CN209652218U - Nickel plating copper foil shielding tape - Google Patents
Nickel plating copper foil shielding tape Download PDFInfo
- Publication number
- CN209652218U CN209652218U CN201920231442.5U CN201920231442U CN209652218U CN 209652218 U CN209652218 U CN 209652218U CN 201920231442 U CN201920231442 U CN 201920231442U CN 209652218 U CN209652218 U CN 209652218U
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- Prior art keywords
- copper foil
- layer
- conductive
- line
- nickel plating
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Abstract
The utility model discloses a kind of nickel plating copper foil shielding tapes, including copper foil layer, the nickel coating on one surface of copper foil layer is formed in by magnetron sputtering membrane process, and the conductive and heat-conductive glue-line coated on another surface of copper foil layer, this conductive and heat-conductive glue-line are covered with a release film layer in copper foil layer opposite to each other on one side；One pet layer is bonded by the fitting glue-line one side in copper foil layer opposite with the nickel coating, and the another side of the pet layer is sequentially coated with a thermal dispersant coatings and a light oil reservoir from inside to outside, and the thermal dispersant coatings are carbon nanotube thermal dispersant coatings or graphene thermal dispersant coatings；The utility model nickel plating copper foil shielding tape good heat dissipation effect, and copper is had both to the screening ability of frequency electromagnetic waves and the screening ability of nickel centering low-frequency electromagnetic wave, good effectiveness is all had in all band, electronic product can be effectively prevent to interfere with each other in use with external electromagnetic signal.
Description
Technical field
The utility model relates to a kind of adhesive tape more particularly to a kind of nickel plating copper foil shielding tapes.
Background technique
With the development of science and technology lightening trend is presented in electronic product, electronic component refers to that size is smaller and smaller, work
Efficiency and working strength are increasing, cause the heat generated increasing, requirement of the electronic component to heat dissipation effect is increasingly
Height, therefore efficiently solve heat dissipation problem and have become the key technology that electronic equipment must solve.
And the interference being easy when electronic product use by external electromagnetic signal needs to make on the frame of the products such as LCD
With heat dissipation performance in connection with the preferable adhesive tape of anti-jamming effectiveness, therefore improving such adhesive tape, develops one kind and take into account
The adhesive tape of heat dissipation and shielding properties has important practical value.
Summary of the invention
The purpose of the utility model is to provide a kind of nickel plating copper foil shielding tape, which has both copper pair
The screening ability of frequency electromagnetic waves and the screening ability of nickel centering low-frequency electromagnetic wave, all have good electromagnetic shielding in all band
Effect can effectively prevent electronic product to interfere with each other in use with external electromagnetic signal.
In order to achieve the above objectives, the technical solution adopted in the utility model is: kind nickel plating copper foil shielding tape, including copper foil
Layer is formed in the nickel coating on one surface of copper foil layer by magnetron sputtering membrane process, and is coated on another surface of copper foil layer
Conductive and heat-conductive glue-line, this conductive and heat-conductive glue-line is covered with a release film layer in copper foil layer opposite to each other on one side；
One pet layer by the one side fitting in copper foil layer opposite with the nickel coating of fitting glue-line, the pet layer it is another
Face is sequentially coated with a thermal dispersant coatings and a light oil reservoir from inside to outside, and the thermal dispersant coatings are carbon nanotube thermal dispersant coatings or stone
Black alkene thermal dispersant coatings.
Further improved scheme is as follows in above-mentioned technical proposal:
1. in above scheme, the thickness of the nickel plating copper foil shielding tape is less than 70 μm.
2. in above scheme, the light oil reservoir with a thickness of 2 ~ 5 μm.
3. in above scheme, the fitting glue-line is heat-conduction polyurethane glue-line or thermally conductive acrylate glue-line.
4. in above scheme, the release film layer includes parting agent layer and release film substrate layer；It is highly preferred that it is described from
Type film base material layer choosing is from one of PET film, PE film and PP film.
5. in above scheme, landfill has heat-expandable microsphere in the conductive and heat-conductive glue-line.
Due to the application of the above technical scheme, the utility model has the advantage that compared with prior art
1, the utility model nickel plating copper foil shielding tape, using copper foil layer as substrate, further through magnetron sputtering plating work
Skill forms the nickel coating of dense uniform in copper foil surface, so that it is had both copper low to the screening ability of frequency electromagnetic waves and nickel centering
The screening ability of frequency electromagnetic waves all has good effectiveness in all band, electronic product can be effectively prevent to make
With being interfered with each other in the process with external electromagnetic signal.
2, on the one hand the utility model nickel plating copper foil shielding tape is realized using the heating conduction of copper foil and is produced to electronic component
The quick conduction of heat amount, to play the effect of radiating and cooling, on the other hand its surface is additionally provided with by carbon nanotube or stone
The thermal dispersant coatings that black alkene is constituted, the coating are playing shaded effect while the heat for being transmitted to tape surface can also passed through heat
Radiation distributes, than it is traditional cross-ventilation radiate by way of more efficiently, it is narrow especially for inner space
There is bigger heat dissipation advantage for ultrathin electronic product.
3, the utility model nickel plating copper foil shielding tape, substrate are provided with a pet layer outside to improve the tension of the adhesive tape
Performance and insulation performance are stretched, makes it have reworking, and safer；Also landfill has thermal expansivity in its conductive and heat-conductive glue-line
Microballoon, the volume increase after heated of this microballoon generates foaming effect, so that conductive and heat-conductive glue-line is made to lose viscosity, be easily peeled off,
The reworking energy of the adhesive tape is further improved, keeps reprocessing for electronic component more easy；In addition, the coating of pet layer surface
Light oil reservoir has the effect of oil-stain-preventing, resistance and fingerprint resistance, significantly improves the appearance and weather resistance of adhesive tape, increases the use of adhesive tape
Service life.
Detailed description of the invention
Attached drawing 1 is the utility model nickel plating copper foil shielding tape structural schematic diagram；
In the figures above: 1, light oil reservoir；2, thermal dispersant coatings；3, pet layer；4, it is bonded glue-line；5, nickel coating；6, copper foil layer；
7, conductive and heat-conductive glue-line；71, heat-expandable microsphere；8, release film layer；81, parting agent layer；82, release film substrate layer.
Specific embodiment
Embodiment 1: a kind of nickel plating copper foil shielding tape, including copper foil layer 6 are formed in copper by magnetron sputtering membrane process
The nickel coating 5 on 6 one surfaces of layers of foil, and the conductive and heat-conductive glue-line 7 coated on another surface of copper foil layer 6, this electrically and thermally conductive adhesive
Layer 7 is covered with a release film layer 8 in copper foil layer 6 opposite to each other on one side；
One pet layer 3 is bonded by fitting glue-line 4 one side in copper foil layer 6 opposite with the nickel coating 5, the pet layer 3
Another side be sequentially coated with a thermal dispersant coatings 2 and a light oil reservoir 1 from inside to outside, the thermal dispersant coatings 2 are carbon nanotube heat dissipation
Coating；
Above-mentioned nickel plating copper foil shielding tape with a thickness of 50 μm, above-mentioned light oil reservoir 1 with a thickness of 2 μm；
Above-mentioned fitting glue-line 4 is heat-conduction polyurethane glue-line；
Above-mentioned release film layer 8 includes parting agent layer 81 and release film substrate layer 82, and above-mentioned release film substrate layer 82 is that PE is thin
Film；
Landfill has heat-expandable microsphere 71 in above-mentioned conductive and heat-conductive glue-line 7.
Embodiment 2: a kind of nickel plating copper foil shielding tape, including copper foil layer 6 are formed in copper by magnetron sputtering membrane process
The nickel coating 5 on 6 one surfaces of layers of foil, and the conductive and heat-conductive glue-line 7 coated on another surface of copper foil layer 6, this electrically and thermally conductive adhesive
Layer 7 is covered with a release film layer 8 in copper foil layer 6 opposite to each other on one side；
One pet layer 3 is bonded by fitting glue-line 4 one side in copper foil layer 6 opposite with the nickel coating 5, the pet layer 3
Another side be sequentially coated with a thermal dispersant coatings 2 and a light oil reservoir 1 from inside to outside, the thermal dispersant coatings 2 are graphene heat-radiation coating
Layer；
Above-mentioned nickel plating copper foil shielding tape with a thickness of 65 μm, above-mentioned light oil reservoir 1 with a thickness of 5 μm；
Above-mentioned fitting glue-line 4 is thermally conductive acrylate glue-line；
Above-mentioned release film layer 8 includes parting agent layer 81 and release film substrate layer 82, and above-mentioned release film substrate layer 82 is that PET is thin
Film；
Landfill has heat-expandable microsphere 71 in above-mentioned conductive and heat-conductive glue-line 7.
Above-mentioned nickel plating copper foil shielding tape all has good effectiveness in all band, can effectively prevent electronics
Product is interfered with each other with external electromagnetic signal in use；And radiating efficiency is high, the ultra-thin electricity narrow for inner space
There is bigger heat dissipation advantage for sub- product.
The above embodiments are only for explaining the technical ideas and features of the present invention, and its object is to allow be familiar with technique
Personage can understand the content of the utility model and implement accordingly, do not limit the protection scope of the present invention.
All equivalent change or modifications according to made by the spirit of the present invention essence, should all cover the protection scope of the utility model it
It is interior.
Claims (7)
1. a kind of nickel plating copper foil shielding tape, it is characterised in that: including copper foil layer (6), formed by magnetron sputtering membrane process
Nickel coating (5) in (6) surfaces of copper foil layer, and it is coated on the conductive and heat-conductive glue-line (7) on copper foil layer (6) another surface,
This conductive and heat-conductive glue-line (7) is covered with a release film layer (8) in copper foil layer (6) opposite to each other on one side；
One pet layer (3) is bonded by fitting glue-line (4) one side in copper foil layer (6) opposite with the nickel coating (5), the PET
The another side of layer (3) is sequentially coated with a thermal dispersant coatings (2) and a light oil reservoir (1) from inside to outside, and the thermal dispersant coatings (2) are carbon
Nanotube thermal dispersant coatings or graphene thermal dispersant coatings.
2. nickel plating copper foil shielding tape according to claim 1, it is characterised in that: the thickness of the nickel plating copper foil shielding tape
Degree is less than 70 μm.
3. nickel plating copper foil shielding tape according to claim 1, it is characterised in that: the light oil reservoir (1) with a thickness of 2 ~ 5
μm。
4. nickel plating copper foil shielding tape according to claim 1, it is characterised in that: the fitting glue-line (4) is thermally conductive poly-
Urethane glue-line or thermally conductive acrylate glue-line.
5. nickel plating copper foil shielding tape according to claim 1, it is characterised in that: the release film layer (8) includes release
Oxidant layer (81) and release film substrate layer (82).
6. nickel plating copper foil shielding tape according to claim 5, it is characterised in that: the release film substrate layer (82) is selected from
One of PET film, PE film and PP film.
7. nickel plating copper foil shielding tape according to claim 1, it is characterised in that: filled out in the conductive and heat-conductive glue-line (7)
It is embedded with heat-expandable microsphere (71).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920231442.5U CN209652218U (en) | 2019-02-25 | 2019-02-25 | Nickel plating copper foil shielding tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920231442.5U CN209652218U (en) | 2019-02-25 | 2019-02-25 | Nickel plating copper foil shielding tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209652218U true CN209652218U (en) | 2019-11-19 |
Family
ID=68525047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920231442.5U Active CN209652218U (en) | 2019-02-25 | 2019-02-25 | Nickel plating copper foil shielding tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209652218U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110982441A (en) * | 2019-12-24 | 2020-04-10 | 佳普电子新材料(连云港)有限公司 | Conductive cloth shielding adhesive tape and manufacturing process thereof |
| CN112261859A (en) * | 2020-10-20 | 2021-01-22 | 苏州第一元素纳米技术有限公司 | Novel electromagnetic shielding material and preparation method thereof |
| CN114736620A (en) * | 2022-06-15 | 2022-07-12 | 深圳市卓汉材料技术有限公司 | Shielding adhesive tape, preparation method thereof and shielding structure |
-
2019
- 2019-02-25 CN CN201920231442.5U patent/CN209652218U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110982441A (en) * | 2019-12-24 | 2020-04-10 | 佳普电子新材料(连云港)有限公司 | Conductive cloth shielding adhesive tape and manufacturing process thereof |
| CN112261859A (en) * | 2020-10-20 | 2021-01-22 | 苏州第一元素纳米技术有限公司 | Novel electromagnetic shielding material and preparation method thereof |
| CN114736620A (en) * | 2022-06-15 | 2022-07-12 | 深圳市卓汉材料技术有限公司 | Shielding adhesive tape, preparation method thereof and shielding structure |
| CN114736620B (en) * | 2022-06-15 | 2022-11-15 | 深圳市卓汉材料技术有限公司 | Shielding adhesive tape, preparation method thereof and shielding structure |
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