CN102143667B

CN102143667B - Electronic device

Info

Publication number: CN102143667B
Application number: CN201010106242.0A
Authority: CN
Inventors: 李芳庆; 庄政洁; 施金忠; 曾绪祥
Original assignee: High Tech Computer Corp
Current assignee: HTC Corp
Priority date: 2010-01-29
Filing date: 2010-01-29
Publication date: 2014-05-28
Anticipated expiration: 2030-01-29
Also published as: CN102143667A

Abstract

The invention discloses an electronic device, which comprises a circuit board, an electronic element and a thin loudspeaker. The electronic element is arranged on the circuit board, and the thin loudspeaker is arranged on the circuit board. A chamber is formed between the thin loudspeaker and the circuit board, and the electronic element is positioned in the chamber.

Description

Electronic installation

Technical field

The present invention is about a kind of electronic installation, particularly utilizes the configuration of integrated circuit plate and has the electronic installation of microminiaturization design about a kind of.

Background technology

Carry for the convenience of the users, also microminiaturization increasingly of the design of portable electronic devices, referring to Fig. 1, the internal structure of traditional portable electronic devices 10 that Fig. 1 shows, comprises a circuit board 20, a main electronic component (being for example an integrated circuit component) 30, a Microspeaker 40 and an electromagnetic protection lid 50.

Main electronic component 30 is arranged on circuit board 20, electromagnetic protection lid 50 is arranged on main electronic component 30 tops, main electronic component 30 is shielded, to avoid the interference of electromagnetic radiation, Microspeaker 40 is also arranged on circuit board 20, occupies the area of about 15mmx15mm, in addition, portable electronic devices 10 also comprises that other attached electronic elements (not shown) are arranged on main electronic component 30 and loud speaker 40 peripheries, to utilize fully the space on circuit board 20.

Summary of the invention

The invention provides a kind of electronic installation, electronic installation comprises a circuit board, an electronic component and a thin speaker.Electronic component is arranged on circuit board, and thin speaker is arranged on circuit board, and forms a chamber between thin speaker and circuit board, and electronic component is arranged in chamber.

For above-mentioned and other object of the present invention, feature and advantage can be become apparent, a concrete preferred embodiment cited below particularly, and coordinate accompanying drawing to elaborate.

Accompanying drawing explanation

Fig. 1 shows the schematic diagram of traditional electronic devices;

Fig. 2 A is the schematic diagram in electronic installation of the present invention;

Fig. 2 B is the generalized section along A-A ' in Fig. 2 A;

Fig. 3 A is the schematic diagram in electronic installation of the present invention;

Fig. 3 B is the generalized section along B-B ' in Fig. 3 A

Fig. 4 A, Fig. 4 B, Fig. 5, Fig. 6 are the routine schematic diagram of variation of the present invention.

Main element symbol description

10 portable electronic devices

100 electronic installations

20 circuit boards

200 circuit boards

30 main electronic components

300 electronic components

40 Microspeakers

400 thin speakers

400A sheet metal

400B vibrating diaphragm main body

401 Part I

402 Part II

50 electromagnetic protection lids

500 shielding parts

A acoustical cotton

C chamber

G guiding channel

H housing

HH, HH ' sound hole

O opening

S1 the first space

S2 second space

T perforation

Embodiment

Referring to Fig. 2 A, Fig. 2 B, electronic installation 100 of the present invention can be a mobile communications device, a personal digital assistant (PDA), a portable computer or other portable electronic devices.As shown in Fig. 2 A, Fig. 2 B figure, electronic installation 100 comprises a circuit board 200, at least one electronic component 300 (as shown in Figure 2 B), a thin speaker 400 and a shielding part 500.

As shown in Figure 2 B, electronic component 300 is arranged on circuit board 200, shielding part 500 is an electromagnetic protection lid, to be arranged on circuit board 200 around the mode of electronic component 300, and thering is an opening O, thin speaker 400 is a piezoelectric type wafer speaker, an electrostatic wafer speaker or other thin speakers.Thin speaker 400 is arranged on shielding part 500, and opening O is shielded completely, can between circuit board 200, thin speaker 400 and shielding part 500, form a cavity C whereby.Moreover thin speaker 400 has a sheet metal 400A and a vibrating diaphragm main body 400B, wherein vibrating diaphragm main body 400B produces vibration according to audio signal and sounds, and vibrating diaphragm main body 400B is mounted on shielding part 500 by the support of sheet metal 400A.

Referring to Fig. 3 A, Fig. 3 B, in a variation example, thin speaker 400 has a Part I 401 and a Part II 402 (as shown in Figure 3 B), Part I 401 is arranged on cavity C top, Part II 402 is connected with Part I 401, and extended to away from cavity C by Part I 401, and protrude from shielding part 500, this setting position can make thin speaker 400 need and displacement or increase area according to different designs, does not affect the configuration area on circuit board 200.

Referring to Fig. 4 A, Fig. 4 B, electronic installation 100 of the present invention also comprises a housing H, and wherein circuit board 200, electronic component 300 and thin speaker 400 are all arranged in housing H.As shown in Figure 4 A, in a variation example, housing H has multiple sound hole HH, and correspondence is formed on thin speaker 400 tops, and the sound that thin speaker 400 can be produced is sent to housing H outside (as shown in arrow in Fig. 4 A).As shown in Figure 4 B, change in example at another, housing H has a sound hole HH ' and a guiding channel G, sound hole HH ' is formed on a side of thin speaker 400, can, by sound hole HH ' and thin speaker 400 conductings, make the sound that thin speaker 400 produces be sent to housing H outside (as shown in arrow in Fig. 4 B) via the guiding of guiding channel G and by sound hole HH ' by guiding channel G.

It should be noted, in above-mentioned each embodiment, thin speaker 400 and shielding part 500 are two independent elements, but be not limited to this, thin speaker 400 also can be one of the forming with shielding part 500, and namely shielding part 500 can be used as a part for thin speaker 400 shell bodies, and the sheet metal 400A of for example thin speaker 400 can be integrally formed with shielding part 500, and sheet metal 400A ground connection voluntarily, or sheet metal 400A can be electrically connected the use as ground connection with shielding part 500.In addition, except electronic component 300, electronic installation 100 has also comprised other attached electronic element, is arranged on shielding part 500 peripheries.

In electronic installation 100 of the present invention, cavity C is except electronic component 300 being contained in wherein, and can be used as outside electromagnetic protection by the ground connection of shielding part 500, can also be as the back of the body sound chamber of thin speaker 400, can increase the bass effect of loud speaker

In addition, in order more to strengthen the bass effect of loud speaker, can on circuit board 200, form a perforation, take above-mentioned arbitrary embodiment wherein as example, referring to Fig. 5, in the time that circuit board 200 is arranged in housing H, circuit board 200 is one first space S 1 and a second space S2 by spatial separation in housing H, the first space S 1 and a second space S2 lay respectively at the two opposite sides of circuit board 200, and cavity C is formed in the first space S 1, in cavity C, one perforation T is formed on circuit board 200, cavity C is communicated with second space S2, increase the back of the body sound chamber capacity of thin speaker 400, the bass effect of reinforcement loud speaker that can be advanced.More person referring to Fig. 6, take above-mentioned arbitrary embodiment wherein as example, sets up an acoustical cotton A in cavity C, and acoustical cotton A is attached to this sheet metal 400A below, so as to promoting the quality of sound.

In the present invention, thin speaker 400 and shielding element 500 (electromagnetic protection lid) combination, except saving the configuration area of circuit board 200, shielding element 500 also can be brought into play electromagnetic shielding effect originally, in addition, the cavity C that shielding element 500 forms around electronic component 300 also can be used as thin speaker 400 and carries on the back sound chamber, increases the bass effect of thin speaker 400, the effectively inner space of integrated electronic devices 100.

Although the present invention with preferred embodiment openly as above; so it is not in order to limit the present invention, any those skilled in the art, without departing from the spirit and scope of the present invention; still can do a little change and retouching, therefore protection scope of the present invention is when being as the criterion depending on claims person of defining.

Claims

1. an electronic installation, comprising:

One circuit board;

One electronic component, is arranged on this circuit board;

One thin speaker, is arranged on this circuit board, and and this circuit board between form a chamber, and this thin speaker has a sheet metal and a vibrating diaphragm main body is arranged on this sheet metal, wherein this electronic component is arranged in this chamber; And

Shielding part, it is around this electronic component, and is connected between this circuit board and this thin speaker, so as to form this chamber between this shielding part, this circuit board and this thin speaker, the wherein sheet metal ground connection of this shielding part and this thin speaker.

2. electronic installation according to claim 1, wherein this thin speaker is a piezoelectric type wafer speaker or an electrostatic wafer speaker, and this electronic component is an integrated circuit component.

3. electronic installation according to claim 1, wherein this sheet metal and this shielding part are integrally formed.

4. electronic installation according to claim 1, wherein this shielding part has an opening, and this thin speaker is arranged on this shielding part, this opening covered, and this sheet metal and the electric connection of this shielding part.

5. electronic installation according to claim 1, wherein this thin speaker comprises a Part I and a Part II, this Part I is arranged on this chamber top, and this Part II is connected with this Part I, and is extended to away from this chamber by this Part I.

6. electronic installation according to claim 1, wherein one first space and a second space lay respectively at the two opposite sides of this circuit board, and this chamber is formed in this first space, a perforation is formed on this circuit board, and this chamber is communicated with this second space.

7. electronic installation according to claim 1, also comprises an acoustical cotton, is arranged in this chamber.

8. electronic installation according to claim 1, also comprises a housing, and wherein this circuit board, this electronic component, this thin speaker are all arranged in this housing.

9. electronic installation according to claim 8, wherein this housing has a sound hole, corresponding to this thin speaker.

10. electronic installation according to claim 8, wherein this housing has a sound hole, and a guiding channel is formed on this enclosure interior, by this thin speaker and this sound hole conducting.