WO2021082044A1

WO2021082044A1 - Mems sensor assembly manufacturing method and sensor assembly manufactured by means of said method

Info

Publication number: WO2021082044A1
Application number: PCT/CN2019/116506
Authority: WO
Inventors: 游振江; 林育菁
Original assignee: 潍坊歌尔微电子有限公司
Priority date: 2019-10-31
Filing date: 2019-11-08
Publication date: 2021-05-06
Also published as: CN110759313B; CN110759313A

Abstract

A MEMS sensor assembly manufacturing method and a MEMS sensor assembly. The manufacturing method comprises: providing a filter membrane, comprising micrometer-scale or nanometer-scale objects (102) coated on a substrate (100); depositing a filter membrane material (104) on the substrate (100); removing the micrometer-scale or nanometer-scale objects (102), so as to form through holes (106) in the deposited filter membrane material (104). The manufacturing method further comprises providing a MEMS sensor, the MEMS sensor having thereon an opening, and being capable of performing sensing via the opening. The manufacturing method further comprises joining the filter membrane onto the MEMS sensor, causing the filter membrane to cover the opening, thereby forming a MEMS sensor assembly.

Description

MEMS sensor component manufacturing method and sensor component manufactured by the method

Technical field

The present disclosure mainly relates to a method for manufacturing a MEMS sensor component, and a MEMS sensor component manufactured by the method.

Background technique

Nowadays, portable computing devices such as notebook computers and tablet computers are very common, as are portable communication devices such as smart phones. However, the internal space left for microphones or speakers in such devices is very limited. Therefore, microphones and speakers are getting smaller and smaller in size and becoming more and more compact. In addition, because microphones and speakers are deployed in compact portable devices, they usually need to be close to the related acoustic input or output ports of the device, so the ingress of particles and water can easily cause the malfunction of the MEMS sensor therein.

In the prior art, a particle filter is deployed in some MEMS sensor components, which prevents certain types of debris from entering the MEMS sensor.

Currently, the dust-proof membrane in the particle filter often adopts a wire mesh made of fine metal wires, or a porous structure formed from a silicon substrate with multiple through holes. The formation of the fine pattern of the metal mesh film is performed by photolithography, which is a complicated process that requires expensive exposure equipment and photomasks.

Summary of the invention

An object of the present disclosure is to provide a new technical solution for a method of manufacturing a MEMS sensor assembly.

According to a first aspect of the present disclosure, there is provided a method of manufacturing a MEMS sensor assembly, including: providing a filter membrane, including coating a micro-sized or nano-sized object on a substrate; depositing a filter membrane material on the substrate; and removing Micro-sized or nano-sized objects to form through holes in the deposited filter membrane material. The method further includes providing a MEMS sensor with an opening and capable of sensing through the opening. The method also includes bonding the filter membrane to the MEMS sensor such that the filter membrane covers the opening.

Those skilled in the art can understand that the above-mentioned coating and deposition are performed on the same side of the substrate, and the coated micro-sized or nano-sized objects function as a mask in the manufacturing process. Coating micro-sized or nano-sized objects can be spin-coated using a liquid in which micro-sized or nano-sized objects are dispersed. The micro-sized or nano-sized objects may have any suitable shape, such as a spherical shape, a star shape, an oblate shape, a polygonal shape (for example, a hexagonal shape), a disc shape, and the like.

Optionally, the filter membrane material is an amorphous metal material.

Optionally, the filter membrane material is metallic glass.

Optionally, the filter membrane material is deposited with a thickness of 5 nm to 5 μm.

Optionally, the filter membrane material is deposited with a thickness of 20 nm to 1000 nm.

Optionally, the through hole is formed with an inner diameter of 1 nm to 100 μm.

Optionally, the through hole is formed with an inner diameter of 100 nm to 10 μm.

According to a second aspect of the present disclosure, there is provided a MEMS sensor assembly, which is manufactured using the method according to the first aspect of the present disclosure.

Optionally, the MEMS sensor component is used in a microphone module or a microphone chip.

The manufacturing method of the MEMS sensor assembly provided in an embodiment of the present disclosure does not require the use of a photolithography process, and does not require expensive exposure equipment and photomasks. The inner diameter of the through hole can be controlled by the size of the micron-sized or nano-sized object used, and the through-holes of different sizes can be formed by changing the micron-sized or nano-sized object used.

Through the following detailed description of exemplary embodiments of the present disclosure with reference to the accompanying drawings, other features and advantages of the present disclosure will become clear.

Description of the drawings

The drawings incorporated in the specification and constituting a part of the specification illustrate embodiments of the present disclosure, and together with the description thereof, serve to explain the principle of the present disclosure.

Fig. 1 schematically shows an embodiment of a method for manufacturing a MEMS sensor assembly according to the present disclosure, in which Fig. 1(A), Fig. 1(B) and Fig. 1(C) sequentially show each of the filter membrane manufacturing processes step.

Figure 2 shows an embodiment of the method of Figure 1 in a cross-sectional view, wherein Figure 2 (A), Figure 2 (B) and Figure 2 (C) are Figure 1 (A), Figure 1 (B) and Figure 1(C) cross-sectional view.

Detailed ways

Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that unless specifically stated otherwise, the relative arrangement, numerical expressions and numerical values of the components and steps set forth in these embodiments do not limit the scope of the present disclosure.

The following description of at least one exemplary embodiment is actually only illustrative, and in no way serves as any limitation to the present disclosure and its application or use.

The technologies, methods, and equipment known to those of ordinary skill in the relevant fields may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be regarded as part of the specification.

In all examples shown and discussed herein, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of the exemplary embodiment may have different values.

It should be noted that similar reference numerals and letters indicate similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

The present disclosure provides a method for manufacturing a MEMS sensor component and a MEMS sensor component manufactured by the method. The MEMS sensor component can be used in acoustic equipment, for example, in a microphone chip or a microphone module. Of course, for those skilled in the art, the MEMS sensor assembly can also be used in other types of equipment, which will not be described in detail here.

Fig. 1 schematically shows an embodiment of a method for manufacturing a MEMS sensor assembly according to the present disclosure, in which Fig. 1(A), Fig. 1(B) and Fig. 1(C) sequentially show the membrane manufacturing process The corresponding steps in the. Figure 2 shows an embodiment of the method of Figure 1 in a cross-sectional view, wherein Figure 2 (A), Figure 2 (B) and Figure 2 (C) are Figure 1 (A), Figure 1 (B) and Figure 1(C) cross-sectional view.

As shown in FIG. 1(A) and FIG. 2(A), first, a micron-sized or nano-sized object 102 is coated on the substrate 100. The coating of the micro-sized or nano-sized object 102 can be performed by spin coating using a liquid in which the micro-sized or nano-sized object is dispersed. The micron-sized or nano-sized object 102 may have any suitable shape, such as, but not limited to, a spherical shape, a star shape, an oblate shape, a polygonal shape (for example, a hexagonal shape), a disc shape, and the like.

As shown in FIG. 1(B) and FIG. 2(B), a filter membrane material 104 is deposited on a substrate 100 that has been coated with a micron-sized or nano-sized object 102. Those skilled in the art can understand that the coating shown in FIG. 1(A) and the deposition shown in FIG. 1(B) are performed on the same side of the substrate 100.

As shown in FIG. 1(C) and FIG. 2(C), the micron-sized or nano-sized object 102 is removed to form a through hole 106 in the deposited filter membrane material 104. Those skilled in the art can understand that the micro-sized or nano-sized object 102 functions as a mask in the manufacturing process.

The manufacturing process shown in FIGS. 1(A) to 1(C) and FIGS. 2(A) to 2(C) does not involve photolithography technology, nor does it require expensive exposure equipment and photomasks. The inner diameter of the through hole 106 can be controlled by the size of the micron-sized or nano-sized object 102 used, and the through-holes of different sizes can be formed by changing the used micron-sized or nano-sized object.

The filter membrane material 104 may be deposited in a thickness of 5 nm to 5 μm, preferably 20 nm to 1000 nm. The through hole 106 may be formed with an inner diameter of 1 nm to 100 μm, preferably 100 nm to 10 μm.

The filter membrane material 104 may be an amorphous metal material, preferably metallic glass. Since amorphous metal has irregular atomic arrangement and no specific slip surface, compared with crystalline metal, it has higher strength and excellent fatigue performance, elastic deformation ability, and shock resistance. There are several methods to produce amorphous metal materials, including extremely rapid cooling, physical vapor deposition (PVD), electroplating, pulsed laser deposition (PLD), solid state reaction, ionizing radiation, and mechanical alloying.

Since metallic glass is isotropic and uniform, there are basically no defects such as grain boundaries and segregation caused by polycrystalline structure, and its size effect is small. Therefore, when designing the micro filter, it is not necessary to consider the changes in physical properties due to anisotropy and size, which facilitates the structural design of the micro filter. In addition, because metallic glass is an alloy composed of multiple elements, the range of material selection in the design of a micro filter is widened, and a higher performance micro filter can be designed and manufactured.

The filter membrane provided in the manner shown in FIGS. 1(A) to (C) and FIGS. 2(A) to 2(C) can be bonded to a MEMS sensor (not shown), thereby forming a MEMS sensor assembly . The MEMS sensor has an opening, and the object to be measured can be contacted through the opening for sensing. The process of providing the MEMS sensor is well known to those skilled in the art, and will not be repeated here. Combining the filter membrane to the MEMS sensor can include making the filter membrane cover the opening of the sensor, so that the filter membrane can play a filtering role, and prevent particles, water and other debris from entering the MEMS sensor assembly without affecting the sensor's sensing function. in.

Although some specific embodiments of the present disclosure have been described in detail through examples, those skilled in the art should understand that the above examples are only for illustration and not for limiting the scope of the present disclosure. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present disclosure. The scope of the present disclosure is defined by the appended claims.

Claims

A method of manufacturing a MEMS sensor assembly, characterized in that it comprises:

Provide membranes, including:

Coating micro-sized or nano-sized objects on the substrate,

Depositing a filter membrane material on the substrate, and

Removing the micron-sized or nano-sized objects to form through holes in the deposited filter membrane material;

Provide a MEMS sensor, which has an opening and can be sensed through the opening; and

The filter membrane is bonded to the MEMS sensor so that the filter membrane covers the opening.
The method according to claim 1, wherein the filter membrane material is an amorphous metal material.
The method according to claim 2, wherein the filter membrane material is metallic glass.
The method according to claim 1, wherein the filter membrane material is deposited with a thickness of 5 nm to 5 μm.
The method according to claim 4, wherein the filter film material is deposited with a thickness of 20 nm to 1000 nm.
The method according to claim 1, wherein the through hole is formed with an inner diameter of 1 nm to 100 μm.
The method according to claim 6, wherein the through hole is formed with an inner diameter of 100 nm to 10 μm.
A MEMS sensor assembly characterized by being manufactured by the method according to any one of claims 1 to 7.
8. The MEMS sensor assembly according to claim 8, wherein the MEMS sensor assembly is used in a microphone module or a microphone chip.