CN108848610A - A kind of printed circuit board - Google Patents
A kind of printed circuit board Download PDFInfo
- Publication number
- CN108848610A CN108848610A CN201810999838.4A CN201810999838A CN108848610A CN 108848610 A CN108848610 A CN 108848610A CN 201810999838 A CN201810999838 A CN 201810999838A CN 108848610 A CN108848610 A CN 108848610A
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- wiring
- layer
- effective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a kind of printed circuit board, including at least one layer of wiring layer, each wiring layer includes effective wiring and the non-effective wiring positioned at effective wiring periphery；And the side-wall metallic layer for being formed in the printed circuit board side wall and being connected to the non-effective wiring of each wiring layer.Embodiment provided by the invention is by the non-effective wiring of each wiring layer for the printed circuit board that will directly contact with the heater element in electronic equipment by heat derives, and it is distributed by side-wall metallic layer, the heat of electronic equipment generation is effectively relieved, reduce electronic equipment internal temperature, the risk of electronic equipment thermal failure is reduced with this, while improving reliability and the service life of electronic equipment.
Description
Technical field
The present invention relates to electronic product radiating fields, more particularly to a kind of printed circuit board.
Background technique
In electronic product, electronic equipment consumed electric energy, such as RF power amplification, fpga chip and electricity during operation
Source class product is largely converted to heat and distributes other than useful work.Electronic equipment generate heat make internal temperature it is rapid on
It rises, if not in time distributed the heat, electronic equipment will continue to heat up, and device is easy for causing electronics to set because of overheating failure
Standby unfailing performance decline.As electronic product enters component miniaturization, high-density installation, high-incidence thermalization assembling epoch, if
It is far from being enough for only carrying out heat dissipation by the surface area of element.
Simultaneously again due to a large amount of uses of the surface encapsulations element such as QFP, BGA, the heat that component generates is transmitted in large quantities
Printed circuit board, therefore the best method for solving heat dissipation is to improve dissipating for the printed circuit board itself directly contacted with heater element
The heat that component generates is conducted or is distributed by printed circuit board by thermal energy power.
The plate for the printed circuit board being widely used at present is to cover copper or epoxy glass fabric substrate or phenolic resin glass
Glass cloth base material, there are also use paper-based copper-coated board material and metal substrate on a small quantity.Although these substrates have excellent electric property and
Processing performance, but poor radiation cannot go conduction heat as the sinking path of high heater element by conventional print-circuit board itself
Amount, therefore how research improves the heat-sinking capability of printed circuit board and has become electronic field urgent problem to be solved.
Summary of the invention
At least one to solve the above-mentioned problems, first aspect present invention provides a kind of printed circuit board, including at least one
Layer wiring layer,
Each wiring layer includes effective wiring and the non-effective wiring positioned at effective wiring periphery；And
The side-wall metallic layer for being formed in the printed circuit board side wall and being connected to the non-effective wiring of each wiring layer.
Further, the width of the non-effective wiring is more than or equal to 0.15mm.
Further, the electric attribute of the non-effective wiring is set as non-electrical attribute.
Further, the electric attribute of the non-effective wiring is set as GND attribute.
Further, the side-wall metallic layer be the coat of metal, the coat of metal with a thickness of 10-20 μm.
Further, the material of the side-wall metallic layer is selected from one of gold, silver, copper, nickel, palladium or a variety of.
Beneficial effects of the present invention are as follows：
The present invention is directed to that current existing electronic product radiating performance is poor, the case where easily generating heat, and provides a kind of printed circuit
Plate, will by the non-effective wiring of each wiring layer on the printed circuit board that will directly contact with the heater element in electronic equipment
Heat derives, and distributed by side-wall metallic layer, the deficiency of previous electronic product radiating is compensated for, electronics is effectively relieved and sets
The standby heat generated, is advantageously reduced electronic equipment internal temperature, the risk of electronic equipment thermal failure is reduced with this, is improved simultaneously
The reliability of electronic equipment and service life.
Detailed description of the invention
Specific embodiments of the present invention will be described in further detail with reference to the accompanying drawing.
Fig. 1 shows the sectional view of printed circuit board described in the prior art；
Fig. 2 shows the sectional views of printed circuit board described in one embodiment of the present of invention.
Specific embodiment
In order to illustrate more clearly of the present invention, the present invention is done further below with reference to preferred embodiments and drawings
It is bright.Similar component is indicated in attached drawing with identical appended drawing reference.It will be appreciated by those skilled in the art that institute is specific below
The content of description is illustrative and be not restrictive, and should not be limited the scope of the invention with this.
It is as shown in Figure 1 the sectional view of two layer printed circuit boards in the prior art, wherein substrate 1 is insulating layer, on substrate 1
Side is layer top layer wiring layer 2, and lower section is bottom wiring layer 3, the surface covering ink 4, d1 of layer top layer wiring layer 2 and bottom wiring layer 3
The inactive area being arranged between effective wiring of each wiring layer and the edge of printed circuit board, is not provided with circuit in this area
Wiring.The wiring layer of conventional printed circuit boards is one layer of copper sheet of coating, for avoid preventing the edge of each wiring layer leak copper or
There is short circuit phenomenon at the time of molding in the interlayer signal of each wiring layer, usually etches away the copper that covers of cyclic annular inactive area, i.e., in vain
It is insulating layer below the ink of the region part d1.Although this structure can be avoided short circuit, for printing urgently to be resolved at present
The heat dissipation problem of circuit board is helpless.
For the heat dissipation problem of printed circuit board existing in the prior art, as shown in Fig. 2, one embodiment of the present of invention
A kind of printed circuit board, including at least one layer of wiring layer are provided, each wiring layer includes effectively being routed and being located at effectively wiring
The non-effective wiring on periphery；And it is formed in the printed circuit board side wall and is connected to the non-effective wiring of each wiring layer
Side-wall metallic layer.
Still with two layer printed circuit boards for example, be illustrated in figure 2 the sectional view of printed circuit board in the present embodiment,
It is layer top layer wiring layer 2 above substrate 1 on the basis of the prior art, lower section is bottom wiring layer 3, layer top layer wiring layer 2 and bottom cloth
The surface of line layer 3 covers ink 4, and retain the region each wiring layer d1 covers copper, sets non-effective wiring, the i.e. area d1 for the region d1
Domain and top layer wiring area are laid with one layer of copper sheet, wiring area are made by pattern picture on the copper sheet, then by the area d1
Domain is set as non-effective wiring.A thickness is equably plated on other 4 faces that printed circuit board removes top layer 2 and bottom 3 simultaneously
Degree is the side-wall metallic layer 5 of d2, i.e., the described side-wall metallic layer 5 is circumferentially positioned at the periphery of the printed circuit board, the side wall
Metal layer 5 is connected with the non-effective wiring of each wiring layer, to be routed the heat for generating heater element by non-effective
The heat derives that amount and printed circuit board itself generate, then quickly and efficiently reach the side-wall metallic of printed circuit board surrounding
On layer, metal be both electricity good conductor and heat good conductor, it is described in the present embodiment it is non-effective wiring be effectively routed it
Between be only used for heat transfer, there is no electrical connections, therefore increase heat dissipation area using the side-wall metallic layer, and realization passes heat
It leads except printed circuit board, the heat of printed circuit board surface can be effectively reduced, reduce the temperature of printed circuit board surface,
It avoids electronic equipment because of the risk of thermal failure caused by radiating not in time, while improving reliability and the service life of electronic equipment.
It is worth noting that the present embodiment can be used at least one layer of printed circuit board, and the printing electricity that the number of plies is more
The heat dissipation problem of road plate is more serious, non-effective wiring is laid on each wiring layer, and by being looped around printed circuit board four
The side-wall metallic layer in week is connected, and can efficiently solve printed circuit board radiating problem.Therefore those skilled in the art should
Understand, needs according to practical application request designing printed circuit board, to meet the cooling requirements of printed circuit board as design principle.
In a preferred embodiment, in order to guarantee the heat derives for effectively generating the heater element,
And the width of the area for not influencing the volume of printed circuit board and being effectively routed, the non-effective wiring is more than or equal to
0.15mm。
Simultaneously in order to further ensure the signal quality that is effectively routed on printed circuit board, the non-effective wiring it is electrical
Attribute is set as non-electrical attribute, or is set as safer GND attribute, while guaranteeing heat conduction and heat radiation, avoids because each
Short circuit caused by the non-effective wiring of wiring layer is connect with side-wall metallic layer, it is ensured that the normal operation of printed circuit board.
In another preferred embodiment, the side-wall metallic layer be the coat of metal, including but not limited to metallic gold,
One of silver, copper, nickel, palladium are a variety of, are similarly the effectively heat dissipation for guaranteeing the printed circuit board and do not influence it in electricity
The thickness of occupied volume in sub- equipment, the side-wall metallic layer is set as 10-20 μm, i.e., d2 shown in Fig. 2.Side-wall metallic
Layer is while solving the heat dissipation problem of printed circuit board, and because non-effective wiring phase with each wiring layer of printed circuit board
Connection, can effectively promote the anti-electromagnetic interference capability of electronic product.
Obviously, the above embodiment of the present invention be only to clearly illustrate example of the present invention, and not be pair
The restriction of embodiments of the present invention may be used also on the basis of the above description for those of ordinary skill in the art
To make other variations or changes in different ways, all embodiments can not be exhaustive here, it is all to belong to this hair
The obvious changes or variations that bright technical solution is extended out are still in the scope of protection of the present invention.
Claims (6)
1. a kind of printed circuit board, including at least one layer of wiring layer, which is characterized in that
Each wiring layer includes effective wiring and the non-effective wiring positioned at effective wiring periphery；And
The side-wall metallic layer for being formed in the printed circuit board side wall and being connected to the non-effective wiring of each wiring layer.
2. printed circuit board according to claim 1, which is characterized in that the width of the non-effective wiring is more than or equal to
0.15mm。
3. printed circuit board according to claim 1, which is characterized in that the electric attribute of the non-effective wiring is set as
Non-electrical attribute.
4. printed circuit board according to claim 1, which is characterized in that the electric attribute of the non-effective wiring is set as
GND attribute.
5. printed circuit board according to claim 1, which is characterized in that the side-wall metallic layer is the coat of metal, described
The coat of metal with a thickness of 10-20 μm.
6. printed circuit board according to claim 1, which is characterized in that the material of the side-wall metallic layer be selected from gold, silver,
One of copper, nickel, palladium are a variety of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810999838.4A CN108848610A (en) | 2018-08-30 | 2018-08-30 | A kind of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810999838.4A CN108848610A (en) | 2018-08-30 | 2018-08-30 | A kind of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108848610A true CN108848610A (en) | 2018-11-20 |
Family
ID=64189010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810999838.4A Pending CN108848610A (en) | 2018-08-30 | 2018-08-30 | A kind of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108848610A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07106720A (en) * | 1993-09-29 | 1995-04-21 | Ibiden Co Ltd | Mounting board for electronic component |
| CN102510657A (en) * | 2011-10-08 | 2012-06-20 | 苏州佳世达电通有限公司 | Multilayer circuit board and electronic device comprising same |
| US20150029661A1 (en) * | 2014-10-15 | 2015-01-29 | AzTrong Inc. | Wearable portable electronic device with heat conducting path |
| CN206977798U (en) * | 2017-07-31 | 2018-02-06 | 深圳市丰达兴线路板制造有限公司 | Heat radiating type thickness copper coin |
-
2018
- 2018-08-30 CN CN201810999838.4A patent/CN108848610A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07106720A (en) * | 1993-09-29 | 1995-04-21 | Ibiden Co Ltd | Mounting board for electronic component |
| CN102510657A (en) * | 2011-10-08 | 2012-06-20 | 苏州佳世达电通有限公司 | Multilayer circuit board and electronic device comprising same |
| US20150029661A1 (en) * | 2014-10-15 | 2015-01-29 | AzTrong Inc. | Wearable portable electronic device with heat conducting path |
| CN206977798U (en) * | 2017-07-31 | 2018-02-06 | 深圳市丰达兴线路板制造有限公司 | Heat radiating type thickness copper coin |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20201016 Address after: 261031 north of Yuqing East Street, east of Dongming Road, Weifang High tech Zone, Weifang City, Shandong Province (Room 502, Geer electronic office building) Applicant after: GoerTek Optical Technology Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Applicant before: GOERTEK Inc. |
|
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181120 |