CN104981138B - A kind of manufacturing method for being electromagnetically shielded heat dissipation film - Google Patents
A kind of manufacturing method for being electromagnetically shielded heat dissipation film Download PDFInfo
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- CN104981138B CN104981138B CN201410140979.2A CN201410140979A CN104981138B CN 104981138 B CN104981138 B CN 104981138B CN 201410140979 A CN201410140979 A CN 201410140979A CN 104981138 B CN104981138 B CN 104981138B
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- electromagnetic shielding
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 101
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims abstract description 30
- 239000002184 metal Substances 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 18
- 230000004888 barrier function Effects 0.000 claims abstract description 16
- 239000000843 powder Substances 0.000 claims abstract description 13
- 239000000853 adhesive Substances 0.000 claims abstract description 10
- 239000011230 binding agent Substances 0.000 claims abstract description 8
- 150000001875 compounds Chemical class 0.000 claims abstract description 8
- 239000004575 stone Substances 0.000 claims abstract description 8
- 239000000696 magnetic material Substances 0.000 claims abstract description 7
- 239000003054 catalyst Substances 0.000 claims abstract description 3
- 239000007791 liquid phase Substances 0.000 claims abstract description 3
- 239000012808 vapor phase Substances 0.000 claims abstract description 3
- 239000002390 adhesive tape Substances 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 12
- 230000001681 protective effect Effects 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 10
- 229910001021 Ferroalloy Inorganic materials 0.000 claims description 9
- 229910045601 alloy Inorganic materials 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 229910000640 Fe alloy Inorganic materials 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 6
- -1 Lauxite Polymers 0.000 claims description 4
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- QHCZEKMIMJAYOR-UHFFFAOYSA-N [Fe].[Zn].[Nb] Chemical compound [Fe].[Zn].[Nb] QHCZEKMIMJAYOR-UHFFFAOYSA-N 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 239000006096 absorbing agent Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 229920001971 elastomer Polymers 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 2
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 229910000604 Ferrochrome Inorganic materials 0.000 claims description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 2
- 229910000914 Mn alloy Inorganic materials 0.000 claims description 2
- 229910000676 Si alloy Inorganic materials 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- KLARSDUHONHPRF-UHFFFAOYSA-N [Li].[Mn] Chemical compound [Li].[Mn] KLARSDUHONHPRF-UHFFFAOYSA-N 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- ADCXHZZSUADYMI-UHFFFAOYSA-N cadmium lithium Chemical compound [Li].[Cd] ADCXHZZSUADYMI-UHFFFAOYSA-N 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- NVIVJPRCKQTWLY-UHFFFAOYSA-N cobalt nickel Chemical compound [Co][Ni][Co] NVIVJPRCKQTWLY-UHFFFAOYSA-N 0.000 claims description 2
- 229920001577 copolymer Polymers 0.000 claims description 2
- 230000008021 deposition Effects 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- 239000011777 magnesium Substances 0.000 claims description 2
- 239000002905 metal composite material Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 229910001120 nichrome Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 claims description 2
- 229920001568 phenolic resin Polymers 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 2
- 229920002635 polyurethane Polymers 0.000 claims description 2
- 239000004814 polyurethane Substances 0.000 claims description 2
- 239000000741 silica gel Substances 0.000 claims description 2
- 229910002027 silica gel Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- NDKWCCLKSWNDBG-UHFFFAOYSA-N zinc;dioxido(dioxo)chromium Chemical compound [Zn+2].[O-][Cr]([O-])(=O)=O NDKWCCLKSWNDBG-UHFFFAOYSA-N 0.000 claims description 2
- QVYYOKWPCQYKEY-UHFFFAOYSA-N [Fe].[Co] Chemical compound [Fe].[Co] QVYYOKWPCQYKEY-UHFFFAOYSA-N 0.000 claims 1
- LNRYQGINUXUWLV-UHFFFAOYSA-N [Mn].[Fe].[Zn] Chemical compound [Mn].[Fe].[Zn] LNRYQGINUXUWLV-UHFFFAOYSA-N 0.000 claims 1
- KSIIOJIEFUOLDP-UHFFFAOYSA-N [Si].[Fe].[Ni] Chemical compound [Si].[Fe].[Ni] KSIIOJIEFUOLDP-UHFFFAOYSA-N 0.000 claims 1
- 150000002085 enols Chemical class 0.000 claims 1
- 229910001004 magnetic alloy Inorganic materials 0.000 claims 1
- 229910000702 sendust Inorganic materials 0.000 claims 1
- 229910021484 silicon-nickel alloy Inorganic materials 0.000 claims 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 25
- 229910002804 graphite Inorganic materials 0.000 description 25
- 239000010439 graphite Substances 0.000 description 25
- 238000012360 testing method Methods 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- 239000011358 absorbing material Substances 0.000 description 4
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 235000019253 formic acid Nutrition 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 238000010792 warming Methods 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- RIVZIMVWRDTIOQ-UHFFFAOYSA-N cobalt iron Chemical compound [Fe].[Co].[Co].[Co] RIVZIMVWRDTIOQ-UHFFFAOYSA-N 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Abstract
The present invention provides a kind of electromagnetic shielding heat dissipation film and its manufacturing methods.The electromagnetic shielding heat dissipation film includes heat dissipation film layer, barrier film layer and suction wave film layer, and heat dissipation film layer therein is compound stone ink film, and barrier film layer is metal film, and it is to be mixed with the organic adhesive agent film of soft magnetic material powder to inhale wave film layer.The step of manufacturing the electromagnetic shielding heat dissipation film be：Step 1, heat dissipation film is covered in smooth high temperature resistant film layer and forms heat dissipation film layer, step 2, metal film is deposited on heat dissipation film surface by vapor phase method or liquid phase method or both combined method and forms barrier film layer, step 3, the organic binder bond for being mixed with soft magnetic material powder, which is coated in, to deposit has metal film heat dissipation film surface and cures under the action of high temperature or catalyst, 4, and the high temperature resistant film layer of stripping heat dissipation film surface obtains electromagnetic shielding heat dissipation film of the present invention.
Description
Technical field
The present invention relates to a kind of electromagnetic shielding heat dissipation film and its manufacturing methods, have the electromagnetism of electromagnetic shielding and heat sinking function
Heat dissipation film is shielded, for the electromagnetic shielding in motor and electronics industry and the inhibition of electromagnetic noise.
Background technology
With the rapid development of electronic technology, possess becoming increasingly popular for the electronic product of various personalized entertainment functions,
Electronic product is made to develop to the directions such as intelligent, integrated, lightening, multifunction rapidly.
But the increase of the speed and frequency and circuit board integrated level due to data transmission, to improving electromagnetic interference
Environment proposes increasingly higher demands to reduce the interference of adjacent component.In addition smart machine at work, can constantly outward
Emit electromagnetic wave, maximum power can reach 2w, this influence to ambient enviroment is very big.Therefore, for it is avoided to work
When each other and the interference to ambient enviroment, it is necessary to some it is unnecessary radiation limit.Therefore, use can absorb simultaneously
Absorbing material can be to avoid this respect the problem of of magnetic energy is lost, such as proposed in patent EP0667643B1 by magnetic material
It is formed with blend rubber and inhales wave film layer.
The principle of absorbing material shielding electromagnetic wave is that the electromagnetic wave of absorption is converted into thermal energy, this can cause electronic device temperature
The raising of degree can not only reduce the wave-absorbing effect for inhaling wave film, can also reduce the power consumption and stability of electronic device.
Compound stone ink film（JP1985181129A）Due to the thermal conductivity of its superelevation（800-2000 W/m·k）With it is frivolous
Feature（10-50um）, the hot spot that is increasingly becoming in Heat Conduction Material.But because its proportion is small（<2g/cm3）, cause its thermal capacity and
Heat flux is limited, it is impossible in time conduct heat.Therefore, it improves the thermal capacity of compound stone ink film and stablizes with absorbing material
Combination exist, can effectively solve absorbing material heating problem and increase its processing reliability.
The present invention provides a kind of electromagnetic shielding heat dissipation film, heat-conducting layer is compound stone ink film, provides very high heat
Diffusivity is provided with metal screen layer by sedimentation on it, effectively increases the thermal capacity of graphite film layer, and because
Metal layer is deposited directly to graphite layer surface, greatly reduces the thermal resistance between two layers.It is provided in metallic shield layer surface
Wave film layer is inhaled, in use, penetrating suction wave layer can be by metal layer reflection so as to two without absorbed electromagnetic wave part
It is secondary by inhaling wave layer, it is effective to increase electro-magnetic wave absorption effect so as to by double absorption.
Invention content
The present invention be directed to current electronic products in technical problem present on electromagnetic shielding and heat dissipation, provide a kind of same
When the comprehensive solution with excellent electromagnetic shield effectiveness and heat sinking function, be electromagnetically shielded heat dissipation film.The electromagnetic shielding
Heat dissipation film can be pasted easily on the electronic devices, while ultra-thin size requirement is met, play heat dissipation and electromagnetic screen
The function of covering.
Electromagnetic shielding heat dissipation film of the present invention includes heat dissipation film layer, barrier film layer and suction wave film layer, heat dissipation film therein
Layer is graphite film layer, and barrier film layer is metal film, and it is to be mixed with the organic adhesive agent film of soft magnetic material powder to inhale wave film layer.
Preferably, electromagnetic shielding heat dissipation film according to the present invention, the heat dissipation film one of the electromagnetic shielding heat dissipation film
Side has protective film, and in the side for inhaling wave film with double faced adhesive tape and release film, electromagnetic shielding heat dissipation film passes through after removing release film
Double faced adhesive tape fits wave film side is inhaled with electronic device, and protective film then plays protection film layer and the function of insulation.
Preferably, electromagnetic shielding heat dissipation film according to the present invention, the suction wave film one of the electromagnetic shielding heat dissipation film
Side has protective film, and in the side of heat dissipation film with double faced adhesive tape and release film, electromagnetic shielding heat dissipation film passes through after removing release film
Double faced adhesive tape fits heat dissipation film side with electronic device, and protective film then plays protection film layer and the function of insulation.
Preferably, electromagnetic shielding heat dissipation film according to the present invention, the suction wave film one of the electromagnetic shielding heat dissipation film
Side and the side of heat dissipation film are with double faced adhesive tape and release film, and electromagnetic shielding heat dissipation film is fitted in electronic device table after removing release film
Face, and outer surface can pass through other functional components of sticking double faced adhesive tape.
Preferably, electromagnetic shielding heat dissipation film according to the present invention, the heat dissipation film layer is compound stone ink film, thick
It spends for 10um-50um, thermal conductivity 800-2000W/mk.The high thermal conductivity of compound stone ink film can be that electronic device is generating heat
The heat come out on point is diffused to rapidly on entire graphite film, so as to realize that it is efficiently dissipated by increasing heating area
Hot property.
Preferably, electromagnetic shielding heat dissipation film according to the present invention, the conjunction of the compound stone ink film of the heat dissipation film layer
It is into method, by Kapton under the protection of inert gas, with 5-20OThe speed of C/min rises to 500 from room temperatureOC/
Min simultaneously keeps the temperature 1-5 hour, thereafter with 5-10OThe speed of C/min is warming up to 800-1200OC simultaneously keeps the temperature 1-5 hour, and then
With 5-10OThe speed of C/min is warming up to 2600-3200OC simultaneously keeps the temperature 1-5 hour, obtains graphite film after cooling, firing is obtained
Graphite film by calendering the graphite membrane product with required thickness and smooth surface is made.
Preferably, electromagnetic shielding heat dissipation film according to the present invention, the barrier film layer are metal film, and material is
Gold, silver, copper, nickel, iron, aluminium, zinc, titanium, chromium, cobalt or alloy.The metal film be the film of single metal or be two layers or
The metal composite film that more than two layers of different metal is formed, thickness 5nm-50um.
Preferably, electromagnetic shielding heat dissipation film according to the present invention, the making side of the metal film of the barrier film layer
Method is physical vaporous deposition（PVD), chemical vapour deposition technique（CVD), evaporation coating method, magnetron sputtering method, chemical plating, plating
Or its combination process is formed.
Preferably, electromagnetic shielding heat dissipation film according to the present invention, the suction formed as 50-90% of the suction wave film
Wave agent and the organic binder bond of 10-40%, thickness 20um-1mm are more than 50 in the magnetic conductivity of 1MHz frequencies.
Preferably, electromagnetic shielding heat dissipation film according to the present invention, the material of the wave absorbing agent is non-retentive alloy
Powder includes but are not limited to nickel zinc ferroalloy, ambrose alloy ferroalloy, zinc chrome ferroalloy, MnZn ferroalloy, niobium zinc-iron alloy, iron
Silico-aluminum, nichrome, niobium zinc-iron alloy, iron-nickel alloy, ferroaluminium, ferrocobalt, ferrochrome, iron tantnickel close
Gold, iron, silicon, aluminum and nickel alloy, magnesium manganeisen, cobalt-nickel alloy, lithium manganese alloy or lithium cadmium ferroalloy.
Preferably, electromagnetic shielding heat dissipation film according to the present invention, the organic binder bond are high molecular material, are wrapped
It includes but is not limited only to phenolic resin, Lauxite, epoxy resin, acrylic resin, polyvinyl butyral resin, vinyl acetate
And its copolymer, organic silica gel resinoid, polyurethane, rubber resin or their polymer.
The present invention also provides a kind of manufacturing method for being electromagnetically shielded heat dissipation film, this method includes：
Step 1, heat dissipation film is covered in the smooth high temperature resistant film layer in surface；
Step 2, by metal film, by vapor phase method or liquid phase method, combined method is deposited on the heat dissipation film table of step 1 again or both
Face,
Step 3, soft magnetic material powder and organic binder bond are mixed and high-speed stirred is uniformly mixed, pass through inverse painting, net
Roller coating cloth, blade coating, the modes such as spraying or slot coated are coated in the metallic film surface of step 2 and in the effects of high temperature or catalyst
Lower curing,
Step 4, the high temperature resistant film layer of stripping heat dissipation film surface obtains electromagnetic shielding heat dissipation film of the present invention.
Preferably, according to above-mentioned manufacturing method, the material of high temperature resistance diaphragm is the indeformable material at a temperature of more than 100oC
Material, such as high-temperature resistance plastice, glass, stainless steel, ceramics.
Electromagnetic shielding heat dissipation film of the present invention, structure include graphite radiating film layer, metallic diaphragm and suction wave film layer,
This multilayered structure not only has its unique function, and each layer can be cooperateed with mutually, enhance whole heat dissipation and electromagnetism for every layer
Shield effectiveness.
In terms of heat sinking function, since metal layer has higher density（Such as copper 8.9g/cm3）, therefore ratio of heat capacities
It is larger, temperature is reduced, and because of it as heat sink a part of heat of storage when electronic device calorific value is bigger
High thermal conductivity（Such as copper 400W/mk）It can also assist heat transfer.And wave layer is inhaled because it is up to the alloy packing ratio of 50-90%,
It can also be used as it and heat sink store heat.
It in terms of electromagnetic shielding, metal film and inhales wave film all there is electro-magnetic screen function, but the mechanism of its shielding not phase
Together.Metal film belongs to the shielding material based on reflection loss, and it is then to reach shielding electromagnetic wave by magnetic hystersis loss to inhale wave film
Function.After metal film and suction wave film are combined, in application process, electromagnetic wave is absorbed damage by inhaling wave film first
Consumption, unabsorbed part are consumed after then passing through suction wave film by the reflection loss of metal film.After by Metal film reflector, remain
Remaining electromagnetic wave, which can again pass through, inhales wave film, so as to which by suction wave film, second absorbs, so as to greatly enhance effectiveness.
And graphite is used as conductive material in itself, it may have certain effectiveness, it can be to projecting the electromagnetic waveforms of metal film
Into certain shield effectiveness.
From the point of view of whole design structure, metal film is produced on graphite film by depositing, in graphite film and metal
There is no the bonding material of the high thermal resistance of double faced adhesive tape etc between film, ensure that heat quickly passes between graphite film and metal film
It leads.Also, because the surface of graphite film is dispersed with the micropore of nano-scale, by deposition method, metal can be deposited on this slightly
So as to increase the contact area with graphite film, adhesion effect can be more firm than pasting, it is not easy to be shelled due to graphite laminated in hole
It falls.Finally, the surface of graphite film can be than relatively low, it is not easy to organic binder bond is coated on it, and metal film can as middle layer
The adhesive property of wave film on it is inhaled with effective increase.
Description of the drawings
The present invention will be described in more detail below in conjunction with the accompanying drawings.
Fig. 1 is the structure chart of one embodiment of electromagnetic shielding heat dissipation film of the present invention.
Fig. 2 is the structure chart of another embodiment of electromagnetic shielding heat dissipation film of the present invention.
Fig. 3 is the structure chart of another embodiment of electromagnetic shielding heat dissipation film of the present invention.
Fig. 4 is the electromagnet shield effect figure of embodiment 1.
Fig. 5 is the electromagnet shield effect figure of embodiment 2.
Fig. 6 is the flow chart of the manufacturing method of electromagnetic shielding heat dissipation film of the present invention.
Specific embodiment
With reference to the accompanying drawings, the present invention is further illustrated in conjunction with specific embodiments.
Embodiment 1：As shown in Figure 1, electromagnetic shielding heat dissipation film includes heat dissipation film layer 11, barrier film layer 12 and suction wave film layer
13, it is therein heat dissipation film layer 11 be 25um graphite film, thermal conductivity be 1600 W/mk, barrier film layer 12 be copper foil, thickness
For 20um, wave film 13 is inhaled for the thin of the epoxy resin adhesive of the Fe-Ni Alloy Powder containing 80% weight ratio and 20% weight ratio
Film, thickness 50mm, magnetic conductivity are 120 in 1MHz.
Embodiment 2：As shown in Figure 1, the graphite film that the heat dissipation film layer 11 in electromagnetic shielding heat dissipation film is 10um, heat conduction
Rate is 1900 W/mk, and barrier film layer 12 is aluminium foil, and thickness 40um, it is the iron-nickel alloy containing 70% weight ratio to inhale wave film 13
The film of powder and the epoxy resin adhesive of 30% weight ratio, thickness 30mm, magnetic conductivity are 90 in 1MHz.
Embodiment 3：As shown in Fig. 2, electromagnetic shielding heat dissipation film includes heat dissipation film layer 11, barrier film layer 12 and suction wave film layer
13, it is therein heat dissipation film layer 11 be 25um graphite film, thermal conductivity be 1600 W/mk, barrier film layer 12 be copper foil, thickness
For 20um, wave film 13 is inhaled for the thin of the epoxy resin adhesive of the Fe-Ni Alloy Powder containing 80% weight ratio and 20% weight ratio
Film, thickness 50mm, magnetic conductivity are 120 in 1MHz.Have the PET protective films 14 of 25um on wave film 13 is inhaled（Gather to benzene two
Formic acid glycol ester）, have 10um acrylic acid adhesives double faced adhesive tape 15 on 11 surface of graphite film and contact surface be coated with the PET of silicone oil
Release film layer 16, thickness 50um.
Embodiment 4：As shown in figure 3, electromagnetic shielding heat dissipation film includes heat dissipation film layer 11, barrier film layer 12 and suction wave film layer
13, it is therein heat dissipation film layer 11 be 25um graphite film, thermal conductivity be 1600 W/mk, barrier film layer 12 be copper foil, thickness
For 20um, wave film 13 is inhaled for the thin of the epoxy resin adhesive of the Fe-Ni Alloy Powder containing 80% weight ratio and 20% weight ratio
Film, thickness 50mm, magnetic conductivity are 120 in 1MHz.Have the PET protective films 14 of 25um on graphite film 11（Gather to benzene two
Formic acid glycol ester）, silicone oil is coated with inhaling acrylic acid adhesive double faced adhesive tape 15 and contact surface of 13 surface of wave film with 10um thickness
PET release film layers 16, thickness 50um.
Shield effectiveness is tested：Shield effectiveness（dB）It is to pass through Agilent E5061A in accordance with ASTM-D-4935 testing standards
Vector network tester, the test of DN1015 shield effectiveness test device, the results are shown in Fig. 4 and Fig. 5.It can by test result
Know, in the frequency range of 0-1GHz, the electromagnetic shielding effectiveness of embodiment 1 is average 96dB, the electromagnetism wave screen of embodiment 1
It is average 85dB to cover efficiency.
Thermal conductivity test experiments：Thermal conductivity test is to be led in accordance with ASTM-E-1461 testing standards by the resistance to LFA 447 that speeds
Hot coefficient tester test, the results are shown in tables 1.By test result it is found that the thermal conductivity factor of embodiment 1 is 1605.317
W/mk, and the thermal conductivity factor of embodiment 2 is 1909.385 W/mk.
Shield effectiveness and thermal conductivity test experiments the result shows that, high heat dissipation of the invention inhale wave composite membrane with respect to
The composite material pasted heat conducting film and inhale wave film has significantly excellent electromagnetic shielding and heat dissipation effect.
Table 1, thermal conductivity test result
| Sample | Environment temperature（℃） | Model | Thermal diffusion coefficient（mm2/s） | Thermal conductivity factor（W/m·K） |
| Embodiment 1 | 25.0 | In Plan, isotropism | 933.324 | 1605.317 |
| Embodiment 2 | 25.0 | In Plan, isotropism | 1110.108 | 1909.385 |
Embodiment 5：The present invention provides a kind of manufacturing method for being electromagnetically shielded heat dissipation film, as shown in fig. 6, this method packet
It includes：
Step 1, heat dissipation film is covered in the smooth Thin Stainless Steel on piece in surface using compounding machine,
Step 2, using chemical vapour deposition technique（CVD）Using the divalent complex Cu of copper(II)(hfac)2As predecessor,
Using hydrogen as carrier gas, 250oThe metallic copper film layer of 10nm is deposited under C normal pressures on graphite guide hotting mask.Later, using copper sulphate as
Electroplate liquid continues galavanic growth copper film layer on the copper film formed with CVD method, until the thickness of copper film reaches 25um,
Step 3, the epoxy resin adhesive of the Anhyster powder for being mixed with 80% weight ratio and 20% weight ratio is existed
It is uniformly mixed in agitator tank and in copper film layer surface and is formed by curing the suction wave film layer of 50umm using coater.
Step 4, the stainless steel thin slice being in contact with graphite film is removed, obtains electromagnetic shielding heat dissipation film.
In use, double faced adhesive tape can be attached to the graphite film side of electromagnetic shielding heat dissipation film or inhale wave film side, and paste
The electronical elements surface for needing to radiate and be electromagnetically shielded is overlayed on, so as to reach reduction device temperature, prevents the effect of electromagnetic interference.
The heat dissipation film side of described electromagnetic shielding heat dissipation film with protective film, the side for inhaling wave film with double faced adhesive tape and
Release film, electromagnetic shielding heat dissipation film is fitted by double faced adhesive tape by wave film side is inhaled with electronic device after removing release film, and is protected
Cuticula then plays protection film layer and the function of insulation.
The suction wave film side of described electromagnetic shielding heat dissipation film with protective film, the side of heat dissipation film with double faced adhesive tape and
Release film, electromagnetic shielding heat dissipation film is fitted heat dissipation film side with electronic device by double faced adhesive tape after removing release film, and is protected
Cuticula then plays protection film layer and the function of insulation.
The side for inhaling wave film side and heat dissipation film of the electromagnetic shielding heat dissipation film is with double faced adhesive tape and release film, stripping
Electronic device surface is fitted in from heat dissipation film is electromagnetically shielded after release film, and outer surface can pass through other functions of sticking double faced adhesive tape
Component.
Claims (1)
1. a kind of manufacturing method for being electromagnetically shielded heat dissipation film, it is characterised in that：
The electromagnetic shielding heat dissipation film includes heat dissipation film layer, barrier film layer and inhales wave film layer；
The film layer that radiates is compound stone ink film, thickness 10um-50um, thermal conductivity 800-2000W/mk；
The barrier film layer is metal film, and material is gold, silver, copper, nickel, iron, aluminium, zinc or alloy, and the metal film is single
The film of metal or the metal composite film formed for the different metal on two layers or two layers, thickness 5nm-50um；
The suction wave film layer is to be mixed with the organic adhesive agent film of soft magnetic material powder；The composition for inhaling wave film layer is 70%-90%
Wave absorbing agent and 10%-30% organic binder bond, thickness 20um-1mm, 1MHz frequencies magnetic conductivity be more than 50；
The material of the wave absorbing agent is soft magnetic alloy powder, including nickel zinc ferroalloy, ambrose alloy ferroalloy, zinc chrome ferroalloy, manganese
Zinc-iron alloy, niobium zinc-iron alloy, sendust, nichrome, niobium zinc-iron alloy, iron-nickel alloy, ferroaluminium, iron cobalt close
Gold, ferrochrome, iron silicon nickel alloy, iron, silicon, aluminum and nickel alloy, magnesium manganeisen, cobalt-nickel alloy, lithium manganese alloy or lithium cadmium ferroalloy；
The organic binder bond is high molecular material, including phenolic resin, Lauxite, epoxy resin, acrylic resin, poly- second
Enol butyral resin, vinyl acetate and its copolymer, organic silica gel resinoid, polyurethane, rubber resin or theirs is poly-
Close object；
The manufacturing method includes the following steps：
Step 1, heat dissipation film is covered in the smooth high temperature resistant film layer in surface；The material of the high temperature resistance diaphragm is more than 100
Indeformable material at a temperature of DEG C；
Step 2, by heat dissipation film surface of the metal film by vapor phase method or liquid phase method or both combined method deposition in step 1；
Step 3, by the organic binder bond for the being mixed with soft magnetic material powder metallic film surface that is formed in step 2 of coating and in height
Cure under the action of temperature or catalyst；
Step 4, the high temperature resistant film layer of stripping heat dissipation film surface obtains electromagnetic shielding heat dissipation film；
In addition,
The electromagnetic shielding heat dissipation film side or suction wave film side have double faced adhesive tape to fit with electronic device；
Alternatively,
The heat dissipation film side of the electromagnetic shielding heat dissipation film is with protective film, in the side for inhaling wave film with double faced adhesive tape and release
Film, electromagnetic shielding heat dissipation film is fitted by double faced adhesive tape by wave film side is inhaled with electronic device after removing release film, and protective film
Then play protection film layer and the function of insulation；
Alternatively,
The suction wave film side of the electromagnetic shielding heat dissipation film is with protective film, in the side of heat dissipation film with double faced adhesive tape and release
Film, electromagnetic shielding heat dissipation film is fitted heat dissipation film side with electronic device by double faced adhesive tape after removing release film, and protective film
Then play protection film layer and the function of insulation；
Alternatively,
It is removed release with double faced adhesive tape and release film the side for inhaling wave film side and heat dissipation film of the electromagnetic shielding heat dissipation film
Heat dissipation film is electromagnetically shielded after film and is fitted in electronic device surface, and outer surface can pass through other functional components of sticking double faced adhesive tape.
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| CN201410140979.2A CN104981138B (en) | 2014-04-10 | 2014-04-10 | A kind of manufacturing method for being electromagnetically shielded heat dissipation film |
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