CN110602619A - Silicon microphone packaging structure and electronic equipment - Google Patents
Silicon microphone packaging structure and electronic equipment Download PDFInfo
- Publication number
- CN110602619A CN110602619A CN201911039027.0A CN201911039027A CN110602619A CN 110602619 A CN110602619 A CN 110602619A CN 201911039027 A CN201911039027 A CN 201911039027A CN 110602619 A CN110602619 A CN 110602619A
- Authority
- CN
- China
- Prior art keywords
- radio frequency
- reflecting layer
- silicon microphone
- frequency reflecting
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 65
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 65
- 239000010703 silicon Substances 0.000 title claims abstract description 65
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 26
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 239000011135 tin Substances 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 230000000694 effects Effects 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The invention discloses a silicon microphone packaging structure and electronic equipment. Wherein, silicon microphone packaging structure includes: a substrate; a microphone assembly; the packaging shell covers the substrate, a containing cavity is formed between the packaging shell and the substrate, and the microphone assembly is placed in the containing cavity; and the radio frequency reflecting layer is arranged on the packaging shell and used for reflecting external radio frequency signals. The invention improves the problem of radio frequency interference.
Description
Technical Field
The embodiment of the invention relates to the technical field of silicon microphone packaging, in particular to a silicon microphone packaging structure and electronic equipment.
Background
Micro-Electro-Mechanical systems (MEMS) technology is a high-tech technology that has been developed at a high speed in recent years, and it uses advanced semiconductor manufacturing processes to implement batch manufacturing of devices such as sensors and drivers. Major examples of applications of MEMS devices on the market include pressure sensors, accelerometers, and silicon microphones.
Silicon microphones, also known as MEMS microphones, are microphones fabricated based on MEMS technology. Because of its advantages over ECM in terms of miniaturization, performance, reliability, environmental tolerance, cost and mass production, it rapidly dominates the consumer electronics markets such as cell phones, PDAs, MP3 and hearing aids.
When the silicon microphone is applied to a mobile phone or other signal generating devices, the performance index of the silicon microphone can be greatly affected by the radio frequency interference, and especially with the popularization of 5G networks, the capability of the silicon microphone to resist the radio frequency interference also faces a serious challenge. At present, the common silicon microphone shell on the market is mainly of a metal structure and is used for protecting an internal chip and shielding, but for a 5G network which is popularized at once, the silicon microphone is in a high-power radio frequency radiation environment, and the metal shell of the conventional silicon microphone can not effectively shield radio frequency signals. Therefore, how to effectively improve the radio frequency interference has become an urgent problem to be solved by those skilled in the art.
Disclosure of Invention
In view of the above, the present invention provides a silicon microphone package and an electronic device to improve the problem of radio frequency interference.
In order to achieve the purpose, the invention adopts the following technical scheme:
in one aspect, an embodiment of the present invention provides a silicon microphone package structure, including:
a substrate;
a microphone assembly;
the packaging shell covers the substrate, a containing cavity is formed between the packaging shell and the substrate, and the microphone assembly is placed in the containing cavity;
and the radio frequency reflecting layer is arranged on the packaging shell and used for reflecting external radio frequency signals.
In an alternative embodiment, the radio frequency reflecting layer covers the outer surface of the package housing.
In an alternative embodiment, the outer surface includes a top surface opposite the substrate and a plurality of side surfaces connected to the top surface, and the radio frequency reflecting layer covers at least one of the top surface and the plurality of side surfaces.
In an alternative embodiment, the radio frequency reflective layer is integrally formed when the radio frequency reflective layer covers the top surface and at least two consecutive adjacent faces of the plurality of side faces.
In an alternative embodiment, the radio frequency reflecting layer is adhered to the package housing, or the radio frequency reflecting layer is detachably mounted on the package housing.
In an optional embodiment, when the radio frequency reflecting layer is detachably mounted on the package housing, one of the radio frequency reflecting layer and the package housing is provided with a bayonet, and the other is provided with a clamping portion matched with the bayonet.
In an alternative embodiment, the material of the radio frequency reflecting layer comprises at least one of iron, tin, copper, aluminum, silver and gold.
In an alternative embodiment, the thickness of the radio frequency reflecting layer is greater than 0.2 microns.
In an optional embodiment, the accommodating cavity is provided with a sound inlet hole.
In another aspect, an embodiment of the present invention provides an electronic device including the silicon microphone package structure provided in any embodiment of the present invention.
The invention has the beneficial effects that: according to the silicon microphone packaging structure and the electronic equipment, the radio frequency reflecting layer is arranged on the packaging shell of the silicon microphone packaging structure, so that the radio frequency signals reaching the radio frequency reflecting layer from the outside can be reflected, the electromagnetic interference on the microphone assembly caused by the fact that the external radio frequency signals reach the microphone assembly through the packaging shell is avoided, and the problem of radio frequency interference is effectively solved.
Drawings
The above and other features and advantages of the present invention will become more apparent to those of ordinary skill in the art by describing in detail exemplary embodiments thereof with reference to the attached drawings, in which:
figure 1 is a cross-sectional view of a silicon microphone package according to an embodiment of the present invention;
figure 2 is a top view of a silicon microphone package according to one embodiment of the present invention;
figure 3 is a cross-sectional view of another silicon microphone package according to an embodiment of the present invention;
figure 4 is a cross-sectional view of another silicon microphone package according to an embodiment of the present invention;
figure 5 is a cross-sectional view of yet another silicon microphone package according to an embodiment of the present invention;
figure 6 is a cross-sectional view of a silicon microphone package according to another embodiment of the present invention;
figure 7 is a top view of a silicon microphone package structure according to another embodiment of the present invention;
figure 8 is a cross-sectional view of yet another silicon microphone package structure according to another embodiment of the present invention;
figure 9 is a cross-sectional view of another silicon microphone package according to another embodiment of the present invention;
figure 10 is a cross-sectional view of a silicon microphone package according to yet another embodiment of the present invention;
figure 11 is a cross-sectional view of another silicon microphone package according to yet another embodiment of the present invention;
figure 12 is a cross-sectional view of another silicon microphone package according to yet another embodiment of the present invention;
figure 13 is a cross-sectional view of another silicon microphone package according to yet another embodiment of the present invention.
Detailed Description
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
Figure 1 is a cross-sectional view of a silicon microphone package according to an embodiment of the present invention; figure 2 is a top view of a silicon microphone package according to an embodiment of the present invention. The silicon microphone packaging structure provided by the embodiment is suitable for electronic equipment with a microphone function, such as a mobile phone, a palm computer, an intelligent watch and the like. Specifically, as shown in fig. 1 and fig. 2, the silicon microphone package structure provided in this embodiment may include:
a substrate 10;
a microphone assembly 20;
a package housing 30 covering the substrate 10 and forming a receiving cavity with the substrate 10, wherein the microphone assembly 20 is disposed in the receiving cavity;
and a radio frequency reflection layer 40 disposed on the package housing 30 for reflecting an external radio frequency signal.
The substrate 10 may be a circuit board, the substrate of the circuit board includes but is not limited to FR4 and a ceramic substrate, and the substrate of the package housing 30 includes but is not limited to metal, polymer and FR4 material. The microphone assembly 20 may be disposed on the substrate 10, or may be disposed on an inner wall of the package housing 30; the microphone assembly 20 includes a MEMS sensor 21 and an ASIC chip 22, the MEMS sensor 21 is electrically connected to the ASIC chip 22, the ASIC chip 22 is electrically connected to the substrate 10, the MEMS sensor 21 may be a micro capacitor formed by a silicon diaphragm and a silicon back plate, and converts a sound pressure change into a capacitance change, and the ASIC chip 22 converts the capacitance change into an electrical signal, thereby implementing an acoustic-electrical conversion.
Considering that the mirror is made of glass-plated silver, the mirror can reflect light waves. Radio frequency signals are electromagnetic waves like light waves, so that the interference of the radio frequency signals to electronic elements can be reduced by a method of additionally adding a reflecting layer. Based on this, the invention can reduce or even completely block the rf signal of the external rf source (such as transceiver) from entering the interior of the silicon microphone package structure by adding the rf reflective layer. In an embodiment of the present invention, the material of the radio frequency reflecting layer 40 may include materials having high reflection characteristics for radio frequency signals, such as iron, tin, copper, aluminum, silver, and gold, and optionally, the material of the radio frequency reflecting layer includes at least one of iron, tin, copper, aluminum, silver, and gold; optionally, the thickness range of the radio frequency reflecting layer is greater than 0.2 μm, so as to improve the reflectivity of the radio frequency reflecting layer 40 for radio frequency signals, so as to reflect more radio frequency signals. In the embodiment, the radio frequency interference can be improved or even eliminated and the problem of radio frequency interference can be improved by utilizing the reflection effect of the radio frequency reflection layer 40 on the radio frequency signal and matching with the shielding effect of the package housing 30 on the radio frequency signal.
According to the technical scheme, the radio frequency reflecting layer is arranged on the packaging shell of the silicon microphone packaging structure, so that the radio frequency signals reaching the radio frequency reflecting layer from the outside can be reflected, electromagnetic interference on the microphone assembly due to the fact that the external radio frequency signals reach the microphone assembly through the packaging shell is avoided, and the problem of radio frequency interference is effectively solved.
Based on the above technical solution, optionally, the radio frequency reflecting layer covers the outer surface of the package housing. The radio frequency reflecting layer in the invention can cover the inner surface of the packaging shell, but high temperature welding is required when the packaging shell is fixed on the substrate, and the high temperature can influence the reflecting characteristic of the radio frequency reflecting layer, thereby reducing the reflecting effect on radio frequency signals. Therefore, the radio frequency reflecting layer can be arranged on the outer surface of the packaging shell, and can be arranged on the packaging shell after the packaging shell is welded on the substrate, so that the radio frequency reflecting layer is prevented from being influenced by high welding temperature, the reflecting effect of the radio frequency reflecting layer on radio frequency signals is ensured, and the installation of the radio frequency reflecting layer is facilitated.
Optionally, the outer surface includes a top surface opposite the substrate and a plurality of side surfaces connected to the top surface, and the radio frequency reflecting layer covers at least one of the top surface and the plurality of side surfaces. In some specific examples, referring to fig. 1, 3, and 4, the radio frequency reflective layer 40 covers the outer surface 100 of the package housing 30. Specifically, referring to fig. 1, the rf reflective layer 40 covers the top surface 101, and at this time, the rf reflective layer 40 can reflect the rf signals from above the silicon microphone package structure, so as to improve the rf interference above the silicon microphone package structure. Referring to fig. 3, the rf reflective layer 40 covers at least one side surface 102, and at this time, the rf reflective layer 40 can reflect the rf signals from the side surface of the silicon microphone package structure to improve the rf interference of the side surface of the silicon microphone package structure; preferably, an rf reflective layer 40 covers each side 102 to improve rf interference around the silicon microphone package. Referring to fig. 4, the rf reflective layer 40 covers the top surface 101 and each side surface 102, so as to reflect rf signals from all directions of the silicon microphone package structure, thereby completely eliminating rf interference to the microphone assembly 20. In practical arrangements of the rf reflective layer 40, the rf reflective layer 40 may be arranged according to the position of the rf source relative to the silicon microphone package structure, for example, when the rf source is located above the silicon microphone package structure, the rf reflective layer 40 is arranged on the top surface 101 of the package housing 30.
In addition, as shown in fig. 5, the radio frequency reflecting layer 40 is integrally formed when the radio frequency reflecting layer 40 covers the top surface 101 and at least two continuously adjacent surfaces of the plurality of side surfaces 102. Therefore, the manufacturing process of the radio frequency reflecting layer 40 can be simplified, the radio frequency reflecting layer 40 can be covered on a plurality of surfaces at one time, the operation of mounting the radio frequency reflecting layer 40 is reduced, and the mounting of the radio frequency reflecting layer 40 is facilitated.
In the above embodiments, the radio frequency reflecting layer may be adhered to the package housing, for example, the radio frequency reflecting layer may be adhered to the package housing by an adhesive. In other embodiments of the present invention, the radio frequency reflecting layer may be removably mounted to the package housing. Based on the above embodiments, the radio frequency reflection layer may be detachably mounted to the outer surface of the package housing, may cover the top surface and/or at least one side surface of the package housing, and the radio frequency reflection layer covering at least two continuous surfaces may also be integrally formed. In the embodiment of the invention, the radio frequency reflecting layer is detachably arranged on the packaging shell, and the radio frequency reflecting layer can be adaptively arranged on the top surface and/or the side surface of the packaging shell according to the position of the radio frequency source, so that the radio frequency interference is improved, and the flexibility of the arrangement of the radio frequency reflecting layer is improved.
Optionally, when the radio frequency reflecting layer is detachably mounted on the package housing, one of the radio frequency reflecting layer and the package housing is provided with a bayonet, and the other is provided with a clamping portion matched with the bayonet.
For example, as shown in fig. 6 and 7, taking the example of disposing the radio frequency reflection layer 40 on the top surface of the package housing 30 as an example, the top surface of the package housing 30 may be provided with a first bayonet 1, a first clamping portion 2 matched with the first bayonet 1 is formed on a side surface of the radio frequency reflection layer 40, and the radio frequency reflection layer 40 may be clamped on the top surface of the package housing 30 by matching the first bayonet 1 and the first clamping portion 2, so as to improve radio frequency interference above.
For example, as shown in fig. 8, taking the case that the radio frequency reflection layer 40 is integrally formed on the top surface and each side surface of the package housing 30 as an example, the second clamping portion 3 may be formed on at least two opposite side surfaces of the package housing 30, the inner surface of the radio frequency reflection layer 40 is provided with the second clamping portion 4 matched with the second clamping portion 3, and the radio frequency reflection layer 40 may be clamped on the package housing 30 by the matching of the second clamping portion 4 and the second clamping portion 3, and covers the entire outer surface of the package housing 30, so as to improve radio frequency interference in each direction.
It is understood that the above examples are only some specific embodiments for realizing the detachable installation of the radio frequency reflecting layer on the package housing, and the radio frequency reflecting layer can also be installed on the package housing by other movable connection methods, and the detachable installation of the radio frequency reflecting layer can also be realized by a separate fixing mechanism. For example, referring to fig. 9, a fixing mechanism 5 may be disposed on the package housing 30, and the radio frequency reflecting layer 40 may be fixed on the package housing 30 by the fixing mechanism 5, and at the same time, the radio frequency reflecting layer 40 may also be detachable from the fixing mechanism 5, where the fixing mechanism 5 may be any mechanical structure that can enable the radio frequency reflecting layer to be detachably mounted, and this embodiment is not limited thereto.
Based on any of the above embodiments, optionally, the accommodating cavity is provided with a sound inlet, for example, the substrate or the package housing may be provided with a sound inlet. Preferably, referring to fig. 1, 3, 4, 5, 6, 8 and 9, the base plate 10 is provided with a sound inlet hole 50. Thus, the sound inlet hole 50 may communicate with a sound cavity formed between the MEMS sensor 21 and the substrate 10, so that the MEMS sensor 21 senses external sound. Meanwhile, the sound inlet 50 is formed in the substrate 10, and a sound inlet does not need to be formed in the package housing 30, so that holes can be prevented from being formed in the radio frequency reflecting layer 40, the reflecting effect of the radio frequency reflecting layer 40 on radio frequency signals is improved, and radio frequency interference is further improved.
Based on any one of the above embodiments, in another embodiment of the present invention, the radio frequency reflecting layer includes a first surface and a second surface opposite to each other, the first surface contacts with an outer surface of the package housing, and the second surface may include an arc surface, a concave-convex curved surface, a sawtooth surface, or the like. Optionally, the second surface is a concave arc surface. For example, referring to fig. 10 and 11, the radio frequency reflection layer 40 covers the top surface 101 of the package housing 30, the radio frequency reflection layer 40 may be adhered to the top surface 101 of the package housing 30 by an adhesive, the first surface 401 of the radio frequency reflection layer 40 is attached to the top surface 101 of the package housing 30, and the second surface 402 of the radio frequency reflection layer 40 is a concave arc surface. In fig. 10, the rf reflective layer 40 covers the top surface 101 of the package housing 30 completely to reflect the rf signals from above the silicon microphone package structure, so as to improve the rf interference above the silicon microphone package structure; in fig. 11, the rf reflective layer 40 completely covers the top surface 101 of the package housing 30 and extends beyond the edge of the top surface 101 of the package housing 30 to reflect rf signals from above and partially from the side of the silicon microphone package structure, thereby improving rf interference above and partially from the side of the silicon microphone package structure. In addition, for example, referring to fig. 12 and 13, the rf reflective layer 40 covers the top surface 101 and each side surface 102 of the package housing 30, so as to reflect rf signals from all directions of the silicon microphone package structure, thereby completely eliminating rf interference to the microphone assembly; the rf reflective layer 40 can be clamped with the package housing 30 (for example, a clamping groove and a clamping portion are correspondingly disposed), the first surface 401 of the rf reflective layer 40 (which can be regarded as an inner surface of the rf reflective layer) contacts with an outer surface of the package housing 30, and the second surface 402 of the rf reflective layer 40 located on the top of the package housing 30 is a concave arc surface. The rf reflective layer 40 of fig. 12 and 13 may be integrally formed, and in fig. 12, the rf reflective layer 40 on the top surface 101 of the package 30 is just connected to the rf reflective layer 40 on the side surface 102 of the package 30; in fig. 13, the rf reflective layer 40 on the top side 101 of the package housing 30 extends beyond the edge of the top of the rf reflective layer on the side 102 of the package housing 30. The present embodiment is not limited to the above-mentioned various cases, and the details may be determined according to actual situations.
In addition, an embodiment of the present invention further provides an electronic device, which includes the silicon microphone package structure provided in any embodiment of the present invention. The electronic equipment can be mobile phones, palm computers, smart watches, MP3, hearing aids and other electronic equipment with microphone function.
The electronic device provided by the embodiment of the invention comprises the silicon microphone provided by the embodiment of the invention, and has corresponding functions and beneficial effects.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious modifications, rearrangements, combinations and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. A silicon microphone package structure, comprising:
a substrate;
a microphone assembly;
the packaging shell covers the substrate, a containing cavity is formed between the packaging shell and the substrate, and the microphone assembly is placed in the containing cavity;
and the radio frequency reflecting layer is arranged on the packaging shell and used for reflecting external radio frequency signals.
2. A silicon microphone package structure as claimed in claim 1 wherein the radio frequency reflecting layer covers an outer surface of the package housing.
3. A silicon microphone package structure as claimed in claim 2 wherein the outer surface comprises a top surface opposite the substrate and a plurality of side surfaces connected to the top surface, the radio frequency reflecting layer covering at least one of the top surface and the plurality of side surfaces.
4. A silicon microphone package structure as claimed in claim 3 wherein the radio frequency reflecting layer is integrally formed when the radio frequency reflecting layer covers the top surface and at least two consecutive adjacent faces of the plurality of side faces.
5. A silicon microphone package according to claim 1 wherein the radio frequency reflecting layer is adhered to the package housing or the radio frequency reflecting layer is removably mounted to the package housing.
6. A silicon microphone package structure as claimed in claim 5 wherein one of the radio frequency reflecting layer and the package housing is provided with a bayonet and the other is provided with a bayonet fitting when the radio frequency reflecting layer is detachably mounted on the package housing.
7. A silicon microphone package according to claim 1 wherein the material of the radio frequency reflecting layer comprises at least one of iron, tin, copper, aluminum, silver and gold.
8. A silicon microphone package according to claim 1 wherein the radio frequency reflecting layer has a thickness greater than 0.2 microns.
9. A silicon microphone package structure as claimed in claim 1 wherein the cavity has a sound inlet.
10. An electronic device comprising a silicon microphone package according to any of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911039027.0A CN110602619A (en) | 2019-10-29 | 2019-10-29 | Silicon microphone packaging structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911039027.0A CN110602619A (en) | 2019-10-29 | 2019-10-29 | Silicon microphone packaging structure and electronic equipment |
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| CN110602619A true CN110602619A (en) | 2019-12-20 |
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| CN201911039027.0A Pending CN110602619A (en) | 2019-10-29 | 2019-10-29 | Silicon microphone packaging structure and electronic equipment |
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| CN (1) | CN110602619A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102883254A (en) * | 2012-10-30 | 2013-01-16 | 无锡芯奥微传感技术有限公司 | Silicon microphone packaging structure |
| CN104113811A (en) * | 2014-07-21 | 2014-10-22 | 美律电子（惠州）有限公司 | Micro electro mechanical system microphone packaging structure with three-dimensional base plate and manufacturing process thereof |
| CN207911006U (en) * | 2017-10-24 | 2018-09-25 | 歌尔科技有限公司 | Product casing and MEMS microphone |
| CN208675540U (en) * | 2018-10-31 | 2019-03-29 | 歌尔科技有限公司 | MEMS microphone |
| CN209314104U (en) * | 2019-03-27 | 2019-08-27 | 歌尔科技有限公司 | MEMS microphone and electronic equipment |
| CN211063783U (en) * | 2019-10-29 | 2020-07-21 | 苏州敏芯微电子技术股份有限公司 | Silicon microphone packaging structure and electronic equipment |
-
2019
- 2019-10-29 CN CN201911039027.0A patent/CN110602619A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102883254A (en) * | 2012-10-30 | 2013-01-16 | 无锡芯奥微传感技术有限公司 | Silicon microphone packaging structure |
| CN104113811A (en) * | 2014-07-21 | 2014-10-22 | 美律电子（惠州）有限公司 | Micro electro mechanical system microphone packaging structure with three-dimensional base plate and manufacturing process thereof |
| CN207911006U (en) * | 2017-10-24 | 2018-09-25 | 歌尔科技有限公司 | Product casing and MEMS microphone |
| CN208675540U (en) * | 2018-10-31 | 2019-03-29 | 歌尔科技有限公司 | MEMS microphone |
| CN209314104U (en) * | 2019-03-27 | 2019-08-27 | 歌尔科技有限公司 | MEMS microphone and electronic equipment |
| CN211063783U (en) * | 2019-10-29 | 2020-07-21 | 苏州敏芯微电子技术股份有限公司 | Silicon microphone packaging structure and electronic equipment |
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