiment of microfilter of the present invention.With reference to Fig. 4, figure
5, film layer 2 is connected to the top of substrate 1, and vacantly on the hollow back chamber 3 of substrate 1.There is the through-hole 4 of arrangement in film layer 2, with
Gas supply stream passes through.Substrate 1 can use metal, silicon or SiO2, and mode shape well-known to those skilled in the art can be passed through
At hollow back chamber 3.Such as formed by techniques such as etchings, it no longer illustrates herein.
Film layer 2 can use nonmetal film, such as polyimide material, SiO2, SiN etc..Film layer 2 can also be using gold
Belong to film, such as with the crystalline membrane containing Cr, Al, Ti or Cu etc. as an example.
Currently preferred is using amorphous metal film, such as glassy metal.Amorphous metal film can be by extremely cold
But, physical vapour deposition (PVD), plating, pulse laser be heavy, solid-state reaction, the mode of ionizing radiation or mechanical alloying are formed, this
A little molding modes belong to the common knowledge of those skilled in the art, no longer illustrate herein.
Since glassy metal has irregular atomic arrangement and no specific slide surface, it has than crystallization
The higher intensity of metal and have that excellent fatigue behaviour, flexible deformation is with resistance to deformation.The elasticity modulus of glassy metal is big
It is approximately the one third of crystal metal, but tensile strength is its three times.For example, the intensity of Mg alloy is 300MPa, Mg Base Metal
The intensity of glass is 800MPa, and the intensity of FeCoBSiNb glassy metal is 4400MPa, and the intensity of SUS304 stainless steel is
1400MPa。
Therefore, the film layer using glassy metal as microfilter can be improved on the basis of guaranteeing film strength
Percent opening in film layer, and the thickness of film layer can be made thinning, so that infiltration processing becomes easy and can be formed smaller
Through-hole, avoid after traditional thick film aperture due to hole depth it is larger caused by acoustic resistance.
In an optional embodiment of the invention, the internal diameter of through-hole 4 can be 1nm to 100 μm in film layer 2.
In an optional embodiment of the invention, the internal diameter of through-hole 4 can be 5nm to 10 μm in film layer 2.
In an optional embodiment of the invention, film layer 2 with a thickness of 5nm to 5 μm.
In an optional embodiment of the invention, film layer 2 with a thickness of 20nm to 1000nm.
It is isotropism and uniform since glassy metal is amorphous materials.In addition, being substantially absent by such as
Defect caused by the polycrystalline structure of grain boundary and segregation, and dimensional effect is small.Therefore, when designing microfilter, no
It must consider the variation of the physical property due to caused by anisotropy and size, this structure for being conducive to design microfilter is set
Meter.In addition, due to the alloy that glassy metal is made of multiple element, the range of material selection in microfilter design
It broadens, and the PB chip of higher performance can be designed and manufactured.
For example, glassy metal may include a variety of transition metal elements, also optionally including one or more nonmetallic members
Element.Glassy metal containing transition metal element can have Sc, Y, La, Al, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn,
At least one of Tc, Re, Fe, Ru, Os, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd and Hg.It, can be with according to application
Use any suitable transition metal element or their combination.Any suitable nonmetalloid or their group can be used
It closes.For example, nonmetalloid can be F, Cl, Br, I, At, O, S, Se, Te, Po, N, P, As, Sb, Bi, C, Si, Ge, Sn, Pb
Any one of with B.
In an optional embodiment of the invention, the glass transition temperature Tg of glassy metal is 150 DEG C or higher.
In an optional embodiment of the invention, the glass transition temperature Tg of glassy metal is 250 DEG C or higher.
In microfilter of the invention, film layer 2 can be set one layer, also can be set two layers, three layers or more
Multilayer.
With reference to Fig. 5, film layer includes the one layer of primary diaphragm 2a and one layer of secondary diaphragm 2b being combined with each other.Wherein,
One diaphragm 2a has tensile stress, and secondary diaphragm 2b has compression.After primary diaphragm, secondary diaphragm are combined with each other, answered in drawing
Power, compression interaction under reduce the stress of entire film layer 2 so that entire film layer 2 smooth can be placed in substrate 1.
Primary diaphragm 2a, secondary diaphragm 2b can use identical material, can also use different materials.Such as first
Diaphragm 2a, secondary diaphragm 2b can select crystal metal film, amorphous metal film or nonmetal film.In order to improve film layer 2
Elasticity and impact resistance, at least one layer of diaphragm in film layer 2 select amorphous metal film.
Diaphragm can show various internal stress, and from compression is stretched to, this depends on the condition of film deposition, deposition of thick
Degree.The internal stress of diaphragm can greatly change diaphragm performance, such as mechanical performance.Therefore, by by tensile stress diaphragm and pressure
Stress diaphragm is combined with each other, to eliminate film layer internal stress and be adjusted in the desired range of stress.
For example, the Stress Control of film layer 2 is in -300 MPa (compression) to 300 in an optional embodiment
Between MPa (tensile stress).
For example, the Stress Control of film layer 2 is between 0 to 300 MPa (tensile stress) in an optional embodiment.
By the control of film layer 2 in lower tensile stress, so that film layer 2 may be at the state of tensioning, and the shape of itself is kept, this is advantageous
In on the base 1 smooth of diaphragm 2, so that optics monitors automatically.
In an optional embodiment, secondary diaphragm 2b is arranged relative to primary diaphragm 2a adjacent substrate 1.With pressure
The secondary diaphragm 2b of stress is positioned adjacent to the side of substrate 1, offsets the second film by the primary diaphragm 2a with tensile stress
The compression of piece 2b.
In an optional embodiment, primary diaphragm 2a is arranged relative to secondary diaphragm 2b adjacent substrate 1.With drawing
The primary diaphragm 2a of stress is positioned adjacent to the side of substrate 1, offsets the first film by the secondary diaphragm 2b with compression
The tensile stress of piece 2a；And due to primary diaphragm 2a itself have tensile stress, so as to further avoid primary diaphragm 2a with
The problems such as substrate 1 is detached from.
Fig. 6 shows the structural schematic diagram of microfilter another embodiment of the present invention.Not with embodiment illustrated in fig. 5
With the film layer in substrate 10 includes trilamellar membrane piece, which is suspended on the hollow back chamber 30 of substrate 10.This three
Tunic piece includes one layer of primary diaphragm 20a, two layers of secondary diaphragm 20b with compression with tensile stress.Primary diaphragm 20a
Between two layers of secondary diaphragm 20b, trilamellar membrane piece is combined with each other.By two sides there is the secondary diaphragm of compression to offset
It is located in the middle the tensile stress of primary diaphragm；Conversely, its two sides can also be offset by being located in the middle the primary diaphragm with tensile stress
The compression of secondary diaphragm, no longer illustrates herein.
The trilamellar membrane chip architecture of film layer also may include two layers with tensile stress primary diaphragm 20a and one layer have
The secondary diaphragm 20b of compression.Secondary diaphragm 20b is located between two layers of primary diaphragm 20a.
Based on similar principle, multilayer, such as four layers, five layers have been can be set in primary diaphragm, secondary diaphragm in film layer
Or more layers.Primary diaphragm, secondary diaphragm are configured in a manner of being spaced each other.
In an optional embodiment of the invention, substrate uses photopolymerizable material, and passes through exposure, polymerization work
The shape of skill formation substrate.Such as in a specific embodiment of the invention, substrate can use epoxy resin or polyamides
Imide resin.Optionally, epoxy resin, polyimide resin select dry film or liquid-type.
Substrate is manufactured using photosensitive polymer, negative photoresist or photosensitive polyamides based on epoxy resin can be used for example
Imines, this becomes easy manufacturing process.
Such as SU-8 is common epoxy-based negative photoresist.Negativity refers to photoresist, wherein being exposed to the portion of UV
Dividing becomes to be crosslinked, and rest part keeps solvable and can be washed off during development.
Polyimides is the polymer of dant monomer.Polyimides has high-fire resistance, is requiring robust to have
There are a variety of applications during machine material.Polyimides can be used as photoresist, such as " just " and " negative " type
Photoresist quasi-polyimide.
Microfilter can complete simultaneously on wafer.It, can be first such as when manufacturing microfilter
Film layer first is formed by techniques such as deposition, etchings on substrate, photosensitive polymer conduct can be bonded by way of lamination later
Substrate forms the substrate with back chamber subsequently through the mode of exposure, polymerization, is finally separated from film layer from substrate and comes.
Metallic film or Kapton are carried in the substrate of light-sensitive material, are propped up by substrate film layer
Support, on the basis of guaranteeing structure, can make microfilter be made small.
Although some specific embodiments of the invention are described in detail by example, the skill of this field
Art personnel it should be understood that example above merely to being illustrated, the range being not intended to be limiting of the invention.The skill of this field
Art personnel are it should be understood that can without departing from the scope and spirit of the present invention modify to above embodiments.This hair
Bright range is defined by the following claims.
Claims (10)
1. a kind of microfilter, which is characterized in that including the substrate with back chamber, and be arranged in substrate and be suspended at back
Metallic film on chamber；And the outer surface of the metallic film is coated with antistick layer；It is viscous between the antistick layer and particle
Property lower than viscosity between metallic film and particle；There is the through-hole of arrangement on the metallic film and antistick layer.
2. microfilter according to claim 1, which is characterized in that the antistick layer be silicone compounds coating or
Person's fluoropolymer coating.
3. microfilter according to claim 1, which is characterized in that the antistick layer selects teflon coating.
4. microfilter according to claim 1, which is characterized in that the coating is provided with two layers, is located at gold
Belong to the opposite two sides of film.
5. microfilter according to claim 1, which is characterized in that the metallic film is configured with pressure and answers
Power；The antistick layer is configured with tensile stress；Alternatively, the metallic film is configured with tensile stress；It is described not glue
Layer is configured with compression；
The metallic film, antistick layer are configured as reducing the stress of entire film layer.
6. microfilter according to claim 5, which is characterized in that the stress of the film layer -300MPa extremely
Between 300MPa.
7. microfilter according to claim 1, which is characterized in that the metallic film uses glassy metal.
8. microfilter according to claim 1, which is characterized in that the substrate uses polymer material, metal, silicon
Or SiO2。
9. a kind of acoustic equipment, which is characterized in that including microfilter according to any one of claims 1 to 8.
10. acoustic equipment according to claim 9, which is characterized in that the acoustic equipment is microphone mould group or wheat
Gram wind chip.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910577035.4A CN110351618A (en) | 2019-06-28 | 2019-06-28 | A kind of microfilter and acoustic equipment |
| PCT/CN2019/094777 WO2020258364A1 (en) | 2019-06-28 | 2019-07-05 | Microfilter and acoustic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910577035.4A CN110351618A (en) | 2019-06-28 | 2019-06-28 | A kind of microfilter and acoustic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110351618A true CN110351618A (en) | 2019-10-18 |
Family
ID=68177055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910577035.4A Pending CN110351618A (en) | 2019-06-28 | 2019-06-28 | A kind of microfilter and acoustic equipment |
Country Status (2)
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|---|---|
| CN (1) | CN110351618A (en) |
| WO (1) | WO2020258364A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110809207A (en) * | 2019-10-31 | 2020-02-18 | 歌尔股份有限公司 | Micro-filter and MEMS sensor assembly |
| WO2021135118A1 (en) * | 2019-12-31 | 2021-07-08 | 潍坊歌尔微电子有限公司 | Dustproof structure, microphone packaging structure and electronic device |
| WO2021135124A1 (en) * | 2019-12-31 | 2021-07-08 | 潍坊歌尔微电子有限公司 | Dustproof structure, microphone packaging structure and electronic device |
| WO2021135115A1 (en) * | 2019-12-31 | 2021-07-08 | 潍坊歌尔微电子有限公司 | Dustproof structure, microphone packaging structure and electronic device |
| WO2021135122A1 (en) * | 2019-12-31 | 2021-07-08 | 潍坊歌尔微电子有限公司 | Dust-proof structure, microphone packaging structure and electronic device |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1210901A (en) * | 1997-06-26 | 1999-03-17 | 通用电气公司 | Protective coating by high rate arc plasma deposition |
| CN1901758A (en) * | 2005-07-19 | 2007-01-24 | 青岛歌尔电子有限公司 | Capacitive silicon microphone |
| CN2935691Y (en) * | 2006-05-22 | 2007-08-15 | 潍坊歌尔电子有限公司 | Silicon microphone |
| CN101374373A (en) * | 2007-08-20 | 2009-02-25 | 雅马哈株式会社 | Vibration sensor |
| CN102066239A (en) * | 2009-01-09 | 2011-05-18 | 松下电器产业株式会社 | MEMS device |
| CN102811413A (en) * | 2011-06-01 | 2012-12-05 | 英飞凌科技股份有限公司 | Plate, transducer and methods for making and operating transducer |
| US20130017432A1 (en) * | 2011-07-11 | 2013-01-17 | Roumi Farshid | Novel separators for electrochemical systems |
| CN109379684A (en) * | 2018-10-09 | 2019-02-22 | 歌尔股份有限公司 | Microphone and electronic equipment |
| CN109536748A (en) * | 2019-01-04 | 2019-03-29 | 上海交通大学 | The preparation method and the micro-nano band of glassy metal of the micro-nano band of glassy metal |
| CN109890748A (en) * | 2017-06-09 | 2019-06-14 | 歌尔股份有限公司 | MEMS microphone, its manufacturing method and electronic equipment |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000070630A2 (en) * | 1999-05-19 | 2000-11-23 | California Institute Of Technology | High performance mems thin-film teflon® electret microphone |
| US20060018487A1 (en) * | 1999-10-28 | 2006-01-26 | Clive Smith | Transducer for sensing body sounds |
-
2019
- 2019-06-28 CN CN201910577035.4A patent/CN110351618A/en active Pending
- 2019-07-05 WO PCT/CN2019/094777 patent/WO2020258364A1/en active Application Filing
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1210901A (en) * | 1997-06-26 | 1999-03-17 | 通用电气公司 | Protective coating by high rate arc plasma deposition |
| CN1901758A (en) * | 2005-07-19 | 2007-01-24 | 青岛歌尔电子有限公司 | Capacitive silicon microphone |
| CN2935691Y (en) * | 2006-05-22 | 2007-08-15 | 潍坊歌尔电子有限公司 | Silicon microphone |
| CN101374373A (en) * | 2007-08-20 | 2009-02-25 | 雅马哈株式会社 | Vibration sensor |
| CN102066239A (en) * | 2009-01-09 | 2011-05-18 | 松下电器产业株式会社 | MEMS device |
| CN102811413A (en) * | 2011-06-01 | 2012-12-05 | 英飞凌科技股份有限公司 | Plate, transducer and methods for making and operating transducer |
| US20130017432A1 (en) * | 2011-07-11 | 2013-01-17 | Roumi Farshid | Novel separators for electrochemical systems |
| CN109890748A (en) * | 2017-06-09 | 2019-06-14 | 歌尔股份有限公司 | MEMS microphone, its manufacturing method and electronic equipment |
| CN109379684A (en) * | 2018-10-09 | 2019-02-22 | 歌尔股份有限公司 | Microphone and electronic equipment |
| CN109536748A (en) * | 2019-01-04 | 2019-03-29 | 上海交通大学 | The preparation method and the micro-nano band of glassy metal of the micro-nano band of glassy metal |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110809207A (en) * | 2019-10-31 | 2020-02-18 | 歌尔股份有限公司 | Micro-filter and MEMS sensor assembly |
| CN110809207B (en) * | 2019-10-31 | 2020-12-08 | 潍坊歌尔微电子有限公司 | Micro-filter and MEMS sensor assembly |
| WO2021082052A1 (en) * | 2019-10-31 | 2021-05-06 | 潍坊歌尔微电子有限公司 | Microfilter and mems sensor assembly |
| WO2021135118A1 (en) * | 2019-12-31 | 2021-07-08 | 潍坊歌尔微电子有限公司 | Dustproof structure, microphone packaging structure and electronic device |
| WO2021135124A1 (en) * | 2019-12-31 | 2021-07-08 | 潍坊歌尔微电子有限公司 | Dustproof structure, microphone packaging structure and electronic device |
| WO2021135115A1 (en) * | 2019-12-31 | 2021-07-08 | 潍坊歌尔微电子有限公司 | Dustproof structure, microphone packaging structure and electronic device |
| WO2021135122A1 (en) * | 2019-12-31 | 2021-07-08 | 潍坊歌尔微电子有限公司 | Dust-proof structure, microphone packaging structure and electronic device |
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