CN110324767A - A kind of microfilter and acoustic equipment - Google Patents
A kind of microfilter and acoustic equipment Download PDFInfo
- Publication number
- CN110324767A CN110324767A CN201910579438.2A CN201910579438A CN110324767A CN 110324767 A CN110324767 A CN 110324767A CN 201910579438 A CN201910579438 A CN 201910579438A CN 110324767 A CN110324767 A CN 110324767A
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- Prior art keywords
- substrate
- microfilter
- film layer
- film
- acoustic equipment
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
- B01D46/54—Particle separators, e.g. dust precipitators, using ultra-fine filter sheets or diaphragms
- B01D46/543—Particle separators, e.g. dust precipitators, using ultra-fine filter sheets or diaphragms using membranes
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/12—Non-planar diaphragms or cones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/06—Loudspeakers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2207/00—Details of diaphragms or cones for electromechanical transducers or their suspension covered by H04R7/00 but not provided for in H04R7/00 or in H04R2307/00
- H04R2207/021—Diaphragm extensions, not necessarily integrally formed, e.g. skirts, rims, flanges
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2400/00—Loudspeakers
- H04R2400/11—Aspects regarding the frame of loudspeaker transducers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Multimedia (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Micromachines (AREA)
Abstract
The invention discloses a kind of microfilter and acoustic equipments, including the substrate with back chamber, and the film layer for being arranged in substrate and being suspended on back chamber；There is the through-hole of arrangement, and the film layer uses metallic film or Kapton in the film layer；The substrate uses photopolymerizable material, and the shape of substrate is formed by exposure, polymerization technique.According to one embodiment of the disclosure, substrate is manufactured using photosensitive polymer, this becomes easy manufacturing process；And microfilter can complete simultaneously on wafer.
Description
Technical field
The present invention relates to microfilters, can be a kind of microfilter suitable for acoustic equipment, to filter powder
Dirt, particle or/and water etc. are not intended to enter the substance inside acoustic equipment.
Background technique
The portable computing device of such as laptop, tablet computer etc is ubiquitous, such as smart phone etc
Portable communication device be also generally existing.However, these equipment do not have enough spaces to accommodate relatively large wheat
Gram wind or loudspeaker.Therefore, microphone and speaker size become more and more compacter and size reduces.In addition, these are portable
Microphone and loudspeaker in formula setting usually require associated acoustic input or output port close to terminal, so that particle and water
It is easily accessible microphone, in loudspeaker, and causes the failure of these acoustic equipments.
Filter membrane is disposed sometimes in pervious equipment, to prevent certain form of clast from entering in component.Unfortunately,
These filters often have an adverse effect to the operation of microphone.For example, when using these previous methods, microphone
Performance significant reduction sometimes.Since performance declines, microphone client often selects to use such Mike not in its application
Wind.
When manufacturing filtration membrane, common metal film has the limiting range of stress.When the stress of common metal film shows pressure
After contracting and forming fold, automatic optical detection equipment can not detect pressure.In order to manufacture filtrating chip structure, will be suitable
When thin metal film is deposited on substrate, need to obtain the film of low tensile stress.There is no the film of low tensile stress to tend to removing, break
It splits, wrinkle or is detached from from its substrate in other ways, therefore PB chip must not be abandoned infrequently after putting into operation.
The structure for being used to support film is necessary, although silicon wafer or glass substrate have been used as support construction,
In the presence of being difficult to handle material, the problem of manufacture spends time and material expensive.
Summary of the invention
It is an object of the present invention to provide a kind of new solutions of microfilter.
According to the first aspect of the invention, a kind of microfilter is provided, including having the substrate of back chamber, and setting
In substrate and it is suspended at the film layer carried on the back on chamber；There is the through-hole of arrangement, and the film layer uses metallic film in the film layer
Or Kapton；The substrate uses photopolymerizable material, and the shape of substrate is formed by exposure, polymerization technique
Shape.
Optionally, the substrate uses epoxy resin or polyimide resin.
Optionally, the epoxy resin, polyimide resin select dry film or liquid-type.
Optionally, the metallic film is amorphous metal.
Optionally, the amorphous metal is glassy metal.
Optionally, the internal diameter of through-hole is 1nm to 100 μm in the film layer.
Optionally, the internal diameter of through-hole is 5nm to 10 μm in the film layer.
According to another aspect of the present invention, a kind of acoustic equipment is additionally provided, including above-mentioned microfilter.
Optionally, the acoustic equipment is microphone chip.
Optionally, the acoustic equipment is microphone mould group.
According to one embodiment of the disclosure, substrate is manufactured using photosensitive polymer, this becomes easy manufacturing process；
And microfilter can complete simultaneously on wafer.
By referring to the drawings to the detailed description of exemplary embodiment of the present invention, other feature of the invention and its
Advantage will become apparent.
Detailed description of the invention
It is combined in the description and the attached drawing for constituting part of specification shows the embodiment of the present invention, and even
With its explanation together principle for explaining the present invention.
Fig. 1 is the cross-sectional view of microfilter first embodiment of the present invention.
Fig. 2 is the cross-sectional view of microfilter second embodiment of the present invention.
Fig. 3 is the cross-sectional view at another visual angle in microfilter second embodiment of the present invention.
Fig. 4 is the cross-sectional view of microfilter third embodiment of the present invention.
Fig. 5 is the cross-sectional view of the 4th embodiment of microfilter of the present invention.
Fig. 6 is the cross-sectional view of the 5th embodiment of microfilter of the present invention.
Specific embodiment
Carry out the various exemplary embodiments of detailed description of the present invention now with reference to attached drawing.It should also be noted that unless in addition having
Body explanation, the unlimited system of component and the positioned opposite of step, numerical expression and the numerical value otherwise illustrated in these embodiments is originally
The range of invention.
Be to the description only actually of at least one exemplary embodiment below it is illustrative, never as to the present invention
And its application or any restrictions used.
Technology, method and apparatus known to person of ordinary skill in the relevant may be not discussed in detail, but suitable
In the case of, the technology, method and apparatus should be considered as part of specification.
It is shown here and discuss all examples in, any occurrence should be construed as merely illustratively, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, then in subsequent attached drawing does not need that it is further discussed.
The present invention provides a kind of acoustic equipments of this microfilter of microfilter and application.The acoustic equipment is for example
It can be microphone chip, be also possible to microphone mould group.Such as when acoustic equipment is microphone chip, microfilter is set
It sets on microphone chip；When acoustic equipment is in microphone mould group, the sound of the shell in mould group is can be set in microfilter
Hole site.Certainly, to those skilled in the art, which is also possible to other types of sonic transducer, herein
Type is no longer illustrated.
Microfilter provided by the invention, including substrate and the film layer being arranged in substrate.Substrate has hollow
The marginal position of back cavity structure, film layer is connected in substrate, and the central region of film layer is suspended at the top of back chamber, so that film layer
Constitute cantilever bridge structure.
Fig. 1 shows the structural schematic diagram of the one of embodiment of microfilter of the present invention.With reference to Fig. 1, film layer 2 connects
It connects in the top of substrate 1, and vacantly on the hollow back chamber 3 of substrate 1.There is the through-hole 4 of arrangement, so that air-flow is logical in film layer 2
It crosses.Substrate 1 can use metal, silicon or SiO2, and can be formed by mode well-known to those skilled in the art hollow
Carry on the back chamber 3.Such as formed by techniques such as etchings, it no longer illustrates herein.
Film layer 2 can use nonmetal film, such as polyimide material, SiO2, SiN etc..Film layer 2 can also be using gold
Belong to film, such as with the crystalline membrane containing Cr, Al, Ti or Cu etc. as an example.
Currently preferred is using amorphous metal film, such as glassy metal.Amorphous metal film can be by extremely cold
But, physical vapour deposition (PVD), plating, pulse laser be heavy, solid-state reaction, the mode of ionizing radiation or mechanical alloying are formed, this
A little molding modes belong to the common knowledge of those skilled in the art, no longer illustrate herein.
Since glassy metal has irregular atomic arrangement and no specific slide surface, it has than crystallization
The higher intensity of metal and have that excellent fatigue behaviour, flexible deformation is with resistance to deformation.The elasticity modulus of glassy metal is big
It is approximately the one third of crystal metal, but tensile strength is its three times.For example, the intensity of Mg alloy is 300MPa, Mg Base Metal
The intensity of glass is 800MPa, and the intensity of FeCoBSiNb glassy metal is 4400MPa, and the intensity of SUS304 stainless steel is
1400MPa。
Therefore, the film layer using glassy metal as microfilter can be improved on the basis of guaranteeing film strength
Percent opening in film layer, and the thickness of film layer can be made thinning, so that infiltration processing becomes easy and can be formed smaller
Through-hole, avoid after traditional thick film aperture due to hole depth it is larger caused by acoustic resistance.
In an optional embodiment of the invention, the internal diameter of through-hole 4 can be 1nm to 100 μm in film layer 2.
In an optional embodiment of the invention, the internal diameter of through-hole 4 can be 5nm to 10 μm in film layer 2.
In an optional embodiment of the invention, film layer 2 with a thickness of 5nm to 5 μm.
In an optional embodiment of the invention, film layer 2 with a thickness of 20nm to 1000nm.
It is isotropism and uniform since glassy metal is amorphous materials.In addition, being substantially absent by such as
Defect caused by the polycrystalline structure of grain boundary and segregation, and dimensional effect is small.Therefore, when designing microfilter, no
It must consider the variation of the physical property due to caused by anisotropy and size, this structure for being conducive to design microfilter is set
Meter.In addition, due to the alloy that glassy metal is made of multiple element, the range of material selection in microfilter design
It broadens, and the PB chip of higher performance can be designed and manufactured.
For example, glassy metal may include a variety of transition metal elements, also optionally including one or more nonmetallic members
Element.Glassy metal containing transition metal element can have Sc, Y, La, Al, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn,
At least one of Tc, Re, Fe, Ru, Os, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd and Hg.It, can be with according to application
Use any suitable transition metal element or their combination.Any suitable nonmetalloid or their group can be used
It closes.For example, nonmetalloid can be F, Cl, Br, I, At, O, S, Se, Te, Po, N, P, As, Sb, Bi, C, Si, Ge, Sn, Pb
Any one of with B.
In an optional embodiment of the invention, the glass transition temperature Tg of glassy metal is 150 DEG C or higher.
In an optional embodiment of the invention, the glass transition temperature Tg of glassy metal is 250 DEG C or higher.
In microfilter of the invention, film layer 2 can be set one layer, also can be set two layers, three layers or more
Multilayer.
With reference to Fig. 2, Fig. 3, film layer includes the one layer of primary diaphragm 2a and one layer of secondary diaphragm 2b being combined with each other.Its
In, primary diaphragm 2a has tensile stress, and secondary diaphragm 2b has compression.After primary diaphragm, secondary diaphragm are combined with each other,
Tensile stress, compression interaction under reduce the stress of entire film layer 2 so that entire film layer 2 smooth can be placed in substrate 1
On.
Primary diaphragm 2a, secondary diaphragm 2b can use identical material, can also use different materials.Such as first
Diaphragm 2a, secondary diaphragm 2b can select crystal metal film, amorphous metal film or nonmetal film.In order to improve film layer 2
Elasticity and impact resistance, at least one layer of diaphragm in film layer 2 select amorphous metal film.
Diaphragm can show various internal stress, and from compression is stretched to, this depends on the condition of film deposition, deposition of thick
Degree.The internal stress of diaphragm can greatly change diaphragm performance, such as mechanical performance.Therefore, by by tensile stress diaphragm and pressure
Stress diaphragm is combined with each other, to eliminate film layer internal stress and be adjusted in the desired range of stress.
For example, the Stress Control of film layer 2 is in -300MPa (compression) to 300MPa in an optional embodiment
Between (tensile stress).
For example, the Stress Control of film layer 2 is between 0 to 300MPa (tensile stress) in an optional embodiment.It will
The control of film layer 2 so that film layer 2 may be at the state of tensioning, and keeps the shape of itself, this is conducive in lower tensile stress
On the base 1 smooth of diaphragm 2, so that optics monitors automatically.
In an optional embodiment, secondary diaphragm 2b is arranged relative to primary diaphragm 2a adjacent substrate 1.With pressure
The secondary diaphragm 2b of stress is positioned adjacent to the side of substrate 1, offsets the second film by the primary diaphragm 2a with tensile stress
The compression of piece 2b.
In an optional embodiment, primary diaphragm 2a is arranged relative to secondary diaphragm 2b adjacent substrate 1.With drawing
The primary diaphragm 2a of stress is positioned adjacent to the side of substrate 1, offsets the first film by the secondary diaphragm 2b with compression
The tensile stress of piece 2a；And due to primary diaphragm 2a itself have tensile stress, so as to further avoid primary diaphragm 2a with
The problems such as substrate 1 is detached from.
Fig. 4 shows the structural schematic diagram of microfilter another embodiment of the present invention.Not with embodiment illustrated in fig. 2
With the film layer in substrate 10 includes trilamellar membrane piece, which is suspended on the hollow back chamber 30 of substrate 10.This three
Tunic piece includes one layer of primary diaphragm 20a, two layers of secondary diaphragm 20b with compression with tensile stress.Primary diaphragm 20a
Between two layers of secondary diaphragm 20b, trilamellar membrane piece is combined with each other.By two sides there is the secondary diaphragm of compression to offset
It is located in the middle the tensile stress of primary diaphragm；Conversely, its two sides can also be offset by being located in the middle the primary diaphragm with tensile stress
The compression of secondary diaphragm, no longer illustrates herein.
The trilamellar membrane chip architecture of film layer also may include two layers with tensile stress primary diaphragm 20a and one layer have
The secondary diaphragm 20b of compression.Secondary diaphragm 20b is located between two layers of primary diaphragm 20a.
Based on similar principle, multilayer, such as four layers, five layers have been can be set in primary diaphragm, secondary diaphragm in film layer
Or more layers.Primary diaphragm, secondary diaphragm are configured in a manner of being spaced each other.
In an optional embodiment of the invention, substrate uses photopolymerizable material, and passes through exposure, polymerization work
The shape of skill formation substrate.Such as in a specific embodiment of the invention, substrate can use epoxy resin or polyamides
Imide resin.Optionally, epoxy resin, polyimide resin select dry film or liquid-type.
Substrate is manufactured using photosensitive polymer, negative photoresist or photosensitive polyamides based on epoxy resin can be used for example
Imines, this becomes easy manufacturing process.
Such as SU-8 is common epoxy-based negative photoresist.Negativity refers to photoresist, wherein being exposed to the portion of UV
Dividing becomes to be crosslinked, and rest part keeps solvable and can be washed off during development.
Polyimides is the polymer of dant monomer.Polyimides has high-fire resistance, is requiring robust to have
There are a variety of applications during machine material.Polyimides can be used as photoresist, such as " just " and " negative " type
Photoresist quasi-polyimide.
Microfilter can complete simultaneously on wafer.It, can be first such as when manufacturing microfilter
Film layer first is formed by techniques such as deposition, etchings on substrate, photosensitive polymer conduct can be bonded by way of lamination later
Substrate forms the substrate with back chamber subsequently through the mode of exposure, polymerization, is finally separated from film layer from substrate and comes.
Metallic film or Kapton are carried in the substrate of light-sensitive material, are propped up by substrate film layer
Support, on the basis of guaranteeing structure, can make microfilter be made small.
Fig. 5 shows the structural schematic diagram of microfilter another embodiment of the present invention.Embodiment shown in Fig. 5
In, unlike Fig. 1, Fig. 2, Fig. 3, embodiment illustrated in fig. 4, metallic film 6a is arranged on substrate 5, and is suspended at substrate 5
The top of hollow back chamber 7.Metallic film 6a can use amorphous metal film, such as glassy metal etc..Substrate 5 can use
Polymer material, metal, silicon or SiO2。
Antistick layer 6b is coated in the outer surface of metallic film 6a.Viscosity between antistick layer 6b and particle is lower than metal
Viscosity between film 6a and particle；There is the through-hole of arrangement on metallic film 6a and antistick layer 6b (view does not provide).
In an optional embodiment of the invention, antistick layer 6b is silicone compounds coating or fluoropolymer
Coating.
In an optional embodiment of the invention, antistick layer 6b selects teflon coating.Teflon has high temperature special
Property, and coefficient of friction is low.
It, can be to avoid being adhered to the gold with through-hole using rear particle for a long time by the way that antistick layer is arranged on metallic film
Belong to the problem on film, to ensure that the sensitivity of sensor.
In an optional embodiment of the invention, metallic film 6a is configured with compression；Antistick layer 6b quilt
It is configured to tensile stress；Metallic film 6a is combined with each other with antistick layer 6b, can reduce the stress of entire film layer.Certainly,
It is also possible to metallic film 6a and is configured with tensile stress, antistick layer 6b is configured with compression.Concrete principle and figure
2, embodiment illustrated in fig. 4 is identical, no longer illustrates herein.
For example, the Stress Control for the film layer being combined with each other in -300MPa, (answer by pressure in an optional embodiment
Power) between 300MPa (tensile stress).
For example, the Stress Control for the film layer being combined with each other (is drawn 0 to 300MPa in an optional embodiment
Stress) between.
Fig. 6 shows the structural schematic diagram of microfilter another embodiment of the present invention.Not with embodiment illustrated in fig. 5
With the film layer in substrate 50 includes trilamellar membrane piece, which is suspended on the hollow back chamber 70 of substrate 50.This three
Tunic piece includes one layer of metallic film 60a, two layers of antistick layer 60b with tensile stress with compression.Metallic film 60a
Between two layers of antistick layer 60b, three layers are combined with each other.It is offset by antistick layer 60b of the two sides with tensile stress in being located at
Between metallic film compression；It is not glued conversely, being located in the middle the metallic film 60a with compression also and can offset its two sides
The compression of layer 60b, no longer illustrates herein.
In addition, antistick layer 60b is respectively set in the two sides of metallic film 60a, can to avoid or reduce metallic film 60a
Granular absorption, ensure that the performance of microfilter.
Although some specific embodiments of the invention are described in detail by example, the skill of this field
Art personnel it should be understood that example above merely to being illustrated, the range being not intended to be limiting of the invention.The skill of this field
Art personnel are it should be understood that can without departing from the scope and spirit of the present invention modify to above embodiments.This hair
Bright range is defined by the following claims.
Claims (10)
1. a kind of microfilter, which is characterized in that including the substrate with back chamber, and be arranged in substrate and be suspended at back
Film layer on chamber；There is the through-hole of arrangement, and the film layer uses metallic film or Kapton in the film layer；Institute
Substrate is stated using photopolymerizable material, and forms the shape of substrate by exposure, polymerization technique.
2. microfilter according to claim 1, which is characterized in that the substrate uses epoxy resin or polyimides
Resin.
3. microfilter according to claim 2, which is characterized in that the epoxy resin, polyimide resin are selected
Dry film or liquid-type.
4. microfilter according to claim 1, which is characterized in that the metallic film is amorphous metal.
5. microfilter according to claim 4, which is characterized in that the amorphous metal is glassy metal.
6. microfilter according to claim 1, which is characterized in that the internal diameter of through-hole is 1nm to 100 in the film layer
μm。
7. microfilter according to claim 8, which is characterized in that the internal diameter of through-hole is 5nm to 10 μ in the film layer
m。
8. a kind of acoustic equipment, which is characterized in that including microfilter according to any one of claims 1 to 7.
9. acoustic equipment according to claim 8, which is characterized in that the acoustic equipment is microphone chip.
10. acoustic equipment according to claim 8, which is characterized in that the acoustic equipment is microphone mould group.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910579438.2A CN110324767A (en) | 2019-06-28 | 2019-06-28 | A kind of microfilter and acoustic equipment |
| PCT/CN2019/094775 WO2020258362A1 (en) | 2019-06-28 | 2019-07-05 | Microfilter and acoustic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910579438.2A CN110324767A (en) | 2019-06-28 | 2019-06-28 | A kind of microfilter and acoustic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110324767A true CN110324767A (en) | 2019-10-11 |
Family
ID=68120731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910579438.2A Pending CN110324767A (en) | 2019-06-28 | 2019-06-28 | A kind of microfilter and acoustic equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110324767A (en) |
| WO (1) | WO2020258362A1 (en) |
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| CN110794499A (en) * | 2019-10-31 | 2020-02-14 | 歌尔股份有限公司 | Light filter |
| CN111787473A (en) * | 2020-06-30 | 2020-10-16 | 歌尔微电子有限公司 | Miniature microphone particle blocker and MEMS microphone |
| WO2021082052A1 (en) * | 2019-10-31 | 2021-05-06 | 潍坊歌尔微电子有限公司 | Microfilter and mems sensor assembly |
| WO2021082044A1 (en) * | 2019-10-31 | 2021-05-06 | 潍坊歌尔微电子有限公司 | Mems sensor assembly manufacturing method and sensor assembly manufactured by means of said method |
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|---|---|---|---|---|
| CN110794499A (en) * | 2019-10-31 | 2020-02-14 | 歌尔股份有限公司 | Light filter |
| WO2021082052A1 (en) * | 2019-10-31 | 2021-05-06 | 潍坊歌尔微电子有限公司 | Microfilter and mems sensor assembly |
| WO2021082044A1 (en) * | 2019-10-31 | 2021-05-06 | 潍坊歌尔微电子有限公司 | Mems sensor assembly manufacturing method and sensor assembly manufactured by means of said method |
| WO2021082053A1 (en) * | 2019-10-31 | 2021-05-06 | 潍坊歌尔微电子有限公司 | Optical filter |
| CN111787473A (en) * | 2020-06-30 | 2020-10-16 | 歌尔微电子有限公司 | Miniature microphone particle blocker and MEMS microphone |
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| Publication number | Publication date |
|---|---|
| WO2020258362A1 (en) | 2020-12-30 |
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