CN206977798U - Heat radiating type thickness copper coin - Google Patents
Heat radiating type thickness copper coin Download PDFInfo
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- CN206977798U CN206977798U CN201720940682.3U CN201720940682U CN206977798U CN 206977798 U CN206977798 U CN 206977798U CN 201720940682 U CN201720940682 U CN 201720940682U CN 206977798 U CN206977798 U CN 206977798U
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- heat radiating
- radiating type
- copper
- copper coin
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Abstract
The utility model discloses a kind of heat radiating type thickness copper coin, including dual platen, mobility PP layers, PP layers and metal substrate are not flowed, mobility PP is laminated together on dual platen, PP laminations are not flowed together on mobility PP layers, press fit of metal substrate is not in flowing on PP layers, the surface of metal substrate is covered with modified ceramic powder insulation material layer, the circuit made of thick copper foil is provided with modified ceramic powder insulating materials layer surface, layers of copper is plated with the left and right sidewall of heat radiating type thickness copper coin, the both ends of metal substrate are connected with layers of copper, heat emission hole is offered at left and right sides of circuit surface, heat emission hole is from the surface of circuit deeply to not flowing PP layer surfaces, copper plate is provided with the hole wall of heat emission hole, copper plate is connected with metal substrate.The utility model excellent heat dissipation performance, while can efficiently solve and occur that serious gummosis flows to groove center or circuit surface fills unreal the problem of causing hickie using the single PP circuit pressing plates made.
Description
Technical field
It the utility model is related to printed-board technology field, more particularly to a kind of heat radiating type thickness copper coin.
Background technology
Copper-clad plate, also known as base material, supporting material is soaked with resin, one or both sides are coated with copper foil, one formed through hot pressing
Kind board-like material, referred to as copper coating pressing plate, are the basic materials for being printed circuit board (PCB) (Printed Circuit Board, PCB)
Material.The PCB being widely used at present is to cover copper/epoxy glass fabric base material or phenolic resin glass cloth base material, is also used on a small quantity
Paper-based copper-coated board material.Although these base materials are with excellent electric property and processing characteristics, poor radiation, as height heating member
It the sinking path of part, can hardly look to conducting heat by PCB resins itself, but be dissipated from the surface of element into surrounding air
Heat.But as electronic product has enter into part miniaturization, high-density installation, thermalization occurred frequently assembling epoch, if only Pictest area
Very small element surface is very inadequate to radiate.Simultaneously because Quad Flat formula encapsulation technology (Plastic Quad
Flat Package, QFP), the surface mounted component such as the PCB (Ball Grid Array, BGA) of ball bar array architecture it is a large amount of
Use, heat caused by component is transmitted to pcb board in large quantities.Therefore, how to improve the radiating effect of pcb board has turned into decision electricity
An important factor for sub- device stability and reliability.
Therefore, it is necessary to the radiating effect of existing pcb board is further developed, to avoid drawbacks described above.
In addition, traditional product circuit pressing plate is typically all made using single PP, it uses common PP and panel
Pressed, because PP is a kind of those semi-crystalline materials, in the circuit pressing plate of gong sky product, if being made using mobility PP merely
Circuit pressing plate, then the problem of serious gummosis flows to groove center occurs；It is and if simple using not flowing PP the electricity that makes
Road pressing plate, then can not effectively fill line gap, it may appear that circuit surface fills unreal the problem of causing hickie.
Utility model content
The purpose of this utility model is overcome the deficiencies in the prior art, there is provided a kind of heat radiating type thickness copper coin, its thermal diffusivity
Can be good, while can efficiently solve and occur that serious gummosis flows to groove center or line using the single PP circuit pressing plates made
Fill unreal the problem of causing hickie in road surface.
The technical solution of the utility model is as follows：A kind of heat radiating type thickness copper coin, including dual platen, mobility PP layers, do not flow
Dynamic PP layers and metal substrate, together on the dual platen, the PP that do not flow is laminated together in the stream for the mobility PP laminations
On dynamic property PP layers, the press fit of metal substrate is not flowed on PP layers in described, and the surface of the metal substrate is covered with modified pottery
Porcelain powder insulation material layer, the circuit made of thick copper foil is provided with the ceramic powder insulating materials layer surface of the modification, it is described to dissipate
Layers of copper is plated with the left and right sidewall of heat type thickness copper coin, the both ends of the metal substrate are connected with the layers of copper, the circuit
Heat emission hole is offered at left and right sides of surface, the heat emission hole does not deeply flow PP layer tables from the surface of the circuit to described
Face, copper plate is provided with the hole wall of the heat emission hole, the copper plate is connected with the metal substrate.
In the above-mentioned technical solutions, the metal substrate being connected with the layers of copper extends to the heat radiating type thickness copper coin
Side wall, and protrude the side wall at least 0.4mm of the heat radiating type thickness copper coin.
In the above-mentioned technical solutions, the thickness of the layers of copper is less than or equal to 4mil.
In the above-mentioned technical solutions, the thickness of the metal substrate is 3mm.
In the above-mentioned technical solutions, the thickness of the circuit made of thick copper foil is 0.5mm.
In the above-mentioned technical solutions, the dual platen is multilayer LED gong sky dual platen.
In the above-mentioned technical solutions, the dual platen is the dual platen of gong blanking bar groove.
In the above-mentioned technical solutions, the dual platen is pcb board.
In the above-mentioned technical solutions, the PP of the mobility PP layers is filled in the gap of dual platen circuit surface.
In the above-mentioned technical solutions, the PP layers that do not flow are formed by the nonflowing character PP of advance beer out.
Relative to prior art, the beneficial effects of the utility model are：The ceramic powder insulation of modification of the present utility model
Material is mixed with ceramic powder and epoxy resin, and this kind of material has good heat conductivity and radiating, can be by circuit
On heat discharged through ceramic powder insulating materials and be delivered to metal substrate, metal substrate again by inside heat be conducted to both sides
Layers of copper and the copper plate of heat emission hole discharge, take full advantage of the space of copper coin, substantially increase heat-sinking capability, and be made
The copper foil of circuit is also than usual thick many, and the utility model has good thermal diffusivity, electric conductivity, available for high-power, high pressure
Used with the occasion of high current；And the utility model is efficiently solved the simple circuit pressing plate made using mobility PP and can gone out
The problem of now serious gummosis flows to groove center, while can solve simple using its circuit surface of the circuit pressing plate of nonflowing character PP making
Fill unreal the problem of causing hickie.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model heat radiating type thickness copper coin.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail.
As shown in figure 1, a kind of heat radiating type thickness copper coin provided by the utility model, including dual platen 1, mobility PP layers 2, no
The metal substrate 4 of PP layers 3 and thickness for 3mm is flowed, mobility PP layers 2 are pressed on dual platen 1, do not flow PP layers 3 and be pressed on
On mobility PP layers 2, metal substrate 4, which is pressed on, not to be flowed on PP layers 3, and it is exhausted that the surface of metal substrate 4 is covered with modified ceramic powder
Edge material layer 5, it is provided with the modified surface of ceramic powder insulation material layer 5 and the circuit 6 that thickness is 0.5mm is made with thick copper foil, is dissipated
Layers of copper 7 is plated with the left and right sidewall of heat type thickness copper coin, the both ends of metal substrate 4 are connected with layers of copper 7, the left side on the surface of circuit 6
Right both sides offer heat emission hole 8, heat emission hole 8 from the surface of circuit 6 deeply to not flowing the surface of PP layers 3, on the hole wall of heat emission hole 8
Copper plate 9 is provided with, copper plate 9 is connected with metal substrate 4.
Preferably, the metal substrate 4 being connected with layers of copper 7 extends to the side wall of heat radiating type thickness copper coin, and it is thick to protrude heat radiating type
The side wall of copper coin at least 0.4mm.So that the metal substrate 4 is preferably connected heat conduction with the layers of copper 7.
Preferably, the thickness of layers of copper 7 is less than or equal to 4mil.Both excessive space had been not take up, and can makes full use of space, reaches
The effect to be radiated using the layers of copper.
Modified ceramic powder insulating materials is mixed with ceramic powder and epoxy resin, and this kind of material has heat well
Conductibility and radiating, the heat on circuit can be discharged through ceramic powder insulating materials and be delivered to metal substrate 4, metal substrate
The heat of inside is conducted to the layers of copper 7 of both sides and the copper plate 9 of heat emission hole 8 discharges by 4 again, takes full advantage of the sky of copper coin
Between, heat-sinking capability is substantially increased, and the copper foil that circuit is made has good thermal diffusivity, electric conductivity also than usual thick many,
Used available for the occasion of high-power, high pressure and high current.
Preferably, dual platen 1 is multilayer LED gong sky dual platen.It uses the dual platen 1 of gong blanking bar groove as pcb board.It is described
Metal substrate 4 is the thick copper coin that radiates, and the metal substrate 4, which is pressed on, not to be flowed on PP layers 3, and this does not flow PP layers 3 and gone out by advance beer
The nonflowing character PP come is formed.Traditional printed circuit pressure plate dissipates in being related to by the dual platen 1 and thick of the empty trough of belt of gong
The pressing of thermometal substrate 4 forms, but common directly pressing has gummosis and circuit surface fills unreal the problem of causing hickie.
The utility model use is not flowed PP and effectively combined with mobility PP, efficiently avoid the simple electricity made using mobility PP
The problem of serious gummosis is to groove center occurs in road pressing plate；It can solve the simple circuit pressure made using nonflowing character PP simultaneously
Its circuit surface of plate fills unreal the problem of causing hickie.
When making, using stitching by step by step, pressed first with common PP and dual platen 1, because the common PP has
There is mobility, it can effectively be filled in the gap of dual platen circuit surface, and avoiding not flowing PP starveds causes to press the problem of unreal；
After once having pressed, then gong plate is carried out, then carry out second pressing, the metal substrate for not flowing PP and thickness come out with advance beer
4 press together, because circuit has been filled in advance, in the absence of starved problem, meanwhile, immobilising PP is by effectively adjusting
Beer grinds to obtain indent, preferable the problem of controlling gummosis.
Preferred embodiment of the present utility model is these are only, is not limited to the utility model, it is all in this practicality
All any modification, equivalent and improvement made within new spirit and principle etc., should be included in guarantor of the present utility model
Within the scope of shield.
Claims (10)
- A kind of 1. heat radiating type thickness copper coin, it is characterised in that：Including dual platen, mobility PP layers, PP layers and metal substrate are not flowed, Mobility PP lamination is described not flow PP laminations together on the mobility PP layers together on the dual platen, the gold Category substrate is not flowed on PP layers described in being pressed on, and the surface of the metal substrate is covered with modified ceramic powder insulation material layer, The ceramic powder insulating materials layer surface of the modification is provided with circuit, the left and right sides of the heat radiating type thickness copper coin made of thick copper foil Layers of copper is plated with wall, the both ends of the metal substrate are connected with the layers of copper, are opened up at left and right sides of the circuit surface There is heat emission hole, the heat emission hole does not deeply flow PP layer surfaces, the hole wall of the heat emission hole from the surface of the circuit to described On be provided with copper plate, the copper plate is connected with the metal substrate.
- 2. heat radiating type thickness copper coin according to claim 1, it is characterised in that：The metal substrate being connected with the layers of copper The side wall of the heat radiating type thickness copper coin is extended to, and protrudes the side wall at least 0.4mm of the heat radiating type thickness copper coin.
- 3. heat radiating type thickness copper coin according to claim 1, it is characterised in that：The thickness of the layers of copper is less than or equal to 4mil.
- 4. heat radiating type thickness copper coin according to claim 1, it is characterised in that：The thickness of the metal substrate is 3mm.
- 5. heat radiating type thickness copper coin according to claim 1, it is characterised in that：The thickness of the circuit made of thick copper foil For 0.5mm.
- 6. heat radiating type thickness copper coin according to claim 1, it is characterised in that：The dual platen is that multilayer LED gong sky is two-sided Plate.
- 7. heat radiating type thickness copper coin according to claim 1, it is characterised in that：The dual platen is two-sided for gong blanking bar groove Plate.
- 8. the heat radiating type thickness copper coin according to claim 6 or 7, it is characterised in that：The dual platen is pcb board.
- 9. heat radiating type thickness copper coin according to claim 1, it is characterised in that：The PP of the mobility PP layers is filled in two-sided The gap on printed line road surface.
- 10. heat radiating type thickness copper coin according to claim 1, it is characterised in that：The PP layers that do not flow are come out by advance beer Nonflowing character PP formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720940682.3U CN206977798U (en) | 2017-07-31 | 2017-07-31 | Heat radiating type thickness copper coin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720940682.3U CN206977798U (en) | 2017-07-31 | 2017-07-31 | Heat radiating type thickness copper coin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206977798U true CN206977798U (en) | 2018-02-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720940682.3U Active CN206977798U (en) | 2017-07-31 | 2017-07-31 | Heat radiating type thickness copper coin |
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| CN (1) | CN206977798U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108471669A (en) * | 2018-02-28 | 2018-08-31 | 宁波央腾汽车电子有限公司 | A kind of welding method reducing printed circuit board thermal resistance |
| CN108848610A (en) * | 2018-08-30 | 2018-11-20 | 歌尔股份有限公司 | A kind of printed circuit board |
| CN113950205A (en) * | 2020-07-16 | 2022-01-18 | 深南电路股份有限公司 | Processing method of circuit board, processing method of copper-clad plate and circuit board |
-
2017
- 2017-07-31 CN CN201720940682.3U patent/CN206977798U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108471669A (en) * | 2018-02-28 | 2018-08-31 | 宁波央腾汽车电子有限公司 | A kind of welding method reducing printed circuit board thermal resistance |
| CN108848610A (en) * | 2018-08-30 | 2018-11-20 | 歌尔股份有限公司 | A kind of printed circuit board |
| CN113950205A (en) * | 2020-07-16 | 2022-01-18 | 深南电路股份有限公司 | Processing method of circuit board, processing method of copper-clad plate and circuit board |
| CN113950205B (en) * | 2020-07-16 | 2024-03-22 | 深南电路股份有限公司 | Circuit board processing method, copper-clad plate processing method and circuit board |
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