CN109788416A - With the microphone apparatus for entering protection - Google Patents
With the microphone apparatus for entering protection Download PDFInfo
- Publication number
- CN109788416A CN109788416A CN201811337250.9A CN201811337250A CN109788416A CN 109788416 A CN109788416 A CN 109788416A CN 201811337250 A CN201811337250 A CN 201811337250A CN 109788416 A CN109788416 A CN 109788416A
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- China
- Prior art keywords
- lid
- base portion
- sensor according
- sensor
- filtering material
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
- G01L19/0636—Protection against aggressive medium in general using particle filters
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/142—Multiple part housings
- G01L19/143—Two part housings
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/021—Casings; Cabinets ; Supports therefor; Mountings therein incorporating only one transducer
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/08—Mouthpieces; Microphones; Attachments therefor
- H04R1/083—Special constructions of mouthpieces
- H04R1/086—Protective screens, e.g. all weather or wind screens
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0257—Microphones or microspeakers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0264—Pressure sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
- B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- General Physics & Mathematics (AREA)
- Pressure Sensors (AREA)
- Micromachines (AREA)
Abstract
The present invention relates to a kind of with the microphone apparatus for entering protection.Microphone includes the integrated circuit i.e. IC of base portion, MEMS i.e. combination of MEMS wafer and setting on the base portion.The microphone further includes lid, and the lid is mounted on the base portion and covers the combination of MEMS wafer and the IC.The lid includes imprinting area or inside drawing region, the top port that the imprinting area or the inside drawing region restriction sound can enter the microphone through it and be incident on the combination of MEMS wafer.The microphone further includes filtering material, and the filtering material is set on the outer surface of the lid in the top port and is arranged in the imprinting area or the inside drawing region.The filtering material resists solid particle or liquid enters in the microphone.
Description
Technical field
The present invention relates to the microphone apparatus for entering protection.
Background technique
In MEMS (MEMS) microphone, combination of MEMS wafer includes at least one diaphragm and at least one backboard.
Combination of MEMS wafer is by base portion or substrate support and by shell (for example, cup or lid with wall) closing.Single port can extend across base
The top (being used for top port device) of plate (being used for bottom port device) or shell.Sound can cross port, keep diaphragm mobile, and
And the variation potential of backboard is generated, to generate electric signal.Microphone is deployed in various types of equipment (such as individual calculus
Machine, cellular phone, mobile device, earphone and hearing-aid device) in.
Summary of the invention
In in one aspect of the present disclosure, a kind of sensor includes base portion, and the base portion has first surface and opposed
Second surface.The sensor further comprises MEMS i.e. combination of MEMS wafer, and the combination of MEMS wafer is mounted to the base
The first surface in portion.The sensor further includes integrated circuit, and the integrated circuit setting is on the base portion.The biography
Sensor further comprises lid, and the lid is arranged on the first surface of the base portion to cover MEMS transducer and IC,
The lid has outer surface and inner surface, and the outer surface of the lid limits the imprinting area with stamping surface, the lid
It is limited to the top port extended between the stamping surface and the inner surface.The sensor also comprises filtering material,
The filtering material is arranged in the stamping surface to cover the top port, and the filtering material is configured to prevent dirt
Dye object enters via the top port.
In in one aspect of the present disclosure, a kind of sensor includes: base portion, and the base portion has first surface and opposed
Second surface；MEMS, that is, combination of MEMS wafer, the combination of MEMS wafer are mounted to the first surface of the base portion；And
Integrated circuit, the integrated circuit setting is on the base portion.The sensor further comprises lid, and the lid is arranged described
To cover MEMS transducer and IC on the first surface of base portion, the lid has outer surface and an inner surface, it is described cover into
One step limits the inside drawing region for the recessed portion to be formed in the lid, and the inside drawing region limits top port.It is described
Sensor further includes filtering material, and the filtering material is arranged in the inside drawing region and the covering top port,
The filtering material is configured to prevent pollutant from entering via the top port.
In in one aspect of the present disclosure, a kind of sensor includes: base portion, and the base portion has first surface and opposed
Second surface；MEMS, that is, combination of MEMS wafer, the combination of MEMS wafer are installed to the first surface of the base portion；And collection
At circuit, the integrated circuit setting is on the base portion.The sensor further comprises lid, and the lid is arranged in the base
To cover MEMS transducer and IC on the first surface in portion, the lid has the bottom surface in face of the base portion, the lid
The bottom surface limit coining portion, the lid limits the top port in the coining portion.The sensor further includes mesh screen,
The mesh screen is arranged in the coining portion and is oriented to cover the top port, and the mesh screen is configured to prevent particle
Enter via the top port.
Foregoing summary is merely illustrative, it is no intended to be limited in any way.In addition to theory described above
In terms of bright property, except embodiment and feature, by reference to the following drawings and detailed description, other aspect, embodiment and spies
Sign will become obvious.
Detailed description of the invention
In order to which the disclosure is more fully understood, features as discussed above should be referred to.
Fig. 1 is the perspective view according to the top port microphone with molded areas of an illustrated embodiment.
Fig. 2 is the sectional view according to the top port microphone of Fig. 1 of an illustrated embodiment.
Fig. 3 is the solid according to the top port microphone with molded areas and sieve of an illustrated embodiment
Figure.
Fig. 4 is the sectional view according to the top port microphone of Fig. 3 of an illustrated embodiment.
Fig. 5 is the top port microphone on the top surface of cover according to an illustrated embodiment with molded areas
Sectional view.
Fig. 6 is the close-up side view according to illustrated embodiment molded areas when being constructed by punching press.
Fig. 7 is the close-up side view according to illustrated embodiment molded areas in drilling.
Fig. 8 is the sectional view according to the bottom port microphone of an illustrated embodiment.
Fig. 9 is the sectional view according to the top port microphone of an illustrated embodiment.
Figure 10 is shown in the molded areas according to an illustrated embodiment on the top surface that net is located in cover
In the case of top port sensor cross-sectional view.
Figure 11 shows the top view of sensor device shown in Fig. 10.
Figure 12, which is shown, can be used in having inwardly in sensor shown in Fig. 10 according to an illustrated embodiment
The cross-sectional view of the example lid in drawing region.
Figure 13, which is shown, can be used in having inwardly in sensor shown in Fig. 10 according to an illustrated embodiment
The cross-sectional view of drawing region and another example lid in imprinting area.
Figure 14 show in the molded areas according to an illustrated embodiment on the top surface that net is located in cover and
The cross-sectional view of top port sensor in the case where including cavity in base portion.
In conjunction with attached drawing, according to the following description and the appended claims book, the foregoing and other feature of the disclosure will become aobvious
And it is clear to.It should be understood that these attached drawings depict only several embodiments according to the disclosure, therefore, it is not considered as to its model
The limitation enclosed will describe the disclosure by using attached drawing with additional feature and details.In the accompanying drawings, unless the context otherwise
Instruction, otherwise similar appended drawing reference usually identifies similar component.
Specific embodiment
In the following detailed description, with reference to attached drawing, attached drawing forms a part of the invention.In specific embodiment, attached
Illustrated embodiment described in figure and claims is not intended to be restrictive.Subject matter presented here is not being departed from
Spirit or scope in the case where, using other embodiments, and other changes can be carried out.It is easily understood that such as this
Literary general description and all aspects of this disclosure that illustrate in the accompanying drawings can with a variety of different configurations come arrange, replace,
Combination and design, it is all these all it is expressly contemplated that and becoming a part of this disclosure.
It is used for different types of acoustic apparatus for many years.A type of device is microphone.In micro-electro-mechanical systems
It unites in (MEMS) microphone, combination of MEMS wafer includes diaphragm and backboard.Combination of MEMS wafer is covered or is covered by substrate or base portion supports
(there is wall) closing.Single port can extend across the top (for top port device) of shell or pass through base portion or substrate (use
In bottom port device).Sound can cross port, keep diaphragm mobile and generate the current potential of variation with backboard, to generate electric signal.
Microphone is deployed in various types of equipment (such as personal computer or cellular phone).Structure disclosed herein can also be used
In relevant sensor, such as pressure sensor, the non-audible frequency designed for detecting such as ultrasonic wave sensor and
The Multifunction Sensor for detection pressure, gas, the humidity or temperature of having the ability.
In top port device, port is formed by the lid or cover of microphone.Cover usually consists of metal.For port brill
Hole is expensive.It is a kind of lower-cost alternative arrangement that mechanical stamping, which is entirely covered,.Regrettably, it is rushed by the mechanical of low cost
Pressure technique is difficult to form 400 μm of voice entries below.However, the use of laser drilling or other drilling equipments being expensive.
In addition, space or volume are very valuable in microphone, because it is usually desirable that microphone is with as small as possible
Size.Unfortunately, this, which may generate internal part, does not have the microphone of sufficient space.For example, lacking enough spaces
It may cause line contact conductive shield and line may be damaged with cover short circuit or otherwise.In addition, sometimes above port
Using net, but if inner space is insufficient, this may also be led to the problem of.Due to worrying space, previous method is had to it
His mode increases microphone height (or other sizes), this is undesirable in many applications for needing small microphone.
In various embodiments described herein, molding associated with the port in microphone or embossed region are used
Domain.In one example, the region covered or covered is stamped out for MEMS top port microphone.Cover or lid can be passed through
Rest part drills out aperture.In another aspect, hole is relatively wide opening, and mesh screen is placed in opening or only from hole
Slightly extend.In another aspect, coining allows the decline of cover or lid, produces volume because being stamped between line and cover or lid
Outer interval.
In these many embodiments, microphone includes base portion and combination of MEMS wafer, and integrated circuit is arranged in base portion
On.Lid or cover are connected to base portion and combination of MEMS wafer and integrated circuit are enclosed in cavity.Lid or cover, which have, to be connected to cavity
Inner surface, and the inner surface for covering or covering has the coining portion or molding extended in lid or cover but not entirely through lid or cover
Portion.
In some instances, microphone is top port microphone, and wherein at least one opening extends through lid or cover simultaneously
It is connected to coining portion.At least one opening can be multiple openings (for example, being configured to prevent pollutant entrance) or single opening
(not preventing pollutant entrance).In other examples, microphone is bottom port device, middle port extend through base portion and with
Combination of MEMS wafer communication in cavity.
In some embodiments, mesh screen is at least partially disposed in coining portion.In some instances, mesh screen is set completely
It sets in coining portion, and in other examples, mesh screen extends coining portion.
In some embodiments, coining portion has the circular edge of connection lid or cover.In other embodiments, it imprints
Portion provides bigger one-movement-freedom-degree and space for the wire rod that integrated circuit is coupled to MEMS device.Increased space facilitates
If preventing, wire rod from touching or hitting the damage of lid wire rod or wire rod is shorted to conductive shield.
The present disclosure describes the robustness for improving microphone apparatus (such as comprising those of MEMS transducer device)
Device and technology.Particularly, device and technology described in the disclosure improve microphone package to solid particle and liquid
The resistance of entrance.In some embodiments, the disclosure can be set to improve the resistance for entering particle, and to microphone apparatus
Signal-to-noise ratio (SNR) have very little influence or do not influence.
In one or more embodiments, microphone package may include base portion, MEMS transducer and integrated circuit
(IC) it is arranged on base portion.Lid is attached to base portion, so that lid closing MEMS transducer and IC are to limit frontal volume.Lid can wrap
Top port is included, sound can enter microphone package by top port and be incident in MEMS transducer.Top port
It can be covered with the permeable filter structure of acoustics or material, but solid particle or liquid is hindered to enter microphone package.One
In a little embodiments, filtering material is net materials.Net can be set in the outside of microphone package, be more particularly set on the outer of lid
On surface.Lid may include the coining portion or inside drawing region of supporting network.In some embodiments, coining portion or inwardly drawing
The thickness substantially the same depth that region can have with net is pulled out, so that the surface of net and the surface of lid are substantially flush.Some
In embodiment, the depth in coining portion or inside drawing region can be greater than the thickness of net.
Fig. 1 is the perspective view according to the top port microphone with molded areas of an illustrated embodiment.Fig. 2
It is the sectional view according to the top port microphone of Fig. 1 of an illustrated embodiment.At the top of MEMS (MEMS)
One example of port microphone 100 has the molding being located in lid (or shell) or coining thickness, forms molding or coining
Volume.MEMS microphone 100 includes base portion 102, combination of MEMS wafer 104 (including diaphragm and backboard), lid 106 and integrated circuit 108,
And the wire rod 110 including connecting integrated circuit 108 and combination of MEMS wafer 104.Molding or coining volume 120 extend to the bottom of lid 106
In surface 122.Multiple openings 126 extend through the rest part of the thickness of lid, to allow outside 128 and the Mike of microphone
Connection between the frontal volume 130 of wind 100.
Lid 106 in Fig. 1 and embodiment shown in Fig. 2 is the integrated metal cup or tank for being connected to base portion 102.So
And, it should be understood that lid 106 is also possible to be connected to the flat cover of wall, and the wall is connected to base portion 102.In one example, base
Portion 102 can be printed circuit board.In alternative embodiment, any suitable arrangement can be used.
Molding or coining volume 120 can be formed by imprinting the punching course of lid 106.Volume 120 not exclusively extends through
Cross lid 106.
In operation diagram 1 and an example of the microphone of Fig. 2, sound can pass through multiple openings 126 and (in one example may be used
To be laser drill), coining volume 120, frontal volume 130 are then passed through, combination of MEMS wafer 104 is reached.Sound can make combination of MEMS wafer
104 diaphragm is mobile, and the potential of variation is generated with the backboard of combination of MEMS wafer 104, to generate electric signal.Electric signal is sent
To integrated circuit 108.Integrated circuit 108 (can be specific integrated circuit (ASIC) in some instances) can be further processed letter
Number (for example, removal signal noise, convert analog signals into digital signal etc.).Processed signal can be via base portion 102
The pad being sent on base portion 102, may be coupled to consumer electronics device.
In some embodiments, being molded or imprint volume 120 is that microphone 100 is provided into protection.For example, opening
126 prevent particle or other kinds of pollutant to be moved to the inside of microphone 100 from the outside of microphone 100.That is,
Opening 126, which can permit sound, can pass through opening 126, but most of particles or other pollutants is not allowed to enter frontal volume 130.
Coining volume 120 is formed by coining lid 106, provides greater room on interior front volume 130 for line
Material 110 is mobile.The section that is molded of metal shell or lid 106 allows greater room mobile for wire rod.In addition reduce metal shell
Thickness to reduce manufacturing cost because this method reduce pass through metal can 106 whole thickness be open 126 drill systems
Cause this.
Fig. 3 is the perspective view for the top port microphone for having molded areas and sieve according to an illustrated embodiment.
Fig. 4 is the sectional view according to the top port microphone of Fig. 3 of an illustrated embodiment.Fig. 3 and Fig. 4 are instantiated several
The method using thicker net is adapted in the case where not being with or without intrusion metal can cavity (frontal volume).This method provides
The less stacking of greater room and chip assembly.
Fig. 3 and embodiment shown in Fig. 4 include to cover in (or shell) to have at the top of the MEMS for being molded or imprinting thickness
Port microphone 300 forms molding or coining volume in lid.MEMS microphone 300 includes base portion 302, combination of MEMS wafer 304
(including diaphragm and backboard), lid 306 and integrated circuit 308, and the wire rod including connecting integrated circuit 308 and combination of MEMS wafer 304
310.Molding or coining volume 320 extend in the bottom surface 322 of lid 306.Single opening 326 extends through its of the thickness of lid
Remaining part point, to allow the connection between the outside 328 of microphone and the frontal volume 330 of microphone 300.Net 329 is across mould
Pressure or coining volume 130 extend.In one example, net 329 is flushed with surface 322.In another example, net 329 slightly prolongs
Extend over surface 322.Net 329 can be the metallic screen with small opening or porous septum, and sound is allowed to lead to the outer of microphone 300
Portion is to mistake between the inside of microphone 300 but prevents pollutant (for example, solid, liquid or gas) from passing through.
In Fig. 4 embodiment illustrated, lid 306 is the integrated metal cup or tank for being connected to base portion 302.In alternative reality
It applies in mode, lid 306 can be the flat cover for being connected to wall, and the wall is connected to base portion 302.In illustrated embodiment,
Base portion 302 is printed circuit board.In illustrated embodiment, molding or coining volume 320 pass through the punching press for imprinting lid 306
Journey is formed.Volume 320 does not extend completely through lid 306.
In operation diagram 3 and an example of the microphone of Fig. 4, sound can travel across opening 326 and (in one example may be used
It is drilled), coining volume 320, net 329, frontal volume 330 are then passed through, and reach combination of MEMS wafer 304.Sound can make MEMS brilliant
The diaphragm of piece 304 is mobile, and the potential of variation is generated with the backboard of combination of MEMS wafer 304, to generate electric signal.Electric signal is sent out
It is sent to integrated circuit 308.Integrated circuit 308 (can be ASIC in some instances) can be further processed signal (for example, removal
The noise of signal enhances signal, etc.).Processed signal can be sent to the pad on base portion 302 via base portion 302, can be with
It is coupled or connected to consumer electronics device.
Fig. 5 is the top port microphone on the top surface of cover according to an illustrated embodiment with molded areas
Sectional view.Top port microphone 500 has the molding volume on the outside of lid.MEMS microphone 500 includes base
Portion 502, combination of MEMS wafer 504 (including diaphragm and backboard), lid 506, integrated circuit 508 and connection integrated circuit 508 and MEMS
The wire rod 510 of chip 504.Molding or coining volume 520 extend in the top surface 522 of lid 506.Embodiment party shown in Fig. 5
In formula, multiple openings 526 extend through the rest part of the thickness of lid, to allow outside 528 and the microphone 500 of microphone
Frontal volume 530 between connection.In alternative embodiment, it is similar to Fig. 3 and embodiment shown in Fig. 4, can be used
Sieve.
In embodiment shown in Fig. 5, lid 506 is the integrated metal cup or tank for being connected to base portion 502.In alternative reality
It applies in mode, lid 506 can be the flat cover for being connected to wall, and the wall is connected to base portion 502.Base portion 502 can be printing electricity
Road plate.In illustrated embodiment, molding or coining volume 520 can be formed by imprinting the punching course of lid 506.Volume
520 do not extend completely through lid 506.
In an example of the microphone of operation diagram 5, sound can pass through the frontal volume 520 of coining, multiple openings 526
(can be laser drill in one example), frontal volume 530, and reach combination of MEMS wafer 504.Sound can make combination of MEMS wafer 504
Diaphragm it is mobile, and the potential of variation is generated with the backboard of combination of MEMS wafer 504, to generate electric signal.Electric signal is sent to
Integrated circuit 508.Integrated circuit 508 (can be ASIC in some instances) can be further processed signal (for example, removal signal
Noise).Processed signal can be sent to the pad on base portion 502 via base portion 502, can be coupled to client's electronics and set
It is standby.
Fig. 6 is the close-up side view of the molded areas according to an illustrated embodiment when being constructed by punching press.Lid
Or cover 602 includes being molded or imprinting volume 604, molding or coining volume 604 are generated using punching course, wherein stamping tool quilt
In indentation lid or cover 602.The material of contracting cover is forced to generate coining volume 604.Curved lip 606, which surrounds and limits coining, to be held
Product 604.Hole 608 may pass through lid or cover 602 (for example, for top port device) or can omit (for example, for bottom port
Device).
Fig. 7 is the close-up side view of the molded areas according to an illustrated embodiment in drilling.702 packet of lid or cover
Molding or coining volume 704 are included, generates molding or coining volume 704 using the drill bit pierced in lid or cover 702.Lip 706 encloses
Around and limit coining volume 704, and lip 706 with lid or cover 702 surface it is vertical or substantially vertical.Hole 708 may pass through cover
702 (for example, being directed to top port device) can omit (for example, for bottom port device).
Fig. 8 is the sectional view according to the bottom port microphone of an illustrated embodiment.MEMS
(MEMS) bottom port microphone 800 has the molding being located in lid (or shell) or coining thickness.MEMS microphone 800 includes
Base portion 802, combination of MEMS wafer 804 (including diaphragm and backboard), lid 806, integrated circuit 808 and connection 808 and of integrated circuit
The wire rod 810 of combination of MEMS wafer 804.Molding or coining volume 820 extend in the bottom surface 822 of lid 806.Port 826 extends through
Cross base portion 802.Frontal volume 830 is connected to bottom port.Rear volume 832 is connected to coining volume 820.
In embodiment shown in Fig. 8, lid 806 is the integrated metal cup or tank for being connected to base portion 802.In alternative reality
It applies in mode, lid 806 can be the flat cover for being connected to wall, and the wall is connected to base portion 802.Base portion 802 can be printing electricity
Road plate.Molding or coining volume 820 can be formed by the punching course for imprinting lid 806.Volume 820 does not extend completely through
Lid 806.
In an example of the microphone of operation diagram 8, sound can pass through the port in base portion 802 and reach combination of MEMS wafer
Frontal volume 830 in 804.Sound can make the diaphragm of combination of MEMS wafer 804 mobile, and generate change with the backboard of combination of MEMS wafer 804
The potential of change, to generate the electric signal for being sent to integrated circuit 808.Integrated circuit 808 (can be ASIC) in some instances
Signal can be further processed.Processed signal can be sent to the pad on base portion 802 via base portion 802, can be coupled to visitor
Family electronic equipment.
Advantageously, greater room is provided so that wire rod 810 is mobile for rear volume 832.In other words, metal shell or
The section that is molded or imprints of lid 806 provides greater room for wire rod movement.Hold in addition, coining volume 820 provides larger rear portion
Product 832, this performance (for example, sensitivity) that can produce microphone 800 improve.In some embodiments, coining volume 820 can
To allow the height of microphone 800 smaller (for example, the distance between surface 822 and base portion 802), because wire rod 810 can prolong
It reaches in coining volume 820.
Fig. 9 is the sectional view according to the top port microphone of an illustrated embodiment.Implementation shown in Fig. 9
In mode, sound can travel across the port in cover 806 and pass through frontal volume 830.Sound can cause the diaphragm of combination of MEMS wafer 804 to move
It is dynamic.Combination of MEMS wafer 804 surrounds rear volume 832.The embodiment of Fig. 8 and Fig. 9 shows coining portion (such as coining portion 820) can
To be used in any suitable microphone (or other suitable devices).In illustrated embodiment, coining portion 820 can be
Wire rod 810 provides space or leeway (for example, to increase mobile space without short-circuit with cover 806).For example, shown in Fig. 1 to Fig. 5
Embodiment may include one or more coining portions, such as coining portion 820.Additional coining portion can permit in microphone
Wire rod move freely everywhere without damage microphone function.In illustrated embodiment, coining portion can be used for permitting
Perhaps wire rod is mobile and is used as sound port.
Figure 10 shows the molding area according to an illustrated embodiment on the top surface that filtering material is located in cover
The cross-sectional view of top port sensor 1000 in domain.Top port sensor 1000 includes having first surface (" front surface ")
1016 and second surface (" rear surface ") 1014 substrate or base portion 1002.Combination of MEMS wafer 1004 and IC 1008 are located in base portion
In 1002 front surface 1016.Combination of MEMS wafer 1004 is connected to IC 1008, and second group of wire rod by first group of wire rod 1010
IC 1008 is connected to base portion 1002 by 1026.Optionally, in some embodiments, encapsulating material 1012 at least partly covers
Cover IC 1008 and second group of wire rod 1026.In some embodiments, 1008 He of IC can be completely covered in encapsulating material 1012
Second group of wire rod 1026.Encapsulating material 1012 may include insulating materials, such as (epoxy resin).Encapsulating material 1012 can subtract
The interference for the electric signal that few IC and/or the electromagnetic signal and combination of MEMS wafer for combining wire rod to generate generate.In some embodiments,
Sensor 1000 may be used as microphone, and wherein sensor 1000 generates the electric signal for corresponding to incident voice signal.Some
In embodiment, sensor 1000 is also used as pressure sensor, and wherein sensor 1000 is generated in response to pressure change
Electric signal.In some embodiments, sensor 1000 is also used as acoustic sensor, and wherein sensor 1000 generates response
In the electric signal of the incident sound energy of any level.
In some embodiments, at least part of IC 1008 can be embedded into base portion 1002.For example, base portion
Front surface 1016 may include cavity, and IC 1008 can be set in cavity.In some embodiments, cavity can be with
Height than IC 1008 is deep, so that the top surface of IC 1008 is lower than the plane of front surface 1016.In some other embodiments
In, the depth of cavity can make the top surface of IC 1008 higher than the plane of front surface 1016.
Lid 1006 is arranged in the front surface 1016 of base portion 1002 and covers 1004, first groups of wire rods of combination of MEMS wafer
1010,1008, second groups of wire rods 1026 of IC and encapsulating material 1012.Lid 1006 limit be located at outer surface 1024 on molding or
Imprinting area 1020.Imprinting area 1020 includes with the offset of the outer surface 1024 of lid 1006 or in the stamping surface of ladder relationship
1038.Imprinting area 1020 can have thickness T2, thickness T2Less than the thickness T of lid 10061.Imprinting area 1020 limits opening
1040, opening 1040 extends between stamping surface 1038 and the inner surface 1022 of lid 1006.Being open 1040 permission sound can be from biography
The outside of sensor 1000 enters the frontal volume 1030 of sensor 1000 and is incident on combination of MEMS wafer 1004.In some embodiment party
In case, the thickness T of imprinting area 10202It can be the thickness T of lid 10061About 10% or more.In some other embodiments
In, the thickness T of imprinting area2It can be the thickness T of lid 10061About 50% to about 70%.In some embodiments, lid
Thickness T1It can be about 75 microns to about 125 microns.In some embodiments, opening 1040 can have about 350 microns extremely
At least one size of about 650 microns of sizes.For example, the size may include the diameter of opening 1040 (for example, when opening 1040
When for circle), the diagonal line of opening or side length (for example, when opening be rectangle or polygon) or be open 1040 in stamping surface
1038 or inner surface 1022 plane interior longitudinal axis.
Filtering material (for example, net 1034) can be set on the opening 1040 in the stamping surface 1038 of lid 1006.
It is permeable that net 1034 can be acoustics.That is, net 1034 can permit sound can be via opening 1040 from sensor 1000
Outside enter frontal volume 1030 and be incident on combination of MEMS wafer 1004.The acoustics permeability of net 1034 can be higher, makes
The presence for obtaining net 1034 has no substantial effect on the SNR of sensor 1000.In some embodiments, it can choose the sound of net 1034
Permeability is learned, so that pact of the SNR of sensor 1000 and net 1034 not less than the SNR of the sensor 1000 of no net 1034
90%.Net 1034 may include the porous material for allowing sound to pass through but preventing pollutant from entering or invading via opening 1040.
Pollutant may include solid particle and liquid.In some embodiments, net 1034 may include the gold with small opening
Belong to sieve.In some embodiments, net 1034, which may be configured to provide, enters protection, and degree equals or exceeds International Power
The requirement of the committee (IEC) IP67 grade.
In some embodiments, net 1034 can be interweaved by netting, network or material and be formed, and may include but not
It is limited to metal, polymer, composite material or combinations thereof.In some embodiments, net 1034 may include that range can be between
The opening of about 1 micron Dao about 4 microns size.In some embodiments, be used to form net 1034 material can have it is hydrophobic
Property, to prevent liquid from entering via opening 1040.For example, net 1034 may include the Teflon or class of hydrophobic property matter
Teflon material.In some embodiments, it substitutes net 1034 or in addition to net 1034, can use porous septum, interval
Film can have the hole for being similar to the size discussed above for net 1034.In addition, diaphragm can be by being similar to above for net
1034 materials discussed are made.
In some embodiments, net 1034 can be removably arranged on opening 1040.For example, net 1034 can be with
Be bound to stamping surface 1038 with adhesive so that adhesive opening 1040 on by net 1034 keep in place, it is also possible to
The net 1034 when applying enough power is allowed to be pulled out and removed on opening 1040.In some embodiments, asphalt mixtures modified by epoxy resin
Rouge can be used for net 1034 being bound to stamping surface 1038.In some other embodiments, chip attachment can be used for
Net 1034 is bound to stamping surface 1038, so as to remove net 1034.The clamping and placing system of colligator can be used in net 1034
It is placed on lid 1006.Before net 1034 is placed on lid 1006, can apply adhesive to lid 1006, net 1034 or
In 1034 the two of lid 1006 and net.Net 1034, which can be, can remove and can replace, so that be once removed, net 1034
It is replaced with another net or filtering material.
In some embodiments, the depth of imprinting area 1020 can be greater than the thickness of net 1034.Specifically, region
Depth can be by the thickness T of lid 10061With the thickness T of imprinting area 10202Difference limit.Make the depth of imprinting area 1020
Thickness greater than net 1034 allows net 1034 to be fully located in imprinting area 1020, thus by reducing net 1034 and sensor
The risk contacted between other surfaces near 1000 carrys out catch net 1034.Alternatively, the depth of imprinting area 1020 can be small
In the thickness of net 1034.
Figure 11 shows the top view of sensor 1000 shown in Fig. 10.Figure 11 shows the molding being formed in lid 1006
Or the boundary of imprinting area 1020.Imprinting area 1020 is surrounded by the outer surface 1024 of lid 1006.Net 1034 is in outer surface 1024
Plane in size can be less than imprinting area 1020 correspondingly-sized.The shape of substantially rectangular net 1034 can be similar to
The shape of imprinting area 1020.Alternatively, the shape of net 1034 can be different from the shape of imprinting area 1020.For example, net
1034 shape can be round or oval, and the shape of imprinting area 1020 can be rectangle.The shape of net 1034 can be with
For any shape, such as round, oval regular or irregular polygonal shape.Opening 1040 positioned at 1034 lower section of net
It is shown in phantom.
Figure 12 shows the example that can be used in sensor 1000 shown in Fig. 10 according to an illustrated embodiment
The cross-sectional view of lid 1206.Particularly, lid 1206 can be used, substitute lid 1006 shown in Fig. 10.Lid 1206 includes outer surface
1224 and inner surface 1222.Although being not shown in Figure 12, lid 1206 can be positioned at front surface (such as Figure 10 institute of base portion
The front surface 1016 shown) on to close the component of sensor.Lid 1206 further includes inside drawing region 1220, inside drawing region
1220 form the recessed portion in lid 1206.Inside drawing region 1220 includes drawing area surfaces 1256, drawing region appearance
Face 1256 is located at from the inside plane of the plane of outer surface 1224.Outer side wall surface 1254 is in drawing area surfaces 1256
Extend between periphery and the periphery of outer surface 1224.Inside drawing region 1220 further includes drawing region inner surface 1258, drawing
Region inner surface 1258 be located at in the different plane of inner surface 1222.The table in drawing region of interior side-wall surface 1252
Extend between the periphery in face 1258 and the periphery of inner surface 1222.Outer side wall surface 1254 and interior side-wall surface 1252 can be greatly
Cause plane.Alternatively, outer side wall surface 1254 and interior side-wall surface 1252 can have curved shape.
Inside drawing region 1220, which is limited between drawing area surfaces 1256 and drawing region inner surface 1258, to be extended
Opening 1240.Opening 1240 can provide Single port, so that sound can enter the frontal volume of sensor from the outside of sensor
And it is incident on combination of MEMS wafer.Drawing area surfaces 1256 can support filtering material (for example, net 1234).Net 1234 can be with
Similar to the net 1034 above for Figure 10 discussion.Net 1234 can resist solid particle and liquid and enter via opening 1240.
The inside drawing region 1220 such as measured between drawing area surfaces 1256 and drawing region inner surface 1258
Thickness T4It is substantially equal to such as the rest part of the lid 1206 measured between outer surface 1224 and inner surface 1222
Thickness T3.In some embodiments, thickness T4Thickness T can be less than3.In other embodiments, thickness T4Thickness can be greater than
Spend T3.In some embodiments, thickness T3It can be about 75 microns to about 125 microns, or be about 100 microns.In some realities
It applies in scheme, thickness T4It can be about 75 microns to about 125 microns, or be about 100 microns.The depth in inside drawing region 1220
Spend D1It can be limited by the distance between the plane of outer surface 1224 and plane of drawing area surfaces 1256.In some implementations
In scheme, depth D1It is substantially equal to the thickness of net 1234, leads to the surface of net 1234 and the plane base of outer surface 1224
This is coplanar.That is, the surface of net 1234 can be flushed with outer surface 1224.In some other embodiments, depth D1
The thickness of net 1234 can be greater than.It can permit net 1234 in this way to be disposed entirely in inside drawing region 1220, reduce net
1234 scratch or the risk of other damages.In other embodiments, depth D1The thickness of net 1234 can be less than.Some
In embodiment, depth D1It can be about 75 microns to about 125 microns, perhaps about 40 microns to about 80 microns or be about 60
Micron.Figure 13 shows another example that can be used in sensor 1000 shown in Fig. 10 according to an illustrated embodiment
The cross-sectional view of lid 1306.Lid 1306 (being similar to lid 1206 shown in Figure 12) further includes inside drawing region 1320, inside drawing
Region 1320 forms the recessed portion in lid 1306.To a certain extent, some spies in inside drawing region 1320 shown in Figure 13
Sign is similar to some features in inside drawing region 1220 shown in Fig. 2, and such feature is indicated with common appended drawing reference.To
Interior drawing region 1320 further includes imprinting area 1360.Imprinting area is similar to imprinting area 1020 shown in Fig. 10.However, not
It is same as imprinting area 1020 (offset of the outer surface 1024 of stamping surface 1038 and lid 1006 or being in ladder relationship) shown in Fig. 10,
The stamping surface 1338 and drawing area surfaces 1256 of imprinting area 1360 deviate or are in ladder relationship.Opening 1240 is in drawing
Extend between region inner surface 1258 and stamping surface 1338.Although Figure 13 is not shown, stamping surface 1338 can support filtering
Material (for example, net).Net can be similar to net 1234 shown in Figure 12.In some embodiments, filtering material (such as net
1234) it can be placed on drawing area surfaces 1256, without being located in stamping surface 1338.That is, net
1234 lower surface can be bound to drawing area surfaces 1256, without contacting with stamping surface 1258.It is similarly to Figure 12
Shown situation (wherein net 1234 is incorporated in drawing area surfaces 1256), but cause the more large area of net 1234 sudden and violent
Dew.The more large area exposure of net 1234 is set to can reduce the acoustic impedance of net 1234.
Imprinting area 1360 can have between plane and drawing region inner surface 1258 by stamping surface 1338 away from
Thickness T from restriction5.In some embodiments, thickness T5Thickness T can be less than4With thickness T3.For example, thickness T5Can be
Thickness T4About 50% Dao about 70%, or be about 60%.Inside drawing region 1320 can have by the flat of outer surface 1224
The depth D that the distance between plane of face and stamping surface 1338 limits2.In some embodiments, depth D2It can be substantially
Equal to the thickness of net, so that the outer surface of net is coplanar with outer surface 1224 or flushes.In some other embodiments, depth D2
The thickness of net can be greater than, so that net is arranged in inside drawing region 1320.In other embodiments, depth D2It can be small
In the thickness of net.It can permit depth D including imprinting area 13602Greater than depth D1(as shown in figure 12), without increasing as interior
The total depth in the inside drawing region 1320 measured between the plane on surface 1222 and the plane of drawing region inner surface 1258.By
There are a certain amount of gap, inside drawing region 1320 between desired drawing region inner surface 1258 and the internal part of sensor
Total depth increase and may must be compensated by increasing the height of lid 1306, this again may cause size increase of sensor.
By the inclusion of imprinting area 1360, height of the additional depth without increasing lid 1306 can be provided in the outer surface in drawing region
Degree.In some embodiments, depth D2It can be about 100 microns to about 200 microns, or be about 150 microns.
Figure 14 show in the molded areas according to an illustrated embodiment on the top surface that net is located in cover and
The cross-sectional view of top port sensor 1400 in the case where including cavity in base portion.In many aspects, sensor 1400 is similar
In sensor 1000 shown in Fig. 10.In this regard, sensor 1400 and sensor shown in Fig. 10 1,000 2 shown in Figure 14
The common trait of person is presented with like reference characters.With base portion 1002 shown in Fig. 10 on the contrary, sensor shown in Figure 14
1400 base portion 1402 includes cavity 1460, and cavity 1460 is limited to the base portion 1402 between front surface 1016 and rear surface 1014
It is interior.Base portion 1402 further defines the cavities open 1464 between cavity 1460 and front surface 1016.Cavities open 1464 is located in
Under combination of MEMS wafer 1004, so that combination of MEMS wafer 1004 and cavity 1460 are in fluid communication.Cavity 1460,1464 and of cavities open
The rear volume 1462 of the sum of volume of combination of MEMS wafer 1004 restriction sensor 1400.The size of rear volume 1462 may influence
The frequency response characteristic of sensor 1400.For this purpose, can choose the size of cavity 1460 to realize desired frequency response characteristic.
The height H of lid 1006c(be measured as between the outer surface 1024 of lid 1006 and the front surface 1016 of base portion 1402 away from
From) the height H of base portion 1402 can be less thanb(be measured as between the rear surface 1014 of base portion 1402 and front surface 1016 away from
From).In some embodiments, the height H of lid 1006c500 microns, and the height H of base portion can be at least aboutbCan be
At least about 250 microns.In some embodiments, the combined altitudes (H of lid 1006 and base portion 1402c+Hb) it can be about 0.75mm
It to about 2.25mm or is about 1.5mm.In some embodiments, lid 1006 shown in Figure 14 can with above for Figure 12 and
The replacement of any of lid 1206 and 1306 of Figure 13 discussion.
Theme described herein illustrates the difference for being included in different other components or connecting from different other components sometimes
Component.It is to be understood that the framework described in this way is only exemplary, and can actually implement to realize identical function
Many other frameworks.On conceptual sense, realize that any part arrangement of identical function all effectively " is associated with ", to realize
Desired function.Therefore, it is herein combined to realize that any two component of specific function can be viewed as being " associated with " each other,
To realizing desired function, but regardless of framework or intermediate member how.Similarly, so associated any two component can also
To be considered as " being operably connected " each other or " be operatively coupled/couple " is to realize desired function, and can be such
Associated any two component can also be considered as " capable of being operatively coupled/coupling " each other to realize desired function.Energy can
The specific example for being operatively coupled/coupling include but is not limited to can physically match and/or the component that physically interacts and/
Or can wireless interaction and/or wireless interaction component and/or the component that interacts and/or can interact in logic in logic.
About the use of substantially any plural number and/or singular references herein, those skilled in the art can be according to upper
Hereafter and/or application is odd number from complex conversion and/or is converted to plural number from odd number.It for clarity, herein can be clearly
Illustrate various singular/plural arrangements.
It will be understood by those skilled in the art that in general, terms used herein especially appended claims are (for example, appended
The main body of claim) open to the outside world term is generally intended as (for example, term " including (including) " should be interpreted " packet
Include but be not limited to ", term " having " should be interpreted " at least having ", term " including (includes) " should be interpreted that " including
But it is not limited to ", etc.).
It will be further understood by those skilled in the art that if being intended to state the claim of certain amount of reference,
Such intention will be clearly stated in claim, and in the case where not such statement, such meaning is not present
Figure.For example, in order to help to understand, claims appended below may include introductory phrase "at least one" and " one or more
It is a " use with introduce claims state.However, the use of these phrases is not necessarily to be construed as implying by indefinite article " one "
Or the reference of "one" citation claim limits any specific rights requirement of the claims state comprising this reference
In only include one as statement invention, even if identical claim include introduction phrase " one or more " or
"at least one", and such as "a" or "an" indefinite article (for example, " one " and/or "one" should usually be interpreted
Mean "at least one" or " one or more ")；It is also such for using the definite article for quoting claims state.
In addition, even if clearly set forth the claims state of certain amount of reference, it will also be recognized that this
Kind of statement should be typically interpreted as at least meaning stated number (for example, the detailed statement of " two statements ", without other
Modifier generally means that at least two statements or two or more statements).
In addition, in the case of being similar to the convention of " at least one of A, B and C etc. ", it is however generally that, it is such
Construction be intended to it will be appreciated by those skilled in the art that in the sense that the convention (for example, " what it is at least one of A, B and C is
System " will include but is not limited to following system: A is used alone, B is used alone, C is used alone, A is used together with B, and A and C are together
It uses, B is used together with C and/or A, B are used together with C, etc.).Similar to " at least one of A, B or C etc. "
In the case of convention, it is however generally that, such construction is intended to it will be appreciated by those skilled in the art that in the sense that the convention
(for example, " system at least one of A, B or C " will include but is not limited to following system: A is used alone, is used alone
C is used alone in B, and A is used together with B, and A is used together with C, and B is used together with C and/or A, B are used together with C, etc.).
It will be further understood by those skilled in the art that any word and/or short of extracting of two or more alternative terms is actually presented
Language all should be understood that considering includes one of these terms, any either in specification, claims or attached drawing
A possibility that one term or two terms.For example, phrase " A or B " will be understood to comprise " A " or " B " or " A and B " can
It can property.In addition, unless otherwise stated, meaning to add deduct hundred using word " approximation ", " about ", " about ", " substantially " etc.
/ ten.
The foregoing description of illustrated embodiment has been presented for the purpose of illustration and description.It is not intended to exhaustion
Or the precise forms that limitation is disclosed, and can modify and change according to the above instruction, or can be from disclosed reality
It applies and obtains modifications and variations in the practice of mode.The scope of the present invention is intended to be defined by the appended claims and the equivalents thereof.
Cross reference to related applications
The application is the U.S. Patent application No.15/154 submitted on May 13rd, 2016, and 545 part continuation application should
The U.S. Provisional Application No.62/161 that application requires on May 14th, 2015 to submit, 512 equity and priority, above-mentioned application
Theme is totally integrating herein by reference.
Claims (32)
1. a kind of sensor, the sensor include:
Base portion, the base portion have first surface and opposed second surface；
MEMS, that is, combination of MEMS wafer, the combination of MEMS wafer are mounted to the first surface of the base portion；
Integrated circuit, the integrated circuit setting is on the base portion；
Lid, the lid are arranged on the first surface of the base portion to cover MEMS transducer and the integrated circuit,
The lid has outer surface and inner surface, and the outer surface of the lid limits the imprinting area with stamping surface, the lid
It is limited to the top port extended between the stamping surface and the inner surface；And
Filtering material, the filtering material are arranged in the stamping surface to cover the top port, the filtering material
It is configured to prevent pollutant from entering via the top port.
2. sensor according to claim 1, wherein between the stamping surface and the inner surface of the lid away from
From the distance between the outer surface and the inner surface of the lid for being less than the lid.
3. sensor according to claim 1, wherein the depth of the imprinting area is greater than the thickness of the filtering material
Degree.
4. sensor according to claim 1, wherein the depth of the imprinting area is substantially equal to the filtering material
Thickness so that the outer surface of the filtering material and the outer surface of the lid are substantially coplanar.
5. sensor according to claim 1, wherein the filtering material includes web filter.
6. sensor according to claim 1, wherein the base portion limits the first surface that the base portion is arranged in
Cavity between the second surface and the opening being arranged under the combination of MEMS wafer, the opening in the cavity and
Extend between the first surface of the base portion.
7. sensor according to claim 1, wherein the integrated circuit is installed in first table of the base portion
On face.
8. sensor according to claim 1, wherein at least part of the integrated circuit is embedded in the base portion
In.
9. sensor according to claim 1, wherein the sensor is microphone, pressure sensor and acoustics sensor
At least one of device.
10. sensor according to claim 1, wherein the stamping surface can be removably arranged in the filtering material
On.
11. sensor according to claim 1, wherein the filtering material includes the web filter that can be replaced.
12. a kind of sensor, the sensor include:
Base portion, the base portion have first surface and opposed second surface；
MEMS, that is, combination of MEMS wafer, the combination of MEMS wafer are mounted to the first surface of the base portion；
Integrated circuit, the integrated circuit setting is on the base portion；
Lid, the lid are arranged on the first surface of the base portion to cover MEMS transducer and the integrated circuit,
The lid has outer surface and inner surface, described to cover the inside drawing region for further limiting the recessed portion to be formed in the lid,
The inside drawing region limits top port；And
Filtering material, the filtering material is arranged in the inside drawing region and the covering top port, the filtering
Material is configured to prevent pollutant from entering via the top port.
13. sensor according to claim 12, wherein the inside drawing region includes drawing area surfaces and drawing
Pull out region inner surface, wherein the top port is prolonged between the drawing area surfaces and drawing region inner surface
It stretches.
14. sensor according to claim 13, wherein the inside drawing region includes the table in the drawing region
The first side wall extended between face and the inner surface of the lid, and including in the drawing area surfaces and the lid
The second sidewall extended between the outer surface.
15. sensor according to claim 13, wherein the plane of the outer surface and the drawing area surfaces
The distance between plane is greater than the thickness of the filtering material.
16. sensor according to claim 13, wherein the plane of the outer surface and the drawing area surfaces
The distance between plane is substantially equal to the thickness of the filtering material.
17. sensor according to claim 13, wherein the drawing area surfaces limit the pressure with stamping surface
Region is printed, and wherein, the top port extends between the stamping surface and drawing region inner surface.
18. sensor according to claim 17, wherein the filtering material is arranged in the stamping surface.
19. sensor according to claim 18, wherein the stamping surface can be removably arranged in the filtering material
On.
20. sensor according to claim 18, wherein the filtering material includes the web filter that can be replaced.
21. sensor according to claim 18, wherein the outer surface of the plane of the stamping surface and the lid
The distance between plane be greater than the thickness of the filtering material.
22. sensor according to claim 18, wherein the outer surface of the plane of the stamping surface and the lid
The distance between plane be substantially equal to the thickness of the filtering material.
23. sensor according to claim 13, wherein the filtering material is arranged in the drawing area surfaces
On.
24. sensor according to claim 12, wherein the filtering material includes web filter.
25. sensor according to claim 12, wherein the integrated circuit is installed in described the first of the base portion
On surface.
26. sensor according to claim 12, wherein the integrated circuit is embedded in the base portion.
27. sensor according to claim 12, wherein the base portion limits first table that the base portion is arranged in
Cavity between face and the second surface, and the opening being arranged under the combination of MEMS wafer is limited, the opening is described
Extend between cavity and the first surface of the base portion.
28. sensor according to claim 12, wherein the sensor is that microphone, pressure sensor and acoustics pass
At least one of sensor.
29. a kind of sensor, the sensor include:
Base portion, the base portion have first surface and opposed second surface；
MEMS, that is, combination of MEMS wafer, the combination of MEMS wafer are installed to the first surface of the base portion；
Integrated circuit, the integrated circuit setting is on the base portion；
Lid, the lid are arranged on the first surface of the base portion to cover MEMS transducer and the integrated circuit, institute
Stating lid has the bottom surface for facing the base portion, and the bottom surface of the lid limits coining portion, and the lid limits the coining
Top port in portion；And
Mesh screen, the mesh screen are arranged in the coining portion and are oriented to cover the top port, and the mesh screen is constructed
At preventing particle from entering via the top port.
30. sensor according to claim 29, wherein the mesh screen is flushed with the bottom surface.
31. sensor according to claim 29, wherein the coining portion does not extend completely through the lid.
32. sensor according to claim 29, wherein the sensor is that microphone, pressure sensor and acoustics pass
At least one of sensor.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/813,103 US10291973B2 (en) | 2015-05-14 | 2017-11-14 | Sensor device with ingress protection |
| US15/813,103 | 2017-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109788416A true CN109788416A (en) | 2019-05-21 |
Family
ID=66335856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811337250.9A Pending CN109788416A (en) | 2017-11-14 | 2018-11-12 | With the microphone apparatus for entering protection |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109788416A (en) |
| DE (1) | DE102018219133A1 (en) |
Cited By (1)
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|---|---|---|---|---|
| WO2021082044A1 (en) * | 2019-10-31 | 2021-05-06 | 潍坊歌尔微电子有限公司 | Mems sensor assembly manufacturing method and sensor assembly manufactured by means of said method |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210038185A1 (en) * | 2019-08-06 | 2021-02-11 | Avent, Inc. | Apparatus, System, and Method for Detecting the Distance Between Sensors Using Ultrasound |
| CN115656341A (en) * | 2022-11-03 | 2023-01-31 | 江苏光微半导体有限公司 | Quantum sound wave sensor based on MEMS technology and array voiceprint system |
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| CN1870836A (en) * | 2005-05-26 | 2006-11-29 | 青岛歌尔电子有限公司 | Mini-packing silicon microphone |
| CN102883254A (en) * | 2012-10-30 | 2013-01-16 | 无锡芯奥微传感技术有限公司 | Silicon microphone packaging structure |
| CN102938867A (en) * | 2012-11-26 | 2013-02-20 | 山东共达电声股份有限公司 | Air pressure blowing resistant acoustical-electric transducer |
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| Publication number | Publication date |
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| DE102018219133A1 (en) | 2019-05-16 |
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Application publication date: 20190521 |
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| RJ01 | Rejection of invention patent application after publication |