JP2784525B2 - Substrate for mounting electronic components - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate for mounting electronic components, which has excellent moisture resistance and heat-sink holding properties, and enables high-density wiring.

(Prior art)

Conventionally, in an electronic component mounting substrate, in order to dissipate heat generated from electronic components such as a semiconductor element, an electronic insulating substrate is provided with an electronic component mounting concave portion and heat is radiated to the opposite side of the electronic component mounting concave portion. A plate is provided (for example, JP-A-59-32191).

That is, as shown in FIG. 10, in the conventional electronic component mounting substrate 90, the heat radiating plate 7 is joined to the concave portion 92 provided in the base material 9 via the adhesive 8. On the back side of the base, a metal plating layer 75 is formed between the heat sink 7 and the base 9, and a metal plating layer 76 is formed between the upper surface of the heat sink 7 and the concave part 93 for mounting electronic components. Therefore, infiltration of moisture from the back side of the base material 9 into the electronic component mounting recess 93 is blocked.

[Problem to be solved]

However, as shown in FIG. 11, the electronic component mounting board 90 has a metal plating layer 75 in an opening 750 in an opposing portion 95 where the side wall of the recess 92 and the side wall of the heat sink 7 oppose each other. May not be formed. That is, a defective plating hole 751 is generated.

When such a plating failure hole 751 is generated, moisture may enter into the electronic component mounting concave portion from this portion, and the electronic component such as a semiconductor may be damaged.

On the other hand, it is considered that the reason why the plating failure hole 751 occurs is that the clearance (about 0.1 to 0.2 mm) of the facing portion 95 between the recess 92 and the heat sink 7 is large.

Therefore, it is conceivable to reduce the clearance of the facing portion 95. However, the clearance is generated due to variations in the processing of the recess 92 and the external processing of the heat radiation plate 7.

As a countermeasure against the above problem, as shown in FIG. 12, there is a method in which the recess 92 is provided widely, and the space between the side wall of the recess 92 and the side wall of the heat sink 7 on the ceiling surface 921 is widened. . Then, a metal plating layer 75 is continuously provided on these surfaces. In this method, the metal plating layer 75 is also formed on the facing portion 95 since the clearance of the facing portion 95 is sufficiently large.

However, if the recess 92 is made large, the degree of freedom in pattern formation on the back surface of the base material 9 is impaired. Meanwhile, the depression 92
If the size is limited, the heat radiating plate 7 becomes small, and the heat radiating property is hindered.

In the above method, the heat sink 7 is provided on the ceiling surface 921 of the recess 92.
When the adhesive is adhered, the adhesive 8 may protrude from between the two (overflow). When the protruding portion of the adhesive is large, the metal plating layer 75 is not formed. Therefore, it is necessary to adjust the amount of the adhesive 8 in order to prevent protrusion.

In the electronic component mounting board shown above,
Although the heat sink is inserted into the recess 92 of the base material 9 and adhered by the adhesive 8, there is a possibility that the heat sink may peel off during long-term use.

By the way, in recent years, as the functions of electronic components have become more sophisticated, it has become necessary to increase the speed of arithmetic processing. In particular, the clock frequency of digital signals (ON-OFF) used for inputting and outputting signals to electronic components has also increased. It has expanded to a high frequency range from ten MHz to several hundred MHz.

However, in order to efficiently input and output a digital signal pulse wave in a high frequency range, it is necessary to reduce the capacitance (permittivity) and the inductance (magnetic induction coefficient) of the circuit as electrical characteristics. Among them,
The capacitance is determined by the material properties of the base material, but the inductance often depends on the wiring design.

In particular, the power supply circuit and the ground circuit need to be low-inductance circuits, and their circuit patterns are desired to be as thick as possible.

In addition, a large amount of heat is generated from the electronic components arranged in the electronic component mounting recesses in accordance with the above-mentioned sophistication. Therefore, the heat sink is required to be as large as possible, and as a result, the back surface of the base material to which the heat sink is joined has a reduced degree of freedom in circuit formation.

In view of the above problems, the present invention has a metal plating layer formed at a portion where a heat radiating plate and a concave portion are opposed to each other, so that there is no possibility of the heat radiating plate falling off, and the power supply circuit and the ground circuit are low inductance circuits. It is an object of the present invention to provide an electronic component mounting substrate that can perform the above-described functions and has excellent heat dissipation.

[Solutions to solve the problem]

According to the present invention, there is provided a first base material, a second base material, and a heat sink sandwiched and fixed between the first base material and the second base material, and the first base material and the adhesive are penetrated on the first base material side. And an electronic component mounting recess formed by counterboring the upper part of the heat sink, and a part of the back side of the heat sink is exposed from a stepped hole provided in the second base material. And a radiating plate facing the stepped hole of the second base material.
An exposed concave portion is provided by counterbore processing which extends over both the second base material and the heat sink and exposes the adhesive on the same surface, and is continuous with the heat sink, the exposed concave portion and the back side of the second base material. A metal plating layer is coated, and a conductive layer is provided on the side wall of the electronic component mounting concave portion, the conductive layer being electrically connected to the outside of the substrate, and a power supply terminal or a ground terminal is provided on the conductive layer. An electronic component mounting board is characterized in that:

The most remarkable point in the present invention is that the exposed concave portion is provided in the opposite portion on the back side, and a continuous metal plating layer is coated between the heat sink, the exposed concave portion, and the back surface of the second base material. A heat sink is sandwiched and fixed between the first base material and the second base material, and a part of the back side of the heat sink is exposed from the stepped hole of the second base material; The power supply terminal or the ground terminal is provided on the side wall of the conductive layer.

The exposed concave portion is formed so as to extend between both the second base member and the heat sink. In addition, the stepped hole on the back side of the second base material is generally formed in a square shape or a circular shape in the center portion of the second base material. The heat sink has a convex shape, and the small diameter portion is held by the second base in a state of being inserted into the stepped hole of the second base, and the back side of the heat sink is exposed to the outside. (See FIG. 1). Therefore, the small diameter portion of the heat sink is provided in a shape similar to the stepped hole. Therefore, the opposed portion is usually formed in a ring shape such as a square shape or a circular shape (see FIG. 4).

The adhesive is filled between the side wall of the stepped hole and the side wall of the heat radiating plate, that is, the above-mentioned facing portion. And, in the exposed concave portion provided by the counterbore processing in the opposed portion,
The adhesive is exposed. The exposed surface of the adhesive is
It is on the same plane as the ceiling surface of the exposed recess.

Examples of the material of the first base material and the second base material include glass-epoxy resin, glass-bismaleimide-triazine resin, and glass-polyimide resin. Further, as the heat radiating plate, there are copper, copper-based alloy, iron-based alloy and the like.

As the adhesive, there is an adhesive sheet called prepreg, which has good flowability. In addition, examples of the material of the adhesive include an epoxy resin, a bismaleimide-triazine resin (BT resin), and a polyimide resin. The material of the metal plating layer includes copper, nickel, gold and the like.

In addition, the clearance at the above opposing part is 0.05 to
It is preferably 0.3 mm. If it is less than 0.05 mm, the dimensional accuracy between the heat sink and the stepped hole becomes severe, while if it exceeds 0.3 mm, the width of the adhesive layer becomes too large and the metal plating layer may not be formed sufficiently.

Further, the depth of the exposed concave portion is preferably set to 0.05 to 0.2 mm. If the thickness is less than 0.05 mm, the thickness accuracy of the base material and the processing accuracy of the exposed concave portion are severe, while if it exceeds 0.2 mm, the load is too large in processing the metal.

Further, the width of the exposed concave portion is preferably set to 0.5 to 2.0 mm. If it is less than 0.5 mm, the diameter of the blade to be machined is too small and it is easy to break. On the other hand, if it exceeds 2.0 mm, the recess to be machined becomes a dead space, which limits the effective wiring area. The exposed recess is formed by counterboring.

Next, as a method of manufacturing the electronic component mounting board,
There are the following methods.

That is, first, a stepped hole for exposing the back side of the heat sink is provided on the back side of the second base material. On the other hand, a power supply circuit or a ground circuit is provided inside the first base material in advance. Next, a radiator plate is sandwiched between the stepped hole of the second base member and the inner surface recess of the first base member, and the second base member and the radiator plate are bonded with an adhesive. Then, the adhesive is filled up to the vicinity of the opening at the opposing portion between the side wall of the stepped hole and the side wall of the heat sink of the second base material.

Then, counterbore processing is performed on both the second base material and the heat radiating plate in the facing portion to form an exposed concave portion exposing the adhesive. Further, the first base material side
A counterbore process is performed through the base material and the adhesive to the upper portion of the heat sink to form an electronic component mounting concave portion.

After that, a continuous metal plating layer is formed between the heat sink, the exposed recess, and the back surface of the second base material, and a metal plating layer of a conductive layer is formed inside the electronic component mounting recess.

In the bonding, it is preferable that the adhesive slightly protrudes into the opening of the opposing portion. This gives
It can be confirmed that the adhesive was completely filled up to the opening of the opposing portion. The protruding adhesive is removed together with the heat radiating plate and the second base material in the facing portion by counterboring when forming the exposed concave portion.

In addition, the shape of the exposed concave portion is square (Fig. 3C),
Semicircular (Fig. 5), triangular (Fig. 6), elliptical (Fig. 7)
In particular, the exposed part of the adhesive is easily plated.

Also, the shape of the heat sink is substantially the same as the space formed by the inner recess and the stepped hole when the first base material and the second base material are overlapped (see FIG. 3A). ).

In addition, one of a power supply terminal and a ground terminal is provided on the conductive layer provided in the electronic component mounting recess. When, for example, a power supply terminal is provided on the conductive layer, a ground terminal is provided, for example, in the same manner as in the related art.

The conductive layer, the power supply terminal, and the ground terminal are integrally provided by, for example, applying metal plating to the electronic component mounting concave portion and the periphery of the opening. Further, as a means for conducting the conduction layer to the outside of the base material, there is a method of providing a wide metal layer (for example, an internal power supply circuit) in the base material, such as a through hole, which leads to the outside. There is also a method of directly establishing electrical conduction with a heat sink provided below the electronic component mounting recess.

A signal terminal is provided around the opening of the electronic component mounting recess. The signal terminal is a tip portion of a signal pattern provided on the base material. On the other hand, the power supply terminal or the ground terminal has a shape in which a part of the conductive layer provided on the side wall of the concave part for mounting the electronic component slightly extends to the periphery of the opening. And the signal terminal, the power supply terminal and the grounding terminal
In other words, they are arranged on the upper body in which they have entered each other (see FIG. 2).

Further, in the present invention, an upper base material layer is stacked on a first base material, and a power supply terminal is formed on one base material and a ground terminal is formed on the other base material. A substrate can also be configured (see FIGS. 8 and 9).

The upper base material layer has an opening above the electronic component mounting recess, and a conductive layer similar to that described above is provided in the opening. Further, a power supply terminal or a ground terminal is provided on the conductive layer. Further, the upper base material layer may be provided in two or more layers.

In such a laminated substrate, the power supply circuit and the ground circuit can be formed arbitrarily and large, respectively, the inductance can be reduced, and the function can be further enhanced.

That is, the most important thing in this laminated substrate is that the upper substrate layer is laminated on the first substrate, and the electronic component mounting concave portion and the opening periphery provided on the first substrate are similarly formed as described above. First
Providing a conductive layer, a signal terminal and a power terminal (or a ground terminal) which have entered each other, and a second conductive layer and a signal terminal which have entered each other at the opening of the upper base material layer and the periphery of the opening. A terminal for power supply (or a terminal for power supply).

The power supply terminal is provided on either the first base material side or the upper base material layer, and the ground terminal is provided on the side where the power supply terminal is not provided. Further, the first conductive layer, the second conductive layer,
The shapes of the conductive layer, the power supply terminal, and the ground terminal are the same as those described above.

(Operation)

In the electronic component mounting board according to the present invention, the exposed concave portion is provided over the second base member and the heat sink, and the adhesive is exposed on the same surface in the exposed concave portion. Therefore, the second
When a metal plating layer is coated on the back side of the base material, the metal plating layer is completely formed on the exposed concave surface.

That is, the exposed concave portion is formed on the same surface with its ceiling surface arranged in the order of the heat sink, the adhesive, and the second base material. Therefore, the metal plating layer is formed continuously between them. If the adhesive does not exist in the facing portion as in the conventional case, or if the adhesive is protruding, the metal plating layer cannot be formed completely continuously.

Further, in the present invention, an adhesive is filled between the opposing portions, and then the opening of the opposing portion is counterbored to form an exposed concave portion. Therefore, the adhesive may be used in an amount sufficient to fill the opposing portion, and may be protruded in some cases. Therefore, it is not necessary to adjust the adhesive so that the adhesive does not protrude, and to adjust the amount to just a suitable amount as in the related art.

Further, in the present invention, it is not necessary to increase the interval between the facing portions as in the prior art. Therefore, the heat radiating plate can be made as large as possible for pattern formation, and the heat radiating property can be improved.

Further, in the present invention, since a continuous metal plating layer is formed on the heat sink, the exposed concave portion, and the back side of the second base material, moisture does not enter the concave portion for mounting electronic components from the back side of the base material.

Further, since the heat radiating plate is sandwiched and fixed between the first base material and the second base material, there is no possibility that the heat radiating plate falls off as in the related art.

On the other hand, on the front side of the first base material, the power supply terminal or the ground terminal is connected to the connection terminal of the electronic component by a bonding wire. The power supply terminal or the grounding terminal is connected to a power supply or a ground outside the base through an internal circuit provided inside the first base through a conductive layer on the side wall of the electronic component mounting recess. Also, the signal terminal is connected to the connection terminal of the electronic component by a bonding wire. The signal terminal is electrically connected to the signal pattern of the conductor circuit.

The conductive layer is provided on the side wall of the electronic component mounting concave portion and has a large conductive area, so that an internal power supply circuit or an internal grounding circuit provided inside the first base member and connected to the outside can be enlarged. The power supply circuit or the ground circuit can be a low inductance circuit.

Furthermore, when the signal terminal and the power supply terminal or the ground terminal are arranged in parallel, the connection terminal of the electronic component and each of the above terminals can be set at substantially the same interval, thereby facilitating the connection of the bonding wire. It is.

(Effect)

Therefore, according to the present invention, the metal plating layer in the above-mentioned opposing portion is securely formed, there is no possibility that the heat sink will fall off, and the power supply circuit and the ground circuit can be low inductance circuits. An electronic component mounting board excellent in heat dissipation can be provided.

〔Example〕

First Embodiment An electronic component mounting board according to an embodiment of the present invention will be described.
This will be described with reference to FIGS.

As shown in FIG. 1, the electronic component mounting board 1 of the present embodiment includes a first base 1A having an internal power supply circuit 15 therein, and a second base 1A.
It comprises a substrate 1B and a radiator plate 2 sandwiched and fixed between the two with an adhesive 3 interposed therebetween. On the first substrate 1A side, the outer first substrate 1A and the electronic component mounting concave portion 13 are formed by penetrating the adhesive 3 and counterboring the upper part of the heat sink 2.

A part of the back side of the heat sink 2 is exposed through a stepped hole 11B provided in the second base material 1B. Also,
An exposed recess 4 (see FIG. 3), which covers both the second base 1B and the radiator plate and exposes the adhesive 3 on the same surface, is provided at a portion where the stepped hole 11B of the second base 1B and the radiator plate 2 face each other. (Fig. 3C)
Are provided by counterbore processing.

Further, a continuous metal plating layer 75 is coated on the back side of the heat sink 2, the exposed concave portion 4, and the second substrate 1B.

On the front side of the first base 1A, a conductive layer 76 of a metal plating layer is formed on the inner surface of the electronic component mounting recess 13, and a conductor circuit 94 for signal patterns is formed on the upper surface of the first base 1A.
Is formed. Further, a conductor pin 99 is inserted into a through hole 98 penetrating the first base material and the second base material. A metal plating layer 981 is formed inside the through hole 98.

As shown in FIG. 2, the internal power supply circuit 15 is connected to the outer wall surface of the conductive layer 76 formed by metal plating. The internal power supply circuit 15 is provided with a large width, for example, 10 to 100 times the line width of the conductor circuit 94 provided on the surface of the first substrate 1. The internal power supply circuit 15 is connected to the power supply through hole 98.

At the periphery of the opening of the electronic component mounting recess 13, a power supply terminal 151 is formed on the conductive layer 76 by simultaneous plating. A signal terminal 941 of the signal pattern conductor circuit 94 and a grounding terminal 181 of the grounding circuit 18 are provided in parallel with the power supply terminal 151 in a state where they are mutually laid.

Next, a method of manufacturing the electronic component mounting board 1 will be described.
This will be described with reference to FIGS. 3A to 3E and FIG.

First, as shown in FIGS. 3A and 4, a stepped hole 11B for exposing the back side 22 of the heat sink 2 is formed on the back side of the second base material 1B.
Is provided. Further, in the first base material 1A, an inner surface recess 11A for inserting the inner surface side 21 of the heat sink 2 is provided on the back side by counterbore processing. The first base 1A has an internal power supply terminal 15 therein. That is, the base material 1A is formed by forming the internal power supply terminals 15 on a thin insulating base material by plating, and further bonding the insulating base material thereon. In addition, the first
Copper foil 19 is provided on the surface of substrate 1A.

The heat radiating plate 2 has an inverted convex shape, and the small diameter portion forms the back side 22 and the large diameter portion forms the inner side 21. The shape of the heat radiating plate 2 is the same as the space formed when the first base material 1A and the second base material 1B are overlapped (see FIG. 3B). The second base material 1B has an opening 12B in the stepped hole 11B for inserting the back side 22 of the heat sink.

Next, as shown in FIG. 3A, the heat sink 2 and the second base material 1B
3B, the heat sink 2 is sandwiched between the first base material 1A and the second base material 1B, and heated and pressed to bond the heat sink 2 as shown in FIG. 3B.

At this time, the adhesive 3 is applied between the inner surface recess 11A of the first base 1A and the heat sink 2, and between the stepped hole 11B of the second base 1 and the heat sink 2.
I.e., in the opposing portion 120. The adhesive 3 protrudes (spills) out of the opening 121 of the facing portion 120 to form the protruding portion 31. Therefore, the space between the heat sink 2 and the stepped hole 11B of the second base material is completely filled with the adhesive 3. At the time of the above bonding, the first
The substrate 1A and the second substrate 1B are simultaneously bonded by the adhesive 3.

Next, as shown in FIG. 3C, counterbore processing is performed on both the second base material 1B and the radiator plate 2 in the facing portion 120 to form the exposed concave portion 4. The ceiling surface of the exposed concave portion 4 has a stepped portion 13B formed in the second base material 1B, a stepped portion 24 formed in the heat sink 2, and an exposed surface 32 of the adhesive 3 exposed therebetween. And these are on the same plane.

On the other hand, on the front side of the first base material 1A, as shown in FIG. 3C, a recess 13 for mounting an electronic component is formed by counterboring to expose the inner surface side of the heat sink 2. That is, the first substrate 1A
And a counterboring process that penetrates through the internal power supply circuit 15 and the adhesive 3 and reaches a part of the inner surface side of the heat sink 2. Also,
In the recess 13 for mounting electronic components, the side wall 131 and
The cut surface 152 of the internal power supply circuit 15 and the exposed surface 33 of the adhesive 3 are on the same plane.

Next, as shown in FIG. 3D, on the back side of the second base 1B, a continuous metal plating layer 75 is formed on the heat sink 2, the exposed recess 4, and the surface of the second base 1B. Also, a conductive layer 76 is formed by metal plating in the electronic component mounting recess 13 on the front side of the first base 1A. The formation of the metal plating layer 75 and the conduction layer 76 is performed simultaneously.

When the conductive layer 76 is formed, its outer surface is connected to the cut surface 152 of the internal power supply circuit 15.

Thereafter, as shown in FIG. 3E, the conductor circuit 94, the power supply terminal 151, and the like are formed by etching. Thus, the electronic component mounting board is manufactured. This is the same as that shown in FIG.

 Next, the function and effect will be described.

That is, the electronic component mounting board 1 of the present embodiment is formed of the second base material.
In the facing portion 120 between the stepped hole 1B of 1B and the heat radiating plate 2, an exposed concave portion 4 extending over the second substrate 1B and the heat radiating plate 2 is formed, and the second substrate 1B, the exposed concave portion 4, and the heat radiating plate 2 are formed. Is provided with a continuous metal plating layer 75. In the exposed recess 4, as shown in FIG. 3C, the step 13B of the second base material, the exposed surface 32 of the adhesive, and the step 24 of the heat sink are on the same plane. Therefore, the metal plating layer 75 is reliably and continuously formed on these surfaces.

Further, in this example, as shown in FIG. 3B, the protrusion 31 of the adhesive 3 is formed when bonding the heat sink 2. Therefore, the adhesive 3 is completely filled between the heat sink 2 and the second base 1B. And this protruding part 31
As shown in FIG. 3C, it is removed when the exposed recess 4 is formed by counterboring.

Therefore, the exposed surface 32 of the adhesive 3 is always formed on the surface of the exposed concave portion 4, so that the metal plating layer 75 is surely formed. Therefore, it is not necessary to adjust the amount of the adhesive in order to prevent the adhesive from protruding and to fill the adhesive as in the related art.

Further, it is not necessary to increase the interval between the facing portions as in the prior art shown in FIG. Therefore, the heat sink is
It can be placed as large as possible, improving heat dissipation. Further, since the continuous metal plating layer 75 is formed on the heat radiating plate, the exposed concave portion, and the back side of the second base member, moisture does not enter the concave portion for mounting electronic components from the back side of the base member.

Further, as shown in FIG. 1, the heat radiating plate 2 is sandwiched and fixed between the first base material 1A and the second base material 1B, so that the heat radiating plate 2 does not fall off even during long-term use.

In the electronic component mounting board of this example, the conductive layer 76 to which the power supply terminal 151 is connected is formed by the electronic component mounting recess 13.
The internal power supply circuit 15
Can be widely taken in the first unit. Therefore, the power supply circuit can be a low-inductance circuit, and it is possible to cope with higher functions of electronic components.

The signal terminal 941, the power supply terminal 151, and the ground terminal 181 provided on the periphery of the opening of the electronic component mounting recess 13 are arranged in parallel. Therefore, it is easy to connect the bonding wires 89 between these terminals and the connection terminals of the electronic component 88 (FIG. 2).

The positions of the power supply terminal 151 and the ground terminal 181 can be reversed. That is, the power supply terminal 151 can be used as a ground terminal, and the ground terminal 181 can be used as a power supply terminal.

In addition, a radiating fin can be joined to the radiating plate to enhance the radiating property.

Second Embodiment In this embodiment, as shown in FIGS. 5 to 7, the shape of the exposed concave portion 4 in the first embodiment is variously changed.

That is, the exposed concave portion 4 shown in FIG.
The arc-shaped surface 141 of FIG. 1B, the exposed surface 32 of the adhesive, and the arc-shaped surface 212 of the heat sink.

The exposed concave portion 4 shown in FIG. 6 is triangular, and has a slope 142 of the second base material 1B, an exposed surface 32 of the adhesive, and a slope 213 of the heat sink.
And

Further, the exposed concave portion 4 shown in FIG.
Arc surface 143 of base 1B, exposed surface 32 of adhesive, and arc surface 2 of heat sink
Consists of 14.

In any of the above-mentioned exposed concave portions, each of the above surfaces is
It is on a continuous surface. Therefore, similarly to the first embodiment, a continuous metal plating layer can be reliably formed on the surface, and the same effect can be obtained.

Third Embodiment A specific example of the first embodiment will be described.

In this example, a 0.5 mm thick bismaleimide-triazine resin (BT resin) is used as the first base material 1A and the second base material 1B.
The material used was a copper-clad laminate. A copper plate was used as the heat sink.

As the adhesive 3, a prepreg adhesive of BT resin was used. The bonding was performed by thermocompression bonding at 170 ° C. At this time, the height of the protruding portion 31 was about 0.1 mm. Also,
The depth of the exposed recess 4 (FIG. 3C) was 0.1 mm and the width was 1.0 mm. The exposed concave portion 4 has a rectangular ring shape along the facing portion 120.

The metal plating layer 75 and the conductive layer 76 were formed by an electroless method or an electrolytic method, and the thickness of the metal plating was about 20 μm. Further, the metal plating layer 75 was reliably formed continuously on the heat sink 2, the exposed recess 4, and the back surface of the second base 1B.
The conductive layer 76 formed by metal plating was similarly formed continuously.

For comparison, as shown in FIG. 3B, the metal plating layer 75 was formed with the protruding portion 31 of the adhesive remaining. As a result, in the protruding portion 31 of the adhesive, defective plating portions where the metal plating layer is not covered are generated at various places.

Fourth Embodiment As shown in FIGS. 8 and 9, a fourth embodiment of the present invention is a laminated type in which another upper base material layer 100 is further laminated on the electronic component mounting board of the first embodiment. It shows a substrate.

The upper base material layer 100 is formed by the conductor circuit 94 of the first embodiment.
Are bonded via a prepreg adhesive 35.

In addition, the upper base material layer 100 is provided with the recess 13 for mounting the electronic component.
Has an opening 105 having a larger diameter than that of the opening 1.
A second conductive layer 760 is formed on the periphery of the opening 05 by metal plating. The upper base material layer 100 is provided with an internal ground circuit 185 on the back surface thereof in advance. The internal ground circuit 185
Is connected to the ground through hole 98, the other is connected to the second conductive layer 760, and has a wide width like the internal power supply circuit 15. Also, the second conductive layer 760
Has a grounding terminal 186 extending therefrom. In addition, upper base material layer 1
The conductor circuit 940 is provided on the upper surface of 00.

Then, between each connection terminal of the electronic component 88 in the electronic component mounting recess 13 and the power supply terminal 151, the signal terminal 941, the ground terminal 186, and the signal terminal 943 of the conductor circuit 940, between the power supply terminal 151, the signal terminal 941, and the ground terminal 186. Are connected to bonding wires 89 and 890, respectively.

According to this embodiment, the same effect as that of the first embodiment can be obtained.

Further, in this example, the power supply terminal 151, the signal terminal 941, and the ground terminal 1 are provided around the opening edge of the electronic component mounting recess 13 and the opening edge of the opening 105 of the upper base material layer 100, respectively.
86 and signal terminals 943 are arranged in parallel. Therefore, higher-density wiring can be performed as compared with the first embodiment.

Further, the power supply terminal 151 and the grounding terminal 186 are provided on the conductive layer 76 and the second conductive layer 760 having a large area, respectively, and the internal power supply circuit 15 and the internal grounding circuit 185 are provided widely. These can have low inductance.
Note that the power supply terminal 151 and the grounding terminal 186 can be used with their uses (for power supply and grounding) reversed.

[Brief description of the drawings]

1 to 4 show an electronic component mounting board according to a first embodiment, FIG. 1 is a cross-sectional view thereof, FIG.
3A to 3E are explanatory views of the manufacturing process, FIG. 4 is an exploded perspective view of a first base material, a heat sink, and a second base material, and FIGS. FIGS. 8 and 9 show the shape of the multilayer electronic component mounting board of the fourth embodiment, FIG. 8 is a sectional view thereof, FIG.
10 to 12 show a conventional board for mounting electronic components.
FIG. 11 is a cross-sectional view of one example, FIG. 11 is a cross-sectional view showing the problem, and FIG. 12 is a cross-sectional view of another conventional electronic component mounting substrate. DESCRIPTION OF SYMBOLS 1 ... Electronic component mounting board, 100 ... Upper base material layer, 120 ... Opposite part, 13 ... Electronic component mounting recess, 15 ... Internal power supply circuit, 151 ... Power supply terminal, 181,186 ... Grounding Terminals, 185 Internal ground circuit, 2 Heat sink, 3 Adhesive, 31 Overhang, 4 Exposed recess, 75 Metal plating layer, 76 Conductive layer, 760 2nd conduction layer, 941,943 ... signal terminal, 1A ... 1st base material, 1B ... 2nd base material, 11A ... inner surface recess, 11B ... stepped hole,

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 23/12 H01L 23/34-23/473 H05K 1/02 H05K 3/46

Claims (1)

(57) [Claims] 1. A first base material, a second base material, a radiator plate sandwiched and fixed between the first base material and the second base material with an adhesive therebetween, and the first base material and the adhesive on the first base material side. An electronic component having a recessed part for mounting an electronic component which penetrates and is formed to the upper part of a heat sink, and a part of the back side of the heat sink is exposed from a stepped hole provided in the second base material; A mounting substrate, wherein a second portion of the second base material is provided with a
An exposed recess is provided by facing to cover both the base material and the heat sink and exposes the adhesive on the same surface, and continuous metal plating is applied to the heat sink, the exposed recess and the back of the second base material. A conductive layer provided on the side wall of the electronic component mounting concave portion, the conductive layer being electrically connected to the outside of the substrate, and a power supply terminal or a ground terminal provided on the conductive layer. Characteristic electronic component mounting board.