CN106412783B - Microphone structure and mobile terminal - Google Patents
Microphone structure and mobile terminal Download PDFInfo
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- CN106412783B CN106412783B CN201611047609.XA CN201611047609A CN106412783B CN 106412783 B CN106412783 B CN 106412783B CN 201611047609 A CN201611047609 A CN 201611047609A CN 106412783 B CN106412783 B CN 106412783B
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- sound inlet
- side wall
- circuit board
- shell
- sound
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Telephone Set Structure (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Abstract
A microphone structure and a mobile terminal, the microphone structure comprising: a circuit board; the shell is provided with a side wall and a top surface, the edge of the side wall is connected with the circuit board, and a cavity is formed between the side wall and the circuit board; the sound inlet hole is positioned on the side wall of the shell; and the acoustic-electric conversion module is positioned on the surface of the circuit board in the cavity. The microphone structure can shorten the length of the sound inlet pipeline, so that the space occupied by the thickness of the rubber sleeve is reduced, and the quality of received sound is improved.
Description
Technical Field
The present invention relates to the field of electronic terminals, and in particular, to a microphone structure and a mobile terminal.
Background
Nowadays, in electronic terminal products, there are few kinds of microphones, including electret microphones and silicon microphones. The silicon microphone is superior to the electret microphone in performance and volume, but the cavity volume and the sound inlet pipeline length of each microphone occupy certain structural space in structural design.
The silicon microphone mainly comprises a top pickup and a bottom pickup, and the top pickup is designed in a mode that a cavity with a certain height is formed by sleeving silica gel on a pickup hole of the microphone body to guide sound; the design mode of bottom pickup is through the mainboard trompil through the microphone body gum cover sound inlet pipe way formation pickup.
Referring to fig. 1, it is a schematic diagram of a microphone structure of a top sound pickup design in the prior art, the microphone structure has a silicon microphone and a chip inside, a rubber sleeve 102 outside, a sound inlet pipe 103 inside the rubber sleeve 102, the sound inlet pipe 103 being connected to a sound inlet 101 and having a sound inlet hole 104. The mobile terminal is provided with a sound inlet which is butted with the sound inlet hole 104 of the microphone structure, and the sound inlet pipeline 103 is a zigzag pipeline because the circuit board 105 of the microphone structure is positioned on the plane of the circuit board of the mobile terminal, the plane of the circuit board is vertical to the plane where the sound inlet is positioned, and the sound inlet pipeline 103 needs to be communicated with the sound inlet of the mobile terminal and the sound inlet hole 101 of the microphone. Wherein, because the sound inlet pipeline is located the gum cover, need to open at the top of microphone structure and advance the sound pipeline to the thickness that needs to increase the gum cover bears the weight of sound inlet pipeline, thereby has increased the volume of microphone structure, occupies mobile terminal's space.
With the decreasing thickness of electronic terminal products and the increasing standby time, the requirement of improving the performance of mobile phones is becoming stronger by fully utilizing the structural space, and for silicon microphones, the size and thickness of the microphone rubber cover have certain requirements on the space, and other concepts of improving the performance of the microphone cannot be realized due to the limitation of the space.
Therefore, the present invention is directed to a microphone structure for saving space.
Disclosure of Invention
The technical problem to be solved by the present invention is to provide a microphone structure, which saves the structural space occupied by the microphone structure.
In order to solve the above problems, the present invention provides a microphone structure.
The microphone structure includes: a circuit board; the shell is provided with a side wall and a top surface, the edge of the side wall is connected with the circuit board, and a cavity is formed between the side wall and the circuit board; the sound inlet hole is positioned on the side wall of the shell; and the acoustic-electric conversion module is positioned on the surface of the circuit board in the cavity.
Optionally, the method further includes: and the rubber sleeve wraps the outer walls of the shell and the circuit board.
Optionally, the sound inlet pipe is located in the rubber sleeve and is communicated with the sound inlet hole.
Optionally, the cross-sectional shape of the sound inlet hole is circular, square, or rectangular.
Optionally, an angle formed by the intersection of the side wall of the sound inlet hole and the side wall of the housing is an acute angle.
The present invention also provides a mobile terminal, comprising: a microphone structure, the microphone structure comprising: the circuit board comprises a circuit board and a shell, wherein the shell is provided with a side wall and a top surface, the edge of the side wall is connected with the circuit board, a cavity and a sound inlet hole are formed between the circuit board and the shell, the sound inlet hole is positioned on the side wall of the shell, and the sound-electricity conversion module is positioned on the surface of the circuit board in the cavity; the sound inlet is formed in the shell; and the sound inlet pipeline is communicated with the sound inlet and the sound inlet hole, and the sound inlet pipeline is a straight pipeline.
Optionally, the method further includes: the rubber sleeve wraps the outer walls of the shell and the circuit board, and the sound inlet pipeline is located in the rubber sleeve.
Optionally, the cross-sectional shape of the sound inlet hole is circular, square or long-strip.
Optionally, an angle formed by the intersection of the side wall of the sound inlet hole and the side wall of the housing is an acute angle.
Optionally, a straight line formed by connecting the center point of the sound inlet and the center point of the sound inlet is parallel to the circuit board.
According to the microphone structure, the sound inlet hole is arranged on the side wall of the shell, so that the sound inlet pipeline is not required to be connected with the sound inlet hole of the mobile terminal in a zigzag manner, but is communicated with the sound inlet hole and the sound inlet hole in a linear manner.
Furthermore, the cross section of the sound inlet hole is rectangular, square or circular, and the angle formed by the intersection of the side wall of the sound inlet hole and the side wall of the shell is an acute angle, so that dust is not easy to enter the inside of the microphone, and the microphone is protected better.
According to the mobile terminal, the sound inlet hole is formed in the side wall of the shell, the sound inlet pipeline is located in the rubber sleeve, the sound inlet hole is communicated with the sound inlet on the mobile terminal, and a straight line formed by connecting the center point of the sound inlet hole and the center point of the sound inlet is parallel to the circuit board. More importantly, the bottom of the shell or the circuit board does not need to be provided with the sound inlet pipeline, and the thickness of the rubber sleeve positioned at the bottom of the shell or the circuit board is reduced, so that the volume of the microphone structure is reduced, the space occupied by the microphone structure in the mobile terminal is saved, and the space utilization of the mobile terminal has more choices.
Furthermore, the cross section of the sound inlet hole is rectangular, square or circular, and the angle formed by the intersection of the side wall of the sound inlet hole and the side wall of the shell is an acute angle, so that dust is not easy to enter the interior of the microphone structure, the microphone structure is better protected, and the performance of the mobile terminal is improved.
Drawings
FIG. 1 is a schematic view of a prior art microphone of the present invention;
FIG. 2 is a schematic diagram of a microphone according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a mobile terminal according to an embodiment of the present invention.
Detailed Description
The following describes in detail a specific embodiment of the microphone structure according to the present invention with reference to the drawings.
Fig. 2 is a schematic diagram of a microphone structure according to an embodiment of the invention.
The microphone structure includes: a circuit board 201; a housing 202, wherein the housing 202 has a side wall and a top surface, the edge of the side wall is connected with the circuit board 201, and a cavity is formed between the side wall and the circuit board 201; a sound inlet 203, wherein the sound inlet 203 is located on the side wall of the housing 202; and the acoustic-electric conversion module 204 is positioned on the surface of the circuit board 201 in the cavity, and the acoustic-electric conversion module 204 is positioned on the surface of the circuit board 201 in the cavity.
The circuit board 201 is used for connecting various components on the circuit board 201, so that the components are mutually communicated and play a role.
The side wall of the housing 202 is perpendicular to the circuit board 201, and the edge of the side wall is connected to the circuit board 201, the formed cavity is a cuboid or a cube, and the like, and the housing 202 is made of metal, and in other specific embodiments, may be made of other materials.
The sound inlet hole 203 is formed in the side wall of the case 202, and sound can enter the inside of the microphone structure from the outside through the sound inlet hole 203.
In one embodiment, the sound inlet 203 may have a circular, rectangular, square or other cross-section, and the side wall of the sound inlet intersects with the side wall of the housing 202 at an acute angle, so that dust is not easily introduced into the microphone structure. In other embodiments, the size of the cross section of the sound inlet 203 may be varied, and the area of the cross section of the sound inlet 202 gradually increases from the outermost side to the innermost side of the side wall of the housing 202 of the sound inlet 202, so that dust is not easy to enter the microphone structure through the sound inlet 203, or the intersection angle between the side wall of the sound inlet 203 and the side wall of the housing 202 is a right angle.
In the present embodiment, an angle formed by the intersection of the sidewall of the sound inlet hole 203 and the sidewall of the housing 202 is an acute angle, and the area of the cross section of the sound inlet hole 202 is gradually increased from the outermost side to the innermost side of the sidewall of the housing 202 of the sound inlet hole 203, so that even dust is not easy to enter the interior of the sound inlet hole 203, and the transmission of sound is not affected, and the manufacturing is most simple and convenient.
The sound-electricity conversion module 204 comprises a silicon microphone 207 and a chip 208 connected with the silicon microphone 207, wherein the silicon microphone 207 is used for converting sound wave signals into electric signals, and the chip 208 is used for processing and transmitting the electric signals generated by the silicon microphone 207.
In a specific embodiment, the microphone structure further includes a rubber sleeve 205, the rubber sleeve 205 wraps the circuit board 201 and the outer wall of the housing 202, and a sound inlet pipe 206 is arranged in the rubber sleeve 205 and is used for communicating the outside with the sound inlet hole 203, so that sound is transmitted from the outside to a transmission pipe inside the microphone structure.
Since the sound enters the microphone structure from the outside through the sound inlet of the mobile terminal, the sound inlet pipe 206 needs to be connected to the sound inlet and the sound inlet hole 203, because the circuit board 201 is located on the circuit board plane of the mobile terminal, the circuit board plane is perpendicular to the plane where the sound inlet is located, the sound inlet hole 203 is located on the side wall of the housing 202, the circuit board 201 is perpendicular to the plane where the sound inlet hole 203 is located, and therefore, the plane where the sound inlet hole 203 is located is parallel to the plane where the sound inlet is located, the sound inlet pipe 206 does not need to be connected to the sound inlet and the sound inlet hole 203 in a zigzag manner, but is connected to the sound inlet and the sound inlet hole 203 in a linear manner, the sound inlet pipe 206 is a straight pipe, and therefore, the length of the sound inlet pipe 206 is smaller than that of the sound inlet pipe in a zigzag manner, so that the sound transmission loss of the sound in the sound inlet pipe 206 can be reduced, noise is not generated, and the volume and the quality of sound received by the microphone structure are improved; and the part of the rubber sleeve 205 positioned at the top of the shell 202 or the bottom of the circuit board 201 does not need to be thickened to bear the sound inlet pipe 206 positioned in the rubber sleeve 205, so that the thickness of the rubber sleeve 205 positioned at the top of the shell 202 or the bottom of the circuit board 201 can be reduced, and the volume of the microphone structure is reduced.
According to the microphone structure, the sound inlet hole 203 is arranged on the side wall of the shell 202, the sound inlet pipeline 206 is not required to be connected with the sound inlet hole 203 and the sound inlet of the mobile terminal in a zigzag manner, but is communicated with the sound inlet hole 203 and the sound inlet in a linear manner, compared with the zigzag sound inlet pipeline 206, the distance of the sound inlet pipeline 206 is smaller, the loss of sound energy is reduced, the generation of noise is avoided, and the communication quality of the mobile terminal is improved.
Further, the cross section of the sound inlet 203 is rectangular, square or circular, and the angle formed by the intersection of the side wall of the sound inlet 203 and the side wall of the housing 202 is an acute angle, so that dust is not easy to enter the inside of the microphone, and the microphone is better protected.
Referring to fig. 3, the present invention further provides a mobile terminal.
The mobile terminal includes: a microphone structure, the microphone structure comprising: the acoustic-electric conversion module comprises a circuit board 201 and a shell 202, wherein the shell 202 is provided with a side wall and a top surface, the edge of the side wall is connected with the circuit board 201, a cavity and an acoustic inlet 203 are formed between the circuit board 201 and the side wall, the acoustic inlet 203 is positioned on the side wall of the shell 202 and the acoustic-electric conversion module 204, and the acoustic-electric conversion module 204 is positioned on the surface of the circuit board 201 in the cavity; a housing 301, wherein a sound inlet 302 is formed on the housing 301; and the sound inlet pipeline 206 is communicated with the sound inlet port 301 and the sound inlet hole 203, and the sound inlet pipeline 206 is a straight pipeline.
The circuit board 201 is used for connecting various components on the circuit board 201, so that the components are mutually communicated and play a role.
The side wall of the housing 202 is perpendicular to the circuit board 201, and the edge of the side wall is connected to the circuit board 201, the formed cavity is a cuboid or a cube, and the like, and the housing 202 is made of metal, and in other specific embodiments, may be made of other materials.
The sound inlet hole 203 is formed in the side wall of the case 202, and sound can enter the inside of the microphone structure from the outside through the sound inlet hole 203.
In one embodiment, the sound inlet 203 may have a circular, rectangular, square or other cross-section, and the side wall of the sound inlet intersects with the side wall of the housing 202 at an acute angle, so that dust is not easily introduced into the microphone structure. In other embodiments, the size of the cross section of the sound inlet 203 may be varied, and the area of the cross section of the sound inlet 202 gradually increases from the outermost side to the innermost side of the side wall of the housing 202 of the sound inlet 202, so that dust is not easy to enter the microphone structure through the sound inlet 203, or the intersection angle between the side wall of the sound inlet 203 and the side wall of the housing 202 is a right angle.
In the present embodiment, an angle formed by the intersection of the sidewall of the sound inlet hole 203 and the sidewall of the housing 202 is an acute angle, and the area of the cross section of the sound inlet hole 202 is gradually increased from the outermost side to the innermost side of the sidewall of the housing 202 of the sound inlet hole 203, so that even dust is not easy to enter the interior of the sound inlet hole 203, and the transmission of sound is not affected, and the manufacturing is most simple and convenient.
The sound-electricity conversion module 204 comprises a silicon microphone 207 and a chip 208, wherein the silicon microphone is used for converting sound wave signals into electronic signals, and the chip is used for processing and transmitting the electronic signals.
The housing 301 is used to protect the hardware of the mobile terminal from damage, and is made of metal, plastic, or ceramic.
The sound inlet 302 is located on the housing 301, and is used for allowing external sound to enter the mobile terminal.
In a specific embodiment, the microphone structure further includes a rubber sleeve 205, the rubber sleeve 205 covers the outer walls of the circuit board 201 and the housing 202, and a sound inlet pipe 206 is disposed in the rubber sleeve 205 and is used for connecting the sound inlet 302 and the sound inlet hole 302, and is a transmission pipe for transmitting sound from the outside to the inside of the microphone structure. When the sound inlet port 302 and the sound inlet port 203 communicate with each other, the sound inlet duct 206 communicates in a straight line, and the length of the sound inlet duct 206 is smaller than the length of a sound inlet duct in a meandering form.
In this embodiment, a straight line formed by connecting the center point of the sound inlet 302 and the center point of the sound inlet hole 203 is parallel to the circuit board 201, the straight line is perpendicular to the side wall of the housing 202 and the casing 301, the length of the sound inlet pipe 206 is the minimum distance between the sound inlet 302 and the plane of the sound inlet hole 203, the acoustic energy loss of sound transmitted in the sound inlet pipe 206 is reduced, no noise is generated, and the volume and quality of sound received by the microphone structure are improved.
More importantly, the rubber sleeve at the top of the housing 202 or the bottom of the circuit board 201 does not need to be thickened to bear the sound inlet pipe 206 in the rubber sleeve 205, so that the thickness of the rubber sleeve 205 at the top of the housing 202 or the bottom of the circuit board 201 can be reduced, the volume of the microphone structure is greatly reduced, the structural space can be more effectively utilized by the mobile terminal, the mobile terminal is lighter and thinner, and the communication quality of the mobile terminal is improved.
In other embodiments, based on the fact that the sound inlet pipe 206 is a straight pipe, the sizes of the sound inlet 203 and the sound inlet 302 may be different, and the relative positions of the sound inlet 203 and the sound inlet 302 may be in other states, such as the sound inlet 203 being located above or below the sound inlet 302, and the like, according to the specific form of the mobile terminal.
In the mobile terminal of the invention, the sound inlet 203 is positioned on the side wall of the shell 202, the sound inlet pipe 206 is positioned in the rubber sleeve 205, so that the sound inlet 203 is communicated with the sound inlet 302 on the mobile terminal, a straight line formed by connecting the center point of the sound inlet hole 203 and the center point of the sound inlet 302 is parallel to the circuit board 201, therefore, the sound inlet pipe 206 is a straight pipe, and compared with the sound inlet pipe 206 in a zigzag form, the distance of the sound inlet pipeline 206 is small, so that the loss of sound energy is reduced, the generation of noise is avoided, the communication quality of the mobile terminal is improved, and more importantly, since the bottom of the housing 202 or the circuit board 201 does not need to open the sound inlet pipe 206, the thickness of the rubber sleeve 205 at the bottom of the housing 202 or the circuit board 201 is reduced, the volume of the microphone structure is reduced, the space occupied by the microphone structure in the mobile terminal is saved, and the space utilization of the mobile terminal has more choices.
Furthermore, the cross section of the sound inlet 203 is rectangular, square or circular, and an angle formed by the intersection of the side wall of the sound inlet 203 and the side wall of the housing 202 is an acute angle, so that dust is not easy to enter the inside of the microphone structure, the microphone structure is better protected, and the performance of the mobile terminal is improved.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (6)
1. A microphone structure, comprising:
a circuit board;
the shell is provided with a side wall and a top surface, the edge of the side wall is connected with the circuit board, and a cavity is formed between the side wall and the circuit board;
the sound inlet hole is positioned on the side wall of the shell;
and the acoustic-electric conversion module is positioned on the surface of the circuit board in the cavity.
The rubber sleeve wraps the outer walls of the shell and the circuit board;
the sound inlet pipeline is positioned in the rubber sleeve and communicated with the sound inlet hole, and the sound inlet pipeline is a straight pipeline;
the angle formed by the intersection of the side wall of the sound inlet hole and the side wall of the shell is an acute angle, and in the cross section of the sound inlet hole, the area of the cross section of the sound inlet hole is gradually increased from the outermost side to the innermost side of the sound inlet hole on the side wall of the shell.
2. The microphone structure as defined by claim 1 wherein the cross-sectional shape of the sound inlet hole is circular, square, or rectangular.
3. A mobile terminal, comprising:
a microphone structure, the microphone structure comprising: the circuit board comprises a circuit board and a shell, wherein the shell is provided with a side wall and a top surface, the edge of the side wall is connected with the circuit board, a cavity and a sound inlet hole are formed between the circuit board and the shell, the sound inlet hole is positioned on the side wall of the shell, and the sound-electricity conversion module is positioned on the surface of the circuit board in the cavity; the angle formed by the intersection of the side wall of the sound inlet hole and the side wall of the shell is an acute angle; in the cross section of the sound inlet, the area of the cross section of the sound inlet is gradually increased from the outermost side to the innermost side of the sound inlet on the side wall of the shell.
The sound inlet is formed in the shell, and the plane where the sound inlet hole is located is parallel to the plane where the sound inlet hole is located;
and the sound inlet pipeline is communicated with the sound inlet and the sound inlet hole, and the sound inlet pipeline is a straight pipeline.
4. The mobile terminal of claim 3, further comprising: the rubber sleeve wraps the outer walls of the shell and the circuit board, and the sound inlet pipeline is located in the rubber sleeve.
5. The mobile terminal of claim 3, wherein the cross-sectional shape of the sound inlet hole is circular, square, or elongated.
6. The mobile terminal of claim 3, wherein a straight line formed by connecting a center point of the sound inlet and a center point of the sound inlet is parallel to the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611047609.XA CN106412783B (en) | 2016-11-23 | 2016-11-23 | Microphone structure and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611047609.XA CN106412783B (en) | 2016-11-23 | 2016-11-23 | Microphone structure and mobile terminal |
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| Publication Number | Publication Date |
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| CN106412783A CN106412783A (en) | 2017-02-15 |
| CN106412783B true CN106412783B (en) | 2022-04-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201611047609.XA Active CN106412783B (en) | 2016-11-23 | 2016-11-23 | Microphone structure and mobile terminal |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109889967B (en) | 2019-03-28 | 2020-10-30 | 百度在线网络技术（北京）有限公司 | Microphone and intelligent voice equipment |
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| TWI284483B (en) * | 2006-01-17 | 2007-07-21 | Lingsen Precision Ind Ltd | Acoustic head structure of microphone |
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| CN202663538U (en) * | 2012-04-28 | 2013-01-09 | 歌尔声学股份有限公司 | Mems microphone |
| CN102905204A (en) * | 2012-11-08 | 2013-01-30 | 山东共达电声股份有限公司 | Unidirectional microphone absorbing sound unidirectionally and sound receiving device |
| CN103533493A (en) * | 2010-09-03 | 2014-01-22 | 歌尔声学股份有限公司 | Silicon microphone, and packaging structure of application product |
| CN203748006U (en) * | 2014-03-26 | 2014-07-30 | 山东共达电声股份有限公司 | MEMS microphone |
| CN206181372U (en) * | 2016-11-23 | 2017-05-17 | 上海传英信息技术有限公司 | Mouthpiece structure and mobile terminal |
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- 2016-11-23 CN CN201611047609.XA patent/CN106412783B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1886008A (en) * | 2005-06-23 | 2006-12-27 | 潍坊怡力达电声有限公司 | Silicon microphone with long sound channel |
| TWI284483B (en) * | 2006-01-17 | 2007-07-21 | Lingsen Precision Ind Ltd | Acoustic head structure of microphone |
| CN200994191Y (en) * | 2006-12-19 | 2007-12-19 | 瑞声声学科技(深圳)有限公司 | MEMS microphone packaging structure |
| CN103533493A (en) * | 2010-09-03 | 2014-01-22 | 歌尔声学股份有限公司 | Silicon microphone, and packaging structure of application product |
| CN202663538U (en) * | 2012-04-28 | 2013-01-09 | 歌尔声学股份有限公司 | Mems microphone |
| CN102905204A (en) * | 2012-11-08 | 2013-01-30 | 山东共达电声股份有限公司 | Unidirectional microphone absorbing sound unidirectionally and sound receiving device |
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| CN106412783A (en) | 2017-02-15 |
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