CN110746782A - High-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and laminating and preparation method thereof - Google Patents
High-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and laminating and preparation method thereof Download PDFInfo
- Publication number
- CN110746782A CN110746782A CN201911052124.3A CN201911052124A CN110746782A CN 110746782 A CN110746782 A CN 110746782A CN 201911052124 A CN201911052124 A CN 201911052124A CN 110746782 A CN110746782 A CN 110746782A
- Authority
- CN
- China
- Prior art keywords
- wave
- silica gel
- absorbing
- die cutting
- gel gasket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/02—Organic and inorganic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/042—Graphene or derivatives, e.g. graphene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2265—Oxides; Hydroxides of metals of iron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2265—Oxides; Hydroxides of metals of iron
- C08K2003/2275—Ferroso-ferric oxide (Fe3O4)
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Sealing Material Composition (AREA)
Abstract
The invention relates to the technical field of functional materials, in particular to a high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching and a preparation method thereof; the composition comprises the following components in parts by mass: silicone oil: 5% -30%; electromagnetic wave-absorbing powder: 65.5% -95%; catalyst: 0.1% -2%; a crosslinking agent: 0.1% -2%; defoaming agent: 0.1% -1.5%; antioxidant: 0.1% -1%; the high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching has the advantages of good flexibility, convenience for individualized die cutting shape, high heat conductivity coefficient, quick heat dissipation, high-frequency magnetic conductivity, good wave-absorbing effect and convenience for forming and processing by coating the heat-conducting wave-absorbing material on the polyester release material layer; the preparation method of the high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching has the advantages of simple process, good flexibility and convenience for individualized die cutting.
Description
Technical Field
The invention relates to the technical field of functional materials, in particular to a high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching and a preparation method thereof.
Background
The heat-conducting wave-absorbing material is a bifunctional composite material integrating heat management and wave-absorbing functions. The material can be used between integrated circuits, heat sinks, other heat conducting elements and metal substrates, and the product can inhibit unnecessary electromagnetic energy coupling, resonance and surface current generated by electromagnetic interference besides solving the problem of heat conduction in the material. The material can be widely applied to electronic components and equipment such as communication equipment, network terminals, storage equipment, consumer electronics, power supply devices and the like.
With the rapid development of electronic communication technology, the heat dissipation requirements of light, thin and integrated electronic products are increasing, and meanwhile, the electromagnetic interference between electronic components can also interfere the signal receiving and processing of the electronic products. In the prior art, in order to meet the requirements of electromagnetic shielding and use, one scheme is to attach adhesives to two surfaces of a multilayer wave-absorbing material so as to achieve the purposes of wave absorption and attachment, and the method has low heat dissipation performance, and the finished product has a limited thickness adjustment range and heat dissipation; the other scheme is that the wave-absorbing alloy powder is added into silicone oil to prepare a paste material, the paste material is inconvenient to use, special equipment such as a dispenser and the like is required to be used, die cutting is inconvenient, the magnetic conductivity is low, and the heat dissipation performance is general.
Disclosure of Invention
The purpose of the invention is: the defects in the prior art are overcome, the high-performance wave-absorbing and heat-conducting silica gel gasket convenient for die cutting and attaching is provided, the silica gel gasket has the advantages of being good in flexibility and convenient for individualized die cutting shapes, and the wave-absorbing material is high in heat conductivity coefficient, fast in heat dissipation, high in high-frequency magnetic conductivity, good in wave-absorbing effect and convenient to mold and process.
Another object of the invention is: the preparation method has the advantages of simple process and high production efficiency, and the prepared wave-absorbing heat-conducting silica gel gasket has the advantages of good flexibility and convenience in individualized die cutting shape, and the wave-absorbing material has the advantages of high heat conductivity coefficient, quick heat dissipation, high-frequency magnetic conductivity and good wave-absorbing effect.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows:
the utility model provides a high performance is inhaled ripples heat conduction silica gel gasket convenient to cross cutting laminating which the part by mass constitutes as follows:
silicone oil: 5% -30%;
electromagnetic wave-absorbing powder: 65.5% -95%;
catalyst: 0.1% -2%;
a crosslinking agent: 0.1% -2%;
defoaming agent: 0.1% -1.5%;
antioxidant: 0.1% -1%;
furthermore, the silicone oil is one or more of methyl silicone oil, phenyl silicone oil, methyl ethoxy silicone oil, methyl trifluoro propyl silicone oil, methyl vinyl silicone oil and methyl hydroxyl silicone oil.
Further, the viscosity of the silicone oil is 200-3000cps at the temperature of 25 ℃.
Furthermore, the electromagnetic wave-absorbing powder material is one or more of ferrite powder, iron-nickel alloy powder, iron-silicon-aluminum alloy powder, carbonyl iron powder and graphene oxide powder.
Furthermore, the D50 particle size of the electromagnetic wave-absorbing powder is 5-100 μm.
Further, the catalyst is one or more of dibutyl tin dilaurate, stannous octoate and methyl vinyl dipyrrolidone silane.
Further, the cross-linking agent is one or more of ethyl orthosilicate, an organic silicon compound and dicumyl peroxide.
Further, the defoaming agent is one or more of an organic silicon type defoaming agent and a fluorine-containing defoaming agent.
Further, the antioxidant is one or more of a multi-element hindered phenol antioxidant and a phosphite antioxidant.
A preparation method of a high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and fitting comprises the following steps:
(1) uniformly mixing the selected silica gel, adding the wave-absorbing powder, the defoaming agent and the antioxidant at a certain stirring speed, stirring for 2 hours, uniformly mixing, adding the catalyst and the crosslinking agent, and finally defoaming for 1 hour under the vacuum of 0.08MPa to prepare the heat-conducting wave-absorbing slurry;
(2) and coating the uniformly mixed slurry on a polyester release layer, and baking for 20min at 150 ℃ to obtain a finished product of the heat-conducting wave-absorbing coiled material for later use.
The technical scheme adopted by the invention has the beneficial effects that:
the high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching has the advantages of good flexibility, convenience in individualized die cutting shape, high heat conductivity coefficient, high heat dissipation speed, high-frequency magnetic conductivity, good wave-absorbing effect and convenience in forming and processing.
The preparation method of the high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching has the advantages of simple process, good flexibility and convenience for individualized die cutting.
Drawings
Fig. 1 is a performance test chart of the high-performance wave-absorbing heat-conducting silica gel gasket in embodiment 4 of the invention.
Detailed Description
The following examples are intended to provide those skilled in the art with a more complete understanding of the present invention, and are not intended to limit the scope of the present invention. Reference herein to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic may be included in at least one implementation of the invention. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments.
Example 1
Methyl ethoxy silicone oil (25 ℃, 1000 cps): 25.5 percent;
ferrite powder (D50: 30 μm): 50 percent;
carbonyl iron powder (D50: 10 μm): 20 percent;
dibutyl tin dilaurate: 0.1 percent;
dicumyl peroxide: 2 percent;
and (3) organic silicon defoaming agent: 1.5 percent;
multi-element hindered phenol antioxidant: 0.9 percent;
example 2
Methyl vinyl silicone oil (25 ℃, 2000 cps): 30 percent;
iron-nickel alloy powder (D50: 20 μm): 43 percent;
iron-silicon-aluminum alloy powder (D50: 10 μm): 22.5 percent;
dibutyl tin dilaurate: 2 percent;
dicumyl peroxide: 2 percent;
and (3) organic silicon defoaming agent: 0.1 percent;
multi-element hindered phenol antioxidant: 0.4 percent;
example 3
Methyl ethoxy silicone oil (25 ℃, 1000 cps): 5 percent;
ferrite powder (D50: 30 μm): 60 percent;
graphene oxide (D50: 10 μm): 32.4 percent;
dibutyl tin dilaurate: 0.1 percent;
dicumyl peroxide: 0.5 percent;
and (3) organic silicon defoaming agent: 1 percent;
multi-element hindered phenol antioxidant: 1 percent;
example 4
Methyl ethoxy silicone oil (25 ℃, 1000 cps): 4 percent;
ferrite powder (D50: 30 μm): 55 percent;
graphene oxide (D50: 10 μm): 40 percent;
dibutyl tin dilaurate: 0.3 percent;
dicumyl peroxide: 0.1 percent;
and (3) organic silicon defoaming agent: 0.5 percent;
multi-element hindered phenol antioxidant: 0.1 percent;
example 5
Methyl silicone oil (25 ℃, 1000 cps): 4 percent;
ferrite powder (D50: 30 μm): 55 percent;
graphene oxide (D50: 10 μm): 40 percent;
stannous octoate: 0.3 percent;
dibenzoyl peroxide: 0.1 percent;
fluorine-containing defoaming agent: 0.5 percent;
phosphite ester antioxidant: 0.1 percent;
example 6
Methyl phenyl silicone oil (25 ℃, 1000 cps): 4 percent;
ferrite powder (D50: 30 μm): 55 percent;
graphene oxide (D50: 10 μm): 40 percent;
stannous octoate: 0.12 percent;
methylvinyldipyrrolidone silane: 0.18 percent;
ethyl orthosilicate: 0.1 percent;
silicone type defoaming agent: 0.5 percent;
multi-element hindered phenol antioxidant: 0.1 percent;
example 7
Methyl trifluoropropyl silicone oil (25 ℃, 1000 cps): 2 percent;
methyl vinyl silicone oil (25 ℃, 1000 cps): 2 percent;
ferrite powder (D50: 30 μm): 55 percent;
graphene oxide (D50: 10 μm): 40 percent;
dibutyl tin dilaurate: 0.3 percent;
dibenzoyl peroxide: 0.1 percent;
silicone type defoaming agent: 0.5 percent;
multi-element hindered phenol antioxidant: 0.1 percent;
the preparation method of the high-performance wave-absorbing heat-conducting silica gel gasket in the embodiments 1 to 7 is as follows:
(1) uniformly mixing the selected silica gel, controlling the stirring speed to be 500rpm, adding the wave-absorbing powder, the defoaming agent and the antioxidant, stirring for 2 hours, adding the catalyst and the crosslinking agent after uniform mixing, and finally defoaming for 1 hour under the vacuum of 0.08MPa to prepare the heat-conducting wave-absorbing slurry;
(2) and coating the uniformly mixed slurry on a polyester release layer, wherein the thickness of the coating is 1.5mm, and baking for 20min at 150 ℃ to obtain a finished product of the heat-conducting wave-absorbing coiled material for later use.
The magnetic conductivity and the heat conductivity of the high-performance wave-absorbing heat-conducting silica gel gasket in the embodiments 1 to 7 are detected, and the detection results are shown in table 1.
And (3) testing conditions are as follows: the samples were concentric circles 8 mm in inner diameter and 18 mm in outer diameter, and the test temperature was 25 ℃ and the relative humidity was 50.
TABLE 1
As can be seen from the data in table 1, the high performance thermal silica gel gasket in example 4 has a permeability of 7.99 at 3MHZ, a permeability of 9.29 at 1GHZ, and a thermal conductivity of 2.03, which are preferred embodiments of the present invention.
Referring to fig. 1, fig. 1 is a performance test chart of the high-performance wave-absorbing heat-conducting silica gel gasket according to embodiment 4 of the present invention.
In fig. 1, the upper curve shows the magnetic conductivity of the high-performance wave-absorbing heat-conducting silica gel gasket, and the lower curve shows the electromagnetic wave transmission loss of the high-performance wave-absorbing heat-conducting silica gel gasket; as can be seen from FIG. 1, in example 4, the magnetic loss at a frequency of 1GHZ is 4.21, and the microwave absorbing material has good microwave absorbing performance.
In light of the foregoing description of the preferred embodiment of the present invention, many modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (9)
1. The utility model provides a high performance is inhaled wave heat conduction silica gel gasket convenient to cross cutting laminating which characterized in that: the composition comprises the following components in parts by mass:
silicone oil: 5% -30%;
electromagnetic wave-absorbing powder: 65.5% -95%;
catalyst: 0.1% -2%;
a crosslinking agent: 0.1% -2%;
defoaming agent: 0.1% -1.5%;
antioxidant: 0.1% -1%;
the high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching of claim 1, characterized in that: the silicone oil is one or more of methyl silicone oil, phenyl silicone oil, methyl ethoxy silicone oil, methyl trifluoro propyl silicone oil, methyl vinyl silicone oil and methyl hydroxyl silicone oil.
2. The high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching of claim 1, characterized in that: the viscosity of the silicone oil is 200-3000cps at the temperature of 25 ℃.
3. The high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching of claim 1, characterized in that: the electromagnetic wave absorbing powder is one or more of ferrite powder, iron-nickel alloy powder, iron-silicon-aluminum alloy powder, carbonyl iron powder and graphene oxide powder.
4. The high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching of claim 1, characterized in that: the D50 particle size of the electromagnetic wave-absorbing powder is 5-100 μm.
5. The high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching of claim 1, characterized in that: the catalyst is one or more of dibutyl tin dilaurate, stannous octoate and methyl vinyl dipyrrolidone silane.
6. The high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching of claim 1, characterized in that: the cross-linking agent is one or more of ethyl orthosilicate and dibenzoyl peroxide.
7. The high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching of claim 1, characterized in that: the defoaming agent is one or more of an organic silicon type defoaming agent and a fluorine-containing defoaming agent.
8. The high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching of claim 1, characterized in that: the antioxidant is one or more of multi-component hindered phenol antioxidant and phosphite antioxidant.
9. A preparation method of a high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching is characterized by comprising the following steps of: the method comprises the following steps:
(1) uniformly mixing the selected silica gel, adding the wave-absorbing powder, the defoaming agent and the antioxidant at a certain stirring speed, stirring for 2 hours, uniformly mixing, adding the catalyst and the crosslinking agent, and finally defoaming for 1 hour under the vacuum of 0.08MPa to prepare the heat-conducting wave-absorbing slurry;
(2) and coating the uniformly mixed slurry on a polyester release layer, and baking for 20min at 150 ℃ to obtain a finished product of the heat-conducting wave-absorbing coiled material for later use.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911052124.3A CN110746782A (en) | 2019-10-31 | 2019-10-31 | High-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and laminating and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911052124.3A CN110746782A (en) | 2019-10-31 | 2019-10-31 | High-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and laminating and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110746782A true CN110746782A (en) | 2020-02-04 |
Family
ID=69281476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911052124.3A Pending CN110746782A (en) | 2019-10-31 | 2019-10-31 | High-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and laminating and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110746782A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113249031A (en) * | 2021-06-07 | 2021-08-13 | 宁波晶飞新材料有限公司 | High-thermal-conductivity silica gel wave absorbing plate and preparation method thereof |
| CN113831896A (en) * | 2020-09-08 | 2021-12-24 | 湖南大学 | Composite phase change powder material for selective laser sintering and preparation method and application thereof |
| CN114539778A (en) * | 2022-02-23 | 2022-05-27 | 深圳市锐扬创科技术股份有限公司 | Heat-conducting wave-absorbing nanoscale novel functional composite material applied to high-wide frequency spectrum and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030171487A1 (en) * | 2002-03-11 | 2003-09-11 | Tyco Electronics Corporation | Curable silicone gum thermal interface material |
| CN101225234A (en) * | 2008-02-01 | 2008-07-23 | 南京凯汇工业科技有限公司 | Heat conductive insulating material and preparation method thereof |
| CN105647191A (en) * | 2016-04-01 | 2016-06-08 | 平湖阿莱德实业有限公司 | Flexible heat conduction interface material with wave absorbing function and preparation method thereof |
| CN108659535A (en) * | 2018-03-09 | 2018-10-16 | 中国电子科技集团公司第三十三研究所 | A kind of heat conduction absorbing material and preparation method thereof for ETC devices |
| CN110294940A (en) * | 2019-06-28 | 2019-10-01 | 深圳市飞荣达科技股份有限公司 | Shielding gasket and preparation method thereof |
-
2019
- 2019-10-31 CN CN201911052124.3A patent/CN110746782A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030171487A1 (en) * | 2002-03-11 | 2003-09-11 | Tyco Electronics Corporation | Curable silicone gum thermal interface material |
| CN101225234A (en) * | 2008-02-01 | 2008-07-23 | 南京凯汇工业科技有限公司 | Heat conductive insulating material and preparation method thereof |
| CN105647191A (en) * | 2016-04-01 | 2016-06-08 | 平湖阿莱德实业有限公司 | Flexible heat conduction interface material with wave absorbing function and preparation method thereof |
| CN108659535A (en) * | 2018-03-09 | 2018-10-16 | 中国电子科技集团公司第三十三研究所 | A kind of heat conduction absorbing material and preparation method thereof for ETC devices |
| CN110294940A (en) * | 2019-06-28 | 2019-10-01 | 深圳市飞荣达科技股份有限公司 | Shielding gasket and preparation method thereof |
Non-Patent Citations (3)
| Title |
|---|
| 崔玉民，等: "《绿色环保功能涂料》", 31 January 2019, 中国书籍出版社 * |
| 武卫莉: "《电线电缆加工工艺学》", 31 October 2014, 哈尔滨工业大学出版社 * |
| 沈国柱，等: "《铁氧体/碳纤维复合材料吸波性能及涂层结构设计》", 31 August 2017, 同济大学出版社 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113831896A (en) * | 2020-09-08 | 2021-12-24 | 湖南大学 | Composite phase change powder material for selective laser sintering and preparation method and application thereof |
| CN113831896B (en) * | 2020-09-08 | 2024-02-23 | 湖南大学 | Composite phase-change powder material for selective laser sintering and preparation method and application thereof |
| CN113249031A (en) * | 2021-06-07 | 2021-08-13 | 宁波晶飞新材料有限公司 | High-thermal-conductivity silica gel wave absorbing plate and preparation method thereof |
| CN114539778A (en) * | 2022-02-23 | 2022-05-27 | 深圳市锐扬创科技术股份有限公司 | Heat-conducting wave-absorbing nanoscale novel functional composite material applied to high-wide frequency spectrum and preparation method thereof |
| CN114539778B (en) * | 2022-02-23 | 2022-10-28 | 深圳市锐扬创科技术股份有限公司 | Heat-conducting wave-absorbing nanoscale functional composite material applied to high-wide frequency spectrum and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110157316A (en) | Heat-insulated suction wave material of one kind and preparation method thereof | |
| CN110746782A (en) | High-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and laminating and preparation method thereof | |
| KR101090743B1 (en) | Electromagnetic wave absorber | |
| CN107743357B (en) | Wave absorbing plate for electronic product | |
| KR100745692B1 (en) | Composition for complex sheet with thermal dissipation, emi shielding and absorption, and products manufactured therefrom | |
| US20100301261A1 (en) | Electromagnetic wave absorbing and heat dissipation material | |
| KR101248385B1 (en) | Hybrid composition with enhanced emi shielding and heat-releasing, and ink, sheet, and composition for injection using same | |
| CN110730607A (en) | Heat-conducting wave-absorbing insulating sheet with high heat-conducting performance and preparation method thereof | |
| CN104972709B (en) | Ripple composite membrane and its manufacture method are inhaled in height radiating | |
| CN109605862B (en) | Composite material with heat conduction and electromagnetic shielding functions and preparation method thereof | |
| KR20150052591A (en) | Composition for complex sheet, complex sheet comprising the same, and preparation method of the complex sheet | |
| CN105007704A (en) | Composite heat-dissipation wave-absorbing film | |
| CN108003841A (en) | Waveguide hot material and its preparation method and application is inhaled in a kind of phase transformation | |
| CN107207950A (en) | Heat conduction electromagnetic interference (EMI) absorbent with carborundum | |
| KR20150096655A (en) | Electromagnetic interference suppression body | |
| CN112094573A (en) | Sprayable efficient electromagnetic shielding slurry and preparation method thereof | |
| CN111554466A (en) | Heat-conducting wave-absorbing composite magnetic sheet with periodic structure and preparation method thereof | |
| CN105034483A (en) | Shield film having heat-dissipating function | |
| CN111902036B (en) | Electromagnetic wave noise suppression sheet and high-frequency electronic equipment | |
| CN117467238A (en) | High-temperature-resistant high-heat-conductivity rigid wave-absorbing material and preparation method thereof | |
| KR100874690B1 (en) | A roll-type composite sheet with enhanced electromagnetic wave-shielding and -absorbing, and heat-releasing properties, and a method for preparation of the same | |
| CN104875441A (en) | Screen protecting film for electronic product | |
| KR102082810B1 (en) | Sheet of complex shielding electromagnetic wave with high performance and manufacturing methods thereof | |
| CN110446407A (en) | A kind of high-performance wave-absorbing material | |
| JP4311654B2 (en) | Laminated electromagnetic wave absorber |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200204 |