JP2001291817A - Electronic circuit device and multilayer printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board which enables high density mounting including electronic components capable of cutting off electric influence between mounted components, and is formed by a simple process, and an electronic circuit device including the printed board. SOLUTION: This multilayer printed wiring board is provided with a first wiring layer 2, a second insulating substrate 1b, a second wiring layer 2 and a third insulating substrate 1a which are laminated in order on a first insulating substrate 1c, a vacancy 6 formed in a part of the second substrate 1b, built-in electronic components 3c, 4 formed on a surface of the first substrate 1 c which faces the vacancy 6, a metal layer 7a formed on a surface of the third substrate 1 a which faces at least the vacancy 6, and columnar metal wiring 7b formed in the second substrate 1 b in the vicinity of the vacancy 6. The electronic circuit device includes the printed wiring board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer printed wiring board in which electronic components are embedded and electronic components can be mounted at high density, and an electronic circuit device including the multilayer printed wiring board. The present invention relates to a multilayer printed wiring board in which the electrical influence of the printed circuit board is blocked and an electronic circuit device including the same.

[0002]

2. Description of the Related Art A multilayer printed wiring board has a structure in which a conductor layer and an insulating substrate are sequentially laminated, and is characterized in that a large amount of wiring of the conductor layer is accommodated. Electronic components such as semiconductor chips are mounted on the surface of the multilayer printed wiring board. There is also a multilayer printed wiring board in which a hole from which a part of a conductive layer or an insulating substrate is removed is provided inside the multilayer printed wiring board and an electronic component such as a semiconductor chip is built in the hole. By mounting electronic components not only on the surface of the multilayer printed wiring board but also inside it, the mounting density of the multilayer printed wiring board can be significantly improved.

FIGS. 6A and 6B are sectional views of a conventional electronic circuit device in which electronic components are mounted on a printed wiring board. In each of the electronic circuit devices shown in FIGS. 6A and 6B, a conductor layer 2 serving as a wiring is formed on one surface of an insulating upper substrate 1a, and the conductor layer 2 is formed on the upper substrate 1a.
The electronic component 3a is mounted so as to be connected to the electronic component 3a. Conductive layers 2 are also formed on both surfaces of lower substrate 1c, and electronic components 3c or semiconductor chips 4 are mounted on both surfaces of lower substrate 1c so as to be connected to conductive layers 2.

When mounting electronic components on a conventional printed wiring board, at least one of the laminated insulating substrates is shielded using a metal case. For example, in the electronic circuit device shown in FIG. 6A or 6B, the lower substrate 1c including the electronic component 3c or the semiconductor chip 4 mounted on the surface is entirely covered with the metal case 5.

[0005] With such a shield structure, mutual electric influence between the electronic component 3a mounted on the upper substrate 1a and the electronic component 3c mounted on the lower substrate 1c is cut off, for example, to prevent electromagnetic waves. Thus, problems such as noise due to noise were reduced. Further, with such a shield structure, the electric influence between the electronic component 3c mounted on the lower substrate 1c and the outside is also cut off.

[0006]

However, as described above, when electronic components are mounted on a conventional printed wiring board and the laminated insulating substrate is shielded using a metal case, the electronic components are mounted. There is a problem that the thickness of the entire electronic circuit device increases. In addition, there is a problem that the weight is increased by providing the metal case.

On the other hand, instead of a metal case, a resin mold having a metal film formed on its surface may be used as a shield member. In this case, the increase in weight is smaller than that in the case of the metal case, but the problem that the thickness of the entire electronic circuit device increases is not solved.

As described above, a metal case or a resin case having a metal coating is used to cut off the mutual electric influence between the mounted components on the insulating substrate or the electric effect between the built-in mounted components and the outside. If provided, a step of attaching a metal case or a resin case is required before joining the layers of the insulating substrate.

Further, when a case made of metal or resin is used to shield between the substrates, in order to electrically connect the upper substrate and the lower substrate, for example, as shown in FIG.
(A) As shown in FIG.
0 must be provided. Alternatively, as shown in FIG. 6B, it is necessary to provide a hole 5a in the metal case 5 and pass the external wiring 10 through the hole 5a.

Therefore, when the external wiring 10 is provided avoiding the metal case 5 as shown in FIG. 6A, the external wiring 10 and an insulator (not shown) covering the external wiring 10 reduce the size of the device. In the way. On the other hand, when the external wiring 10 is passed through the hole 5a of the metal case 5 as shown in FIG. 6B, the step of providing the hole 5a in the metal case 5 and the step of providing the external wiring 10 through the hole 5a and the substrate Requires a step of making connection with

The present invention has been made in view of the above problems, and therefore, the present invention has a high density of electronic components mounted thereon, does not require external wiring for connecting boards, and is thin and lightweight. It is an object to provide a simplified electronic circuit device. It is another object of the present invention to provide an electronic circuit device capable of cutting off the electrical influence between a built-in electronic component and a surface mount component or the outside.

Further, the present invention provides a multi-layer structure in which electronic components are built-in, electronic components can be mounted at high density, electrical effects between the mounted components can be cut off, and a simple process can be used. It is an object to provide a printed wiring board.

[0013]

To achieve the above object, an electronic circuit device according to the present invention comprises a first substrate and a first substrate.
A first wiring layer formed on the first wiring layer, a second substrate formed on the first wiring layer, a second wiring layer formed on the second substrate, A third substrate formed on the second wiring layer, a hole formed in a part of the second substrate, penetrating the second substrate, and the first substrate facing the hole. Including a built-in electronic component formed on a substrate surface, and the third substrate surface facing at least the hole;
A metal layer formed between the second substrate and the third substrate, and a metal layer formed on the second substrate near the hole;
And at least one through hole in which a conductor is embedded.

The electronic circuit device according to the present invention is preferably characterized in that the conductor in the through hole is electrically connected to the metal layer. The electronic circuit device according to the present invention is preferably characterized in that a plurality of the through holes are arranged so as to surround the holes.

The electronic circuit device of the present invention preferably has a conductive layer between the first substrate and the second substrate for electrically connecting the conductors in the plurality of through holes. It is characterized by the following. Alternatively, the electronic circuit device of the present invention preferably has a conductive layer for electrically connecting the conductors in the plurality of through holes between layers between the second substrate and the third substrate. It is characterized by.

The electronic circuit device according to the present invention is preferably characterized in that the first substrate has a via hole in which at least a signal wiring connected to the first wiring layer is embedded. The electronic circuit device according to the present invention is preferably characterized in that the second substrate has a via hole in which a signal wiring for connecting the first wiring layer and the second wiring layer is embedded. . The electronic circuit device according to the present invention is preferably characterized in that the third substrate has a via hole in which at least a signal wiring connected to the second wiring layer is embedded.

The electronic circuit device of the present invention preferably has a third wiring layer formed on the third substrate, and a surface-mounted electronic component formed on the third wiring layer. It is characterized by the following. In the electronic circuit device according to the present invention, preferably, the metal layer on the surface of the third substrate facing the holes is formed of the same layer as the second wiring layer.
Alternatively, the electronic circuit device of the present invention is preferably characterized in that the metal layer is a metal plating layer. Or,
The electronic circuit device of the present invention is preferably characterized in that the metal layer is a bonded metal sheet.

This eliminates the need for a metal case or the like used in conventional electronic circuit devices to cut off the electrical influence between the mounted components, thereby making it possible to reduce the thickness and weight of the electronic circuit device. ADVANTAGE OF THE INVENTION According to the electronic circuit device of this invention, since a metal layer is formed in the hole of a board | substrate and the through-hole in which the conductor was buried near the hole is formed, the built-in electronic component and the surface mounting The electrical influence on the parts or the outside is cut off. Further, in the electronic circuit device of the present invention, since the electronic components are mounted not only on the surface but also inside, the electronic components can be mounted at a high density.

Further, in order to achieve the above object, a multilayer printed wiring board according to the present invention comprises a first insulating substrate, a first wiring layer formed on the first insulating substrate, A second insulating substrate formed on the first wiring layer; a second wiring layer formed on the second insulating substrate; and a third insulating layer formed on the second wiring layer. An insulating substrate, a hole formed in a part of the second insulating substrate, penetrating through the second insulating substrate, and a surface of the first insulating substrate facing the hole. Including the formed built-in electronic component and at least the surface of the third insulating substrate facing the hole;
A metal layer formed between the second insulating substrate and the third insulating substrate; and at least one metal layer formed on the second insulating substrate near the hole and having a conductor embedded therein.
And at least two through holes.

The multilayer printed wiring board of the present invention is preferably
The conductor in the through hole is electrically connected to the metal layer. The multilayer printed wiring board of the present invention is preferably characterized in that the plurality of through holes are interspersed so as to surround the holes.

The multilayer printed wiring board of the present invention is preferably
A conductive layer is provided between the first insulating substrate and the second insulating substrate to electrically connect the conductors in the plurality of through holes. Preferably, the multilayer printed wiring board according to the present invention is a conductive layer for electrically connecting the conductors in the plurality of through holes between layers between the second insulating substrate and the third insulating substrate. It is characterized by having.

The multilayer printed wiring board of the present invention is preferably
The first insulating substrate has a via hole in which at least a signal wiring connected to the first wiring layer is embedded. The multilayer printed wiring board of the present invention preferably has a via hole in which signal wiring for connecting the first wiring layer and the second wiring layer is embedded in the second insulating substrate. Features. The multilayer printed wiring board of the present invention is preferably provided on the third insulating substrate,
At least a via hole in which a signal wiring connected to the second wiring layer is embedded is provided.

The multilayer printed wiring board of the present invention is preferably
It has a third wiring layer formed on the third insulating substrate. The multilayer printed wiring board of the present invention is preferably characterized in that the metal layer on the surface of the third insulating substrate facing the holes is formed of the same layer as the second wiring layer. Alternatively, the multilayer printed wiring board of the present invention is preferably characterized in that the metal layer is a metal plating layer. Alternatively, the multilayer printed wiring board of the present invention is preferably characterized in that the metal layer is a bonded metal sheet.

Thus, it is possible to cut off the electric influence between the mounted electronic components or between the mounted electronic components and the outside while the electronic components are mounted and the electronic components are mounted at a high density. It becomes possible. Further, according to the multilayer printed wiring board of the present invention, since it is not necessary to provide a metal case or the like on each of the boards constituting the multilayer printed wiring board for the purpose of blocking electric influence, the formation of the multilayer printed wiring board is not required. The process can be simplified.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a multilayer printed wiring board, an electronic circuit device including the same and a method of manufacturing the same according to the present invention will be described with reference to the drawings. (Embodiment 1) FIG. 1 is a cross-sectional view of a multilayer printed wiring board of the present embodiment and an electronic circuit device including the same.

The electronic circuit device of FIG. 1 has a multilayer printed wiring board including an insulating upper substrate 1a, an intermediate substrate 1b, and a lower substrate 1c. A conductor layer 2 is formed between the surface layers or between the substrates 1a, 1b, 1c, and the conductor layer 2 is a circuit wiring layer.

An electronic component 3a is mounted on the surface of the upper substrate 1a so as to be connected to the conductor layer 2. An electronic component 3c or a semiconductor chip 4 is mounted on both surfaces of the lower substrate 1c so as to be connected to the conductor layer 2, respectively. Holes 6 are provided at predetermined positions in the middle layer substrate 1b. The electronic component 3c and the semiconductor chip 4 mounted on the surface of the lower substrate 1c on the side facing the middle substrate 1b are arranged in the holes 6. Thus, the electronic component including the semiconductor chip is built in the multilayer printed wiring board.

On the lower surface of the upper substrate 1a facing the holes 6,
A shield metal layer 7a is formed. As the shield metal layer 7a, for example, copper foil, aluminum, iron, or the like can be used. Further, a through hole is formed in the middle substrate 1b, and a columnar metal wiring 7b is formed in the through hole. The columnar metal wirings 7b are arranged so as to surround the holes 6. The shield metal layer 7a and the columnar metal wiring 7b are grounded GND electrodes. The middle substrate 1b and the lower substrate 1c are joined by a joining material 8. As the bonding material 8, a solder, a conductive adhesive, an anisotropic conductive adhesive, or the like can be used.

As described above, according to the multilayer printed wiring board of the present embodiment and the electronic circuit device including the same, the shield metal layer 7a is formed on the upper substrate 1a and the intermediate substrate 1b
Columnar metal wires 7b are formed around the holes 6 of FIG. Thereby, the electronic component 3a mounted on the upper substrate 1a and the electronic component 3c mounted on the lower substrate 1c are electrically disconnected. The electronic component 3c mounted on the lower substrate 1c
Alternatively, the electrical influence between the semiconductor chip 4 and the outside is also cut off.

Therefore, it is possible to prevent the influence of electromagnetic waves and the like between the electronic components and improve the electrical characteristics of the electronic circuit and the wiring. In addition, a metal case or the like used in a conventional electronic circuit device for electrically insulating between electronic components is not required, and the electronic circuit device can be reduced in thickness.

Next, a method of mounting electronic components for forming the electronic circuit device according to the present embodiment will be described.
As a material of the upper substrate 1a, the intermediate substrate 1b, and the lower substrate 1c of the multilayer printed wiring board constituting the electronic circuit device of the present embodiment, for example, a glass epoxy material is used.
Alternatively, a glass polyimide material, a ceramic material, or the like may be used as the high heat-resistant material.

On one or both sides of the insulating substrate serving as the upper substrate 1a, the middle substrate 1b, and the lower substrate 1c, a copper foil serving as the conductor layer 2 is bonded in advance. The conductor layer 2 formed between the upper substrate 1a and the middle substrate 1b is etched into a wiring pattern before laminating these insulating substrates. The conductor layer 2 on the surface of the upper substrate 1a facing the holes 6 can be used as a shield metal layer 7a.

Alternatively, instead of etching the copper foil on the surface of the insulating substrate to form a wiring pattern as described above, the conductor layer 2 may be deposited on the insulating substrate by electroless copper plating. In this case, a portion other than the wiring pattern is coated in advance with a resist, and the conductor layer 2 is deposited along the wiring pattern.

After that, the upper substrate 1a and the middle substrate 1b are overlapped with each other via a prepreg of an adhesive sheet, and then heated and pressed to be bonded. Upper substrate 1a and middle substrate 1
Before laminating b, holes 6 and through holes are formed at predetermined positions of the middle layer substrate 1b. The through holes are holes into which the columnar metal wirings 7b are buried, and a plurality of through holes are provided so as to surround the holes 6.

After bonding the upper substrate 1a and the middle substrate 1b, plating is performed in the through holes to form columnar metal wirings 7b.
To form The plating in the through hole can be performed by, for example, electroless copper plating or electrolytic copper plating. Instead of using the conductor layer 2 formed on the surface of the upper substrate 1a, the shield metal layer 7a can be formed by, for example, metal plating or pasting a metal sheet.

Further, the electronic component 3a is mounted on the surface of the upper substrate 1a on the side opposite to the holes 6, that is, on the surface serving as the outer layer.
On the other hand, also for the lower substrate 1c, the electronic component 3c or the semiconductor chip 4 is mounted so as to be connected to the conductor layer 2 on the surface. Thereafter, the electronic component 3 mounted on the lower substrate 1c
The middle substrate 1b and the lower substrate 1c are joined so that the semiconductor chip 4 and the semiconductor chip 4 are arranged in the holes 6. As the bonding material 8, for example, solder, a conductive adhesive, an anisotropic conductive adhesive, or the like can be used.

Through the above steps, the multilayer printed wiring board of this embodiment shown in FIG. 1 and the electronic circuit device including the same are formed. In the electronic circuit device according to the first embodiment, any method can be used for mounting the electronic components on the multilayer printed wiring board. For example, the space between the semiconductor chip 4 and the lower substrate 1c may be sealed with a mold resin.

(Embodiment 2) FIG. 2 is a sectional view of a multilayer printed wiring board of the present embodiment and an electronic circuit device including the same. The electronic circuit device shown in FIG. 2 has an insulating upper substrate 1a and an intermediate substrate 1 similar to the electronic circuit device shown in the first embodiment.
b and a lower-layer substrate 1c. A conductor layer 2 is formed between the surface layers or between the substrates 1a, 1b, 1c, and the conductor layer 2 is a circuit wiring layer.

An electronic component 3a is mounted on the surface of the upper substrate 1a so as to be connected to the conductor layer 2. An electronic component 3c or a semiconductor chip 4 is mounted on both surfaces of the lower substrate 1c so as to be connected to the conductor layer 2, respectively. Holes 6 are provided at predetermined positions in the middle layer substrate 1b. The electronic component 3c and the semiconductor chip 4 mounted on the surface of the lower substrate 1c on the side facing the middle substrate 1b are arranged in the holes 6. Thus, the electronic component including the semiconductor chip is built in the multilayer printed wiring board.

On the lower surface of the upper substrate 1a facing the holes 6,
A shield metal layer 7a is formed. The electronic circuit device of the first embodiment has columnar metal wirings 7b scattered around the holes 6 in the middle substrate 1b, but the electronic circuit device of the present embodiment further has the columnar signal wiring 11 on the middle substrate 1b. .

The columnar signal wiring 11 is formed by forming through holes in the upper substrate 1a, the middle substrate 1b, and the lower substrate 1c, filling the through holes with copper plating, for example, and then joining the substrates. .
As between the middle substrate 1b and the lower substrate 1c, the bonding material 8
The columnar signal wiring 11 may be connected via the.

Therefore, according to the electronic circuit device of the present embodiment, similarly to the first embodiment, the electronic component 3c or the semiconductor component 4 is mounted on the surface by the shield metal layer 7a and the columnar metal wiring 7b. 3a and between the built-in electronic component 3c or the semiconductor chip 4 and the outside. Further, since the columnar signal wiring 11 is formed,
Electrical continuity between the substrates can be obtained without providing external wiring.

FIG. 3 is a perspective view of the middle substrate 1b of the multilayer printed wiring board of the present embodiment shown in FIG. As shown in FIG. 3, the columnar metal wirings 7 b are arranged so as to surround the holes 6. A conductor wiring 12 for connecting each columnar metal wiring 7b may be formed on at least one surface of the middle layer substrate 1b.

As a result, it is possible to more effectively block the electrical influence between the mounted components (the electronic components 3c and the semiconductor chip 4) in the holes 6 and the surface of the electronic circuit device or the outside. Further, the conductor wiring 12 may be configured to connect some of the columnar metal wirings 7b intermittently without connecting all the columnar metal wirings 7b.

(Embodiment 3) FIG. 4 is a sectional view of a multilayer printed wiring board according to the present embodiment and an electronic circuit device including the same. The electronic circuit device shown in FIG. 4 has an insulating upper substrate 1a and a middle substrate 1 similarly to the electronic circuit device shown in the first embodiment.
b and a lower-layer substrate 1c. A conductor layer 2 is formed between the surface layers or between the substrates 1a, 1b, 1c, and the conductor layer 2 is a circuit wiring layer.

The electronic circuit device according to the first embodiment includes a middle substrate 1
b and the lower substrate 1c are joined by the joining material 8, but the electronic circuit device of the present embodiment has an interlayer between the upper substrate 1a and the middle substrate 1b and an interlayer between the middle substrate 1b and the lower substrate 1c. Are joined by the joining material 8.

An electronic component 3a is mounted on the surface of the upper substrate 1a so as to be connected to the conductor layer 2. An electronic component 3c or a semiconductor chip 4 is mounted on both surfaces of the lower substrate 1c so as to be connected to the conductor layer 2, respectively. Holes 6 are provided at predetermined positions in the middle layer substrate 1b. The electronic component 3c and the semiconductor chip 4 mounted on the surface of the lower substrate 1c on the side facing the middle substrate 1b are arranged in the holes 6. Thus, the electronic component including the semiconductor chip is built in the multilayer printed wiring board.

On the lower surface of the upper substrate 1a facing the holes 6,
A shield metal layer 7a is formed. Columnar metal wires 7b are arranged on the middle layer substrate 1b so as to surround the holes 6. Also, the middle substrate 1 close to the hole 6
A shield metal layer 7c is formed on the upper and lower surfaces of b. That is, in the cross-sectional view, the columnar metal wiring 7b and the shield metal layer 7c have a continuous shape. The shield metal layers 7a and 7c and the columnar metal wiring 7b are grounded GND electrodes.

As the shield metal layers 7a and 7c, for example, the conductor layer 2 made of copper foil on the surface of the upper substrate 1a or the middle substrate 1b can be used. Alternatively, aluminum, iron, or the like can be used in addition to copper. Also,
Instead of using the conductor layer 2, the shield metal layers 7a and 7c can be formed by, for example, metal plating or attaching a metal sheet.

The middle substrate 1b and the lower substrate 1c are connected to the bonding material 8
It is joined by. As the bonding material 8, a solder, a conductive adhesive, an anisotropic conductive adhesive, or the like can be used. Although not particularly shown, the periphery of the bonding material 8 may be sealed with a solder resist or the like according to the thickness of the bonding material 8.

As described above, according to the multilayer printed wiring board of the present embodiment and the electronic circuit device including the same, the shield metal layer 7a is formed on the lower surface of the upper substrate 1a, and around the hole 6 of the intermediate substrate 1b. The columnar metal wiring 7b and the shield metal layer 7c are formed. The upper substrate 1a and the middle substrate 1b are joined via a joining material 8.

According to the multilayer printed wiring board of the present embodiment and the electronic circuit device including the same, the electronic component 3a mounted on the upper substrate 1a and the electronic component 3c or the semiconductor chip 4 mounted on the lower substrate 1c Are electrically interrupted. Further, the electric influence between the electronic component 3c or the semiconductor chip 4 built in the multilayer printed wiring board and the outside is cut off.

Therefore, it is possible to prevent the influence of electromagnetic waves and the like between the electronic components and improve the electrical characteristics of the electronic circuit and the wiring. In addition, a metal case or the like used in a conventional electronic circuit device for electrically insulating between electronic components is not required, and the electronic circuit device can be reduced in thickness. Further, although not shown, if the columnar signal wiring is provided on each of the substrates 1a, 1b, and 1c as shown in the second embodiment, external wiring becomes unnecessary and the electronic circuit device can be reduced in size.

FIG. 5A is a diagram showing a case where the conductor wiring 12 serving as a shield metal layer is formed on both the front and back surfaces of the middle substrate 1b in the electronic circuit device of the present embodiment.
FIG. 5B is an enlarged view of FIG. As shown in Embodiment 2 and FIG. 3, in the multilayer printed wiring board or the electronic circuit device of the present invention, a conductor connected to the columnar metal wiring 7b is provided on the surface of the substrate 1b near the hole 6 in which the electronic component 3c is built. The wiring 12 can be provided as appropriate.

As shown in FIGS. 5A and 5B, the conductor wiring 12a and the
12b, two shield layers (shield metal layer 7) are provided between the upper substrate 1a and the middle substrate 1b.
a and the conductor wiring 12a) are formed. Similarly, two shield layers (the conductor layer 2 and the conductor wiring 12b) are formed between the middle substrate 1b and the lower substrate 1c. Therefore, it is possible to more effectively cut off the electric influence between the built-in electronic component 3c or the semiconductor chip 4 and the surface mount component 3a or between the built-in electronic component 3c or the semiconductor chip 4 and the outside. Can be.

A method for mounting electronic components for forming the electronic circuit device according to the present embodiment will be described below. The electronic circuit device of the present embodiment can be formed according to a method similar to that of the first embodiment, except for a method of bonding the upper substrate 1a and the middle substrate 1b.

As a material of the upper substrate 1a, the intermediate substrate 1b and the lower substrate 1c of the multilayer printed wiring board constituting the electronic circuit device of the present embodiment, for example, a glass epoxy material is used. Alternatively, a glass polyimide material, a ceramic material, or the like may be used as the high heat-resistant material.

A copper foil to be the conductor layer 2 is previously bonded to one or both surfaces of the insulating substrate to be the upper substrate 1a and the lower substrate 1c. The conductor layer 2 formed between the upper substrate 1a and the middle substrate 1b is provided with a wiring pattern or a shield metal layer 7 before stacking these insulating substrates.
a or the pattern of the shield metal layer 7c.

Alternatively, instead of etching the copper foil on the surface of the insulating substrate to form a wiring pattern as described above, the conductor layer 2 is formed on the insulating substrate by electroless copper plating or the like.
Alternatively, the shield metal layers 7a and 7c may be deposited.
In this case, portions other than the wiring pattern (and the shield metal layer) are previously coated with a resist, and the conductor layer 2 (and the shield metal layers 7a and 7c) are deposited along the wiring pattern.

In the middle substrate 1b, holes 6 are formed in predetermined places in advance before joining with the upper substrate 1a or the lower substrate 1c. Before joining with the upper substrate 1a or the lower substrate 1c, the columnar metal wiring 7b is formed in the through hole of the intermediate substrate 1b by, for example, electroless copper plating or electrolytic copper plating.

Further, the electronic component 3a is mounted on the surface of the upper substrate 1a on the side opposite to the holes 6, that is, on the surface serving as the outer layer.
On the other hand, also for the lower substrate 1c, the electronic component 3c or the semiconductor chip 4 is mounted so as to be connected to the conductor layer 2 on the surface. Thereafter, the upper substrate 1 on which the electronic component 3a is mounted
a and the middle substrate 1 b are joined via the joining material 8. As the bonding material 8, for example, solder, an anisotropic conductive adhesive such as a conductive adhesive, or the like can be used.

The middle substrate 1b and the lower substrate 1c are joined so that the electronic component 3c and the semiconductor chip 4 mounted on the lower substrate 1c are arranged in the holes 6.
As the bonding material 8, for example, solder, a conductive adhesive, an anisotropic conductive adhesive, or the like can be used. Through the above steps, the multilayer printed wiring board of this embodiment shown in FIG. 4 and the electronic circuit device including the same are formed.

Embodiments of the multilayer printed wiring board and the electronic circuit device including the same according to the present invention are not limited to the above description. For example, a multilayer printed wiring board having four or more insulating substrates may be provided with the above-mentioned metal layer for electrically shielding the built-in electronic components. In addition, various changes can be made without departing from the gist of the present invention.

[0064]

According to the electronic circuit device of the present invention, it is possible to reduce the thickness and weight of an electronic circuit device on which electronic components are mounted at a high density. Further, according to the electronic circuit device of the present invention, it is possible to cut off the electric influence between the built-in electronic component and the surface mount component or the outside.

According to the multilayer printed wiring board of the present invention, it is possible to cut off the electrical influence between the mounted components while incorporating the electronic components at a high density.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a multilayer printed wiring board according to Embodiment 1 of the present invention and an electronic circuit device including the same.

FIG. 2 is a cross-sectional view of a multilayer printed wiring board according to Embodiment 2 of the present invention and an electronic circuit device including the same.

FIG. 3 is an enlarged perspective view of a multilayer printed wiring board according to Embodiment 2 of the present invention and a part of an electronic circuit device including the same.

FIG. 4 is a sectional view of a multilayer printed wiring board according to Embodiment 3 of the present invention and an electronic circuit device including the same.

FIGS. 5A and 5B are enlarged cross-sectional views of a multilayer printed wiring board according to Embodiment 3 of the present invention and a part of an electronic circuit device including the same.

6A and 6B are cross-sectional views of a conventional electronic circuit device.

[Explanation of symbols]

1a: upper substrate, 1b: middle substrate, 1c: lower substrate, 2
... Conductor layer, 3, 3a, 3c. Electronic component, 4 ... Semiconductor chip, 5 ... Metal case, 5a ... Hole, 6 ... Void, 7, 7
a, 7c: shield metal layer, 7b: columnar metal wiring, 8:
Joining material, 9: molding resin, 10: external wiring, 11: columnar signal wiring, 12, 12a, 12b: conductor wiring.

Claims (24)

[Claims] A first substrate, a first wiring layer formed on the first substrate, a second substrate formed on the first wiring layer, and a second substrate A second wiring layer formed thereon, a third substrate formed on the second wiring layer, and penetrating the second substrate formed on a part of the second substrate The second substrate and the third substrate including at least a hole, a built-in electronic component formed on a surface of the first substrate facing the hole, and a surface of the third substrate facing at least the hole; An electronic circuit device, comprising: a metal layer formed between the substrate and the first substrate; and at least one through hole formed in the second substrate in the vicinity of the hole and having a conductor embedded therein. 2. The electronic circuit device according to claim 1, wherein said conductor in said through hole is electrically connected to said metal layer. 3. The electronic circuit device according to claim 1, wherein a plurality of said through holes are arranged so as to surround said holes. 4. The electronic circuit device according to claim 1, further comprising a conductive layer between said first substrate and said second substrate for electrically connecting said conductors in said plurality of through holes. 5. The electronic circuit device according to claim 1, further comprising a conductive layer for electrically connecting said conductors in said plurality of through holes between layers between said second substrate and said third substrate. 6. The electronic circuit device according to claim 1, wherein the first substrate has a via hole in which at least a signal wiring connected to the first wiring layer is embedded. 7. The electronic circuit device according to claim 1, wherein the second substrate has a via hole in which a signal wiring for connecting the first wiring layer and the second wiring layer is embedded. 8. The electronic circuit device according to claim 1, wherein the third substrate has a via hole in which at least a signal wiring connected to the second wiring layer is embedded. 9. The electronic circuit device according to claim 1, further comprising a third wiring layer formed on the third substrate, and a surface-mounted electronic component formed on the third wiring layer. 10. The electronic circuit device according to claim 1, wherein said metal layer is formed of the same layer as said second wiring layer. 11. The electronic circuit device according to claim 1, wherein said metal layer is a metal plating layer. 12. The electronic circuit device according to claim 1, wherein said metal layer is a bonded metal sheet. 13. A first insulating substrate, a first wiring layer formed on the first insulating substrate, and a second insulating substrate formed on the first wiring layer. A second wiring layer formed on the second insulating substrate, a third insulating substrate formed on the second wiring layer, and a part of the second insulating substrate. A formed hole penetrating the second insulating substrate, a built-in electronic component formed on the surface of the first insulating substrate facing the hole, and at least the first component facing the hole. A metal layer formed between the second insulating substrate and the third insulating substrate, including a surface of the third insulating substrate, and a metal layer formed on the second insulating substrate near the holes. And at least one through hole in which a conductor is embedded. 14. The multilayer printed wiring board according to claim 13, wherein said conductor in said through hole is electrically connected to said metal layer. 15. The multilayer printed wiring board according to claim 13, wherein a plurality of said through holes are arranged so as to surround said holes. 16. The semiconductor device according to claim 13, further comprising a conductive layer between said first insulating substrate and said second insulating substrate for electrically connecting said conductors in said plurality of through holes. Multilayer printed wiring board. 17. The semiconductor device according to claim 13, further comprising a conductive layer between said second insulating substrate and said third insulating substrate for electrically connecting said conductors in said plurality of through holes. Multilayer printed wiring board. 18. The multilayer printed wiring board according to claim 13, wherein the first insulating substrate has a via hole in which at least a signal wiring connected to the first wiring layer is embedded. 19. The multilayer printed wiring board according to claim 13, wherein said second insulating substrate has a via hole in which a signal wiring for connecting said first wiring layer and said second wiring layer is embedded. . 20. The multilayer printed wiring board according to claim 13, wherein the third insulating substrate has a via hole in which at least a signal wiring connected to the second wiring layer is embedded. 21. The multilayer printed wiring board according to claim 13, further comprising a third wiring layer formed on said third insulating substrate. 22. The multilayer printed wiring board according to claim 13, wherein said metal layer is made of the same layer as said second wiring layer. 23. The multilayer printed wiring board according to claim 13, wherein said metal layer is a metal plating layer. 24. The multilayer printed wiring board according to claim 13, wherein said metal layer is a metal sheet attached.