JPH07106720A - Mounting board for electronic component - Google Patents

Abstract

PURPOSE:To provide an electronic component mounting board suitable for thin-layered high-density packing, by forming a power-supply circuit and a grounding circuit on an insulating board using a mounting recessed part, and preventing an electronic component from contacting with a side wall of the mounting recessed part CONSTITUTION:An electronic component mounting board includes insulating 91 and 92, a mounting recessed part 9 for mounting an electronic component at the insulating boards 91 and 92, and a power-supply circuit 11 and a grounding circuit 12 put between the insulating boards 91 and 92. A plurality of side- wall circuits 10 are formed at a side wall 90 of the mounting recessed part 9. The side-wall circuit 10 is connected to the power-supply circuit 11 or the grounding circuit 12 and has an individual potential. The face of the side-wall circuit 10 is coated with an insulating material 2 like epoxy resin. At the inside wall of the recessed part 9, a through hole as a circuit in cross section, for example, can be used as the side-wall circuit.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention makes it possible to form a power supply circuit and a ground circuit on one insulating substrate by using a mounting recess, and to prevent electrical contact between an electronic component and a sidewall of the mounting recess. The present invention relates to a substrate for mounting electronic components, which can achieve the above.

[0002]

2. Description of the Related Art Conventionally, in order to improve the electrical characteristics of a board for mounting electronic parts, generally, a wiring width has to be wide,
It has been attempted to shorten the wiring length. However, this method hinders high-density mounting and may be difficult in design.

Therefore, as an electronic component mounting substrate having excellent electrical characteristics, for example, the substrates shown in FIGS. 12 and 13 can be considered. The electronic component mounting substrate is an insulating substrate 91, 9
2 and a mounting recess 9 for mounting the electronic component 7. A large number of wiring circuits 925 for signals are formed on the front surface of the insulating substrate 92.

The mounting recess 9 is provided in the central portion of the insulating substrates 91 and 92, and the entire wall surface thereof is continuously covered with the metal plating 30. Further, a terminal 300 connected to the metal plating 30 is formed on the surface edge of the mounting recess 9. On the other hand, as shown in FIG.
As shown in FIG. 13, an inner plane layer 3 for use in a power supply circuit or a ground circuit is formed.

The inner plane layer 3 is formed as a so-called solid layer over the entire back surface of the insulating substrate 92 as described above. The inner plane layer 3 is connected to the metal plating 30. The terminal 300 is connected to the electronic component 7 by the wire 70. Inner layer Plain layer 3
Are connected to the through holes 99 covered with the metal plating film 39. The lead pin 6 is provided in the through hole 99.
Has been inserted.

[0006]

However, in the above-mentioned conventional electronic component mounting substrate, the inner plane layer 3 is connected to the metal plating 30 of the mounting recess 9, and the metal plating 30 covers the entire mounting recess 9. It is formed continuously.
Therefore, the metal plating 30 and the inner plane layer 3 can be formed only as a layer having a single potential. Therefore, the inner plane layer 3 can be used only for one of the power supply circuit and the ground circuit.

On the other hand, in recent years, high-density packaging has progressed, and there is a demand for providing a plurality of power supply circuits and ground circuits. Therefore, as shown in FIG.
It is conceivable that a multi-layered substrate is manufactured by using Nos. 94 to 94 and the inner plane layers 32, 33, 34 for use in the power supply circuit or the ground circuit are formed on the back surface of each insulating substrate.

The multilayer electronic component mounting substrate has a mounting recess 9 for mounting an electronic component and through holes 992, 993, 994 covered with a metal plating film 39. The mounting recess 9 has a part of the surface of the insulating substrate 91 as the bottom surface and the opening holes 920, 930, 940 provided in the insulating substrates 92, 93, 94 as the wall surfaces. Opening hole 9
All the walls of 20, 930 and 940 are metal plated 320,
It is covered with 330 and 340.

The metal plating 320, 330, 340 is formed on the surface edge of each opening hole 920, 930, 940.
The connection terminals 302, 303, 304 connected to are formed. In addition, each inner plane layer 32, 33,
34 is connected to each of the metal platings 320, 330 and 340. Also, each inner plane layer 32, 33, 3
4 are connected to through holes 992, 993, 994, respectively.

In the multilayer electronic component mounting board, the inner plane layers 32, 33 and 34 are formed on the back surfaces of different insulating boards 92, 93 and 94, respectively. Therefore, each inner plane layer has its own potential and can be used as a power supply circuit or a ground circuit. As a result, a plurality of power supply circuits or ground circuits can be provided on the electronic component mounting board, and high-density mounting can be achieved.

However, this multilayer electronic component mounting substrate is
This increases the thickness of the entire board, which prevents the electronic component mounting board from becoming thinner. Further, when the electronic component is mounted inside the mounting recess, it is necessary to prevent electrical contact between the electronic component and the side wall of the mounting recess. In view of the above conventional problems, the present invention can form a power supply circuit and a ground circuit on one insulating substrate by using the mounting recess, and achieves thin layer, high density mounting, and electronic component and mounting recess. It is an object of the present invention to provide an electronic component mounting substrate that can prevent electrical contact with the side wall of the electronic component.

[0012]

An electronic component mounting substrate having an insulating substrate, a mounting recess for mounting an electronic component provided on the insulating substrate, and a wiring circuit provided inside the insulating substrate. A plurality of side wall circuits are formed on the side wall of the mounting recess, each side wall circuit is connected to the wiring circuit, and the surface of the side wall circuit is coated with an electrically insulating material. The electronic component mounting board is characterized by the above.

What is most noticeable in the present invention is that a plurality of sidewall circuits are formed on the sidewall of the mounting recess, and the wiring circuit is formed on the back surface of the insulating substrate provided with the sidewall circuit. They are connected and the surface of the side wall circuit is coated with an electrically insulating material.

The side wall circuit is formed continuously from the wall surface of the mounting recess to the surface edge of the mounting recess. The side wall circuit is, for example, a cross-section through hole formed on the wall surface of the mounting recess. The surface edge of the side wall circuit is connected to the electronic component by a wire.

The side wall circuit is connected to the wiring circuit provided inside the insulating substrate, that is, between the plurality of insulating substrates. Further, the sidewall circuit may be connected to, for example, a front surface circuit formed on the front side surface of the insulating substrate or a back surface circuit formed on the back side surface of the insulating substrate. The wiring circuit profitable inside the insulating substrate is, for example, a power supply circuit or / and a ground circuit, a wiring pattern, or the like. The front surface circuit and the back surface circuit are wiring patterns, through-hole lands, connection pads, or the like. Further, a power supply circuit and / or a ground circuit can be provided in the front surface circuit and the back surface circuit.

Examples of the electric insulating material include epoxy resin, epoxy resin, polyimide resin, phenol resin,
It is preferable to use a resin material selected from the group of bismaleimide triazine resin, epoxy modified resin, polyimide modified resin, phenol modified resin, and bismaleimide modified resin.

The electrically insulating material is coated, for example, in a molten state on the exposed portion of the side wall circuit, or as shown in the embodiment, the through hole is filled with the electrically insulating material before the through hole is formed. ， This is covered by cutting at the same time when forming the through hole in the cross section.

The electronic component mounting substrate is formed by laminating at least two insulating substrates. The side wall circuit is formed, for example, on the uppermost insulating substrate, or on the uppermost insulating substrate and the lower insulating substrate. Further, when three or more insulating substrates are used, the sidewall circuit can be formed on the insulating substrate which is an intermediate layer between them.

Next, an example of a method of manufacturing the electronic component mounting board will be described. First, an uppermost insulating substrate is prepared, and a plurality of side wall circuit forming holes are formed near the cutting position of the mounting recess. The hole has a slit shape, a cylindrical shape, or the like. Next, metal plating is applied to the inside of the hole to form a side wall circuit. Further, connection terminals for the side wall circuit are formed on the surface edge of the mounting recess, and a wiring circuit such as a ground circuit and / or a power supply circuit is formed on the back surface of the insulating substrate. Then, the hole is filled with the electrically insulating material.

Next, the holes in the insulating substrate are cut by punching or router processing to form a mounting recess. As a result, the uppermost insulating substrate can be obtained. Further, the surface of the side wall circuit of the mounting recess is covered with an electrically insulating material.
Next, another insulating substrate is laminated under the uppermost insulating substrate and thermocompression bonded. As a result, the electronic component mounting board is obtained.

[0021]

In the present invention, a plurality of side wall circuits are provided on the wall surface of the mounting recess. Therefore, each of the side wall circuits can have a single potential and can be freely connected to any of the wiring circuits formed inside the insulating substrate. Therefore, it is not necessary to stack a large number of insulating substrates. Therefore, it is possible to reduce the thickness of the electronic component mounting substrate. Further, since the wiring circuit is formed inside the electronic component mounting board, there is a high degree of freedom in wiring and high density mounting can be achieved.

The surface of the side wall circuit is coated with an electrically insulating material. Therefore, when the electronic component is mounted in the mounting recess, electrical contact between the electronic component and the sidewall circuit can be prevented. According to the present invention, it is possible to form a wiring circuit on one insulating substrate by utilizing the mounting recess, and to achieve a thin layer, high density mounting, and prevention of electrical contact between the electronic component and the sidewall of the mounting recess. It is possible to provide a substrate for mounting electronic components that can be designed.

[0023]

EXAMPLES Example 1 An electronic component mounting substrate of this example will be described with reference to FIGS. As shown in FIGS. 1 to 3, the electronic component mounting substrate includes insulating substrates 91 and 92, a mounting recess 9 for mounting the electronic component 7, and the insulating substrate 91 and the insulating substrate 92. The power supply circuit 11 and the ground circuit 12 are provided.

Four sidewall circuits 10 are formed on the sidewall 90 of the mounting recess 9. The side wall circuit 10 is formed in the through hole 901 in cross section as shown in FIGS. Each side wall circuit 10 is connected to the power supply circuit 11 or the ground circuit 12 as shown in FIGS.

Further, the surface of the side wall circuit 10 is coated with an electrically insulating material 2. As the electric insulation material 2,
Epoxy resin used for sealing electronic components is used. The connection terminal 100 of each side wall circuit 10 is connected to the electronic component 7 by the wire 70.

The electronic component mounting substrate includes an insulating substrate 91,
A through hole 99 penetrating 92 is provided. The inner wall of the through hole 99 is covered with the metal plating 19, and the lead pin 6 is inserted therein. On the surface of the insulating substrate 91, the wiring circuit 52 and its pad 51 are provided.
Are formed. The power supply circuit 11 and the ground circuit 12 are connected to a plurality of different through holes 99 as shown in FIG.

A method of manufacturing the electronic component mounting board will be described with reference to FIGS. First, as shown in FIGS. 4 and 5, an insulating substrate 92 for the upper layer is prepared, and a plurality of holes 900 for forming sidewall circuits are formed near the cutting position of the mounting recess by router processing. Hall 900 is
It has a long and thin slit shape. Although not shown,
At this time, through holes are also drilled.

Next, as shown in FIG. 6, the side wall circuit 10 is formed in the hole 900 by metal plating. Further, on the surface of the insulating substrate 92, the connection terminals 100 of the sidewall circuit 10,
A wiring circuit 52 for signals and a pad 51 are formed. Further, as shown in FIGS. 7 and 3, the power supply circuit 11 and the ground circuit 12 are formed on the back surface of the insulating substrate 92. Further, metal plating 19 is applied to the inside of the through hole 99.

Next, in all the above holes 900,
Fill with electrically insulating material 2. As the electrically insulating material,
A semi-cured epoxy resin is used.
It is filled in 00 and cured by heating. Next, in FIG.
As shown in FIG. 9, by punching or router processing, the spaces between the holes 900 are cut as indicated by dotted lines 909 in FIG. 8 to form the mounting recesses 9 in the insulating substrate 92. In this way, the upper insulating substrate 92 is obtained. Further, the surface of the side wall circuit 10 of the mounting recess 9 is covered with the electrically insulating material 2 (FIG. 9).

Further, another insulating substrate 91 as a lower layer is prepared. A through hole is formed in the insulating substrate 91 at the same position as the through hole of the insulating substrate 92. Then, metal plating 19 is applied to the inside of the through hole. Next, the upper insulating substrate 92 and the other insulating substrate 91 are stacked and thermocompression bonded. As a result, the electronic component mounting substrate shown in FIGS. 1 to 3 is obtained.

Next, the function and effect of the present invention will be described. In the electronic component mounting board of this example, as shown in FIGS. 1 and 3, four side wall circuits 10 are provided on the wall surface 90 of the mounting recess 9. Therefore, each side wall circuit 10 can have its own potential and can be freely connected to either the power supply circuit 11 or the ground circuit 12.

Corresponding to this, one insulating substrate 9
On the back side of 2, the power supply circuit 11 and the ground circuit 12
Form both sides. Therefore, it is not necessary to stack a large number of insulating substrates. Therefore, it is possible to reduce the thickness of the electronic component mounting substrate.

The inside of the insulating substrate, that is, the insulating substrate 92
Since the power supply circuit 11 and the ground circuit 12 are formed on the back surface of the, the wiring has a high degree of freedom and high density mounting can be achieved. Further, since the surface of the side wall circuit 10 is coated with the electrically insulating material 2, when the electronic component 7 is mounted in the mounting recess 9, the electronic component 7 and the side wall circuit 1 are mounted.
No electrical contact occurs with 0.

Embodiment 2 In the electronic component mounting substrate of this embodiment, as shown in FIG. 10, a large number of semicircular through holes 902 are formed in the side wall 90 of the mounting recess 9. A sidewall circuit is formed in the cross-section through hole 902. Each side wall circuit 10 has a connecting terminal 100 on the surface edge.
Pads 51 of the transmission wiring circuit 52 are formed between the connection terminals 100. In addition, the surface of each sidewall circuit is covered with the electrically insulating material 2 similar to that of the second embodiment in the through hole 902 in cross section.

In producing the electronic component mounting substrate of this example, first, as shown in FIG. 11, twelve cylindrical holes 900 are formed in the upper insulating substrate 92 at the positions where the mounting recesses 9 are formed. To drill. After that, the sidewall circuit 10 is formed in the hole 900 by metal plating in the same manner as in the first embodiment.

Next, the connection terminal 100, the transmission wiring circuit 52 and the pad 51 are formed on the front surface of the insulating substrate 92, and the ground circuit and the power supply circuit are formed on the rear surface of the insulating substrate 92. In addition, the metal plating 19 is provided inside the through hole 99.
Give. Further, the inside of the through hole 99 is filled with the electrically insulating material 2.

Next, the holes 900 are cut between the holes 900 by router processing or the like as shown by dotted lines 909 in FIG. 11 to form the mounting recesses 9 in the insulating substrate 92. As a result, the upper-layer insulating substrate 92 having the through-hole 902 in cross section is obtained. Further, a state in which the surface of the through hole 902 as a side wall circuit is covered with the electrically insulating material 2 is formed.

Further, a through hole having a metal plated inside is formed in the lower insulating substrate 91. Next, the insulating substrate 92 is laminated on the insulating substrate 91 and thermocompression bonded. As a result, the electronic component mounting board shown in FIG. 10 is obtained. Others are the same as in the first embodiment.

In this example, a large number of side wall circuits 10 are provided in the mounting recess 9. Therefore, each sidewall circuit 10 can be connected to either the power supply circuit or the ground circuit, and the power supply circuit and the ground circuit can be arranged at arbitrary positions. Further, the electrical insulating material 2 can prevent electrical contact between the electronic component and the sidewall circuit. The side wall circuit 10 can be connected to the transmission circuit 52 in addition to the power supply circuit and the ground circuit. Further, according to this example, the same effect as that of the first embodiment can be obtained.

[Brief description of drawings]

FIG. 1 is a plan view of an electronic component mounting board according to a first embodiment.

FIG. 2 is a cross-sectional view of the electronic component mounting board according to the first embodiment.

FIG. 3 is a sectional view taken along the line AA of FIG.

FIG. 4 is an explanatory view showing a method for manufacturing an electronic component mounting substrate according to the first embodiment.

FIG. 5 is an explanatory diagram following FIG. 4;

FIG. 6 is an explanatory diagram following FIG. 5;

FIG. 7 is an explanatory diagram following FIG. 6;

FIG. 8 is an explanatory diagram following FIG. 7.

FIG. 9 is an explanatory diagram following FIG. 8;

FIG. 10 is an enlarged perspective view of an essential part of the electronic component mounting board according to the second embodiment.

FIG. 11 is an explanatory view showing a method for manufacturing an electronic component mounting substrate according to a second embodiment.

FIG. 12 is a sectional view of a conventional electronic component mounting substrate.

13 is a cross-sectional view taken along the line BB of FIG.

FIG. 14 is a cross-sectional view of another conventional multilayer electronic component mounting substrate.

[Explanation of symbols]

 10. ． ． Sidewall circuit, 100. ． ． Connection terminal, 11. ． ． Power supply circuit, 12. ． ． Circuit for ground, 2. ． ． Electrical insulating material, 7. ． ． Electronic components, 9. ． ． Mounting recess, 90. ． ． Side wall, 900. ． ． Hall, 901,902. ． ． Cross-section through hole, 91, 92. ． ． Insulating substrate,

Claims (5)

[Claims] 1. An electronic component mounting substrate having an insulating substrate, a mounting recess for mounting an electronic component provided on the insulating substrate, and a wiring circuit provided inside the insulating substrate, wherein: A plurality of side wall circuits are formed on the side wall of the mounting recess, each side wall circuit is connected to the wiring circuit, and the surface of the side wall circuit is coated with an electrically insulating material. Substrate for mounting electronic components. 2. The electronic component mounting board according to claim 1, wherein the wiring circuit is a power supply circuit and / or a ground circuit. 3. The electronic component mounting substrate according to claim 1, wherein the side wall circuit is a through hole having a cross section formed in a side wall of a mounting recess. 4. The side wall circuit according to claim 1, 2 or 3, wherein the side wall circuit is formed on a front side surface of the insulating substrate, a back side circuit formed on a back side surface of the insulating substrate, or inside the insulating substrate. An electronic component mounting board, which is connected to at least one circuit of the internal circuits. 5. The electrical insulating material according to claim 1, wherein the electrical insulating material is epoxy resin, polyimide resin, phenol resin, bismaleimide triazine resin, epoxy modified resin, polyimide modified resin, phenol modified resin, or bismaleimide. A substrate for mounting electronic parts, which is a resin material selected from the group of modified resins.