CN208874751U - A kind of thermally conductive suction wave gasket - Google Patents
A kind of thermally conductive suction wave gasket Download PDFInfo
- Publication number
- CN208874751U CN208874751U CN201821101269.9U CN201821101269U CN208874751U CN 208874751 U CN208874751 U CN 208874751U CN 201821101269 U CN201821101269 U CN 201821101269U CN 208874751 U CN208874751 U CN 208874751U
- Authority
- CN
- China
- Prior art keywords
- thermally conductive
- heat
- layer
- suction wave
- conducting glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model provides a kind of thermally conductive suction wave gasket, is related to thermally conductive technical field.Wherein, this thermally conductive suction wave gasket includes multiple thermally conductive suction wave plates and separated type material layer, and thermally conductive suction wave plate includes the first heat-conducting glue layer set gradually, inhales wave layer and the second heat-conducting glue layer.Inhaling wave layer is the magnetic powder being evenly distributed in the first heat-conducting glue layer, and multiple thermally conductive suction wave plates are set gradually from bottom to up.Separated type material layer is Nian Jie with outermost first heat-conducting glue layer.After removing separated type material layer, thermally conductive suction wave gasket is located between electronic device (heat source) and radiating block, wave layer is inhaled by being formed in efficient heat-conducting glue layer, reach thermally conductive and electromagnetic wave absorption double effects, the thermally conductive and electromagnetic interference problem of the electronic components such as chip can be solved simultaneously.
Description
Technical field
The utility model relates to thermally conductive technical fields, in particular to a kind of thermally conductive suction wave gasket.
Background technique
With the rapid development of electronic technology, electronic product is increasingly to intelligent, integrated, lightening, multifunction etc.
Direction is developed.With the increase of circuit board integrated level and the promotion of data transmission bauds, the calorific value of the electronic devices such as chip is got over
Come it is bigger, and the component on circuit board often to adjacent component generate electromagnetic interference, cause electronic product electricity to use
Fastly, operate failure, operation slowly etc..
Inventor is the study found that in the prior art, often through applying absorbing material on electronic component, for realizing
Electromagnetic wave shielding problem.But the working principle of absorbing material is to convert thermal energy for the electromagnetic wave of absorption, will cause electronics device
The raising of part temperature is unfavorable for electronic device work.
Utility model content
The utility model provides a kind of thermally conductive suction wave gasket, it is intended to improve the thermally conductive and Electromagnetic Interference of electronic device
Problem.
The utility model is realized in this way:
A kind of thermally conductive suctions wave gasket, for setting between electronic device and radiating block, including separated type material layer and multiple
Thermally conductive suction wave plate, the thermally conductive suction wave plate include the first heat-conducting glue layer set gradually, inhale wave layer and the second heat-conducting glue layer, institute
Stating suction wave layer is the magnetic powder being evenly distributed in first heat-conducting glue layer, and multiple thermally conductive suction wave plates are successively set from bottom to up
It sets, the separated type material layer is Nian Jie with outermost first heat-conducting glue layer.
Further, in the utility model preferred embodiment, the magnetic powder is soft magnetic materials, is selected from ferrite, carbon
One of steel, silicon steel, iron-nickel alloy.
Further, in the utility model preferred embodiment, the material of first heat-conducting glue layer and described second
The material of heat-conducting glue layer is identical.
Further, in the utility model preferred embodiment, the thickness of first heat-conducting glue layer is equal to described the
The thickness of two heat-conducting glue layers.
Further, in the utility model preferred embodiment, it is described inhale wave layer with a thickness of first heat-conducting glue
0.3~0.6 times of thickness degree.
Further, in the utility model preferred embodiment, the thermally conductive suction wave gasket is equipped with 3~8 layers of thermally conductive suction
Wave plate, every layer it is described it is thermally conductive inhale wave plate with a thickness of 10~300 μm.
Further, in the utility model preferred embodiment, first heat-conducting glue layer and/or described second thermally conductive
The material of glue-line is heat-conducting silicone grease.
The beneficial effects of the utility model are: the thermally conductive suction wave gasket that the utility model obtains by above-mentioned design, uses
When, separated type material layer is removed, thermally conductive suction wave plate is arranged on heat source (electronic device), electronics can effectively be absorbed by inhaling wave layer
The electromagnetic wave that device is launched, has the function that electromagnetic shielding.And the first conductive adhesive layer and the on the downside of wave layer is inhaled by setting
Two conductive adhesive layers form good thermal conduction path, by heat derives.In addition, thermally conductive suction wave gasket is provided with multilayered thermally-conductive suction
Wave plate realizes the good shielding to electromagnetic wave, and reaches multiple conduction effect.
Detailed description of the invention
It, below will be to required in embodiment in order to illustrate more clearly of the technical solution of the utility model embodiment
The attached drawing used is briefly described, it should be understood that the following drawings illustrates only some embodiments of the utility model, therefore not
It should be considered as the restriction to range, for those of ordinary skill in the art, without creative efforts,
It can also be obtained according to these attached drawings other relevant attached drawings.
Fig. 1 is the structural schematic diagram of the thermally conductive suction wave gasket of the utility model embodiment 1；
Fig. 2 is the structural schematic diagram of the thermally conductive suction wave plate in Fig. 1；
Fig. 3 is the structural schematic diagram of the thermally conductive suction wave gasket of the utility model embodiment 2；
Fig. 4 is the change curve of the reflection loss frequency of the thermally conductive suction wave gasket of utility model embodiment 1.
Icon: the thermally conductive suction wave gasket of 100-；10, the thermally conductive suction wave plate of 10A, 10B, 10C-；The first heat-conducting glue layer of 11-；12- inhales
Wave layer；The second heat-conducting glue layer of 13-；20- separated type material layer.
Specific embodiment
It is practical below in conjunction with this to keep the purposes, technical schemes and advantages of the utility model embodiment clearer
The technical solution in the utility model embodiment is clearly and completely described in attached drawing in novel embodiment, shows
So, described embodiment is a part of embodiment of the utility model, rather than whole embodiments.It is practical based on this
Embodiment in novel, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment is fallen within the protection scope of the utility model.Therefore, the implementation to the utility model provided in the accompanying drawings below
The detailed description of mode is not intended to limit the range of claimed invention, but is merely representative of the utility model
Selected embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not making creative labor
Every other embodiment obtained under the premise of dynamic, fall within the protection scope of the utility model.
In the description of the present invention, it should be understood that term " center ", " longitudinal direction ", " transverse direction ", " length ", " width
Degree ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside",
The orientation or positional relationship of the instructions such as " clockwise ", " counterclockwise " be based on the orientation or positional relationship shown in the drawings, be only for
Convenient for description the utility model and simplify description, rather than the equipment of indication or suggestion meaning or element must have specifically
Orientation is constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features.The meaning of " plurality " is two or two in the description of the present invention,
More than, unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " Gu
It is fixed " etc. terms shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be
Mechanical connection, is also possible to be electrically connected；It can be directly connected, two can also be can be indirectly connected through an intermediary
The interaction relationship of connection or two elements inside element.It for the ordinary skill in the art, can basis
Concrete condition understands the concrete meaning of above-mentioned term in the present invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature the "upper" of second feature or it
"lower" may include that the first and second features directly contact, and also may include that the first and second features are not direct contacts but lead to
Cross the other characterisation contact between them.Moreover, fisrt feature includes above the second feature " above ", " above " and " above "
One feature is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.First is special
Sign is directly below and diagonally below the second feature including fisrt feature under the second feature " below ", " below " and " below ", or only
Indicate that first feature horizontal height is less than second feature.
Embodiment 1
Shown in referring to Figures 1 and 2, the present embodiment provides a kind of thermally conductive suction wave gaskets 100, for being arranged in electronic device
Between (heat source) and radiating block.Electronic device can be such as CPU.
Thermally conductive suction wave gasket 100 includes separated type material layer 20 and multiple thermally conductive suction wave plates 10.Thermally conductive suction wave plate 10 include according to
First heat-conducting glue layer 11 of secondary setting inhales wave layer 12 and the second heat-conducting glue layer 13.Multiple thermally conductive suction wave plates 10 from bottom to up according to
Secondary setting, separated type material layer 20 are Nian Jie with the first heat-conducting glue layer 11 on the outermost side.
Inhaling wave layer 12 is the magnetic powder being evenly distributed in 11 layers of the first heat-conducting glue layer.Magnetic powder is a kind of absorbing material, can
Absorb the electromagnetic wave energy for being transmitted to its surface.In the present embodiment, magnetic powder is soft magnetic materials, selected from ferrite, carbon steel, silicon steel,
One of iron-nickel alloy.
Further, in this embodiment the material of the first heat-conducting glue layer 11 is identical as the material of the second heat-conducting glue layer 13.
It is further preferred that the material of the first heat-conducting glue layer 11 and the second heat-conducting glue layer 13 is heat-conducting silicone grease.Such as select Xing Yongwei
YW-309, YW-310 of silica gel company production, the thermal conductivity of material reach 2.5W/mk or more.Heat-conducting silicone grease has excellent lead
Heat, insulation, antidetonation, ageing-resistant performance, can long-term work within the temperature range of -50 DEG C~300 DEG C, to the equal nothing of multiple material
Corrosiveness.
It is understood that in the other embodiments of the utility model, the first heat-conducting glue layer 11 and the second heat-conducting glue layer
13 material can also be different, as long as selecting the glue material with heat-conducting effect, such as select Nitto Denko Corp raw
Heat-conductive bonding agent TR-5912F, TR-5920F, TR-5925F of production etc..
Further, in this embodiment the thickness of the first heat-conducting glue layer 11 is equal to the thickness of the second heat-conducting glue layer 13.The
One heat-conducting glue layer 11 and 13 thickness of the second heat-conducting glue layer are equal, guarantee the thermally conductive uniform heat distribution for inhaling wave gasket, avoid part
Too high or too low for temperature, heat-conducting effect is more preferable.
Further, in this embodiment inhaling 0.3~0.6 times with a thickness of 11 thickness of the second heat-conducting glue layer of wave layer 12.
It is converted into thermal energy after inhaling 12 electromagnetic wave absorption of wave layer, then heat is conducted by the second heat-conducting glue layer 13.Inhale wave layer 12
Thickness is blocked up, then is unfavorable for heat-conducting effect, and the thickness for inhaling wave layer 12 is excessively thin, then is unable to reach good effectiveness.
Further, in this embodiment thermally conductive suction wave gasket is equipped with 3~8 layers of thermally conductive suction wave plate 10, every layer of thermally conductive suction wave plate
With a thickness of 10~300 μm.It is further preferable that thermally conductive suction wave gasket sets the thermally conductive suction wave plate that haves three layers in the present embodiment.Thermally conductive suction
Wave plate 10 with a thickness of 250 μm.Further, the first heat-conducting glue layer 11, the second heat-conducting glue layer 13 with a thickness of 95~110 μ
M, inhale wave layer 12 with a thickness of 30~40 μm, under this condition, it is thermally conductive inhale wave gasket 100 effectiveness and heat-conducting effect
It is more excellent, and shield effectiveness is high.
The magnetic powder material that multilayered thermally-conductive inhales the suction wave layer 10 in wave plate 10 can be identical, be also possible to different.Example
Such as, it can be, the material that multilayered thermally-conductive inhales the suction wave layer 12 in wave plate 10 is identical, and is soft magnetic ferrite.Soft magnetic ferrite
Have the characteristics that absorption frequency range is high, absorptivity is high, matching thickness is thin, ferrite application is can absorb leakage in electronic device
Electromagnetic radiation can achieve the purpose that eliminate electromagnetic interference.Such as ferrite can select zinc cobalt ferrites, nickel-zinc ferrite, manganese
Zn ferrite etc..
Further, in this embodiment separated type material layer 20 is oiliness release film, oiliness release film and outermost first
Heat-conducting glue layer 11 is bonded.Such as oiliness release film is Nian Jie with the first heat-conducting glue layer 11 by acrylic acid bonding agent.
Test example:
The thermally conductive absorbing property for inhaling wave gasket provided in this embodiment is tested, test specimens are as follows: thermally conductive suction wave gasket
Including three layers of thermally conductive suction wave plate, thermally conductive suction wave plate includes: the first heat-conducting glue layer (heat-conducting silicone grease, 100 μm), inhales wave layer (soft magnet
Oxygen powder MFe12O19, 35 μm), the second heat-conducting glue layer (heat-conducting silicone grease, 100 μm), test results are shown in figure 4.From fig. 4, it can be seen that
8GHz or so maximum attenuation value is -7.8db, has good absorbing property.
Embodiment 2
Provided by the utility model embodiment, the technical effect and embodiment 1 of realization principle and generation is identical, is
It briefly describes, the present embodiment does not refer to place, can refer to corresponding contents in embodiment 1.
In the present embodiment, thermally conductive suction wave gasket includes three layers of thermally conductive suction wave plate, respectively thermally conductive suction wave plate 10A, thermally conductive suction
Wave plate 10B, thermally conductive suction wave plate 10C, the wherein at least one layer thermally conductive magnetic powder for inhaling wave plate is spinel type ferrite (MFe2O4), and
At least one layer of thermally conductive magnetic powder for inhaling wave plate is hexaplanar magneto-plumbite type ferrite (MFe12O19).Spinel type ferrite
(MFe2O4) at low-frequency range (10~1000MHz) there is preferable absorbing property, and hexaplanar magneto-plumbite type ferrite
(MFe12O19) effective field of magnetocrys talline anisotropy with higher, natural resonant frequency is higher, has outstanding high frequency wave absorbtion
Energy.As shown in table 1 below, test shows that the material of the suction wave layer 12 for inhaling wave plate 10 thermally conductive compared to three layers is spinelle type
Oxysome (MFe2O4) or hexaplanar magneto-plumbite type ferrite (MFe12O19), at least one layer is spinel type ferrite (MFe2O4)
Or at least one layer of is hexaplanar magneto-plumbite type ferrite (MFe12O19) product can obtain better effectiveness.
Table 1
Above description is merely a prefered embodiment of the utility model, is not intended to limit the utility model, for
For those skilled in the art, various modifications and changes may be made to the present invention.All spirit and original in the utility model
Within then, any modification, equivalent replacement, improvement and so on be should be included within the scope of protection of this utility model.
Claims (7)
1. a kind of thermally conductive suction wave gasket, which is characterized in that for setting between electronic device and radiating block, including separated type material
Layer and multiple thermally conductive suction wave plates, thermally conductive the suctions wave plate include the first heat-conducting glue layer set gradually, suction wave layer and second lead
Hot glue layer, the suction wave layer is the magnetic powder being evenly distributed in first heat-conducting glue layer, and multiple thermally conductive suction wave plates are under
Supreme to set gradually, the separated type material layer is Nian Jie with outermost first heat-conducting glue layer.
2. thermally conductive suction wave gasket according to claim 1, which is characterized in that the magnetic powder is soft magnetic materials, is selected from iron oxygen
One of body, carbon steel, silicon steel, iron-nickel alloy.
3. thermally conductive suction wave gasket according to claim 1, which is characterized in that the material of first heat-conducting glue layer with it is described
The material of second heat-conducting glue layer is identical.
4. thermally conductive suction wave gasket according to claim 1, which is characterized in that the thickness of first heat-conducting glue layer is equal to institute
State the thickness of the second heat-conducting glue layer.
5. thermally conductive suction wave gasket according to claim 4, which is characterized in that described to inhale leading with a thickness of described first for wave layer
0.3~0.6 times of hot bondline thickness.
6. thermally conductive suction wave gasket according to claim 1, which is characterized in that the thermally conductive suction wave gasket is equipped with 3~8 layers and leads
Heat inhale wave plate, every layer it is described it is thermally conductive inhale wave plate with a thickness of 10~300 μm.
7. thermally conductive suction wave gasket according to claim 1, which is characterized in that first heat-conducting glue layer and/or described
The material of two heat-conducting glue layers is heat-conducting silicone grease.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821101269.9U CN208874751U (en) | 2018-07-12 | 2018-07-12 | A kind of thermally conductive suction wave gasket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821101269.9U CN208874751U (en) | 2018-07-12 | 2018-07-12 | A kind of thermally conductive suction wave gasket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208874751U true CN208874751U (en) | 2019-05-17 |
Family
ID=66462916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821101269.9U Active CN208874751U (en) | 2018-07-12 | 2018-07-12 | A kind of thermally conductive suction wave gasket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208874751U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111341759A (en) * | 2020-02-26 | 2020-06-26 | 京东方科技集团股份有限公司 | Display module and electronic equipment |
-
2018
- 2018-07-12 CN CN201821101269.9U patent/CN208874751U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111341759A (en) * | 2020-02-26 | 2020-06-26 | 京东方科技集团股份有限公司 | Display module and electronic equipment |
| CN111341759B (en) * | 2020-02-26 | 2022-03-11 | 京东方科技集团股份有限公司 | Display module and electronic equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104981138B (en) | A kind of manufacturing method for being electromagnetically shielded heat dissipation film | |
| CN106559974B (en) | The method of thermal interfacial material, shielding part, electronic equipment and offer thermal interfacial material | |
| CN106604606A (en) | Thermally-conductive electromagnetic interference (EMI) absorbers | |
| US20100301261A1 (en) | Electromagnetic wave absorbing and heat dissipation material | |
| CN103929933B (en) | Structure for inhibition of electromagnetic wave interference and flexible printed circuit comprising same | |
| CN206242623U (en) | A kind of heat conduction wave absorbing patch | |
| CN104972709A (en) | High-heat-dissipation wave-absorbing composite film and manufacturing method thereof | |
| CN208874751U (en) | A kind of thermally conductive suction wave gasket | |
| CN211481841U (en) | Heat dissipation absorbing material composite construction | |
| WO2016095507A1 (en) | Heat dissipation device, circuit board, and terminal | |
| CN211199101U (en) | Heat-conducting wave-absorbing material | |
| CN208509527U (en) | Electromagnetic screen | |
| CN203876307U (en) | High-heat-dissipation wave-absorbing composite film | |
| CN209210701U (en) | Inhale wave plate multi-layer compound structure | |
| CN109587940A (en) | A kind of high heat radiating metal aluminum-based copper-clad plate | |
| CN206077940U (en) | Heat conduction electromagnetic interference EMI absorber | |
| TW201320116A (en) | Electromagnetically absorbing, thermally conductive sheet and electronic instrument | |
| CN205467591U (en) | Thermal insulation piece | |
| JP5605766B2 (en) | Radio wave suppression body, electronic device including the radio wave suppression body, and radio wave suppression component | |
| CN210900215U (en) | Novel microwave absorbing material sheet with heat conduction capability | |
| CN210900214U (en) | Electromagnetic shielding and wave-absorbing shielding combined integrated composite material | |
| CN111031776A (en) | Heat conduction wave-absorbing gasket | |
| CN211210360U (en) | Heat-insulation wave-absorbing material | |
| JPH08167682A (en) | Heat sink | |
| CN208242107U (en) | A kind of thermally conductive wave absorbing patch |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |