KR101235541B1 - Multi-functional thin layer seat with excellent thermal diffusion properties, electromagnetic waveshielding function and impact absorbing function and preparation method thereof - Google Patents

Abstract

PURPOSE: A complex function thin film sheet and electronic product applied thereof are provided to efficiently diffuse and discharge heat generated inside a digital communication, electrical and electronic product with a thin, light and compact structure. CONSTITUTION: An electromagnetic shielding layer(20) is formed on a thermal diffusion layer(10). A polymer elastic cushion layer(30) is formed on the thermal diffusion layer. A functional adhesion layer(40) is formed on the polymer elastic cushion layer. The functional adhesion layer is formed to have electrical conductivity. A release film layer(50) is formed on the functional adhesion layer.

Description

MULTI-FUNCTIONAL THIN LAYER SEAT WITH EXCELLENT THERMAL DIFFUSION PROPERTIES, ELECTROMAGNETIC WAVESHIELDING FUNCTION AND IMPACT ABSORBING FUNCTION AND PREPARATION METHOD THEREOF}

The present invention relates to a multi-functional thin film sheet having a thermal diffusion, electromagnetic shielding and shock absorption functions and a method for manufacturing the same, and more particularly, a heat generation as well as a basic role that can protect a circuit from electromagnetic shielding and static electricity against high frequency radiation noise. It conducts and diffuses local heat generated from the site quickly, and conducts, diffuses and radiates heat generated from heat generating elements such as CPU and various semiconductor IC components that generate heat to conduction and open space. The present invention relates to a composite thin film sheet having excellent functions such as dustproofing and shock absorption due to elasticity.

As represented by the "chip power crisis" of microprocessors, the seriousness of thermal problems in electronic devices has recently increased. The market demand of 'faster, smaller and smaller' has accelerated the development of mounting technology and semiconductor technology, resulting in an increase in power consumption density. Meanwhile, environmentally friendly demands such as noise reduction of electronic devices and suppression of unnecessary radiation noise are increasing. . Current technology development is in a situation where low power consumption cannot keep pace with high speed. Noise-free devices High heat dissipation materials, low power devices, and thermal fluid analysis software for electronic devices are the main issues addressing thermal issues. The reduction of power for cooling and the suppression of cooling noise have become a major differentiation of products, and the design of materials and devices for heat dissipation and the development of materials have become a recent direction.

In general, in the operation of advanced telecommunications and digital electrical and electronic products, when various components mounted on the main board become slim and do not efficiently conduct and dissipate heat generated inside the digital communication and electrical and electronic products having a light and small structure. The generated heat causes problems such as device malfunction, malfunction and shortened life.

In addition, recent high-tech digital products have been slimming and high-capacity capacity has been intensifying, so effectively dissipating heat generated from semiconductor chipset, battery compartment, backlight, etc. is a very important factor in determining the performance and reliability of digital products. Can be.

In addition, as the use of electronic communication devices has increased rapidly, concerns and interests about the harmful effects of electromagnetic waves have increased, and research results in which electromagnetic waves have a negative effect on the human body have been published one after another. Spurring

In general, as a heat conduction and heat radiation method of the advanced digital products as described above, a heat sink is applied to a heating element such as a CPU or a semiconductor, or a thermoelectric pad and a heat dissipation sheet are applied to a portion where heat generation such as a backlight and a battery occurs. It functions to conduct and radiate heat.

In this case, in order to maximize the heat dissipation area, the existing heat sink used is made of a metal material such as aluminum that maximizes the thickness and area of the protrusion, or recently, a ceramic heat sink in the form of a thick film is used. Graphite foil or sheet paste products coated with graphite paste or carbon black are applied.

Korean Patent Laid-Open Publication No. 2008-0076761 discloses a thermally conductive layer formed by a composition comprising an organic polymer and a thermally conductive filler; A heat diffusion layer provided on a surface of the heat conductive layer and formed of a metal material; Disclosed is a heat diffusion sheet comprising a heat insulation layer provided on a surface of the heat diffusion layer and formed of an electrically insulating material.

The heat sink has a disadvantage in that the thickness of the product must be maximized in order to improve heat dissipation characteristics, and thus, there is a limit in effectively conducting and radiating heat generated in a slim and light and small digital electric and electronic device.

In addition, the conventional heat dissipation sheet also has a problem that the heat radiation characteristics are significantly lowered in the case of the thick film type manufactured by supplementing the shortcomings of the product which are difficult to thin and electrically shorted or particle detachment problems and fractures easily.

In order to solve this problem, the present inventors have been applied to LCD, OLED, BLU, FPCB, etc. and various electronic products of mobile products such as smart phones, tablet PCs, and have assembly adhesion, airtightness, waterproofness, dustproof, and shock absorbing functions. In order to develop a composite thin film sheet having excellent thermal diffusivity and electromagnetic shielding function, research has been conducted, and as a result, the present invention has been completed.

Accordingly, an object of the present invention is to solve the problem of heat noise by quickly conducting and diffusing the local heat generated from the heat generating region as well as the basic role of protecting the circuit from electromagnetic shielding and static electricity against high frequency radiation noise. In addition, conduction, diffusion, and radiation of heat generated from heat generating elements such as CPUs and various semiconductor IC components, which are mounted on main boards such as various electronic devices, in which the product has become slimmer, and heat sources. It is to provide a multi-functional thin film sheet having a function such as dustproof and shock absorption due to not only excellent role.

In order to achieve the above object, the present invention provides a multi-functional thin film sheet having a thermal diffusion, electromagnetic shielding and shock absorption function, comprising a thermal radiation and thermal diffusion layer, an electromagnetic shielding layer and a polymer elastic cushion layer. .

In the present invention, the thermal radiation and thermal diffusion layer is prepared using a composition containing an inorganic material, the inorganic material is aluminum nitride, boron nitride, alumina, aluminum oxide, aluminum hydroxide, magnesium oxide, silicon dioxide, silicon zirconium and Preference is given to using those prepared by the sol-gel process method using at least four mixtures and inorganic pigments selected from the group consisting of silicate compounds.

In one embodiment of the present invention, the polymer elastic cushion layer using a material selected from the group consisting of polyurethane, acrylic resin, polypropylene, ethylene propene diene monomer (EPDM), ethylene vinyl acetate (EVA) and silicone It can manufacture.

The composite functional thin film sheet according to the present invention may further include a functional adhesive layer and a release film layer together with a thermal radiation and thermal diffusion layer, an electromagnetic wave shielding layer, and a polymer elastic cushion layer.

The composite thin film sheet having thermal diffusion, electromagnetic shielding and shock absorption functions according to the present invention forms a thermal radiation and thermal diffusion layer on one side or both sides of the metal layer having excellent electrical conductivity and electromagnetic noise shielding properties, and is dust-proofed on one side thereof. A thin film sheet including a thin film type polymer elastic cushion layer having excellent shock absorption function. The thin and thin components mounted on the main board efficiently reduce heat generated inside the digital communication and electrical and electronic products. It can diffuse and emit, and is applied to smart phones, tablet PCs, LCDs of mobile products, and OLED, BLU, FPCB, etc., and it is very useful product that has assembly adhesion, air tightness, waterproofness, dustproof and shock absorption function. It can be manufactured from to thick film type products, and it can be mass-produced in the manufacturing process. Wu has excellent advantages.

1 is a schematic cross-sectional side view of a multi-functional thin film sheet having thermal diffusion, electromagnetic shielding and shock absorption functions according to an embodiment of the present invention.

Hereinafter, the present invention will be described in detail.

The present invention provides a multi-functional thin film sheet having a thermal diffusion, electromagnetic shielding and shock absorption function, a thermal radiation and thermal diffusion layer, an electromagnetic shielding layer and a polymer elastic cushion layer.

Inorganic materials used in the thermal radiation and thermal diffusion layers of the multi-functional thin film sheet of the present invention has the insulation and heat dissipation characteristics, excellent thermal conductivity characteristics, chemical resistance, heat resistance, wear resistance, completely non-flammable, environmentally friendly, porous thermal conductivity and excellent thermal conductivity It acts as a heat radiating material.

Inorganic materials in the present invention may include inorganic pigments and at least four kinds of mixtures selected from the group consisting of aluminum nitride, boron nitride, alumina, aluminum oxide, aluminum hydroxide, magnesium oxide, silicon dioxide, silicon zirconium and silicate compounds. Can be.

As the silicate compound used as the inorganic substance in the present invention, aluminum silicate, calcium magnesium silicate, magnesium silicate and the like can be used.

In the present invention, the inorganic pigment may be selected from the group consisting of iron oxide-based, carbon black-based, zinc oxide, manganese dioxide, magnesium oxide and titanium dioxide known in the prior art, but is not necessarily limited thereto.

Inorganic materials used for the thermal radiation and thermal diffusion of the multifunctional thin film sheet of the present invention may be manufactured to have a small particle size to have a high specific surface area by using a sol-gel process method, thereby improving heat dissipation and thermal conductivity. .

In the present invention, the particle size of the inorganic material prepared using the sol-gel process method is 1 to 3 μm, and its specific surface area is preferably 20 to 30 m 2 / g.

In the present invention, the “sol-gel process method” is a hydrolyzate of an alkoxide compound as a reactant while maintaining an appropriate pH to form a dispersion into colloidal fine particles of 1-1000 nm, and then the dispersion is concentrated through a condensation reaction. It refers to a method for producing particulate inorganic material that allows solid molecules to polymerize to a suitable size to form a continuous solid network structure.

The inorganic material is included 65 to 85% by weight based on the total weight of the composition.

Insulation, heat dissipation, excellent thermal conductivity, chemical resistance, heat resistance, abrasion resistance, completely non-flammable, environmentally friendly when the inorganic material used in the thermal radiation and the thermal diffusion layer of the composite thin film sheet of the present invention is included in less than 65% by weight This may be insignificant, and when the inorganic material used for the thermal radiation and the thermal diffusion layer of the multi-functional thin film sheet of the present invention is contained in an amount of more than 85% by weight, there is a problem that the manufacturing cost increases without any improvement in properties.

In the present invention, the composition used to prepare the thermal radiation and thermal diffusion layer may comprise the inorganic material, an alcoholic solvent and a dispersant.

As the alcohol solvent used in the present invention, for example, ethyl alcohol, isopropyl alcohol, etc. may be used, and as the dispersant, for example, aerosilica gel, zeolite, etc. may be used, but is not limited thereto.

In the present invention, the thermal radiation and thermal diffusion layer may be formed by coating the composition by comma roll or micro gravure or silkscreen printing.

In one embodiment of the present invention, the composition of the present invention is an inorganic material 65 to 85% by weight silicate compound, 0.1 to 0.5% by weight carbon nanotube, 0.1 to 0.5% by weight graphene, 0.01 to 0.05% by weight inorganic pigment And as an organic polymer material for thickening 0.5 to 5.0% by weight of ethyl cellulose, 0.5 to 5.0% by weight of ethyl nitro cellulose can be prepared by adding 15 to 30% by weight of a water-soluble alcohol solvent and 0.1 to 0.5% by weight of a dispersant.

An electromagnetic shielding layer capable of blocking harmful electromagnetic waves is formed on one side of the above-described thermal radiation and thermal diffusion layer.

In the present invention, the electromagnetic wave shielding layer is made of a metal foil having excellent electrical conductivity such as copper foil, aluminum, tin, and the like, and the metal foil serves as an electromagnetic shielding as well as an antistatic and electrical grounding role.

In one embodiment of the invention, the electromagnetic shielding layer is a material selected from the group consisting of single or double sided chemical etched and anodized aluminum foil, single or double sided mated copper foil and single or double sided etched tin foil. It may be prepared from, but is not necessarily limited thereto.

In the present invention, in order to maximize the heat dissipation effect and adhesion properties of the coating layer when the thermal radiation and thermal diffusion layer is coated, an electrolytic copper foil or a chemically etched and anodized aluminum foil having a matt side as an electromagnetic shielding layer is used. It is preferable to use.

On one side of the above-described electromagnetic wave shielding layer, a polymer elastic cushion layer having assembly adhesion, airtightness, waterproofness, dustproofing, and shock absorbing functions is formed.

In the present invention, it may be prepared using a material selected from the group consisting of polyurethane, acrylic resin, polypropylene, EPDM (Ethylene Propylene Diene Monomer), EVA (Ethylene vinyl acetate) and silicon.

In one embodiment of the present invention, the polymer elastic cushion layer may be a foamed sponge type.

In the present invention, the polymer elastic cushion layer is manufactured by forming a uniform cell by chemical or mechanical foaming during sheet production in order to provide cushioning properties for shock and vibration absorption, assembly adhesion, and waterproof function.

1, the composite functional thin film sheet according to the first embodiment of the present invention is a thermal radiation and thermal diffusion layer 10, electromagnetic wave shielding layer 20, polymer elastic cushion layer 30, functional adhesive layer 40 And the release film layer 50 has a structure formed sequentially.

The composite thin film sheet according to the present invention is preferably formed to have a thickness of 0.1mm to 1.0mm.

As shown in FIG. 1, the composite functional thin film sheet according to the present invention has a functional adhesive layer 40 and a release film layer in addition to the thermal radiation and thermal diffusion layer 10, the electromagnetic shielding layer 20, and the polymer elastic cushion layer 30. It consists of 50.

The functional adhesive layer is prepared by releasing a conductive paste by adding conductive metal powders such as nickel or nickel-graphite and copper-silver to resins such as acrylic or urethane to have electrical conductivity, and then releasing film or release film such as PET release film. It is manufactured by laminating a comma roll coating on the layer and laminating it with the electromagnetic shielding metal layer, which also serves to electrically ground the functional sheet to the adherend and to be energized up and down. On the other hand, the release film layer serves to protect the functional adhesive layer.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention. Such variations and modifications are intended to be within the scope of the appended claims.

10: thermal radiation and thermal diffusion layer 20: electromagnetic shielding layer
30: polymer elastic cushion layer 40: functional adhesive layer
50: release film layer

Claims (11)

It is a composite thin film sheet with thermal diffusion, electromagnetic shielding and shock absorption.
A thermal radiation and thermal diffusion layer prepared using a composition including an inorganic material; Electromagnetic shielding layer; A polymer elastic cushion layer prepared using a foamed sponge-type polyurethane, acrylic resin, polypropylene, EPDM (Ethylene Propene Diene Monomer), EVA (Ethylene vinyl acetate), and silicon; Including a functional adhesive layer and a release film layer,
The inorganic material may be at least four kinds of mixtures selected from the group consisting of aluminum nitride, boron nitride, alumina, aluminum oxide, aluminum hydroxide, magnesium oxide, silicon dioxide, silicon zirconium and silicate compounds, and iron oxide based, carbon black based, and oxidized. It is prepared using an inorganic pigment selected from the group consisting of zinc, manganese dioxide, magnesium oxide and titanium dioxide, which contains 65 to 85% by weight of the total composition,
The functional adhesive layer is a composite functional thin film sheet formed by coating a release film layer on the adhesive paste dispersed by adding nickel or nickel-graphite and conductive metal powder to the resin. delete delete delete The method of claim 1,
The composition is a multi-functional thin film sheet, characterized in that it further comprises a water-soluble alcohol solvent and a dispersant. delete delete delete The method of claim 1,
The electromagnetic shielding layer is made from a material selected from the group consisting of single or double sided chemical etched and anodized aluminum foil, single or double sided matt copper foil and single or double sided etched tin foil. Function thin sheet. delete An electronic product to which the multi-functional thin film sheet according to any one of claims 1, 5 and 9 is applied.

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