CN102143667A

CN102143667A - Electronic device

Info

Publication number: CN102143667A
Application number: CN2010101062420A
Authority: CN
Inventors: 李芳庆; 庄政洁; 施金忠; 曾绪祥
Original assignee: High Tech Computer Corp
Current assignee: HTC Corp
Priority date: 2010-01-29
Filing date: 2010-01-29
Publication date: 2011-08-03
Anticipated expiration: 2030-01-29
Also published as: CN102143667B

Abstract

The invention discloses an electronic device, which comprises a circuit board, an electronic element and a thin loudspeaker. The electronic element is arranged on the circuit board, and the thin loudspeaker is arranged on the circuit board. A chamber is formed between the thin loudspeaker and the circuit board, and the electronic element is positioned in the chamber.

Description

Electronic installation

Technical field

The present invention is about a kind of electronic installation, particularly utilizes the configuration of integrated circuit plate and has the electronic installation of microminiaturization design about a kind of.

Background technology

Carry for the convenience of the users, the design of portable electronic devices is microminiaturization day by day also, referring to Fig. 1, the internal structure of traditional portable electronic devices 10 that Fig. 1 shows comprises a circuit board 20, one main electronic component (for example being an integrated circuit component) 30, one Microspeaker 40 and electromagnetic protection lid 50.

Main electronic component 30 is arranged on the circuit board 20, electromagnetic protection lid 50 is arranged on main electronic component 30 tops, with main electronic component 30 shieldings, to avoid the interference of electromagnetic radiation, Microspeaker 40 also is arranged on the circuit board 20, occupies the area of about 15mmx15mm, in addition, portable electronic devices 10 comprises that also other attached electronic elements (not shown) are arranged on main electronic component 30 and loud speaker 40 peripheries, to utilize the space on the circuit board 20 fully.

Summary of the invention

The invention provides a kind of electronic installation, electronic installation comprises a circuit board, an electronic component and a thin speaker.Electronic component is arranged on the circuit board, and thin speaker is arranged on the circuit board, and forms a chamber between thin speaker and the circuit board, and electronic component is arranged in chamber.

For above-mentioned and other purpose of the present invention, feature and advantage can be become apparent, cited below particularly one concrete preferred embodiment, and conjunction with figs. elaborates.

Description of drawings

Fig. 1 shows the schematic diagram of traditional electronic devices;

Fig. 2 A is the schematic diagram in the electronic installation of the present invention;

Fig. 2 B is along the generalized section of A-A ' among Fig. 2 A;

Fig. 3 A is the schematic diagram in the electronic installation of the present invention;

Fig. 3 B is along the generalized section of B-B ' among Fig. 3 A

Fig. 4 A, Fig. 4 B, Fig. 5, Fig. 6 are the schematic diagram that changes example of the present invention.

The main element symbol description

10 portable electronic devices

100 electronic installations

20 circuit boards

200 circuit boards

30 main electronic components

300 electronic components

40 Microspeakers

400 thin speakers

The 400A sheet metal

400B vibrating diaphragm main body

401 firsts

402 second portions

50 electromagnetic protections lid

500 shielding parts

The A acoustical cotton

The C chamber

The G guiding channel

The H housing

HH, HH ' sound hole

The O opening

S1 first space

S2 second space

The T perforation

Embodiment

Referring to Fig. 2 A, Fig. 2 B, electronic installation 100 of the present invention can be a mobile communications device, a PDA(Personal Digital Assistant), a portable computer or other portable electronic devices.Shown in Fig. 2 A, Fig. 2 B figure, electronic installation 100 comprises a circuit board 200, at least one electronic component 300 (as shown in Fig. 2 B), a thin speaker 400 and a shielding part 500.

Shown in Fig. 2 B, electronic component 300 is arranged on the circuit board 200, shielding part 500 is an electromagnetic protection lid, be arranged on the circuit board 200 in mode around electronic component 300, and having an opening O, thin speaker 400 is a piezoelectric type wafer speaker, an electrostatic wafer speaker or other thin speakers.Thin speaker 400 is arranged on the shielding part 500, and O shields fully with opening, can form a cavity C whereby between circuit board 200, thin speaker 400 and shielding part 500.Moreover thin speaker 400 has a sheet metal 400A and a vibrating diaphragm main body 400B, and wherein vibrating diaphragm main body 400B produces vibration according to audio signal and sounds, and vibrating diaphragm main body 400B is mounted on shielding part 500 by the support of sheet metal 400A.

Referring to Fig. 3 A, Fig. 3 B, change in the example one, thin speaker 400 has a first 401 and a second portion 402 (as shown in Fig. 3 B), first 401 is arranged on the cavity C top, second portion 402 is connected with first 401, and is extended to away from cavity C by first 401, and protrudes in shielding part 500, this one is provided with the position and can makes thin speaker 400 according to different design needs and displacement or increase area does not influence the configuration area on the circuit board 200.

Referring to Fig. 4 A, Fig. 4 B, electronic installation 100 of the present invention also comprises a housing H, and wherein circuit board 200, electronic component 300 and thin speaker 400 all are arranged among the housing H.Shown in Fig. 4 A, change in the example one, housing H has a plurality of sound hole HH, and correspondence is formed on thin speaker 400 tops, the sound that thin speaker 400 is produced can be sent to housing H outside (shown in arrow among Fig. 4 A).Shown in Fig. 4 B, change in the example at another, housing H has a sound hole HH ' and a guiding channel G, sound hole HH ' is formed on a side of thin speaker 400, can make the sound that thin speaker 400 produced be sent to housing H outside (shown in arrow among Fig. 4 B) sound hole HH ' and thin speaker 400 conductings by guiding channel G via the guiding of guiding channel G and by sound hole HH '.

It should be noted, in above-mentioned each embodiment, thin speaker 400 is two independent elements with shielding part 500, but be not limited thereto, thin speaker 400 also can be one of the forming with shielding part 500, and just shielding part 500 can be used as the part of thin speaker 400 shell bodies, and for example the sheet metal 400A of thin speaker 400 can be integrally formed with shielding part 500, and sheet metal 400A is ground connection voluntarily, or sheet metal 400A can electrically connect usefulness as ground connection with shielding part 500.In addition, except electronic component 300, electronic installation 100 has also comprised other attached electronic element, is arranged on shielding part 500 peripheries.

In electronic installation 100 of the present invention, cavity C be except can being contained in electronic component 300 wherein, and can be used as outside the electromagnetic protection by the ground connection of shielding part 500, can also can increase the bass effect of loud speaker as the back of the body sound chamber of thin speaker 400

In addition, in order more to strengthen the bass effect of loud speaker, can on circuit board 200, form a perforation, with above-mentioned arbitrary embodiment wherein is example, referring to Fig. 5, when circuit board 200 is arranged among the housing H, circuit board 200 is one first space S 1 and one second space S 2 with separated by spaces in the housing H, first space S 1 and one second space S 2 lay respectively at the two opposite sides of circuit board 200, and cavity C is formed in first space S 1, in cavity C, one perforation T is formed on the circuit board 200, cavity C is communicated with second space S 2, increases the back of the body sound chamber capacity of thin speaker 400, can advance the bass effect of the reinforcement loud speaker on rank.More the person referring to Fig. 6, is an example with above-mentioned arbitrary embodiment wherein, sets up an acoustical cotton A in cavity C, and acoustical cotton A is attached to this sheet metal 400A below, so as to promoting the quality of sound.

In the present invention, thin speaker 400 combines with shielding element 500 (electromagnetic protection lid), except saving the configuration area of circuit board 200, shielding element 500 also can be brought into play electromagnetic shielding effect originally, in addition, shielding element 500 also can be used as thin speaker 400 back of the body sound chambeies around electronic component 300 formed cavity C, increases the bass effect of thin speaker 400, effectively the inner space of integrated electronic devices 100.

Though the present invention with preferred embodiment openly as above; right its is not in order to qualification the present invention, any those skilled in the art, without departing from the spirit and scope of the present invention; still can do a little change and retouching, so protection scope of the present invention is as the criterion when looking claims person of defining.

Claims

1. electronic installation comprises:

One circuit board;

One electronic component is arranged on this circuit board; And

One thin speaker is arranged on this circuit board, and and this circuit board between form a chamber, wherein this electronic component is arranged in this chamber.

2. electronic installation according to claim 1, wherein this thin speaker has a sheet metal and a vibrating diaphragm main body, and wherein this vibrating diaphragm main body is arranged on this sheet metal, and this sheet metal ground connection.

3. electronic installation according to claim 1, wherein this thin speaker is a piezoelectric type wafer speaker or an electrostatic wafer speaker, and this electronic component is an integrated circuit component.

4. electronic installation according to claim 1, also comprise a shielding part, it centers on this electronic component, and is connected between this circuit board and this thin speaker, so as between this shielding part, this circuit board and this thin speaker, forming this chamber, wherein this shielding part ground connection.

5. electronic installation according to claim 2, wherein this sheet metal and this shielding part are integrally formed.

6. electronic installation according to claim 2, wherein this shielding part has an opening, and this thin speaker is arranged on this shielding part, this opening covered, and this sheet metal and the electric connection of this shielding part.

7. electronic installation according to claim 1, wherein this thin speaker comprises a first and a second portion, this first is arranged on this chamber top, and this second portion is connected with this first, and is extended to away from this chamber by this first.

8. electronic installation according to claim 1, wherein one first space and one second space lay respectively at the two opposite sides of this circuit board, and this chamber is formed in this first space, and a perforation is formed on this circuit board, with this chamber and this second spatial communication.

9. electronic installation according to claim 1 also comprises an acoustical cotton, is arranged in this chamber.

10. electronic installation according to claim 1 also comprises a housing, and wherein this circuit board, this electronic component, this thin speaker all are arranged in this housing.

11. electronic installation according to claim 10, wherein this housing has a sound hole, corresponding to this thin speaker.

12. electronic installation according to claim 10, wherein this housing has a sound hole, and a guiding channel is formed on this enclosure interior, with this thin speaker and this sound hole conducting.