201126321201126321
【發明所屬之技術領域】 本發明係有關於一種電子裝置’特別是有關於一種利 用整合電路板的配置而具有微小化設計之電子裝置。 【先前技術】 為了方便使用者隨身攜帶，可攜式電子裝置的設計也 曰趨微小化，參見第1圖，第1圖顯示的習知之可攜式電 子裝置1〇之内部結構，包括一電路板20、一主要電子元 φ 件（例如為一積體電路元件)30、一微型揚聲器40以及一電 磁防護蓋50。 主要電子元件30設置於電路板20上，電磁防護蓋50 設置於主要電子元件30上方，將主要電子元件30遮蔽’ 以避免電磁輻射的干擾，微型揚聲器40亦設置於電路板 20上’佔據約15mm X 15mm的面積，另外，可攜式電子 裝置10還包括其他附屬電子元件（未圖示）設置於主要電子 元件30以及揚聲器40周邊，以充分的利用電路板20上的 ® 空間。 【發明内容】 本發明提供一種電子裝置，電子裝置包括一電路板、 一電子元件以及一薄型揚聲器。電子元件設置於電路板 上’薄型揚聲器設置於電路板上，且薄型揚聲器與電路板 之間形成一腔室，而電子元件係位於腔室中。 為使本發明之上述及其他目的、特徵和優點能更明顯 易懂，下文特舉一具體之較佳實施例，並配合所附圖式做 詳細說明。 HTC098176/0746-A42147-TWF 3 201126321 【實施方式】 參見第2A、2B圖’本發明之電子裝置1〇〇可為一行 動通訊裝置、一個人數位助理(PDA)、一可攜式電腦或是其 他可攜式電子裝置。如第2A、2B圖所示，電子裝置1〇〇 包括一電路板200、至少一電子元件3〇〇(如第2B圖中所 示）、一薄型揚聲器400以及一遮蔽件5〇〇。 如第2B圖所示’電子元件300設置於電路板200上， 遮蔽件500為一電磁防護蓋，以圍繞電子元件3〇〇的方式 設置於電路板200上，並具有一開口 〇，薄型揚聲器400 為一壓電式薄膜揚聲器、一靜電式薄膜揚聲器或是其他薄 型揚聲器。薄型揚聲器400設置於遮蔽件500上，將開口 〇完全遮蔽’藉此可在電路板200、薄型揚聲器400以及 遮蔽件500之間形成一腔室c。再者，薄型揚聲器400具 有一金屬片400A及一振膜主體400B，其中振膜主體400B 根據音頻訊號產生振動而發出聲音，而振膜主體40〇B藉由 金屬片400A的支撐而得以架置於遮蔽件500上。 參見第3A、3B圖，在一變化例中，薄型揚聲器400 具有一第一部份401以及一第二部份402(如第3B圖中所 示）’第一部份401設置於腔室C上方’第二部份402與第 一部份401連接，並由第一部份401延伸至遠離腔室c， 並突出於遮蔽件500，此一設置位置可使薄型揚聲器400 根據不同的設計需要而位移或是增加面積，並不影響電路 板200上的配置面積。 參見第4A、4B圖，本發明之電子裝置100更包括一 殼體H，其中電路板200、電子元件300以及薄型揚聲器 HTC098176/0746-A42147-TWF 4 201126321 400皆設置於殼體Η中。如第4A圖所^在—變_中， 威體Η具有複數個音孔HH，對應形成 上方，可將薄型揚聲器働所產生的聲音傳送至殼體Η外 部（如第4Α圖中箭頭所示）。如第仙圖所示，在另-變化 例中，殼體Η具有-音孔ΗΗ>及-導引通道g，音孔冊， 形成於薄型揚聲益4GG之-侧邊’藉由導引通道g可將音 孔HH，與薄型揚聲器400導通，使得薄型揚聲器彻所產BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device, and more particularly to an electronic device having a miniaturized design using a configuration of an integrated circuit board. [Prior Art] In order to facilitate the user to carry around, the design of the portable electronic device is also miniaturized. Referring to FIG. 1 , the internal structure of the conventional portable electronic device shown in FIG. 1 includes a circuit. The board 20, a main electronic unit φ (for example, an integrated circuit component) 30, a microspeaker 40, and an electromagnetic protective cover 50. The main electronic component 30 is disposed on the circuit board 20, and the electromagnetic protection cover 50 is disposed above the main electronic component 30 to shield the main electronic component 30 from being disturbed by electromagnetic radiation. The microspeaker 40 is also disposed on the circuit board 20 In addition, the portable electronic device 10 further includes other accessory electronic components (not shown) disposed on the main electronic component 30 and the periphery of the speaker 40 to fully utilize the ® space on the circuit board 20. SUMMARY OF THE INVENTION The present invention provides an electronic device including a circuit board, an electronic component, and a thin speaker. The electronic components are disposed on the circuit board. The thin speaker is disposed on the circuit board, and a thin chamber forms a chamber with the circuit board, and the electronic components are located in the chamber. The above and other objects, features and advantages of the present invention will become more <RTIgt; HTC098176/0746-A42147-TWF 3 201126321 [Embodiment] Referring to Figures 2A and 2B, the electronic device 1 of the present invention can be a mobile communication device, a PDA, a portable computer or the like. Portable electronic device. As shown in Figs. 2A and 2B, the electronic device 1A includes a circuit board 200, at least one electronic component 3 (as shown in Fig. 2B), a thin speaker 400, and a shield member 5''. As shown in FIG. 2B, the electronic component 300 is disposed on the circuit board 200. The shielding member 500 is an electromagnetic shielding cover disposed on the circuit board 200 around the electronic component 3, and has an opening 〇, a thin speaker. The 400 is a piezoelectric film speaker, an electrostatic film speaker or other thin speaker. The thin speaker 400 is disposed on the shield 500 to completely shield the opening ’, whereby a chamber c can be formed between the circuit board 200, the thin speaker 400, and the shield 500. Furthermore, the thin speaker 400 has a metal piece 400A and a diaphragm main body 400B, wherein the diaphragm main body 400B generates a sound according to the vibration of the audio signal, and the diaphragm main body 40B is mounted by the support of the metal piece 400A. On the shield 500. Referring to FIGS. 3A and 3B, in a variant, the thin speaker 400 has a first portion 401 and a second portion 402 (as shown in FIG. 3B). The first portion 401 is disposed in the chamber C. The upper portion 'the second portion 402 is connected to the first portion 401 and extends from the first portion 401 away from the chamber c and protrudes from the shielding member 500. This position can make the thin speaker 400 according to different design needs. The displacement or increased area does not affect the configuration area on the circuit board 200. Referring to Figures 4A and 4B, the electronic device 100 of the present invention further includes a housing H in which the circuit board 200, the electronic component 300, and the thin speaker HTC098176/0746-A42147-TWF 4 201126321 400 are all disposed in the housing case. As shown in Fig. 4A, the power body has a plurality of sound holes HH, correspondingly forming an upper portion, and the sound generated by the thin speaker 传送 can be transmitted to the outside of the casing (as indicated by the arrow in Fig. 4) ). As shown in the first embodiment, in another variation, the housing Η has a - sound hole ΗΗ > and - a guide channel g, a sound hole book, formed on the thin side of the thin sound of the 4GG - by guidance The channel g can connect the sound hole HH with the thin speaker 400, so that the thin speaker is completely produced.
生的聲音經由導引通以㈣導並藉由音孔HH，而傳送至 殼體Η外部（如第4B圖中箭頭所示）。 應注意的是，於上述各個實施例中，薄型揚聲器4〇〇 與遮蔽件500為兩個單獨的元件，但不限於此，薄型揚聲 器400與遮蔽件獨亦可為—體成形，也就是遮蔽件5〇〇 可作為薄型揚聲器400外殼體之—部份，例如薄型揚聲器 之金屬片400Α可與遮蔽件谓—體成形，且金屬片 400Α可自行接地，或是金屬片4〇〇Α可與遮蔽件$⑻電性 連接作為接地之用。另外，除了電子元件3〇〇之外，電子 裝置10G還包括了其他的附屬電子元件，設置於遮蔽件5〇〇 外圍。 在本發明之電子裝置1〇〇中，腔室c除了可將電子元 件300容納於其中，並藉由遮蔽件5〇〇的接地而可作為電 磁防濩之外’還可以用作薄型揚聲器4〇〇的背音腔，可增 加揚聲器的低音效果 除此之外’為了更加強揚聲器的低音效果，可在電路 板200上形成一穿孔，以上述其中之任一實施例為例，參 見第5圖，當電路板2〇〇設置於殼體Η中時，電路板2〇〇The generated sound is transmitted to the outside of the casing (via the arrow in Fig. 4B) via the guide through (4) and through the sound hole HH. It should be noted that in the above embodiments, the thin speaker 4 〇〇 and the shielding member 500 are two separate components, but are not limited thereto, and the thin speaker 400 and the shielding member may be formed separately, that is, shielded. The piece 5 can be used as a part of the outer casing of the thin speaker 400. For example, the metal piece 400 of the thin speaker can be formed with the shielding member, and the metal piece 400 can be grounded by itself or the metal piece can be The shield $(8) is electrically connected for grounding. Further, in addition to the electronic component 3, the electronic device 10G includes other accessory electronic components disposed on the periphery of the shield member 5''. In the electronic device 1 of the present invention, the chamber c can be used as a thin speaker 4 in addition to the electronic component 300 and can be used as an electromagnetic tamper by the grounding of the shielding member 5'. The back sound cavity of the cymbal can increase the bass effect of the speaker. In addition, in order to further enhance the bass effect of the speaker, a through hole can be formed on the circuit board 200. Taking any of the above embodiments as an example, see the fifth. Figure, when the circuit board 2 is placed in the casing, the circuit board 2〇〇
HTC098176/0746-Α42147-TWF 201126321 將殼體Η内空間分隔為一第一空間Sl以及一第二空間 S2第工間S1以及一第二空間S2分別位於電路板2〇〇 之相反兩側，而腔室c係形成於第一空間si甲，在腔室c 中，一穿孔了形成於電路板200上，將腔室c與第二空間 S2連通’增加薄型揚聲器_的背音腔容量;進^加 強揚聲器的低音效果。更者’參見第6圖，以上述其中之 = ’在腔室C巾增設—^帛A，並將吸音 7::金屬片—下方’藉以提升聲音的品質。 護蓋）結合，除了可節省電路板的^/面件項電磁防 500也可發揮原本的電磁遮蔽功效，另=面積:遮蔽元件 圍繞電子元件3〇〇所形成的腔室 遮蔽兀件500 _背音腔，增加薄型揚聲器_ ㈣揚聲器 整合電子裝置100的内部空間。％致果’可有效的 雖然本發明已以較佳實施例揭露如上 限定本發明，任何熟習 然其並非用以 神和範_ ’仍可作些許的更動與 ^ .【圖式二申4利範圍所界定者為準。 第1圖顯示習知電子裝置之示意圖； 第2A圖為本發明電子裝置中之示意圖； 第2B圖為第2A圖中沿A-A，之剖面示意圖； 第3A圖為本發明電子裝置中之示意圖； 第3B圖為第3A圖中沿Β·Β，之剖面示意圖 % 4Α > άΐι c β、5、6圖為本發明之變化例之示意圖。HTC098176/0746-Α42147-TWF 201126321 Separating the inner space of the casing into a first space S1 and a second space S2, the first working room S1 and the second space S2 are respectively located on opposite sides of the circuit board 2〇〇, and The chamber c is formed in the first space si, in which a perforation is formed on the circuit board 200, and the chamber c is connected to the second space S2 to increase the capacity of the back cavity of the thin speaker _; ^Strengthen the bass effect of the speaker. Further, see Fig. 6, in which the above-mentioned = ' is added to the chamber C--, and the sound-absorbing 7:: metal sheet-below' is used to enhance the quality of the sound. The cover is combined, in addition to saving the circuit board ^ / face item electromagnetic anti-500 can also play the original electromagnetic shielding effect, another = area: the shielding element around the electronic component 3 〇〇 formed by the chamber shielding element 500 _ The back sound chamber is added with a thin speaker _ (4) The speaker integrates the internal space of the electronic device 100. % 致果' is effective, although the present invention has been disclosed in the preferred embodiment as defined above, and any familiarity is not intended to be used by God and Fan _ 'can still make some changes and ^. [Figure 2 The definition is final. 1 is a schematic view of a conventional electronic device; FIG. 2A is a schematic view of the electronic device of the present invention; FIG. 2B is a schematic cross-sectional view along line AA of FIG. 2A; FIG. 3A is a schematic view of the electronic device of the present invention; Fig. 3B is a cross-sectional view along the line Β·Β in Fig. 3A, % 4 Α > άΐι c β, 5, 6 are schematic views of variations of the present invention.
HTC098176/0746-Α42147-TWF 201126321 【主要元件符號說明】 ίο可攜式電子裝置 100電子裝置 20電路板 200電路板 30主要電子元件 300電子元件 40微型揚聲器 • 400薄型揚聲器 400A金屬片 400B振膜主體 401第一部份 402第二部份 50電磁防護蓋 500遮蔽件 A吸音棉 ® C腔室 G導引通道 Η殼體 ΗΗ、ΗΗ’音孔 0開口 S1第一空間 S2第二空間 Τ穿孔HTC098176/0746-Α42147-TWF 201126321 [Description of main components] ίο Portable electronic device 100 Electronic device 20 Circuit board 200 Circuit board 30 Main electronic components 300 Electronic components 40 Micro-speakers • 400 thin speaker 400A Metal sheet 400B Diaphragm body 401 first part 402 second part 50 electromagnetic protective cover 500 shielding piece A sound absorbing cotton® C chamber G guiding channel Η housing ΗΗ, ΗΗ ' sound hole 0 opening S1 first space S2 second space Τ perforation
HTC098176/0746-Α42147-TWFHTC098176/0746-Α42147-TWF