CN207911006U - Product casing and MEMS microphone - Google Patents
Product casing and MEMS microphone Download PDFInfo
- Publication number
- CN207911006U CN207911006U CN201721384744.3U CN201721384744U CN207911006U CN 207911006 U CN207911006 U CN 207911006U CN 201721384744 U CN201721384744 U CN 201721384744U CN 207911006 U CN207911006 U CN 207911006U
- Authority
- CN
- China
- Prior art keywords
- product casing
- housing base
- product
- buffer layer
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011347 resin Substances 0.000 claims abstract description 7
- 229920005989 resin Polymers 0.000 claims abstract description 7
- 239000010409 thin film Substances 0.000 claims abstract description 5
- 239000003292 glue Substances 0.000 claims abstract description 4
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 230000005855 radiation Effects 0.000 abstract description 2
- 239000000047 product Substances 0.000 abstract 4
- 239000006227 byproduct Substances 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000013019 agitation Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Abstract
The utility model provides a kind of product casing and MEMS microphone, and product casing therein includes housing base and the buffer layer that is arranged on the madial wall of housing base；Wherein, buffer layer is organic thin film layer, glue layer or resin layer.Using above-mentioned utility model by product casing, Radio Frequency Interfere can be shielded, and the energy that product casing generates is forced to reduce its influence to interiors of products electronic component to external radiation.
Description
Technical field
The utility model is related to technical field of electronic products, more specifically, are related to a kind of product casing and are provided with this
The MEMS microphone of product casing.
Background technology
With the development of social progress and technology, in recent years, the electronic products volume such as mobile phone, laptop constantly subtracts
Small, people are also higher and higher to the performance requirement of these portable electronic products, to also require matched electronic component
Volume constantly reduces, performance and consistency are continuously improved.MEMS (Micro-Electro-Mechanical-System, referred to as
MEMS) the integrated MEMS microphone of technique starts by the electronic products such as batch application to mobile phone, laptop, packaging body
Product is smaller than traditional electret microphone, therefore is favored by most of microphone manufacturer.
It is fabricated currently, the shell of microphone mostly uses greatly metal material, metal shell can do a part of radio frequency
It disturbs signal reflex to go out, while can also absorb a part of Radio Frequency Interfere, and be converted into mechanical energy and thermal energy to shell
Both sides radiate, and the energy radiated to outer casing inner wall side can influence the normal operation of interiors of products electronic component etc., are formed dry
Signal is disturbed, the quality and performance of product are influenced.
Utility model content
In view of the above problems, the purpose of this utility model is to provide a kind of product casing and MEMS microphone, to solve mesh
Preceding product casing structure is single, cannot effectively be shielded completely to Radio Frequency Interfere, to influence product quality and performance
The problems such as.
Product casing provided by the utility model, including housing base and be arranged on the madial wall of housing base slow
Rush layer；Wherein, buffer layer is organic thin film layer, glue layer or resin layer.
Furthermore it is preferred that structure be, buffer layer paste, smear or be moulded on housing base.
Furthermore it is preferred that structure be, madial wall be housing base close to product electronic component side side wall.
Furthermore it is preferred that structure be that housing base is magnetic conductive part, magnetic conductive part is stainless steel part, iron-nickel alloy part or glass
Not alloy components.
The utility model also provides a kind of MEMS microphone, including the said goods shell, the electricity that is housed in product casing
The chip that road plate and setting are connected on circuit boards and with circuit board.
From technical solution above it is found that the product casing and MEMS microphone of the utility model, in housing base
Buffer layer is arranged in wall side, reduces damage of the energy to the component inside product casing in housing base by buffer layer, really
It is reliable and stable to protect properties of product.
Description of the drawings
By reference to the explanation below in conjunction with attached drawing, and with the utility model is more fully understood, this practicality is new
The other purposes and result of type will be more clearly understood and understood.In the accompanying drawings：
Fig. 1 is the product casing part section structural representation according to the utility model embodiment.
Reference numeral therein includes：Housing base 1, buffer layer 2.
Identical label indicates similar or corresponding feature or function in all the appended drawings.
Specific implementation mode
For the product casing structure of the utility model is described in detail, below with reference to attached drawing to the specific reality of the utility model
Example is applied to be described in detail.
Fig. 1 shows the product casing part section structure according to the utility model embodiment.
As shown in Figure 1, the product casing of the utility model embodiment, including housing base 1 and setting are in housing base 1
Madial wall on buffer layer 2；Wherein, buffer layer 2 can be organic thin film layer, glue layer or resin layer etc..
Specifically, buffer layer 2 can be arranged by various ways such as stickup, smearing or injection moldings on housing base 1.Example
Such as, when buffer layer 2 is organic thin film layer, which can be pasted by laminator or be manually directly sticked in shell
On matrix 1；When buffer layer 2 is resin layer, resin layer can be arranged in shell by the casting resin on housing base 1
On matrix 1.
Wherein, the madial wall of above-mentioned housing base 1 refers mainly to side of the housing base 1 close to product electronic component side
Wall is arranged buffer layer 2, can reduce the energy that housing base 1 is radiated to interiors of products, interference signal is forced to exist on the side wall
The mechanical energy or thermal energy formed in housing base 1 is most of to radiation on the outside of product, to ensure the electronics member device of interiors of products
Part is run steadily in the long term.
In a specific implementation mode of the utility model, magnetic conductive part can be used in housing base 1, and magnetic conductive part is stainless steel
Part, iron-nickel alloy part or glass not alloy components etc., to improve the magnetic permeability of product casing and its to the shield effectiveness of interference signal.
Corresponding with the said goods shell, the utility model also provides a kind of MEMS microphone, including the said goods shell,
The chip that the circuit board and setting being housed in product casing are connected on circuit boards and with circuit board.
Wherein, using the MEMS microphone of the said goods shell, interference can be forced to believe by the buffer layer of product casing
It number is radiated on the outside of product, avoids interference signal from radiating and cause the air agitation of chip perimeter to interiors of products, form noise
Signal, it is ensured that the electronic components such as interiors of products chip are not influenced by external interference signal.
By the above embodiment as can be seen that product casing provided by the utility model and MEMS microphone, Neng Gouping
The interference signal radiated to interiors of products is covered, and then most of Radio Frequency Interfere is reflexed to the outside of product casing, is reached
It enhances product performance, ensure the effect of its internal components stable operation.
Described in an illustrative manner above with reference to attached drawing according to the utility model proposes product casing and MEMS Mikes
Wind.It will be understood by those skilled in the art, however, that the product casing proposed for above-mentioned the utility model and MEMS Mikes
Wind can also make various improvement on the basis of not departing from the utility model content.Therefore, the scope of protection of the utility model
It should be determined by the content of appended claims.
Claims (4)
1. a kind of product casing, which is characterized in that including housing base and be arranged on the madial wall of the housing base
Buffer layer；Wherein,
The buffer layer is organic thin film layer, glue layer or resin layer；
The housing base is magnetic conductive part, and the magnetic conductive part is stainless steel part, iron-nickel alloy part or glass not alloy components.
2. product casing as described in claim 1, which is characterized in that
The buffer layer is pasted, smears or be moulded on the housing base.
3. product casing as described in claim 1, which is characterized in that
The madial wall is side wall of the housing base close to product electronic component side.
4. a kind of MEMS microphone, which is characterized in that including product casing as described in any one of claims 1 to 3, be housed in
Circuit board in the product casing and the chip for being arranged on the circuit board and being connected with the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721384744.3U CN207911006U (en) | 2017-10-24 | 2017-10-24 | Product casing and MEMS microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721384744.3U CN207911006U (en) | 2017-10-24 | 2017-10-24 | Product casing and MEMS microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207911006U true CN207911006U (en) | 2018-09-25 |
Family
ID=63570546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721384744.3U Active CN207911006U (en) | 2017-10-24 | 2017-10-24 | Product casing and MEMS microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207911006U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110602619A (en) * | 2019-10-29 | 2019-12-20 | 苏州敏芯微电子技术股份有限公司 | Silicon microphone packaging structure and electronic equipment |
-
2017
- 2017-10-24 CN CN201721384744.3U patent/CN207911006U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110602619A (en) * | 2019-10-29 | 2019-12-20 | 苏州敏芯微电子技术股份有限公司 | Silicon microphone packaging structure and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200616 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 266100 Qingdao, Laoshan District, North House Street investment service center room, Room 308, Shandong Patentee before: GOERTEK TECHNOLOGY Co.,Ltd. |