TWI480718B - Electronic device - Google Patents

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Publication number
TWI480718B
TWI480718B TW099102529A TW99102529A TWI480718B TW I480718 B TWI480718 B TW I480718B TW 099102529 A TW099102529 A TW 099102529A TW 99102529 A TW99102529 A TW 99102529A TW I480718 B TWI480718 B TW I480718B
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Taiwan
Prior art keywords
electronic device
circuit board
chamber
shielding member
disposed
Prior art date
Application number
TW099102529A
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Chinese (zh)
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TW201126321A (en
Inventor
Fang Ching Lee
Cheng Chieh Chuang
Chin Chung Shih
Hsu Hsiang Tseng
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Htc Corp
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Priority to TW099102529A priority Critical patent/TWI480718B/en
Publication of TW201126321A publication Critical patent/TW201126321A/en
Application granted granted Critical
Publication of TWI480718B publication Critical patent/TWI480718B/en

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Description

電子裝置Electronic device

本發明係有關於一種電子裝置,特別是有關於一種利用整合電路板的配置而具有微小化設計之電子裝置。The present invention relates to an electronic device, and more particularly to an electronic device having a miniaturized design using a configuration of an integrated circuit board.

為了方便使用者隨身攜帶,可攜式電子裝置的設計也日趨微小化,參見第1圖,第1圖顯示的習知之可攜式電子裝置10之內部結構,包括一電路板20、一主要電子元件(例如為一積體電路元件)30、一微型揚聲器40以及一電磁防護蓋50。In order to facilitate the user to carry around, the design of the portable electronic device is also becoming more and more miniaturized. Referring to FIG. 1 , the internal structure of the conventional portable electronic device 10 shown in FIG. 1 includes a circuit board 20 and a main electronic device. An element (for example, an integrated circuit element) 30, a microspeaker 40, and an electromagnetic protective cover 50.

主要電子元件30設置於電路板20上,電磁防護蓋50設置於主要電子元件30上方,將主要電子元件30遮蔽,以避免電磁輻射的干擾,微型揚聲器40亦設置於電路板20上,佔據約15mm x 15mm的面積,另外,可攜式電子裝置10還包括其他附屬電子元件(未圖示)設置於主要電子元件30以及揚聲器40周邊,以充分的利用電路板20上的空間。The main electronic component 30 is disposed on the circuit board 20, and the electromagnetic protection cover 50 is disposed above the main electronic component 30 to shield the main electronic component 30 from electromagnetic interference. The microspeaker 40 is also disposed on the circuit board 20, occupying approximately In addition, the portable electronic device 10 further includes other accessory electronic components (not shown) disposed on the main electronic component 30 and the periphery of the speaker 40 to fully utilize the space on the circuit board 20.

本發明提供一種電子裝置,電子裝置包括一電路板、一電子元件以及一薄型揚聲器。電子元件設置於電路板上,薄型揚聲器設置於電路板上,且薄型揚聲器與電路板之間形成一腔室,而電子元件係位於腔室中。The invention provides an electronic device comprising a circuit board, an electronic component and a thin speaker. The electronic component is disposed on the circuit board, the thin speaker is disposed on the circuit board, and a cavity is formed between the thin speaker and the circuit board, and the electronic component is located in the cavity.

為使本發明之上述及其他目的、特徵和優點能更明顯易懂,下文特舉一具體之較佳實施例,並配合所附圖式做詳細說明。The above and other objects, features and advantages of the present invention will become more apparent from

參見第2A、2B圖,本發明之電子裝置100可為一行動通訊裝置、一個人數位助理(PDA)、一可攜式電腦或是其他可攜式電子裝置。如第2A、2B圖所示,電子裝置100包括一電路板200、至少一電子元件300(如第2B圖中所示)、一薄型揚聲器400以及一遮蔽件500。Referring to Figures 2A and 2B, the electronic device 100 of the present invention can be a mobile communication device, a PDA, a portable computer or other portable electronic device. As shown in FIGS. 2A and 2B, the electronic device 100 includes a circuit board 200, at least one electronic component 300 (as shown in FIG. 2B), a thin speaker 400, and a shield 500.

如第2B圖所示,電子元件300設置於電路板200上,遮蔽件500為一電磁防護蓋,以圍繞電子元件300的方式設置於電路板200上,並具有一開口O,薄型揚聲器400為一壓電式薄膜揚聲器、一靜電式薄膜揚聲器或是其他薄型揚聲器。薄型揚聲器400設置於遮蔽件500上,將開口O完全遮蔽,藉此可在電路板200、薄型揚聲器400以及遮蔽件500之間形成一腔室C。再者,薄型揚聲器400具有一金屬片400A及一振膜主體400B,其中振膜主體400B根據音頻訊號產生振動而發出聲音,而振膜主體400B藉由金屬片400A的支撐而得以架置於遮蔽件500上。As shown in FIG. 2B, the electronic component 300 is disposed on the circuit board 200. The shielding component 500 is an electromagnetic shielding cover disposed on the circuit board 200 so as to surround the electronic component 300, and has an opening O. The thin speaker 400 is A piezoelectric film speaker, an electrostatic film speaker or other thin speaker. The thin speaker 400 is disposed on the shield 500 to completely shield the opening O, whereby a chamber C can be formed between the circuit board 200, the thin speaker 400, and the shield 500. Furthermore, the thin speaker 400 has a metal piece 400A and a diaphragm main body 400B, wherein the diaphragm main body 400B generates a sound according to the vibration of the audio signal, and the diaphragm main body 400B is shielded by the support of the metal piece 400A. On the 500.

參見第3A、3B圖,在一變化例中,薄型揚聲器400具有一第一部份401以及一第二部份402(如第3B圖中所示),第一部份401設置於腔室C上方,第二部份402與第一部份401連接,並由第一部份401延伸至遠離腔室C,並突出於遮蔽件500,此一設置位置可使薄型揚聲器400根據不同的設計需要而位移或是增加面積,並不影響電路板200上的配置面積。Referring to FIGS. 3A and 3B, in a variant, the thin speaker 400 has a first portion 401 and a second portion 402 (as shown in FIG. 3B), and the first portion 401 is disposed in the chamber C. The upper portion 402 is connected to the first portion 401 and extends from the first portion 401 away from the chamber C and protrudes from the shielding member 500. This arrangement position enables the thin speaker 400 to be designed according to different designs. The displacement or increased area does not affect the configuration area on the circuit board 200.

參見第4A、4B圖,本發明之電子裝置100更包括一殼體H,其中電路板200、電子元件300以及薄型揚聲器 400皆設置於殼體H中。如第4A圖所示,在一變化例中,殼體H具有複數個音孔HH,對應形成於薄型揚聲器400上方,可將薄型揚聲器400所產生的聲音傳送至殼體H外部(如第4A圖中箭頭所示)。如第4B圖所示,在另一變化例中,殼體H具有一音孔HH’以及一導引通道G,音孔HH’形成於薄型揚聲器400之一側邊,藉由導引通道G可將音孔HH’與薄型揚聲器400導通,使得薄型揚聲器400所產生的聲音經由導引通道G的引導並藉由音孔HH’而傳送至殼體H外部(如第4B圖中箭頭所示)。Referring to FIGS. 4A and 4B, the electronic device 100 of the present invention further includes a housing H, wherein the circuit board 200, the electronic component 300, and the thin speaker 400 are all disposed in the housing H. As shown in FIG. 4A, in a variant, the housing H has a plurality of sound holes HH correspondingly formed above the thin speaker 400, and the sound generated by the thin speaker 400 can be transmitted to the outside of the housing H (eg, 4A). The arrow in the figure). As shown in FIG. 4B, in another variation, the housing H has a sound hole HH' and a guiding channel G, and the sound hole HH' is formed on one side of the thin speaker 400 by the guiding channel G. The sound hole HH' can be electrically connected to the thin speaker 400, so that the sound generated by the thin speaker 400 is guided to the outside of the casing H via the guide channel G and transmitted through the sound hole HH' (as indicated by the arrow in FIG. 4B) ).

應注意的是,於上述各個實施例中,薄型揚聲器400與遮蔽件500為兩個單獨的元件,但不限於此,薄型揚聲器400與遮蔽件500亦可為一體成形,也就是遮蔽件500可作為薄型揚聲器400外殼體之一部份,例如薄型揚聲器400之金屬片400A可與遮蔽件500一體成形,且金屬片400A可自行接地,或是金屬片400A可與遮蔽件500電性連接作為接地之用。另外,除了電子元件300之外,電子裝置100還包括了其他的附屬電子元件,設置於遮蔽件500外圍。It should be noted that, in the above embodiments, the thin speaker 400 and the shielding member 500 are two separate components, but the invention is not limited thereto, and the thin speaker 400 and the shielding member 500 may also be integrally formed, that is, the shielding member 500 may be As a part of the outer casing of the thin speaker 400, for example, the metal piece 400A of the thin speaker 400 can be integrally formed with the shielding member 500, and the metal piece 400A can be grounded by itself, or the metal piece 400A can be electrically connected to the shielding member 500 as a ground. Use. In addition, in addition to the electronic component 300, the electronic device 100 includes other accessory electronic components disposed on the periphery of the shield 500.

在本發明之電子裝置100中,腔室C除了可將電子元件300容納於其中,並藉由遮蔽件500的接地而可作為電磁防護之外,還可以用作薄型揚聲器400的背音腔,可增加揚聲器的低音效果In the electronic device 100 of the present invention, the chamber C can be used as an electromagnetic shielding in addition to the grounding of the shielding member 500, and can also be used as a back sound chamber of the thin speaker 400. Increases the bass of the speaker

除此之外,為了更加強揚聲器的低音效果,可在電路板200上形成一穿孔,以上述其中之任一實施例為例,參見第5圖,當電路板200設置於殼體H中時,電路板200 將殼體H內空間分隔為一第一空間S1以及一第二空間S2,第一空間S1以及一第二空間S2分別位於電路板200之相反兩側,而腔室C係形成於第一空間S1中,在腔室C中,一穿孔T形成於電路板200上,將腔室C與第二空間S2連通,增加薄型揚聲器400的背音腔容量,可進階的加強揚聲器的低音效果。更者,參見第6圖,以上述其中之任一實施例為例,在腔室C中增設一吸音棉A,並將吸音棉A貼附於該金屬片400A下方,藉以提升聲音的品質。In addition, in order to further enhance the bass effect of the speaker, a through hole may be formed on the circuit board 200, taking any of the above embodiments as an example, see FIG. 5, when the circuit board 200 is disposed in the housing H. , circuit board 200 The space inside the casing H is divided into a first space S1 and a second space S2. The first space S1 and the second space S2 are respectively located on opposite sides of the circuit board 200, and the chamber C is formed in the first space. In S1, in the chamber C, a through hole T is formed on the circuit board 200, and the chamber C is connected to the second space S2 to increase the back cavity capacity of the thin speaker 400, and the bass effect of the speaker can be enhanced step by step. Furthermore, referring to FIG. 6, in any of the above embodiments, a sound absorbing cotton A is added to the chamber C, and the sound absorbing cotton A is attached under the metal piece 400A, thereby improving the quality of the sound.

在本發明中,薄型揚聲器400與遮蔽元件500(電磁防護蓋)結合,除了可節省電路板200的配置面積,遮蔽元件500也可發揮原本的電磁遮蔽功效,另外,遮蔽元件500圍繞電子元件300所形成的腔室C還可作為薄型揚聲器400背音腔,增加薄型揚聲器400的低音效果,可有效的整合電子裝置100的內部空間。In the present invention, the thin speaker 400 is combined with the shielding member 500 (electromagnetic protective cover). In addition to saving the arrangement area of the circuit board 200, the shielding member 500 can also exert the original electromagnetic shielding effect. In addition, the shielding member 500 surrounds the electronic component 300. The formed chamber C can also serve as a back cavity of the thin speaker 400, which increases the bass effect of the thin speaker 400, and can effectively integrate the internal space of the electronic device 100.

雖然本發明已以較佳實施例揭露如上,然其並非用以限定本發明,任何熟習此項技藝者,在不脫離本發明之精神和範圍內,仍可作些許的更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been described above in terms of the preferred embodiments, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

10‧‧‧可攜式電子裝置10‧‧‧Portable electronic devices

100‧‧‧電子裝置100‧‧‧Electronic devices

20‧‧‧電路板20‧‧‧ boards

200‧‧‧電路板200‧‧‧ boards

30‧‧‧主要電子元件30‧‧‧Main electronic components

300‧‧‧電子元件300‧‧‧Electronic components

40‧‧‧微型揚聲器40‧‧‧Micro Speakers

400‧‧‧薄型揚聲器400‧‧‧Small speaker

400A‧‧‧金屬片400A‧‧‧metal piece

400B‧‧‧振膜主體400B‧‧‧ Diaphragm body

401‧‧‧第一部份401‧‧‧ first part

402‧‧‧第二部份402‧‧‧Part 2

50‧‧‧電磁防護蓋50‧‧‧Electromagnetic protective cover

500‧‧‧遮蔽件500‧‧‧Shield

A‧‧‧吸音棉A‧‧‧Acoustic cotton

C‧‧‧腔室C‧‧‧室

G‧‧‧導引通道G‧‧‧ Guide channel

H‧‧‧殼體H‧‧‧shell

HH、HH’‧‧‧音孔HH, HH’‧‧‧ sound hole

O‧‧‧開口O‧‧‧ openings

S1‧‧‧第一空間S1‧‧‧ first space

S2‧‧‧第二空間S2‧‧‧Second space

T‧‧‧穿孔T‧‧‧ perforation

第1圖顯示習知電子裝置之示意圖;第2A圖為本發明電子裝置中之示意圖;第2B圖為第2A圖中沿A-A’之剖面示意圖;第3A圖為本發明電子裝置中之示意圖;第3B圖為第3A圖中沿B-B’之剖面示意圖1 is a schematic view of a conventional electronic device; FIG. 2A is a schematic view of the electronic device of the present invention; FIG. 2B is a cross-sectional view taken along line A-A' of FIG. 2A; FIG. 3A is a view of the electronic device of the present invention; Schematic diagram; Figure 3B is a schematic cross-sectional view along B-B' in Figure 3A

第4A、4B、5、6圖為本發明之變化例之示意圖。4A, 4B, 5, and 6 are schematic views of variations of the present invention.

100‧‧‧電子裝置100‧‧‧Electronic devices

200‧‧‧電路板200‧‧‧ boards

300‧‧‧電子元件300‧‧‧Electronic components

400‧‧‧薄型揚聲器400‧‧‧Small speaker

400A‧‧‧金屬片400A‧‧‧metal piece

400B‧‧‧振膜主體400B‧‧‧ Diaphragm body

500‧‧‧遮蔽件500‧‧‧Shield

C‧‧‧腔室C‧‧‧室

O‧‧‧開口O‧‧‧ openings

Claims (11)

一種電子裝置,包括:一電路板;一電子元件,設置於該電路板上;一靜電式薄膜揚聲器,具有一金屬片及一振膜主體,設置於該電路板上方,並與該電路板之間形成一腔室,其中該電子元件係位於該腔室中,其中該振膜主體係設置於該金屬片上並根據一音頻訊號產生振動而發出聲音,且該金屬片接地;以及一遮蔽件,其圍繞該電子元件,並連接於該電路板與該靜電式薄膜揚聲器之間,藉以在該遮蔽件、該電路板以及該靜電式薄膜揚聲器之間形成該腔室,其中該遮蔽件接地。 An electronic device comprising: a circuit board; an electronic component disposed on the circuit board; an electrostatic film speaker having a metal piece and a diaphragm body disposed above the circuit board and with the circuit board Forming a chamber in which the electronic component is located in the chamber, wherein the diaphragm main system is disposed on the metal sheet and emits sound according to an audio signal, and the metal piece is grounded; and a shielding member, The device surrounds the electronic component and is connected between the circuit board and the electrostatic film speaker, thereby forming the chamber between the shielding member, the circuit board and the electrostatic film speaker, wherein the shielding member is grounded. 如申請專利範圍第1項所述的電子裝置,其中該金屬片與該遮蔽件一體成形。 The electronic device of claim 1, wherein the metal piece is integrally formed with the shielding member. 如申請專利範圍第1項所述的電子裝置,其中該遮蔽件具有一開口,該靜電式薄膜揚聲器設置於該遮蔽件上,將該開口覆蓋,且該金屬片與該遮蔽件電性連接。 The electronic device of claim 1, wherein the shielding member has an opening, the electrostatic film speaker is disposed on the shielding member, the opening is covered, and the metal piece is electrically connected to the shielding member. 如申請專利範圍第1項所述的電子裝置,其中該靜電式薄膜揚聲器包括一第一部份以及一第二部份,該第一部份設置於該腔室上方,該第二部份與該第一部份連接,並由該第一部份延伸至遠離該腔室。 The electronic device of claim 1, wherein the electrostatic film speaker comprises a first portion and a second portion, the first portion being disposed above the chamber, the second portion being The first portion is coupled and extends from the first portion away from the chamber. 如申請專利範圍第1項所述的電子裝置,其中一第一空間以及一第二空間分別位於該電路板之相反兩側,而該腔室係形成於該第一空間中,一穿孔形成於該電路板 上,將該腔室與該第二空間連通。 The electronic device of claim 1, wherein a first space and a second space are respectively located on opposite sides of the circuit board, and the chamber is formed in the first space, and a through hole is formed in The board Upper, the chamber is in communication with the second space. 如申請專利範圍第1項所述的電子裝置,更包括一吸音棉,設置於該腔室中。 The electronic device of claim 1, further comprising a sound absorbing cotton disposed in the chamber. 如申請專利範圍第1項所述的電子裝置,更包括一殼體,其中該電路板、該電子元件、該靜電式薄膜揚聲器皆設置於該殼體中。 The electronic device of claim 1, further comprising a casing, wherein the circuit board, the electronic component, and the electrostatic film speaker are disposed in the casing. 如申請專利範圍第7項所述的電子裝置,其中該殼體具有一音孔,對應於該靜電式薄膜揚聲器。 The electronic device of claim 7, wherein the housing has a sound hole corresponding to the electrostatic film speaker. 如申請專利範圍第7項所述的電子裝置,其中該殼體具有一音孔,且一導引通道形成於該殼體內部,將該靜電式薄膜揚聲器與該音孔導通。 The electronic device of claim 7, wherein the housing has a sound hole, and a guiding channel is formed inside the housing, and the electrostatic thin film speaker is electrically connected to the sound hole. 如申請專利範圍第1項所述的電子裝置,其中該電子裝置為一行動通訊裝置、一個人數位助理或是一可攜式電腦。 The electronic device of claim 1, wherein the electronic device is a mobile communication device, a number of assistants, or a portable computer. 如申請專利範圍第1項所述的電子裝置,其中該電子元件為一積體電路元件。 The electronic device of claim 1, wherein the electronic component is an integrated circuit component.
TW099102529A 2010-01-29 2010-01-29 Electronic device TWI480718B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI608790B (en) * 2016-12-02 2017-12-11 和碩聯合科技股份有限公司 Electromagnetic protective cover, digital decoding device slot assembly and digital decoding device assembly

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW440446B (en) * 1999-01-07 2001-06-16 Sarnoff Corp Hearing aid with large diaphragm microphone element including a printed circuit board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW440446B (en) * 1999-01-07 2001-06-16 Sarnoff Corp Hearing aid with large diaphragm microphone element including a printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI608790B (en) * 2016-12-02 2017-12-11 和碩聯合科技股份有限公司 Electromagnetic protective cover, digital decoding device slot assembly and digital decoding device assembly

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