TWI480718B - Electronic device - Google Patents

Description

Electronic device

The present invention relates to an electronic device, and more particularly to an electronic device having a miniaturized design using a configuration of an integrated circuit board.

In order to facilitate the user to carry around, the design of the portable electronic device is also becoming more and more miniaturized. Referring to FIG. 1 , the internal structure of the conventional portable electronic device 10 shown in FIG. 1 includes a circuit board 20 and a main electronic device. An element (for example, an integrated circuit element) 30, a microspeaker 40, and an electromagnetic protective cover 50.

The main electronic component 30 is disposed on the circuit board 20, and the electromagnetic protection cover 50 is disposed above the main electronic component 30 to shield the main electronic component 30 from electromagnetic interference. The microspeaker 40 is also disposed on the circuit board 20, occupying approximately In addition, the portable electronic device 10 further includes other accessory electronic components (not shown) disposed on the main electronic component 30 and the periphery of the speaker 40 to fully utilize the space on the circuit board 20.

The invention provides an electronic device comprising a circuit board, an electronic component and a thin speaker. The electronic component is disposed on the circuit board, the thin speaker is disposed on the circuit board, and a cavity is formed between the thin speaker and the circuit board, and the electronic component is located in the cavity.

The above and other objects, features and advantages of the present invention will become more apparent from

Referring to Figures 2A and 2B, the electronic device 100 of the present invention can be a mobile communication device, a PDA, a portable computer or other portable electronic device. As shown in FIGS. 2A and 2B, the electronic device 100 includes a circuit board 200, at least one electronic component 300 (as shown in FIG. 2B), a thin speaker 400, and a shield 500.

As shown in FIG. 2B, the electronic component 300 is disposed on the circuit board 200. The shielding component 500 is an electromagnetic shielding cover disposed on the circuit board 200 so as to surround the electronic component 300, and has an opening O. The thin speaker 400 is A piezoelectric film speaker, an electrostatic film speaker or other thin speaker. The thin speaker 400 is disposed on the shield 500 to completely shield the opening O, whereby a chamber C can be formed between the circuit board 200, the thin speaker 400, and the shield 500. Furthermore, the thin speaker 400 has a metal piece 400A and a diaphragm main body 400B, wherein the diaphragm main body 400B generates a sound according to the vibration of the audio signal, and the diaphragm main body 400B is shielded by the support of the metal piece 400A. On the 500.

Referring to FIGS. 3A and 3B, in a variant, the thin speaker 400 has a first portion 401 and a second portion 402 (as shown in FIG. 3B), and the first portion 401 is disposed in the chamber C. The upper portion 402 is connected to the first portion 401 and extends from the first portion 401 away from the chamber C and protrudes from the shielding member 500. This arrangement position enables the thin speaker 400 to be designed according to different designs. The displacement or increased area does not affect the configuration area on the circuit board 200.

Referring to FIGS. 4A and 4B, the electronic device 100 of the present invention further includes a housing H, wherein the circuit board 200, the electronic component 300, and the thin speaker 400 are all disposed in the housing H. As shown in FIG. 4A, in a variant, the housing H has a plurality of sound holes HH correspondingly formed above the thin speaker 400, and the sound generated by the thin speaker 400 can be transmitted to the outside of the housing H (eg, 4A). The arrow in the figure). As shown in FIG. 4B, in another variation, the housing H has a sound hole HH' and a guiding channel G, and the sound hole HH' is formed on one side of the thin speaker 400 by the guiding channel G. The sound hole HH' can be electrically connected to the thin speaker 400, so that the sound generated by the thin speaker 400 is guided to the outside of the casing H via the guide channel G and transmitted through the sound hole HH' (as indicated by the arrow in FIG. 4B) ).

It should be noted that, in the above embodiments, the thin speaker 400 and the shielding member 500 are two separate components, but the invention is not limited thereto, and the thin speaker 400 and the shielding member 500 may also be integrally formed, that is, the shielding member 500 may be As a part of the outer casing of the thin speaker 400, for example, the metal piece 400A of the thin speaker 400 can be integrally formed with the shielding member 500, and the metal piece 400A can be grounded by itself, or the metal piece 400A can be electrically connected to the shielding member 500 as a ground. Use. In addition, in addition to the electronic component 300, the electronic device 100 includes other accessory electronic components disposed on the periphery of the shield 500.

In the electronic device 100 of the present invention, the chamber C can be used as an electromagnetic shielding in addition to the grounding of the shielding member 500, and can also be used as a back sound chamber of the thin speaker 400. Increases the bass of the speaker

In addition, in order to further enhance the bass effect of the speaker, a through hole may be formed on the circuit board 200, taking any of the above embodiments as an example, see FIG. 5, when the circuit board 200 is disposed in the housing H. , circuit board 200 The space inside the casing H is divided into a first space S1 and a second space S2. The first space S1 and the second space S2 are respectively located on opposite sides of the circuit board 200, and the chamber C is formed in the first space. In S1, in the chamber C, a through hole T is formed on the circuit board 200, and the chamber C is connected to the second space S2 to increase the back cavity capacity of the thin speaker 400, and the bass effect of the speaker can be enhanced step by step. Furthermore, referring to FIG. 6, in any of the above embodiments, a sound absorbing cotton A is added to the chamber C, and the sound absorbing cotton A is attached under the metal piece 400A, thereby improving the quality of the sound.

In the present invention, the thin speaker 400 is combined with the shielding member 500 (electromagnetic protective cover). In addition to saving the arrangement area of the circuit board 200, the shielding member 500 can also exert the original electromagnetic shielding effect. In addition, the shielding member 500 surrounds the electronic component 300. The formed chamber C can also serve as a back cavity of the thin speaker 400, which increases the bass effect of the thin speaker 400, and can effectively integrate the internal space of the electronic device 100.

Although the present invention has been described above in terms of the preferred embodiments, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

10‧‧‧Portable electronic devices

100‧‧‧Electronic devices

20‧‧‧ boards

200‧‧‧ boards

30‧‧‧Main electronic components

300‧‧‧Electronic components

40‧‧‧Micro Speakers

400‧‧‧Small speaker

400A‧‧‧metal piece

400B‧‧‧ Diaphragm body

401‧‧‧ first part

402‧‧‧Part 2

50‧‧‧Electromagnetic protective cover

500‧‧‧Shield

A‧‧‧Acoustic cotton

C‧‧‧室

G‧‧‧ Guide channel

H‧‧‧shell

HH, HH’‧‧‧ sound hole

O‧‧‧ openings

S1‧‧‧ first space

S2‧‧‧Second space

T‧‧‧ perforation

1 is a schematic view of a conventional electronic device; FIG. 2A is a schematic view of the electronic device of the present invention; FIG. 2B is a cross-sectional view taken along line A-A' of FIG. 2A; FIG. 3A is a view of the electronic device of the present invention; Schematic diagram; Figure 3B is a schematic cross-sectional view along B-B' in Figure 3A

4A, 4B, 5, and 6 are schematic views of variations of the present invention.

100‧‧‧Electronic devices

200‧‧‧ boards

300‧‧‧Electronic components

400‧‧‧Small speaker

400A‧‧‧metal piece

400B‧‧‧ Diaphragm body

500‧‧‧Shield

C‧‧‧室

O‧‧‧ openings

Claims (11)

An electronic device comprising: a circuit board; an electronic component disposed on the circuit board; an electrostatic film speaker having a metal piece and a diaphragm body disposed above the circuit board and with the circuit board Forming a chamber in which the electronic component is located in the chamber, wherein the diaphragm main system is disposed on the metal sheet and emits sound according to an audio signal, and the metal piece is grounded; and a shielding member, The device surrounds the electronic component and is connected between the circuit board and the electrostatic film speaker, thereby forming the chamber between the shielding member, the circuit board and the electrostatic film speaker, wherein the shielding member is grounded. The electronic device of claim 1, wherein the metal piece is integrally formed with the shielding member. The electronic device of claim 1, wherein the shielding member has an opening, the electrostatic film speaker is disposed on the shielding member, the opening is covered, and the metal piece is electrically connected to the shielding member. The electronic device of claim 1, wherein the electrostatic film speaker comprises a first portion and a second portion, the first portion being disposed above the chamber, the second portion being The first portion is coupled and extends from the first portion away from the chamber. The electronic device of claim 1, wherein a first space and a second space are respectively located on opposite sides of the circuit board, and the chamber is formed in the first space, and a through hole is formed in The board Upper, the chamber is in communication with the second space. The electronic device of claim 1, further comprising a sound absorbing cotton disposed in the chamber. The electronic device of claim 1, further comprising a casing, wherein the circuit board, the electronic component, and the electrostatic film speaker are disposed in the casing. The electronic device of claim 7, wherein the housing has a sound hole corresponding to the electrostatic film speaker. The electronic device of claim 7, wherein the housing has a sound hole, and a guiding channel is formed inside the housing, and the electrostatic thin film speaker is electrically connected to the sound hole. The electronic device of claim 1, wherein the electronic device is a mobile communication device, a number of assistants, or a portable computer. The electronic device of claim 1, wherein the electronic component is an integrated circuit component.