CN202799566U - Electromagnetic shielding assembly and electronic device comprising the same - Google Patents
Electromagnetic shielding assembly and electronic device comprising the same Download PDFInfo
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- CN202799566U CN202799566U CN201220416985.2U CN201220416985U CN202799566U CN 202799566 U CN202799566 U CN 202799566U CN 201220416985 U CN201220416985 U CN 201220416985U CN 202799566 U CN202799566 U CN 202799566U
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- heat conduction
- conduction film
- electromagnetic shielding
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Abstract
An electromagnetic shielding assembly comprises a first heat conduction film and a shielding film. The first heat conduction film is attached onto a surface of an electronic component. The shielding film is attached onto a surface of the first heat conduction film. The first heat conduction film is attached onto the surface of an electronic component, so that heat on the surface of an electronic component is dissipated or conducted. The shielding film is used for shielding the electronic component to enable electromagnetic waves radiated by the electronic component to be mutually isolated from external interference electromagnetic waves. Compared with a conventional radiating fin and a conventional metal shielding cover, the first heat conduction film and the shielding film occupy less space for miniaturization of an electronic device. The utility model also provides an electronic device comprising the above electromagnetic shielding assembly.
Description
Technical field
The utility model relates to a kind of electronic building brick, particularly relates to a kind of electromagnetic shielding component and contains the electronic device of this electromagnetic shielding component.
Background technology
Traditional electromagnetic shielding component generally all is to adopt metallic object, causes like this electromagnetic shielding component volume large, the defectives such as moulding difficulty.
Along with the development of science and technology, electronic device requires more and more exquisiter, and volume is more and more less, and function from strength to strength.But the volume of the shield assembly of at present traditional electronic device is larger.The volume of electronic device and heat dissipation problem are just more outstanding like this.In order to solve heat dissipation problem, traditional electronic device is provided for separately the radiating subassembly that dispels the heat in addition, yet radiating subassembly has taken the inner space of electronic device further, has increased the volume of electronic device.
The utility model content
Based on this, be necessary to provide a kind of electromagnetic shielding component that has heat sinking function and be beneficial to electronics miniaturization.
A kind of electromagnetic shielding component comprises:
The first heat conduction film is attached on the electronical elements surface; And
Shielded film is attached on the surface of described the first heat conduction film.
In the execution mode, described the first heat conduction film is flexible heat conduction film therein.
In the execution mode, described shielded film is the absorbing material film therein.
In the execution mode, described electronic component is fixed on the loading plate therein, and described electromagnetic shielding component is attached on the described loading plate, and coats the surface that described electronic component exposes fully.
In the execution mode, described shielded film is the flexible shielding film therein.
In the execution mode, also comprise the second heat conduction film therein, described the second heat conduction film is attached on the surface of described shielded film.
In the execution mode, described the second heat conduction film is flexible heat conduction film therein.
In the execution mode, described the first heat conduction film or described the second heat conduction film are the graphite heat conducting film therein.
A kind of electronic device that contains this electromagnetic shielding component also is provided.
A kind of electronic device comprises:
Loading plate which is provided with electronic component;
Above-mentioned electromagnetic shielding component, described electromagnetic shielding component is located on the described loading plate, and is connected with described loading plate;
Wherein, described the first heat conduction film is attached on the described electronic component.
In the execution mode, described loading plate is pcb board therein.The electronic device that contains above-mentioned electromagnetic shielding component, compare at least with the conditional electronic device and to have the following advantages:
At first, above-mentioned electronic device reaches the effect of shielding, heat radiation to electronic component by electromagnetic shielding component.And the first heat conduction film is attached on the electronical elements surface, can or conduct the dissipation of heat of electronical elements surface.Shielded film shields electronic component, and the electromagnetism that electronic component is given off involves extraneous interference electromagnetic wave isolates mutually.The first heat conduction film is compared with traditional fin and metallic shield with shielded film and is compared, and the first heat conduction film and shielded film can take less space, are conducive to electronics miniaturization.And the thickness that the first heat conduction film and shielded film can be designed to adapt to according to the requirement of electronic device volume can have been saved valuable volumetric spaces for electronic device.
Secondly, electromagnetic shielding component is attached on the loading plate, and the surface that complete coated electric components exposes.The first heat conduction film is attached to the heat that on the surface of electronic component electronic component is distributed and is transmitted on the loading plate by the first heat conduction film fast, the first heat conduction film and the distance of the second heat conduction film on loading plate are the thickness of shielded film, because the first heat conduction film and shielded film are all very thin, so the distance by loading plate between the first heat conduction film and the second heat conduction film is very short, so the heat that the first heat conduction film and loading plate come out can be transmitted to the second heat conduction film fast, by the second heat conduction film rapidly with the heat radiation clearancen, increasing heat radiation area reaches the effect of rapid heat radiation.And the thickness of the first heat conduction film, the second heat conduction film, shielded film is less, can reach preferably radiating effect.
And the first heat conduction film, the second heat conduction film are flexible heat conduction film, and shielded film is the flexible shielding film, and the first heat conduction film, the second heat conduction film and shielded film are easy to moulding on the one hand, convenient processing.The first heat conduction film, the second heat conduction film and shielded film can be saved valuable volumetric spaces for electronic device so attach easily along with the surface of electronic component on the other hand,
Shielded film is the absorbing material film, shielded film gets up the electronic component package, because the absorbing material membrane body has the performance of electromagnetic wave absorption, the interference electromagnetic wave of the electromagnetic wave that electronic component radiates and electronic component outside all absorbs, thereby reaches the shield effectiveness to electronic component.
Description of drawings
Fig. 1 be an embodiment electronic device structural representation.
Embodiment
For the ease of understanding the utility model, the below is described more fully the utility model with reference to relevant drawings.Provided preferred embodiment of the present utility model in the accompanying drawing.But the utility model can be realized with many different forms, be not limited to embodiment described herein.On the contrary, provide the purpose of these embodiment be make to disclosure of the present utility model understand more comprehensively thorough.
Need to prove that when element is called as " being fixed in " another element, can directly can there be element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be to be directly connected to another element or may to have simultaneously centering elements.Term as used herein " vertical ", " level ", " left side ", " right side " and similar statement do not represent it is unique execution mode just for illustrative purposes.
Unless otherwise defined, the employed all technology of this paper are identical with the implication that belongs to the common understanding of those skilled in the art of the present utility model with scientific terminology.Employed term is not intended to be restriction the utility model just in order to describe the purpose of specific embodiment in specification of the present utility model herein.Term as used herein " and/or " comprise one or more relevant Listed Items arbitrarily with all combinations.
See also Fig. 1 and Fig. 2, the electronic device 110 of present embodiment comprises loading plate 110 and electromagnetic shielding component 120.
Loading plate 110 is provided with electronic component 111, and electronic component 111 is fixed on the loading plate.Electronic component 111 produces heat.Loading plate 110 is pcb board.
The first heat conduction film 121 is attached on the surface of electronic component 111.The first heat conduction film 121 is flexible heat conduction film.Specifically in the present embodiment, the first heat conduction film 121 is the graphite heat conducting film.The chemical composition of graphite heat conducting film mainly is carbon.Because carbon is nonmetalloid, the conduction of metal material is still but arranged, heat conductivility, also has the same plasticity of organic plastics, and also have special hot property, chemical stability, lubricated and can be coated in the surface of solids etc. some good processing performances.Therefore, the first heat conduction film 121 has the advantages such as thermal conductivity is good, easily moulding, attaching.
Be appreciated that the first heat conduction film 121 can also be silicon rubber heat conduction film, silastic heat conduction film.
Shielded film 122 is attached on the surface of the first heat conduction film.Electromagnetic shielding component is attached on the loading plate 110, and the surface that complete coated electric components 111 exposes.Shielded film 122 is the absorbing material film.Absorbing material refers to absorb a class material of the electromagnetic wave energy that projects its surface.Shielded film 122 is electromagnetic wave shield film.Electromagnetic wave shield film is to utilize electromagnetic wave to isolate intercoupling of Electromagnetic Field in the reflection on the conductive surface and the sharp-decay propagated in conductor, thereby prevents the interference of high-frequency electromagnetic field.Shielded film 122 is the flexible shielding film.
Be appreciated that shielded film 122 can be the absorbing material films such as ferrite wave-absorbing material film, lithium Cd ferrite absorbing material film.
The second heat conduction film 123 is attached on the surface of shielded film 122.The second heat conduction film 123 is flexible heat conducting film.Specifically in the present embodiment, the second heat conduction film 123 is the graphite heat conducting film.
Be appreciated that the second heat conduction film 123 can also be silicon rubber heat conduction film, silastic heat conduction film.
The electronic device 100 that contains above-mentioned electromagnetic shielding component 120, compare at least with the conditional electronic device and to have the following advantages:
At first, above-mentioned electronic device 110 reaches the effect of shielding, heat radiation by 120 pairs of electronic components 111 of electromagnetic shielding component.And the first heat conduction film 121 is attached on electronic component 111 surfaces, can or conduct the dissipation of heat on electronic component 111 surfaces.122 pairs of electronic components 111 of shielded film shield, and the electromagnetism that electronic component 111 is given off involves extraneous interference electromagnetic wave isolates mutually.The first heat conduction film 121 is compared with traditional fin and metallic shield with shielded film 122 and is compared, and the first heat conduction film 121 can take less space with shielded film 122, is conducive to electronics miniaturization.And the thickness that the first heat conduction film and shielded film can be designed to adapt to according to the requirement of electronic device volume can have been saved valuable volumetric spaces for electronic device.
Secondly, electromagnetic shielding component is attached on the loading plate 110, and the surface that complete coated electric components 111 exposes.The first heat conduction film 121 is attached to the heat that on the surface of electronic component 111 electronic component 111 is distributed and is transmitted on the loading plate 110 by the first heat conduction film 121 fast.The first heat conduction film 121 and the distance of the second heat conduction film 123 on loading plate 110 are the thickness of shielded film 122, because the first heat conduction film 121 is all very thin with shielded film 122, so the distance by loading plate 110 between the first heat conduction film 121 and the second heat conduction film 123 is very short, then the heat on the first heat conduction film 121 need not into for a long time conduction, can be transmitted on the second heat conduction film 123, so the heat that the first heat conduction film 121 and loading plate 110 come out can be transmitted to the second heat conduction film 123 fast, by the second heat conduction film 123 rapidly with the heat radiation clearancen, increasing heat radiation area reaches the effect of rapid heat radiation.And the thickness of the first heat conduction film 121, the second heat conduction film 123, shielded film 122 is less, can reach preferably radiating effect.
And the first heat conduction film 121, the second heat conduction film 123 are flexible heat conduction film, and shielded film 122 is the flexible shielding film, and the first heat conduction film 121, the second heat conduction film 123 and shielded film 122 are easy to moulding on the one hand, convenient processing.On the other hand the first heat conduction film 121, the second heat conduction film 123 and shielded film 122 can be easily along with the surface of electronic component 111 attaches, so can be that electronic device is saved valuable volumetric spaces.
Shielded film 122 is the absorbing material film, shielded film 122 gets up electronic component 111 packages, because the absorbing material membrane body has the performance of electromagnetic wave absorption, the interference electromagnetic wave of the electromagnetic wave that electronic component 111 radiates and electronic component outside all absorbs, thereby reaches the shield effectiveness to electronic component 111.
The above embodiment has only expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model claim.Should be pointed out that for the person of ordinary skill of the art without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (10)
1. an electromagnetic shielding component is characterized in that, comprising:
The first heat conduction film is attached on the surface of electronic component; And
Shielded film is attached on the surface of described the first heat conduction film.
2. electromagnetic shielding component according to claim 1 is characterized in that, described the first heat conduction film is flexible heat conduction film.
3. electromagnetic shielding component according to claim 1 is characterized in that, described shielded film is the absorbing material film.
4. electromagnetic shielding component according to claim 1 is characterized in that, described electronic component is fixed on the loading plate, and described electromagnetic shielding component is attached on the described loading plate, and coats the surface that described electronic component exposes fully.
5. electromagnetic shielding component according to claim 1 is characterized in that, described shielded film is the flexible shielding film.
6. electromagnetic shielding component according to claim 1 is characterized in that, also comprises the second heat conduction film, and described the second heat conduction film is attached on the surface of described shielded film.
7. electromagnetic shielding component according to claim 6 is characterized in that, described the second heat conduction film is flexible heat conduction film.
8. electromagnetic shielding component according to claim 7 is characterized in that, described the first heat conduction film or described the second heat conduction film are the graphite heat conducting film.
9. an electronic device is characterized in that, comprising:
Loading plate which is provided with electronic component;
Such as electromagnetic shielding component as described in claim 1 ~ 8 any one, described electromagnetic shielding component is located on the described loading plate, and is connected with described loading plate;
Wherein, described the first heat conduction film is attached on the described electronic component.
10. electronic device according to claim 9 is characterized in that, described loading plate is pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220416985.2U CN202799566U (en) | 2012-08-21 | 2012-08-21 | Electromagnetic shielding assembly and electronic device comprising the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220416985.2U CN202799566U (en) | 2012-08-21 | 2012-08-21 | Electromagnetic shielding assembly and electronic device comprising the same |
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| Publication Number | Publication Date |
|---|---|
| CN202799566U true CN202799566U (en) | 2013-03-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201220416985.2U Expired - Lifetime CN202799566U (en) | 2012-08-21 | 2012-08-21 | Electromagnetic shielding assembly and electronic device comprising the same |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103260388A (en) * | 2013-04-24 | 2013-08-21 | 常州碳元科技发展有限公司 | Highly thermally conductive graphite film structure with function of shielding case |
| CN105578706A (en) * | 2014-09-24 | 2016-05-11 | 纬创资通股份有限公司 | circuit board assembly |
| CN106413369A (en) * | 2016-10-31 | 2017-02-15 | 努比亚技术有限公司 | Shielding case and circuit board |
| CN111343782A (en) * | 2020-04-14 | 2020-06-26 | 京东方科技集团股份有限公司 | Flexible circuit board assembly, display assembly and display device |
| CN112118720A (en) * | 2020-09-18 | 2020-12-22 | 华中科技大学 | Heat conduction wave-absorbing patch |
-
2012
- 2012-08-21 CN CN201220416985.2U patent/CN202799566U/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103260388A (en) * | 2013-04-24 | 2013-08-21 | 常州碳元科技发展有限公司 | Highly thermally conductive graphite film structure with function of shielding case |
| CN105578706A (en) * | 2014-09-24 | 2016-05-11 | 纬创资通股份有限公司 | circuit board assembly |
| CN105578706B (en) * | 2014-09-24 | 2018-08-17 | 纬创资通股份有限公司 | circuit board assembly |
| CN106413369A (en) * | 2016-10-31 | 2017-02-15 | 努比亚技术有限公司 | Shielding case and circuit board |
| CN111343782A (en) * | 2020-04-14 | 2020-06-26 | 京东方科技集团股份有限公司 | Flexible circuit board assembly, display assembly and display device |
| CN111343782B (en) * | 2020-04-14 | 2021-04-27 | 京东方科技集团股份有限公司 | Flexible circuit board assembly, display assembly and display device |
| US11991830B2 (en) | 2020-04-14 | 2024-05-21 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Flexible circuit board assembly, display assembly and display device |
| CN112118720A (en) * | 2020-09-18 | 2020-12-22 | 华中科技大学 | Heat conduction wave-absorbing patch |
| CN112118720B (en) * | 2020-09-18 | 2021-09-14 | 华中科技大学 | Heat conduction wave-absorbing patch |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130313 |
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| CX01 | Expiry of patent term |