JP2008211466A - Microphone package, microphone mounting body, and microphone device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a microphone package, a microphone mounting body, and a microphone device, capable of downsizing, thinning, and improving yield when assembling. <P>SOLUTION: The microphone package 100 includes: a board 101 equipped with a mounting area of a microphone 104 on its upper surface; a frame body 102 which is placed on the upper surface of the board 101 in such a way as surrounding the mounting area and which forms a recessed part 103 together with the board 101; and a sound hole 108 having one opening on the upper surface of the board 101 in the recessed part 103 and the other opening outside the recessed part 103. A cover part 106 for covering one of the openings of the sound hole 108 is provided above the board 101 and below the upper surface of the frame body 102. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a microphone package having a sound hole, a microphone mounting body, and a microphone device, and more particularly, to a small microphone that can reduce entry of dust during assembly and is not easily restricted by a mounting position of a microphone element.

  2. Description of the Related Art In recent years, microphone devices that can output input sound as an electrical signal have been widely used in communication devices such as mobile phones and automobile phones, or electronic devices such as information devices such as small IC recorders using semiconductor memories. Has been.

As shown in FIG. 4, such a microphone device includes a microphone 204 that mainly outputs input sound as an electrical signal, a substrate 201 having a recess 203 for housing the microphone 204, and an upper portion of the substrate 201. The frame 202 is formed, and a lid 209 that closes the recess 203 is formed.

  There are various types of microphones 204 such as a capacitor type using static electricity, an inductive type using magnetic induction, and a piezoelectric type using distortion of a piezoelectric element. A semiconductor element in which an integrated circuit composed of an impedance conversion element, an amplifying element, etc. is formed, a fixed electrode portion formed on the surface of the semiconductor element, a spacer formed on the fixed electrode portion, and attached to the spacer And a vibrating membrane that is opposed to the fixed electrode portion at a predetermined interval.

  In addition, an electret layer is formed on the vibration film, and the vibration film vibrates due to sound from the outside, and a change in capacitance between the electret layer and the fixed electrode is output to the semiconductor element as an electric signal. It has a structure. In addition to the microphone 204, the recess 203 may contain an electronic component 205 such as a chip capacitor in order to reduce noise when converting the input sound into an electrical signal.

In an electronic device equipped with a microphone device, in order to prevent the entry of foreign matter and dust from the sound hole 216, it is common to cover the sound hole with a dust-proof film made of, for example, a cloth made of nonwoven fabric or a fine metal mesh. Has been done.
JP 2001-69596 A

  However, the conventional microphone device has a structure in which at least a microphone, a substrate, a lid, an electronic component, a spacer, a diaphragm, and the like are combined and a sound hole is formed above the microphone. Therefore, it has been difficult to reduce the thickness especially in the vertical direction.

  In addition, after attaching the lid, there is a problem that foreign matter and dust enter the recess from the sound hole formed above the microphone and the yield decreases.

  The present invention was devised in view of the above circumstances, and an object of the present invention is to provide a microphone package and a microphone mounted that can achieve further downsizing and thinning and can improve the yield during assembly. It is to provide a body and a microphone device.

  The microphone package of the present invention includes a substrate having a microphone mounting area on the upper surface, a frame formed on the upper surface of the substrate so as to surround the mounting area, and a recess formed with the substrate, and the recess A microphone package having one opening on the upper surface of the substrate and a sound hole having the other opening outside the recess, the upper surface being spaced apart from the substrate and the upper surface of the frame body Further, a cover portion that covers the one opening of the sound hole is provided below the sound hole.

  The microphone package of the present invention is preferably characterized in that the diameter of the sound hole gradually or gradually increases from the one opening toward the other opening. is there.

  The microphone package of the present invention is preferably characterized in that a sound reflecting member is provided on the lower surface of the cover.

  In the microphone package according to the present invention, it is preferable that the cover portion is a protruding portion in which a part of the frame body protrudes toward the inside of the concave portion above the substrate. Is.

  In the microphone package of the present invention, preferably, the frame body is formed of a lower layer frame body and an upper layer frame body disposed on the lower layer frame body, and the projecting portion is formed on the upper layer frame body. It is characterized by that.

  In the microphone package of the present invention, preferably, the substrate and the frame are made of a ceramic material, and the ceramic green sheet for the substrate and the ceramic green sheet for the frame are sintered. Is.

  The microphone mounting body of the present invention is characterized in that a microphone is mounted on the mounting area of the microphone package according to any one of the above, and a lid that covers the recess is mounted on the frame body. To do.

  The microphone-mounted body of the present invention is preferably characterized in that a sound reflecting member is attached to the back surface of the lid.

  In the microphone mounting body of the present invention, preferably, a cutout portion is formed on the upper surface of the frame body, and a bonding material that joins the frame body and the lid body to a part of the cutout portion. It is characterized by entering.

  In the microphone mounting body of the present invention, preferably, a cutout portion is formed on the upper surface of the frame body, and a bonding material that joins the frame body and the lid body to a part of the cutout portion. It is characterized by entering.

In the microphone device of the present invention, the microphone mounting body according to any one of the above includes electrode wiring formed around the other opening, and the external substrate on which the microphone mounting body is mounted has a second sound. A hole, and a second electrode wiring formed around the second sound hole,
The microphone mounting body is mounted on the external substrate so that the sound hole and the second sound hole are communicated with each other and the electrode wiring and the second electrode wiring are connected to each other. It is what.

  The microphone device of the present invention is preferably characterized in that the diameter of the second sound hole is formed larger than the diameter of the sound hole.

  In the microphone package of the present invention, a cover for covering one opening of the sound hole is provided above the space away from the substrate and below the upper surface of the frame body. Since it can suppress falling down and the gap | interval which dust etc. approach can be made small, the problem of a characteristic defect does not arise easily. Furthermore, since a part of the sound hole is formed on the lower side of the frame, the mounting area of the microphone package can be reduced.

  Further, according to the microphone package of the present invention, preferably, the sound hole gradually or gradually increases in diameter from one opening to the other opening. It becomes difficult to receive, and the sound entering from the sound hole can be collected efficiently.

  Further, according to the microphone package of the present invention, preferably, since the sound reflecting member is provided on the lower surface of the cover portion, the sound can be reflected toward the microphone, and is affected by the mounting position of the microphone. A difficult microphone package can be realized.

  Further, according to the microphone package of the present invention, preferably, the cover portion is a protruding portion that protrudes toward the inside of the recessed portion at an upper portion spaced apart from the substrate. The gap between the protruding portion and the sound hole can be finely adjusted depending on the size and thickness, and dust and the like can be prevented from entering the recess from the outside.

  Further, according to the microphone package of the present invention, preferably, the frame is formed of a lower frame and an upper frame arranged on the lower frame, and the protruding portion is formed on the upper frame. Since it is formed as a part thereof, a cover portion covering the upper part of the sound hole can be easily formed.

  According to the microphone package of the present invention, preferably, the substrate and the frame are made of a ceramic material, and the ceramic green sheet for the substrate and the ceramic green sheet for the frame are sintered. Since the substrate is not deformed by the heat generated when the sealing material is bonded to the upper surface of the frame body, a structure having excellent strength can be realized. Further, the electrode wiring can be formed directly without providing a new insulator in the microphone package.

  In the microphone mounting body of the present invention, the microphone is mounted on the mounting area of the microphone package described above, and the lid body that covers the recess is mounted on the frame body. Since dust or the like can be prevented from falling on the microphone, and a gap through which dust or the like enters can be reduced, the problem of poor characteristics hardly occurs.

  According to the microphone mounting body of the present invention, preferably, since the sound reflecting member is attached to the back surface of the lid body, the sound can be reflected toward the microphone, and is affected by the mounting position of the microphone. A difficult microphone package can be realized.

  According to the microphone-mounted body of the present invention, preferably, a notch is formed on the upper surface of the frame, and a bonding material for joining the frame and the lid enters into a part of the notch. The lid can be firmly joined to the upper surface of the frame.

  In the microphone device of the present invention, the microphone mounting body according to any one of the above includes electrode wiring formed around the other opening, and the external substrate on which the microphone mounting body is mounted includes the second sound hole and A second electrode wiring formed around the second sound hole so that the sound hole communicates with the second sound hole, and the electrode wiring and the second electrode wiring are connected to each other. Since the microphone-mounted body is mounted on the external substrate, it is possible to suppress the incoming sound from leaking to the outside, and to simultaneously perform electrical connection between the microphone device and the external substrate.

  The microphone device of the present invention is preferably characterized in that the diameter of the second sound hole is formed larger than the diameter of the sound hole, so that the positional deviation is caused when the microphone package and the external circuit are joined. Even if this occurs, it is possible to keep the opening as a communicating sound hole constant.

  Hereinafter, embodiments of a microphone package (microphone mounting body) according to the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1A is a plan view showing an example of an embodiment of a microphone package according to the present invention, and FIG. 1B is a cross-sectional view taken along line XX ′ of FIG. Note that FIG. 1 shows a structure seen through the lid for easy understanding of the state where the lid is joined, and the position of the lid is indicated by a broken line. In FIGS. 1A and 1B, 100 is a microphone package, 101 is a substrate, 102 is a frame, 103 is a recess, 104 is a microphone, and 105 is an electronic component such as a chip capacitor.

  The microphone package 100 includes a substrate 101 and a frame body 102, and a recess 103 for accommodating the microphone 104 is formed. The shape is, for example, a rectangular parallelepiped shape and has a concave portion 103 on the upper surface.

  In the present embodiment, the microphone package 100 includes a substrate 101 having a mounting area for the microphone 104 on the upper surface, and a frame formed on the upper surface of the substrate 101 so as to surround the mounting area and forming a recess 103 together with the substrate 101. The body 102 and a sound hole 108 having one opening on the upper surface of the substrate 101 in the recess 103 and the other opening outside the recess 103 are provided.

  Such a microphone package 100 is formed of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic sintered body.

  For example, if the microphone package 100 is made of an aluminum oxide sintered body, the plurality of ceramic green sheets to be the substrate 101 and the frame body 102 are stacked and fired. The ceramic green sheet used as the substrate 101 is, for example, a long sheet shape using raw material powders such as aluminum oxide, silicon oxide, and calcium oxide together with an organic solvent, a binder, and the like using a sheet forming technique such as a doctor blade method or a calendar roll method And can be produced by cutting it into a predetermined dimension. Moreover, the ceramic green sheet used as the frame 102 is manufactured by punching a portion of the flat ceramic green sheet that becomes the wall of the concave portion 103 by a punching process using a mold and forming the frame into a frame shape. Can do.

A microphone 104 is mounted in the recess 103 (mounting area) of the substrate 101. The microphone 104 is, for example, a condenser microphone, and mainly outputs the input sound 116 as an electric signal. The microphone 104 is formed on a semiconductor element in which an integrated circuit including an impedance conversion element, an amplification element, and the like is formed, a fixed electrode portion formed on the surface of the semiconductor element, and the fixed electrode portion. And a vibrating membrane attached to the spacer and opposed to the fixed electrode portion with a certain distance. In addition, an electret layer is formed on the vibration film, and the vibration film vibrates due to sound from the outside, and a change in capacitance between the electret layer and the fixed electrode is output to the semiconductor element as an electric signal. It has a structure.

  In addition to the microphone 104, the recess 103 may contain an electronic component 105 such as a chip capacitor in order to reduce noise when converting the input sound into electrical vibration.

  The microphone package 100 includes a cover 106 that covers one opening of the sound hole 108 above the substrate 101 and below the upper surface of the frame body 102. Since such a structure is used, it is possible to suppress dust and the like from falling on the microphone 104 from above the microphone 104, and it is possible to reduce a gap through which dust and the like enter. For example, if ½ of the area of one opening of the sound hole 108 is covered by the cover 106, the dust entry path is narrowed by ½ of the covered area, so that dust or the like enters the recess 103. It can suppress entering. In addition, in the assembly process of the microphone 104, dust such as a piece of dustproof film or fibrous foreign matter generated from an operator may enter the recess 103. Thus, a part of the sound hole 108 is covered. With the structure covered with 106, it is possible to suppress adhesion between electrode wirings connecting the microphone 104 and the other electronic components 105, and the like, thereby suppressing a decrease in yield due to a characteristic defect.

  In addition, the microphone package 100 may preferably be configured such that the diameter of the sound hole 108 gradually or gradually increases from one opening to the other opening. With such a structure, the directivity of sound is improved, and the sound 116 entering from the sound hole 108 can be collected efficiently. Therefore, it is possible to provide a microphone device suitable for an electronic device that is required to be smaller, such as a communication device such as a mobile phone or a car phone, a small IC recorder, and a hearing aid.

  Further, the inner surface of the sound hole 108 on the side away from the microphone 104 is inclined, and the inner surface of the sound hole 108 adjacent to the microphone 104 is made upright, so that the microphone 104 of the sound 116 entering from the sound hole 108 is obtained. Since the directivity to the sound is further increased, the sound 116 can be collected more effectively.

  The microphone package 100 may preferably be provided with a sound reflecting member 110 on the lower surface of the cover 106 (see FIG. 2). With such a structure, it is possible to efficiently reflect the sound 116 and realize a microphone package that is not easily affected by the mounting position in the recess 103 of the microphone 104.

  If the main sound source used by the microphone 104 is a voice uttered by a person, the sound frequency band is about several hundreds to several KHz, so that it is favorable in the sound range of about several hundreds to several thousand Hz. A material that can reflect sound is preferable as the sound reflecting member 110.

  In addition, as a structure of a sound reflection member, the thing which made the reflection efficiency of sound large by laminating | stacking the substance which has a different density is employable. For example, tantalum carbide, titanium nitride, tungsten nitride as high-density materials, silicon, glass, quartz as low-density materials, and sound reflection that can reflect sound well by depositing high-density materials on low-density materials The member 110 can be obtained. As a method of covering the high density material with the low density material, if the sound reflection member 110 is formed thin, it can be applied by chemical vapor deposition or sputtering.

  In the microphone package 100, preferably, the cover 106 may be a protrusion 106a that protrudes toward the inside of the recess 103 above a part of the frame 102 that is separated from the substrate 101 (see FIG. 3). ). With such a structure, when a part of the frame body 102 is formed as the protruding portion 106a, the gap between the protruding portion 106a and the sound hole 108 can be finely adjusted depending on the size and thickness, and dust or the like can be externally formed in the recessed portion 103 It can suppress entering into. Normally, dust-proof measures were taken by attaching a cloth to the top of the sound hole 108 with double-sided tape or adhesive after the microphone device itself was manufactured. There is a possibility that dust such as fibrous foreign matter enters into the recess 103. The size and thickness of the protrusion 106a to be formed are selected, and the gap between the protrusion 106a and the sound hole 108 is finely adjusted. Thus, it is possible to suppress dust or the like that enters into the recess 103. In addition, in the case of dust, such as the above-mentioned piece of dust-proof film or fibrous foreign matter generated by an operator, if the distance between the protrusion 106a and the sound hole 108 is about 100 to 400 μm, the dust enters the recess 103. Can be suppressed. At this time, it is desirable that the sound hole 108 having a sufficient area for sound to pass therethrough is formed so that the sound 116 from the outside of the microphone package 100 sufficiently shakes the vibrating membrane of the microphone 104. Specifically, the opening 116 is sufficiently wide and the gap between the sound hole 108 and the protruding portion 106a is narrowed, or a sound hole having a plurality of small openings is formed to transmit the sound 116 in total. It is sufficient that the opening area is sufficiently large.

  In the microphone package 100, the frame body 102 is preferably formed of the lower layer frame body 102-2 and the upper layer frame body 102-1 disposed on the lower layer frame body 102-2, and the protruding portion 106a is formed on the upper layer frame. It may be formed on the frame 102-1. With such a structure, the protruding portion 106 a can be easily formed above the sound hole 108 by changing the size of one opening forming the frame portion 102. For example, the upper layer frame 102-1 is not formed with an opening, but the lower frame 102-2 is provided with an opening, and the sound hole 108 narrower than the opening is formed in the substrate 101. The portion, that is, the inner peripheral portion of the upper layer frame 102-1 can be easily formed as the protruding portion 106.

  Here, FIG. 1 shows an example in which one sound hole 108 is formed on the inner peripheral short side of the frame body 102 of the microphone package 100. However, in order to further improve the sound collecting property of the sound 116, a plurality of sound holes 108 are provided. The sound hole 108 may be formed on the inner peripheral short side of the frame body 102. In this case, by reducing the opening area of the sound hole 108 and increasing the area of the plurality of sound holes 108, it is possible to reduce the possibility of dust such as fibrous foreign matter entering the recess 103.

  In the microphone package 100, the substrate 101 and the frame body 102 are preferably made of a ceramic material, and the ceramic green sheet for the substrate 101 and the ceramic green sheet for the frame body 102 may be sintered. Thereby, the microphone package 100 is not deformed by heat when the sealing material 111 is cured when the lid 109 is joined to the upper surface of the frame body 102, and a structure with excellent strength can be realized. Normally, when the inside of the recess 103 of the microphone package 100 is sealed, a heat treatment of about 150 ° C. is performed to cure the sealing bonding material 111, but the substrate 101 and the frame body 102 are made of ceramic. Since it is made of a material, it is difficult for the microphone package 100 to be deformed by heat, and the amount of thermal expansion and contraction is small, so that the influence on the electronic component 105 mounted in the recess 103 can be reduced. . Note that an electret layer is formed on the vibration film formed inside the microphone 104, and the vibration film vibrates due to sound from the outside, and the change in capacitance between the electret layer and the fixed electrode is used as an electric signal. The output is to the semiconductor element.

  Next, the microphone mounted body of the present invention will be described. The microphone mounting body is configured such that the microphone 104 is mounted on the mounting region of the microphone package 100 described above, and the lid body 109 that covers the recess 103 is mounted on the frame body 102. Thereby, dust or the like can be prevented from falling on the microphone 104 from above the microphone 104, and a gap through which dust or the like enters can be reduced, so that the problem of poor characteristics is less likely to occur.

For example, a cap-like member obtained by pressing a metal plate can be used as such a lid 109, and has a function of sealing the recess 103 after the microphone 104 or other electronic component 105 is accommodated. Since the sound hole 108 is not formed on the surface of the lid 109 and the sound hole 108 is not formed upward, the step of placing the lid 109 on the frame 102 so as to cover the recess 103 In this case, it is further suppressed that floating dust or the like enters the recess 103 of the microphone package 100. The microphone mounting body may preferably have the sound reflecting member 110 attached to the back surface of the lid 109. As a result, the sound 116 can be efficiently reflected toward the microphone 104, and the microphone package 100 that is hardly affected by the mounting position of the microphone 104 can be realized. A sound hole 108 having one opening on the upper surface of the substrate 101 in the recess 103 and the other opening outside the recess 103 is formed, and the sound 116 entering from the sound hole 108 is covered on the back surface of the lid 109. The sensitivity of the microphone 104 is less affected by the mounting position of the microphone 104 by being rebounded by the worn sound reflecting member 110 and efficiently entering the microphone 104 mounted on the recess 103. Here, the angle of the reflection surface of the sound reflection member 110 attached to the back surface of the lid 109 can be set at a predetermined angle in order to improve the directivity of the sound 116 to the microphone 104. At this time, the shape of the lid 109 is formed in advance so as to have an angle for improving the directivity of the sound 116 to the microphone 104, and the sound reflecting member 110 is further deposited by chemical vapor deposition or sputtering. In this case, it is not necessary to adjust the angle of the sound reflecting member 110.

  The microphone-mounted body preferably has a cutout portion 107 formed on the upper surface of the frame body 102, and a bonding material 111 for joining the frame body 102 and the lid body 109 enters a part of the cutout portion 107. You may do it. With such a structure, the lid body 109 can be firmly joined to the upper surface of the frame body 102.

  As the bonding material 111 for bonding the frame body 102 and the lid body 109, for example, an epoxy-based or polymer-based conductive adhesive containing a conductive agent such as silver, which is cured at a relatively low temperature of about 150 ° C. Is used. Here, the bonding material 111 is cured at a relatively low temperature when the vibration membrane material of the general microphone 104 is made of a fluorine resin such as FEP or a polyester resin such as Mylar. This is because it is necessary to cure at a temperature lower than the heat resistant temperature.

  In this case, a conductive adhesive can be used as the bonding material 111, and a plurality of pieces of the bonding material 111 are formed on the upper surface of the frame body 102 when the lid body 109 made of metal and the frame body 102 are bonded. By entering the notch 107, an anchor effect on the frame 102 can be obtained. As a result, the bonding material 111 and the frame body 102 are firmly bonded to each other, and a microphone device excellent in the bonding property of the lid body 109 can be realized.

  On the other hand, there has been proposed a microphone device that applies a micro-electromechanical system component technology (hereinafter abbreviated as MEMS technology). Since the microphone device of this embodiment is configured by stacking a pair of chips on a pair of silicon substrates and bonding these stacked bodies, the microphone device does not have a vibration film made of an organic material and is relatively resistant to heat. Strong structure. When this MEMS microphone device is used, it is possible to join the frame body 102 and the lid body 109 at a temperature of about 240 ° C. using a soldering material such as solder.

  Next, the microphone device of the present invention will be described. The microphone device according to the present invention includes an electrode wiring 112 in which a microphone mounting body is formed around the other opening, and an external substrate 113 on which the microphone mounting body is mounted includes a second sound hole 114 and a second sound hole 114. The second electrode wiring 115 is formed around the sound hole 108, the sound hole 108 and the second sound hole 114 are communicated with each other, and the electrode wiring 112 and the second electrode wiring 115 are connected. A microphone mounting body is mounted on the external substrate 113. This makes it difficult for a gap to be generated in the sound path between the microphone mounting body and the external board 113, so that the incoming sound 116 can be prevented from leaking to the outside, and the electrical connection between the microphone device and the external board 113 can be suppressed. Connections can be made simultaneously. In this case, if the electrode wiring 112 and the second electrode wiring 115 are connected and the gap is covered with a bonding material such as solder, it is difficult for the gap to be generated in the sound path, and therefore the sound 116 can be prevented from leaking.

  In addition, the electrode wiring 112 is formed in a circular shape along the periphery of the sound hole 108 having the other opening on the lower surface side (the lower surface side of the substrate 101) of the microphone device, and is further opened on the surface of the external substrate 113. If the second electrode wiring 115 is formed in a circular shape along the periphery of the second sound hole 114 and the electrode wiring 112 and the second electrode wiring 115 are connected to each other by a bonding material such as solder, the soldering is further performed. good. Another electric circuit is formed on the external substrate 113, and by connecting the electrode wiring 112 and the second electrode wiring 115, the electrode wiring 112 of the microphone device is electrically connected to the external substrate 113 as a ground potential, for example. .

  In the microphone device, the diameter of the second sound hole 114 is preferably larger than the diameter of the sound hole 116. Thereby, even if a positional shift occurs when the microphone package 100 and the external substrate 113 are joined, the opening as the sound hole 108 that communicates can be kept constant. For example, when the diameter of the other opening of the sound hole 108 of the microphone device is 0.8 mm and the diameter of the second sound hole 114 opening on the surface of the external substrate 113 is 1.0 mm, the microphone package 100 and If the positional deviation at the time of joining with the external substrate 113 is within 0.1 mm, the diameter of the opening as the sound hole 108 that communicates can be set to 0.8 mm.

  In addition, this invention is not limited to the example of above-mentioned embodiment, In the range which does not deviate from the summary of this invention, it can deform | transform into various forms. For example, in the above example, the shape of the sound hole and the second sound hole is circular, but may be elliptical, rectangular, or the like.

  In addition, although the example in which the sound hole is formed on the inner peripheral short side of the frame of the microphone package has been shown, one opening of the sound hole is spaced above the substrate and below the upper surface of the frame. If it is a form in which the cover part which covers is formed, it is good also as a structure formed in the other place.

(A) is a top view which shows an example of embodiment of the package for microphones of this invention, and a microphone mounting body, (b) is sectional drawing in XX '. (A) is principal part sectional drawing which shows an example of other embodiment of the package for microphones of this invention, and a microphone mounting body. (A) is principal part sectional drawing which shows an example of other embodiment of the package for microphones of this invention, and a microphone mounting body. (A) is a top view which shows an example of embodiment of the conventional package for microphones and a microphone mounting body, (b) is sectional drawing in YY '.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Microphone package 101 ... Board | substrate 102 ... Frame body 102-1 ... Upper layer frame body 102-2 ... Lower layer frame body 103 ... .. Recess 104... Microphone 105... Electronic component 106. Cover 106 a... Projection 107. 109: Lid 110 ... Sound reflection member 111 ... Bonding material 112 ... Electrode wiring 113 ... External substrate 114 ... Second Sound hole 115 ... second electrode wiring 116 ... sound

Claims (11)

A substrate provided with a microphone mounting region on the upper surface, a frame formed on the upper surface of the substrate so as to surround the mounting region, and formed with a concave portion together with the substrate;
A microphone package comprising one opening on the top surface of the substrate in the recess and a sound hole having the other opening outside the recess,
A microphone package, characterized in that a cover portion that covers the one opening of the sound hole is provided above the substrate and below the upper surface of the frame body.   2. The microphone package according to claim 1, wherein the diameter of the sound hole gradually increases or gradually increases from the one opening toward the other opening.   The microphone package according to claim 1, wherein a sound reflecting member is provided on a lower surface of the cover portion.   4. The cover according to claim 1, wherein a part of the frame body is a protruding portion that protrudes toward the inside of the concave portion above the substrate. 5. Microphone package.   5. The frame according to claim 4, wherein the frame is formed of a lower frame and an upper frame arranged on the lower frame, and the protrusion is formed on the upper frame. Microphone package.   6. The substrate according to claim 1, wherein the substrate and the frame are made of a ceramic material, and the ceramic green sheet for the substrate and the ceramic green sheet for the frame are sintered. Microphone package.   A microphone is mounted on the mounting region of the microphone package according to any one of claims 1 to 6, and a lid that covers the recess is mounted on the frame. Mounted body. The microphone mounting body according to claim 7, wherein a sound reflecting member is attached to a back surface of the lid body.   The cutout part is formed in the upper surface of the said frame, The joining material which joins the said frame and the said cover body enters in a part of this cutout, The Claim 7 or Claim 8 characterized by the above-mentioned. A microphone-equipped body according to any one of the above. The microphone-mounted body according to any one of claims 7 to 9 includes an electrode wiring formed around the other opening,
The external substrate on which the microphone mounting body is mounted includes a second sound hole and a second electrode wiring formed around the second sound hole,
The microphone mounting body is mounted on the external substrate so that the sound hole and the second sound hole are communicated with each other and the electrode wiring and the second electrode wiring are connected to each other. A microphone device.   The microphone device according to claim 10, wherein a diameter of the second sound hole is formed larger than a diameter of the sound hole.

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