CN102883254A - Silicon microphone packaging structure - Google Patents
Silicon microphone packaging structure Download PDFInfo
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- CN102883254A CN102883254A CN201210424717XA CN201210424717A CN102883254A CN 102883254 A CN102883254 A CN 102883254A CN 201210424717X A CN201210424717X A CN 201210424717XA CN 201210424717 A CN201210424717 A CN 201210424717A CN 102883254 A CN102883254 A CN 102883254A
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Abstract
The invention provides a silicon microphone packaging structure which comprises a metal shielding shell and a substrate. The metal shielding shell is welded on the substrate to form a sealed space with the substrate. The substrate is provided with a silicon acoustic chip and an application-specific integrated circuit chip which are connected each other. The silicon microphone packaging structure is characterized in that: the metal shielding shell is provided with a rectangular groove, the left side wall and the right side wall of the rectangular groove are both provided with a small hole so that sound holes are formed. The output end of the application-specific integrated circuit chip is connected with a radio-frequency interference filtering network, wherein the filtering network comprises a first capacitor, a second capacitor and a resistor, and the sensibility of the resistor is used to form a similar PI-type filter structure together with the capacitors so that high-frequency current leaked in is discharged. The silicon microphone packaging structure has the advantages that: the capacity of resisting airflow blowing and sucking of the microphone is improved, the outside sharp foreign object is prevented from damaging internal devices, the large-particle dust is prevented from entering the microphone, the circuit of the silicon microphone packaging structure is design to have strong electromagnetic interference resisting capacity, and the reliability of the microphone is improved.
Description
Technical field
The present invention relates to the acoustical-electrical transducer field, the silicon micro-microphone encapsulating structure that specifically a kind of antijamming capability is strong.
Background technology
Along with science and technology and the evolution of trend, the mobile phone of a new generation advances towards the direction of day by day frivolous and multifunction, this so that in the mobile phone space of each assembly also relatively compressed.Increasing intelligent ultrathin machine side city has shown that ultra thin handset is luxuriant and has been agitation.Because the thickness limits of ultra thin handset, the height of mobile phone spare part has namely determined the thickness of mobile phone.One of them independent and crucial assembly namely is microphone.Some mobile phone just must cooperate microphone and change especially the moulding of casing or the design of circuit board in when design.The appearance of silicon microphone will crack this quagmire.
Silicon microphone surmounts the advantage of traditional electret microphone because having manufacture of semiconductor.Silicon microphone is by inner ASIC(dedicated IC chip) provide charge pump that electric field stable between back pole plate and the vibrating diaphragm is provided, simultaneously so that the power supply of microphone is independent, be unlikely to be subject to unstable or contain noisy power supply to disturb.In addition, silicon microphone adopts pre-utmost point formula running, therefore can be along with electret changes (the electret electric charge on the Electret Condencer Microphone back pole plate easily changes along with humidity and time, and the micro electromechanical microphone then utilizes power supply to regenerate stable electric field) when each the activation in the variation of electric charge on the back pole plate as Electret Condencer Microphone.The output signal of silicon microphone changes with the variation of power supply hardly.And because the quality of its vibrating diaphragm is extremely light, so extremely low to the susceptibility of external vibration.
The character of two uniquenesses is arranged silicon microphone so that it becomes the excellent selection of light and thin type mobile phone: minimum volume and the high temperature that can bear the reflow stove.Difference the most significant of silicon microphone and traditional electret microphone namely is volume.The back pole plate of silicon microphone and vibrating diaphragm approximately are the sizes of electret microphone 1/10th.And this only the size of first generation micro electromechanical microphone namely approximately be the minimum volume that Electret Condencer Microphone can reach.Along with reaching its maturity of micro electromechanical microphone science and technology, the micro electromechanical microphone that can not dare not or would not speak up will be the optimal selection of following mobile phone.
Another main difference is exactly the high-temperature baking that the micro electromechanical microphone can bear the reflow stove, and this characteristic is also so that many engineers directly are called the micro electromechanical microphone reflow formula microphone.In addition, the design of its packing also meets automation gets and installs standby specification, so that mobile-phone manufacturers can save appreciable cost when production and assembly.
Nowadays mobile device develops to miniaturization, the functional unit that equipment comprises is more and more, on smart mobile phone, because the space that mobile phone screen takies is increasing, the space of leaving other functional units for is greatly reduced, and it is large that the phase mutual interference between the functional unit also becomes gradually, caused the interior of mobile phone environment more and more abominable, especially antenna for mobile phone is to the interference of microphone, and this just requires microphone to have very strong interference free performance.
As shown in Figure 1, general silicon microphone metal shielding 1 sound hole all is the circular ports 2 about diameter 0.84mm at present, and this circular hole can not prevent dust, and can not prevent the damage of the foreign matter that the external world is sharp-pointed, and anti-electromagnetic interference capability is limited.Inner filter structure then is to do two to bury the appearance processing in substrate (PCB) inside substantially, and the filtering of this mode exists a lot of not enough, and anti-electromagnetic interference capability is limited.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, the silicon microphone of a kind of high reliability, strong anti-interference performance is provided.
According to technical scheme provided by the invention, the silicon microphone packaging structure of described strong anti-interference, comprise metal shielding and substrate, metal shielding is welded on the substrate and forms enclosure space with substrate, have interconnective silicon acoustics chip and dedicated IC chip on the substrate, it is characterized in that: have a rectangular recess on the described metal shielding, open respectively osculum in the left and right both sidewalls of described rectangular recess and form sound hole.
The present invention is also at the output connecting needle of the described dedicated IC chip filter network to radio frequency interference, described filter network comprises: the first electric capacity, the second electric capacity and resistance, the output pin of the first electric capacity one termination dedicated IC chip and an end of resistance, the first electric capacity other end ground connection, the resistance other end connects an end of the second electric capacity, the second electric capacity other end ground connection.
Described the first electric capacity, the second electric capacity adopt ceramic disc capacitor.
Advantage of the present invention is: this design has promoted the ability that microphone tolerance air-flow blows, inhales; can also prevent extraneous sharp-pointed foreign object damage internal components; prevent that simultaneously the bulky grain dust from entering the inner silicon acoustics of microphone internal contamination chip; and its circuit design anti-electromagnetic interference capability is strong, has improved the reliability of microphone.
Description of drawings
Fig. 1 is the silicon microphone metal shielding structural representation of prior art.
Fig. 2 is metal shielding structural representation of the present invention.
Fig. 3 is silicon microphone internal view of the present invention.
Fig. 4 is the inner filter network structural representation of the present invention.
Embodiment
The invention will be further described below in conjunction with concrete drawings and Examples.
Shown in Fig. 2,3, silicon microphone packaging structure of the present invention comprises metal shielding 1 and substrate 7, metal shielding 1 is welded on the substrate 7 and forms enclosure space with substrate 7, have interconnective silicon acoustics chip 9 and dedicated IC chip 10 on the substrate 7, have a rectangular recess 5 on the described metal shielding 1, open respectively osculum 6 in the left and right both sidewalls of described rectangular recess 5 and form sound hole.
Sound hole of the present invention adopts the little opening 4 of rectangle, namely stamps out a rectangular recess 5 at described metal shielding 1 surperficial ad-hoc location, then opens osculum 6 in the left and right sides of groove 5 both sidewalls, forms sound hole.After metal shielding 1 is welded on the substrate 7 like this, just microphone inside almost completely can be shielded with the external world, thereby reach the purpose of blocking to a certain extent outside electromagnetic interference.
Simultaneously; the bottom surface 8 of stamped recess 5 has just become inner with the extraneous buffer unit of microphone; be equivalent to be provided with one deck barrier sheet in microphone inside with the external world; this design; can protect inner silicon acoustics chip (MEMS chip) 9; make it to avoid extraneous gas shock; promoted the ability that microphone tolerance air-flow blows, inhales; can also prevent extraneous sharp-pointed foreign object damage internal components; prevent in addition that simultaneously the bulky grain dust from entering the inner silicon acoustics of microphone internal contamination chip 9, improved the reliability of microphone.
The present invention has also designed the filter network structure of silicon microphone inside, namely be that output at the inner ASIC of microphone (dedicated IC chip) 10 increases the filter network for radio frequency interference, as shown in Figure 4, this filter network is comprised of the first electric capacity 11, the second electric capacity 12 and a resistance 13, the output pin of the first electric capacity 11 1 termination ASIC 10 and an end of resistance 13, the first electric capacity 11 other end ground connection, resistance 13 other ends connect an end of the second electric capacity 12, the second electric capacity 12 other end ground connection.Electric capacity adopts ceramic disc capacitor.Utilize the perception of resistance and electric capacity to form a similar PI mode filter structure, release leaking the high-frequency current of coming in, thereby reach the purpose of anti-electromagnetic interference.
Claims (3)
1. silicon microphone packaging structure, comprise metal shielding (1) and substrate (7), metal shielding (1) is welded on substrate (7) upward and substrate (7) forms enclosure space, have interconnective silicon acoustics chip (9) and dedicated IC chip (10) on the substrate (7), it is characterized in that: have a rectangular recess (5) on the described metal shielding (1), open respectively osculum (6) in the left and right both sidewalls of described rectangular recess (5) and form sound hole.
2. silicon microphone packaging structure as claimed in claim 1, it is characterized in that, at the output connecting needle of described dedicated IC chip (10) filter network to radio frequency interference, described filter network comprises: the first electric capacity (11), the second electric capacity (12) and resistance (13), the output pin of the first electric capacity (11) one termination dedicated IC chips (10) and an end of resistance (13), the first electric capacity (11) other end ground connection, resistance (13) other end connects an end of the second electric capacity (12), the second electric capacity (12) other end ground connection.
3. silicon microphone packaging structure as claimed in claim 1 is characterized in that, described the first electric capacity (11), the second electric capacity (12) adopt ceramic disc capacitor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210424717XA CN102883254A (en) | 2012-10-30 | 2012-10-30 | Silicon microphone packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210424717XA CN102883254A (en) | 2012-10-30 | 2012-10-30 | Silicon microphone packaging structure |
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| CN102883254A true CN102883254A (en) | 2013-01-16 |
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| CN201210424717XA Pending CN102883254A (en) | 2012-10-30 | 2012-10-30 | Silicon microphone packaging structure |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104113818A (en) * | 2014-07-18 | 2014-10-22 | 瑞声声学科技(深圳)有限公司 | Silicon substrate microphone encapsulation method |
| CN107978588A (en) * | 2016-10-24 | 2018-05-01 | 日月光半导体制造股份有限公司 | Semiconductor encapsulation device and its manufacture method |
| CN109788416A (en) * | 2017-11-14 | 2019-05-21 | 美商楼氏电子有限公司 | With the microphone apparatus for entering protection |
| CN110278519A (en) * | 2019-08-01 | 2019-09-24 | 华景科技无锡有限公司 | A kind of silicon microphone |
| CN110602619A (en) * | 2019-10-29 | 2019-12-20 | 苏州敏芯微电子技术股份有限公司 | Silicon microphone packaging structure and electronic equipment |
| CN111083622A (en) * | 2019-12-27 | 2020-04-28 | 钰太芯微电子科技（上海）有限公司 | Novel prevent radio frequency interference's micro-electromechanical system microphone |
| CN113316072A (en) * | 2021-05-27 | 2021-08-27 | 武汉大学 | Piezoelectric acoustic transducer with filtering function and manufacturing method thereof |
| CN114885272A (en) * | 2022-06-14 | 2022-08-09 | 深圳市新宇腾跃电子有限公司 | Dustproof method of flexible circuit board MEMS microphone |
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| CN2812465Y (en) * | 2005-06-17 | 2006-08-30 | 瑞声声学科技(深圳)有限公司 | Microphone package structure for micro-electromechanical system |
| CN201639772U (en) * | 2009-12-31 | 2010-11-17 | 瑞声声学科技(常州)有限公司 | Microphone |
| CN201682615U (en) * | 2010-05-06 | 2010-12-22 | 歌尔声学股份有限公司 | Capacitive microphone |
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2012
- 2012-10-30 CN CN201210424717XA patent/CN102883254A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2812465Y (en) * | 2005-06-17 | 2006-08-30 | 瑞声声学科技(深圳)有限公司 | Microphone package structure for micro-electromechanical system |
| CN201639772U (en) * | 2009-12-31 | 2010-11-17 | 瑞声声学科技(常州)有限公司 | Microphone |
| CN201682615U (en) * | 2010-05-06 | 2010-12-22 | 歌尔声学股份有限公司 | Capacitive microphone |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104113818A (en) * | 2014-07-18 | 2014-10-22 | 瑞声声学科技(深圳)有限公司 | Silicon substrate microphone encapsulation method |
| CN107978588A (en) * | 2016-10-24 | 2018-05-01 | 日月光半导体制造股份有限公司 | Semiconductor encapsulation device and its manufacture method |
| CN107978588B (en) * | 2016-10-24 | 2019-09-06 | 日月光半导体制造股份有限公司 | Semiconductor encapsulation device and its manufacturing method |
| US10756025B2 (en) | 2016-10-24 | 2020-08-25 | Advanced Semiconductor Engineering, Inc. | Semiconductor package device and method of manufacturing the same |
| CN109788416A (en) * | 2017-11-14 | 2019-05-21 | 美商楼氏电子有限公司 | With the microphone apparatus for entering protection |
| CN110278519A (en) * | 2019-08-01 | 2019-09-24 | 华景科技无锡有限公司 | A kind of silicon microphone |
| CN110602619A (en) * | 2019-10-29 | 2019-12-20 | 苏州敏芯微电子技术股份有限公司 | Silicon microphone packaging structure and electronic equipment |
| CN111083622A (en) * | 2019-12-27 | 2020-04-28 | 钰太芯微电子科技（上海）有限公司 | Novel prevent radio frequency interference's micro-electromechanical system microphone |
| CN113316072A (en) * | 2021-05-27 | 2021-08-27 | 武汉大学 | Piezoelectric acoustic transducer with filtering function and manufacturing method thereof |
| CN114885272A (en) * | 2022-06-14 | 2022-08-09 | 深圳市新宇腾跃电子有限公司 | Dustproof method of flexible circuit board MEMS microphone |
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Inventor after: Wang Yunlong Inventor after: Wu Guanghua Inventor after: Liu Xinhua Inventor after: Liu Jinfeng Inventor after: Zhu Cuifang Inventor before: Wang Yunlong Inventor before: Liu Xinhua Inventor before: Liu Jinfeng Inventor before: Zhu Cuifang |
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Free format text: CORRECT: INVENTOR; FROM: WANG YUNLONG LIU XINHUA LIU JINFENG ZHU CUIFANG TO: WANG YUNLONG WU GUANGHUA LIU XINHUA LIU JINFENG ZHU CUIFANG |
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Application publication date: 20130116 |