CN206402529U - A kind of high-cooling property printed circuit board (PCB) - Google Patents
A kind of high-cooling property printed circuit board (PCB) Download PDFInfo
- Publication number
- CN206402529U CN206402529U CN201720097404.6U CN201720097404U CN206402529U CN 206402529 U CN206402529 U CN 206402529U CN 201720097404 U CN201720097404 U CN 201720097404U CN 206402529 U CN206402529 U CN 206402529U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- radiating
- pcb
- printed circuit
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of high-cooling property printed circuit board (PCB) in printed-board technology field, including circuit board main body, component hole is offered at the top of the circuit board main body, the outer wall of the circuit board main body is socketed with radiating frame, fastener hole is offered at the top of the radiating frame, the left and right sides wall of the radiating frame is provided with radiating groove, the circuit board main body includes circuit layer, the bottom of the circuit layer is provided with ink dielectric film, the bottom of the ink dielectric film is provided with metal-cored, compared with existing printed circuit board (PCB), the utility model is simple in construction, it is easy to operate, the utility model adds radiating frame and heat radiation silica gel pad on the basis of existing printed circuit board (PCB), radiating frame is fixed and radiated to printed circuit board (PCB), and heat radiation silica gel pad radiates to the bottom of printed circuit board (PCB), and then improve the heat dispersion of printed circuit board (PCB).
Description
Technical field
The utility model is related to printed-board technology field, specially a kind of high-cooling property printed circuit board (PCB).
Background technology
Printed circuit board, also known as printed circuit board (PCB), printed substrate, abbreviation printed board, using insulation board as base material, are cut into one
It is sized, thereon at least with a conductive pattern, and hole (such as component hole, fastener hole, plated through-hole) is furnished with, for replacing
The chassis of conventional device electronic component, and realize the interconnection between electronic component.Because this plate is to use electronics
What the art of printing made, therefore be referred to as " printing " circuit board, wiring board can operationally be fixed on the inside of electric equipment, online
When road plate is operated, because the electronic component on wiring board can give out substantial amounts of heat, the electronic component on wiring board is made
Into influence, and heat emission hole is all provided with common circuit board, although radiating effect increases, but is due to dissipating on collecting plate
Easy dust stratification is used for a long time in heat, causes radiating effect to be gradually reduced, and influences the service life of circuit board, therefore, it is proposed that
A kind of high-cooling property printed circuit board (PCB).
Utility model content
The purpose of this utility model is to provide a kind of high-cooling property printed circuit board (PCB), to solve to carry in above-mentioned background technology
Heat emission hole is all provided with the common circuit board gone out, although radiating effect increases, but be due to that radiating on collecting plate is long
Phase uses easy dust stratification, causes radiating effect to be gradually reduced, the problem of influenceing the service life of circuit board.
To achieve the above object, the utility model provides following technical scheme：A kind of high-cooling property printed circuit board (PCB), including
Component hole is offered at the top of circuit board main body, the circuit board main body, the outer wall of the circuit board main body is socketed with radiating frame,
Fastener hole is offered at the top of the radiating frame, the left and right sides wall of the radiating frame is provided with radiating groove, the circuit board
Main body includes circuit layer, and the bottom of the circuit layer is provided with ink dielectric film, and the bottom of the ink dielectric film is provided with gold
Belong to core, the metal-cored bottom is provided with insulated substrate, and the bottom of the insulated substrate is provided with heat radiation silica gel pad.
It is preferred that, the inwall of the radiating frame is provided with radiating silica gum cover, and the surface of the radiating silica gum cover is opened up
There is embeded slot, the left and right sides wall of the radiating frame offers heat emission hole, and heat emission hole is connected with radiating groove.
It is preferred that, the bottom of the circuit layer is provided with insulation resin protective layer.
It is preferred that, the heat emission hole inwall is provided with thermal conductive silicon adipose membrane.
Compared with prior art, the beneficial effects of the utility model are：Compared with existing printed circuit board (PCB), this practicality is new
Type is simple in construction, easy to operate, and the utility model adds radiating frame and thermal grease on the basis of existing printed circuit board (PCB)
Pad, radiating frame is fixed and radiated to printed circuit board (PCB), and heat radiation silica gel pad radiates to the bottom of printed circuit board (PCB), enters
And improve the heat dispersion of printed circuit board (PCB).
Brief description of the drawings
Fig. 1 is the utility model structural representation；
Fig. 2 is the utility model circuit board main body structural representation；
Fig. 3 is the utility model radiating mount structure schematic diagram.
In figure：It is 1 circuit board main body, 11 insulation resin protective layers, 12 circuit layers, 13 ink dielectric films, 14 metal-cored, 15 exhausted
Edge substrate, 16 heat radiation silica gel pads, 2 component holes, 3 radiating frames, 31 radiating silica gum covers, 32 embeded slots, 33 heat emission holes, 4 fastener holes,
5 radiating grooves.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belongs to the scope of the utility model protection.
Fig. 1-3 are referred to, the utility model provides a kind of technical scheme：A kind of high-cooling property printed circuit board (PCB), including electricity
Road plate main body 1, the top of circuit board main body 1 offers component hole 2, and electronic component is arranged on circuit board main body 1 by component hole 2
The corresponding position in top, the outer wall of circuit board main body 1 is socketed with radiating frame 3, and radiating frame 3 is to circuit board main body 1 to surrounding
The heat distributed carries out radiating work, and the top of radiating frame 3 offers fastener hole 4, will radiating frame 3 and circuit by fastener hole 4
Plate main body 1 is together fixed on the inside of appliance working, and the left and right sides wall of radiating frame 3 is provided with radiating groove 5, and radiating groove 5 can
To increase the area of dissipation of radiating frame 3, and then the heat dispersion of radiating frame 3 can be improved, circuit board main body 1 includes circuit layer
12, the interior operating circuit for being provided with the circuit board of circuit layer 12, the bottom of circuit layer 12 is provided with ink dielectric film 13, and ink is exhausted
The bottom of velum 13 is provided with metal-cored 14, and ink dielectric film 13 is isolated to metal-cored 14 and circuit layer 12, and metal-cored 14
Contacted, and can be played a protective role to metal-cored 14 with circuit layer 12, it is to avoid metal-cored 14 bottom is provided with insulation
Substrate 15, the bottom of insulated substrate 15 is provided with heat radiation silica gel pad 16, and heat radiation silica gel pad 16 is to circuit layer 12, metal-cored 14 and electricity
The heat that the top electronic component of road plate main body 1 is dispersed into downwards insulated substrate 15 is absorbed and dissipated.
Wherein, the inwall of radiating frame 3 is provided with radiating silica gum cover 31, and the surface of radiating silica gum cover 31 offers chimeric
Groove 32, the left and right sides wall of radiating frame 3 offers heat emission hole 33, and heat emission hole 33 is connected with radiating groove 5, the bottom of circuit layer 12
Insulation resin protective layer 11 is provided with, the inwall of heat emission hole 33 is provided with thermal conductive silicon adipose membrane, radiating silica gum cover 31 and circuit board master
Body 1 is directly contacted, and the heat that circuit board main body 1 is distributed is absorbed, and by the heat of absorption by radiate frame 3 and dissipate
Hot hole 33 is delivered to outside.
Operation principle：The utility model by component hole 2 by electronic component before use, be first arranged on circuit board main body 1
The corresponding position in top, then the circuit board main body 1 assembled is fitted together into the inner chamber of embeded slot 32 on radiating frame 3, radiating
Silica gum cover 31 is directly contacted with circuit board main body 1, and frame 3 and circuit board main body 1 will be radiated together finally by fastener hole 4
The inside of appliance working is fixed on, when being operated, heat radiation silica gel pad 16 is to circuit layer 12, metal-cored 14 and circuit board main body 1
The heat that top electronic component is dispersed into downwards insulated substrate 15 is absorbed and dissipated, and radiating frame 3 is to circuit board main body 1 to four
The heat distributed in week carries out radiating work, when radiating frame 3 carries out radiating work, first passes through radiating silica gum cover 31 to circuit board master
The heat that body 1 is distributed is absorbed, and the conduct heat away after absorption gives radiating frame 3, and a part of heat is directly direct by the frame 3 that radiates
It is vaporized exterior space, a part is vaporized exterior space by the heat emission hole 33 and radiating groove 5 that radiate on frame 3, and radiating groove 5
The area of dissipation of radiating frame 3 can be increased, and then the heat dispersion of radiating frame 3 can be improved.
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out in the case where not departing from principle of the present utility model and spirit a variety of changes, repaiies
Change, replace and modification, scope of the present utility model is defined by the appended claims and the equivalents thereof.
Claims (4)
1. a kind of high-cooling property printed circuit board (PCB), including circuit board main body (1), it is characterised in that：The circuit board main body (1)
Top offers component hole (2), and the outer wall of the circuit board main body (1) is socketed with radiating frame (3), the top of the radiating frame (3)
Portion offers fastener hole (4), and the left and right sides wall of the radiating frame (3) is provided with radiating groove (5), the circuit board main body
(1) circuit layer (12) is included, the bottom of the circuit layer (12) is provided with ink dielectric film (13), the ink dielectric film (13)
Bottom be provided with metal-cored (14), the bottom of metal-cored (14) is provided with insulated substrate (15), the insulated substrate
(15) bottom is provided with heat radiation silica gel pad (16).
2. a kind of high-cooling property printed circuit board (PCB) according to claim 1, it is characterised in that：The interior of frame (3) that radiate
Wall is provided with radiating silica gum cover (31), and the surface of the radiating silica gum cover (31) offers embeded slot (32), the radiating
The left and right sides wall of frame (3) offers heat emission hole (33), and heat emission hole (33) is connected with radiating groove (5).
3. a kind of high-cooling property printed circuit board (PCB) according to claim 1, it is characterised in that：The bottom of the circuit layer (12)
Portion is provided with insulation resin protective layer (11).
4. a kind of high-cooling property printed circuit board (PCB) according to claim 2, it is characterised in that：Heat emission hole (33) inwall
It is provided with thermal conductive silicon adipose membrane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720097404.6U CN206402529U (en) | 2017-01-25 | 2017-01-25 | A kind of high-cooling property printed circuit board (PCB) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720097404.6U CN206402529U (en) | 2017-01-25 | 2017-01-25 | A kind of high-cooling property printed circuit board (PCB) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206402529U true CN206402529U (en) | 2017-08-11 |
Family
ID=59515520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720097404.6U Expired - Fee Related CN206402529U (en) | 2017-01-25 | 2017-01-25 | A kind of high-cooling property printed circuit board (PCB) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206402529U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111132445A (en) * | 2019-12-16 | 2020-05-08 | 中国人民解放军军事科学院国防科技创新研究院 | Satellite-borne stack and standardization module thereof |
| CN112888156A (en) * | 2021-01-15 | 2021-06-01 | 新余市木林森线路板有限公司 | High-thermal-conductivity aluminum-based circuit board and preparation process thereof |
-
2017
- 2017-01-25 CN CN201720097404.6U patent/CN206402529U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111132445A (en) * | 2019-12-16 | 2020-05-08 | 中国人民解放军军事科学院国防科技创新研究院 | Satellite-borne stack and standardization module thereof |
| CN112888156A (en) * | 2021-01-15 | 2021-06-01 | 新余市木林森线路板有限公司 | High-thermal-conductivity aluminum-based circuit board and preparation process thereof |
| CN112888156B (en) * | 2021-01-15 | 2022-02-18 | 新余市木林森线路板有限公司 | High-thermal-conductivity aluminum-based circuit board and preparation process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170811 Termination date: 20220125 |