JPH0786752A - Substrate for electronic component mounting - Google Patents
Substrate for electronic component mountingInfo
- Publication number
- JPH0786752A JPH0786752A JP5188941A JP18894193A JPH0786752A JP H0786752 A JPH0786752 A JP H0786752A JP 5188941 A JP5188941 A JP 5188941A JP 18894193 A JP18894193 A JP 18894193A JP H0786752 A JPH0786752 A JP H0786752A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- electronic component
- insulating substrate
- substrate
- side wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
- H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
- H01L2924/15157—Top view
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は，搭載用凹部を利用して
１つの絶縁基板に電源用回路とグランド用回路を形成で
き，かつ薄層化を図ることができる電子部品搭載用基板
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting substrate which can form a power supply circuit and a ground circuit on one insulating substrate by utilizing a mounting recess and can be thinned.
【０００２】[0002]
【従来技術】従来，電子部品搭載用基板の電気的特性を
向上させるためには，一般的に配線幅を広くとること，
配線長を短くすることがおこなわれてきた。しかし，こ
の方法は，高密度実装化の妨げになり，設計上困難な場
合がある。2. Description of the Related Art Conventionally, in order to improve the electrical characteristics of a board for mounting electronic parts, generally, a wiring width has to be wide,
It has been attempted to shorten the wiring length. However, this method hinders high-density mounting and may be difficult in design.
【０００３】そこで，電気的特性に優れた電子部品搭載
用基板として，例えば，図１２，図１３に示すものが考
えられる。該電子部品搭載用基板は，絶縁基板９１，９
２と，電子部品７を搭載するための搭載用凹部９とを有
する。また，絶縁基板９２の表側面には，多数の信号用
の配線回路９２５が形成されている。Therefore, as an electronic component mounting substrate having excellent electrical characteristics, for example, the substrates shown in FIGS. 12 and 13 can be considered. The electronic component mounting substrate is an insulating substrate 91, 9
2 and a mounting recess 9 for mounting the electronic component 7. A large number of wiring circuits 925 for signals are formed on the front surface of the insulating substrate 92.
【０００４】搭載用凹部９は，絶縁基板９１，９２の中
央部に設けられ，その全壁面が金属メッキ３０で連続的
に被覆されている。また，搭載用凹部９の表面縁部に
は，上記金属メッキ３０と接続された端子３００が形成
されている。一方，絶縁基板９２の裏面には，図１２，
図１３に示すごとく，電源用回路又はグランド用回路に
用いるための内層プレーン層３が形成されている。The mounting recess 9 is provided in the central portion of the insulating substrates 91 and 92, and the entire wall surface thereof is continuously covered with the metal plating 30. Further, a terminal 300 connected to the metal plating 30 is formed on the surface edge of the mounting recess 9. On the other hand, as shown in FIG.
As shown in FIG. 13, an inner plane layer 3 for use in a power supply circuit or a ground circuit is formed.
【０００５】この内層プレーン層３は，上記のごとく絶
縁基板９２の裏面全域にいわゆるベタ層の状態で形成さ
れている。内層プレーン層３は，上記金属メッキ３０と
接続されている。上記端子３００は，ワイヤー７０によ
り電子部品７と接続されている。上記内層プレーン層３
は，金属メッキ膜３９で覆われたスルーホール９９に接
続されている。該スルーホール９９には，リードピン６
が挿着されている。The inner plane layer 3 is formed as a so-called solid layer over the entire back surface of the insulating substrate 92 as described above. The inner plane layer 3 is connected to the metal plating 30. The terminal 300 is connected to the electronic component 7 by the wire 70. Inner layer Plain layer 3
Are connected to the through holes 99 covered with the metal plating film 39. The lead pin 6 is provided in the through hole 99.
Has been inserted.
【０００６】[0006]
【解決しようとする課題】しかしながら，上記従来の電
子部品搭載用基板においては，内層プレーン層３は，搭
載用凹部９の金属メッキ３０に接続され，該金属メッキ
３０は搭載用凹部９の全体に連続形成したものである。
そのため，金属メッキ３０及び内層プレーン層３は，単
一の電位を持つ層しか形成できない。そのため，内層プ
レーン層３は，電源用回路またはグランド用回路のいず
れか１つにしか利用できない。However, in the above-mentioned conventional electronic component mounting substrate, the inner plane layer 3 is connected to the metal plating 30 of the mounting recess 9, and the metal plating 30 covers the entire mounting recess 9. It is formed continuously.
Therefore, the metal plating 30 and the inner plane layer 3 can be formed only as a layer having a single potential. Therefore, the inner plane layer 3 can be used only for one of the power supply circuit and the ground circuit.
【０００７】一方，近年は高密度実装化が進み，電源用
回路，グランド用回路を複数設けたいという要望があ
る。そこで，図１４に示すごとく，複数の絶縁基板９１
〜９４を用いて多層基板を作製し，各絶縁基板の裏面
に，電源用回路またはグランド用回路に用いるための内
層プレーン層３２，３３，３４を形成することが考えら
れる。On the other hand, in recent years, high-density packaging has progressed, and there is a demand for providing a plurality of power supply circuits and ground circuits. Therefore, as shown in FIG.
It is conceivable that a multi-layered substrate is manufactured by using Nos. 94 to 94 and the inner plane layers 32, 33, 34 for use in the power supply circuit or the ground circuit are formed on the back surface of each insulating substrate.
【０００８】上記多層電子部品搭載用基板は電子部品を
搭載するための搭載用凹部９と，金属メッキ膜３９で覆
われたスルーホール９９２，９９３，９９４とを有す
る。上記搭載用凹部９は，絶縁基板９１の表面の一部を
底面とし，絶縁基板９２，９３，９４に設けられた開口
穴９２０，９３０，９４０を壁面としている。開口穴９
２０，９３０，９４０の全壁面は，金属メッキ３２０，
３３０，３４０により被覆されている。また，各開口穴
９２０，９３０，９４０の表面縁部には，上記金属メッ
キ３２０，３３０，３４０と接続された接続用端子３０
２，３０３，３０４が形成されている。The multilayer electronic component mounting substrate has a mounting recess 9 for mounting an electronic component and through holes 992, 993, 994 covered with a metal plating film 39. The mounting recess 9 has a part of the surface of the insulating substrate 91 as the bottom surface and the opening holes 920, 930, 940 provided in the insulating substrates 92, 93, 94 as the wall surfaces. Opening hole 9
All the walls of 20, 930 and 940 are metal plated 320,
It is covered with 330 and 340. In addition, the connection terminal 30 connected to the metal plating 320, 330, 340 is provided at the surface edge of each opening hole 920, 930, 940.
2, 303, 304 are formed.
【０００９】また，上記各内層プレーン層３２，３３，
３４は，上記各金属メッキ３２０，３３０，３４０と接
続されている。また，各内層プレーン層３２，３３，３
４は，それぞれスルーホール９９２，９９３，９９４と
接続されている。上記多層電子部品搭載用基板におい
て，内層プレーン層３２，３３，３４は，それぞれ異な
る絶縁基板９２，９３，９４の裏面に形成されている。
そのため，各内層プレーン層はそれぞれ単独の電位を持
ち，電源用回路又はグランド用回路として用いることが
できる。これにより，電子部品搭載用基板に複数の電源
用回路又はグランド用回路を設けることができ，高密度
実装化を図ることができる。Further, the inner plane layers 32, 33,
34 is connected to each of the metal platings 320, 330 and 340. Also, each inner plane layer 32, 33, 3
4 are connected to through holes 992, 993, 994, respectively. In the multilayer electronic component mounting board, the inner plane layers 32, 33, 34 are formed on the back surfaces of different insulating boards 92, 93, 94, respectively.
Therefore, each inner plane layer has its own potential and can be used as a power supply circuit or a ground circuit. As a result, a plurality of power supply circuits or ground circuits can be provided on the electronic component mounting board, and high-density mounting can be achieved.
【００１０】しかし，この多層電子部品搭載用基板は，
基板全体の厚みが大きくなり，電子部品搭載用基板の薄
層化が妨げられる。そこで，本発明はかかる従来の問題
点に鑑み，搭載用凹部を利用して１つの絶縁基板に電源
用回路とグランド用回路を形成でき，かつ薄層化，高密
度実装化を図ることができる電子部品搭載用基板を提供
しようとするものである。However, this multilayer electronic component mounting board is
This increases the thickness of the entire board, which prevents the electronic component mounting board from becoming thinner. Therefore, in view of the above conventional problems, the present invention can form a power supply circuit and a ground circuit on one insulating substrate by utilizing the mounting recess, and can achieve thin layer and high density mounting. It is intended to provide a substrate for mounting an electronic component.
【００１１】[0011]
【課題の解決手段】本発明は，絶縁基板と，該絶縁基板
に設けた電子部品を搭載するための搭載用凹部と，上記
絶縁基板の内部に設けた電源用回路及びグランド用回路
とを有する電子部品搭載用基板であって，上記搭載用凹
部の側壁には複数の側壁回路を形成してなり，かつ上記
各側壁回路は上記電源用回路又はグランド用回路に接続
されていることを特徴とする電子部品搭載用基板にあ
る。The present invention has an insulating substrate, a mounting recess for mounting an electronic component provided on the insulating substrate, and a power supply circuit and a ground circuit provided inside the insulating substrate. A board for mounting electronic parts, wherein a plurality of side wall circuits are formed on a side wall of the mounting recess, and each side wall circuit is connected to the power supply circuit or the ground circuit. It is in the electronic component mounting board.
【００１２】本発明において最も注目すべきことは，搭
載用凹部の側壁に複数の側壁回路を形成したこと，及び
電源用回路又はグランド用回路は側壁回路を設けた絶縁
基板の裏面に形成されており，上記側壁回路と接続され
ていることである。What is most noticeable in the present invention is that a plurality of side wall circuits are formed on the side wall of the mounting recess, and that the power supply circuit or the ground circuit is formed on the back surface of the insulating substrate provided with the side wall circuits. That is, it is connected to the side wall circuit.
【００１３】上記側壁回路は，搭載用凹部の壁面から搭
載用凹部の表面縁部まで連続して形成されている。側壁
回路は，例えば，搭載用凹部の壁面に形成された断面ス
ルーホールである。側壁回路の上記表面縁部は，電子部
品に対してワイヤーにより接続されている。The side wall circuit is formed continuously from the wall surface of the mounting recess to the surface edge of the mounting recess. The side wall circuit is, for example, a cross-section through hole formed on the wall surface of the mounting recess. The surface edge of the side wall circuit is connected to the electronic component by a wire.
【００１４】上記側壁回路は，例えば，絶縁基板の表側
面に形成された表面回路，絶縁基板の裏側面に形成され
た裏面回路，又は絶縁基板の内部に形成された内部回路
の少なくとも１つの回路と接続される。上記表面回路，
裏面回路は，配線パターン，スルーホールのランド，又
は接続用パッド等である。上記内部回路は，電源用回
路，グランド用回路，又は配線パターン等である。ま
た，側壁回路は，電源用回路又はグランド用回路のいず
れかに接続されている。なお，側壁回路は信号用の配線
回路に接続することもできる。The side wall circuit is, for example, at least one circuit of a front surface circuit formed on the front surface of the insulating substrate, a back surface circuit formed on the back surface of the insulating substrate, or an internal circuit formed inside the insulating substrate. Connected with. The above surface circuit,
The back surface circuit is a wiring pattern, a land of through holes, a connection pad, or the like. The internal circuit is a power supply circuit, a ground circuit, a wiring pattern, or the like. The sidewall circuit is connected to either the power supply circuit or the ground circuit. The side wall circuit can also be connected to a wiring circuit for signals.
【００１５】電子部品搭載用基板は，少なくとも２枚の
絶縁基板を積層して形成されている。そして，上記側壁
回路は，例えば最上層となる絶縁基板，或いは最上層と
その下層の絶縁基板に形成される。また，３枚以上の絶
縁基板を用いる場合には，その中間層となる絶縁基板に
も，上記側壁回路を形成することができる。電子部品搭
載用基板の表面，裏面などには，多種類の配線回路を形
成することができる。各絶縁基板の間には，電源用回路
及びグランド用回路が形成されている。The electronic component mounting substrate is formed by laminating at least two insulating substrates. The side wall circuit is formed, for example, on the uppermost insulating substrate, or on the uppermost insulating substrate and the lower insulating substrate. Further, when three or more insulating substrates are used, the sidewall circuit can be formed on the insulating substrate which is an intermediate layer between them. Many kinds of wiring circuits can be formed on the front and back surfaces of the electronic component mounting board. A power supply circuit and a ground circuit are formed between the insulating substrates.
【００１６】次に，上記電子部品搭載用基板の製造方法
について，その１例を説明する。まず，最上層となる絶
縁基板を準備し，搭載用凹部の切断位置付近に，側壁回
路形成用の複数のホールを穿設する。ホールは，スリッ
ト形状，円筒形状等である。Next, an example of the method of manufacturing the electronic component mounting board will be described. First, an uppermost insulating substrate is prepared, and a plurality of side wall circuit forming holes are formed near the cutting position of the mounting recess. The hole has a slit shape, a cylindrical shape, or the like.
【００１７】次に，ホール内に金属メッキを施し，側壁
回路を形成する。また，搭載用凹部の表面縁部に側壁回
路の接続用端子を形成すると共に，絶縁基板の裏面に
は，グランド用回路及び電源用回路を形成する。次に，
打ち抜き又はルーター加工等により，絶縁基板における
上記ホールの間を切断して，搭載用凹部を形成する。こ
れにより，最上層となる絶縁基板を得ることができる。
次に，上記最上層となる絶縁基板の下にその他の絶縁基
板を積層し，加熱圧着する。これにより，電子部品搭載
用基板が得られる。Next, metal plating is applied to the inside of the hole to form a side wall circuit. Further, the connection terminals for the side wall circuit are formed on the surface edge of the mounting recess, and the ground circuit and the power supply circuit are formed on the back surface of the insulating substrate. next,
The mounting recess is formed by cutting the holes in the insulating substrate by punching or router processing. As a result, the uppermost insulating substrate can be obtained.
Next, another insulating substrate is laminated under the uppermost insulating substrate and thermocompression bonded. As a result, the electronic component mounting board is obtained.
【００１８】[0018]
【作用及び効果】本発明においては，搭載用凹部の壁面
に複数の側壁回路を設けている。そのため，上記各側壁
回路はそれぞれ単独の電位を持つことができ，グランド
用回路又は電源用回路のいずれかにそれぞれ自由に接続
することができる。また，これに対応して，例えば１枚
の絶縁基板の裏面には，グランド用回路及び電源用回路
の双方を形成することができる。In the present invention, a plurality of side wall circuits are provided on the wall surface of the mounting recess. Therefore, each of the side wall circuits can have its own potential and can be freely connected to either the ground circuit or the power supply circuit. Corresponding to this, for example, both a ground circuit and a power circuit can be formed on the back surface of one insulating substrate.
【００１９】それゆえ，多数枚の絶縁基板を積層する必
要がない。従って，電子部品搭載用基板の薄層化を図る
ことができる。また，電子部品搭載用基板の内部に，グ
ランド用回路及び電源用回路を形成しているので，配線
の自由度が高い。本発明によれば，搭載用凹部を利用し
て１つの絶縁基板に電源用回路とグランド用回路を形成
でき，かつ薄層化を図ることができる電子部品搭載用基
板を提供することができる。Therefore, it is not necessary to stack a large number of insulating substrates. Therefore, it is possible to reduce the thickness of the electronic component mounting substrate. Further, since the circuit for ground and the circuit for power supply are formed inside the electronic component mounting board, the degree of freedom of wiring is high. According to the present invention, it is possible to provide an electronic component mounting substrate in which a power supply circuit and a ground circuit can be formed on one insulating substrate by using the mounting recesses and the thickness of the electronic component mounting substrate can be reduced.
【００２０】[0020]
【実施例】実施例１ 本例の電子部品搭載用基板について，図１〜図９を用い
て説明する。上記電子部品搭載用基板は，図１〜図３に
示すごとく，絶縁基板９１，９２と，電子部品７を搭載
するための搭載用凹部９と，上記絶縁基板９１と絶縁基
板９２との間に設けた電源用回路１１及びグランド用回
路１２とを有する。EXAMPLES Example 1 An electronic component mounting substrate of this example will be described with reference to FIGS. As shown in FIGS. 1 to 3, the electronic component mounting substrate includes insulating substrates 91 and 92, a mounting recess 9 for mounting the electronic component 7, and the insulating substrate 91 and the insulating substrate 92. The power supply circuit 11 and the ground circuit 12 are provided.
【００２１】上記搭載用凹部９の側壁９０には，４個の
側壁回路１０が形成されている。側壁回路１０は，図
１，図３に示すごとく，断面スルーホール９０１に形成
されている。各側壁回路１０は，図２，図３に示すごと
く，上記電源用回路１１又はグランド用回路１２に接続
されている。Four sidewall circuits 10 are formed on the sidewall 90 of the mounting recess 9. The side wall circuit 10 is formed in the through hole 901 in cross section as shown in FIGS. Each side wall circuit 10 is connected to the power supply circuit 11 or the ground circuit 12 as shown in FIGS.
【００２２】上記各側壁回路１０の接続用端子１００
は，ワイヤー７０により電子部品７と接続されている。
電子部品搭載用基板には，絶縁基板９１，９２を貫通す
るスルーホール９９が設けられている。該スルーホール
９９は，その内壁が金属メッキ１９により被覆されてお
り，リードピン６が挿着されている。絶縁基板９１の表
面には，配線回路５２及びそのパッド５１が形成されて
いる。電源用回路１１及びグランド用回路１２は，図３
に示すごとく，複数の異なるスルーホール９９と接続さ
れている。Connection terminals 100 of the side wall circuits 10 described above.
Are connected to the electronic component 7 by wires 70.
The electronic component mounting board is provided with through holes 99 penetrating the insulating boards 91 and 92. The inner wall of the through hole 99 is covered with the metal plating 19, and the lead pin 6 is inserted therein. A wiring circuit 52 and its pad 51 are formed on the surface of the insulating substrate 91. The power supply circuit 11 and the ground circuit 12 are shown in FIG.
As shown in FIG. 2, the through holes 99 are connected to different through holes 99.
【００２３】上記電子部品搭載用基板の製造方法につい
て，図４〜図９を用いて説明する。まず，図４，図５に
示すごとく，上層用の絶縁基板９２を準備し，搭載用凹
部の切断位置付近に，ルーター加工により側壁回路形成
用の複数のホール９００を穿設する。ホール９００は，
長細いスリット形状をしている。また，図示しないが，
このとき，スルーホールも穿設する。A method of manufacturing the electronic component mounting board will be described with reference to FIGS. First, as shown in FIGS. 4 and 5, an insulating substrate 92 for the upper layer is prepared, and a plurality of holes 900 for forming sidewall circuits are formed near the cutting position of the mounting recess by router processing. Hall 900 is
It has a long and thin slit shape. Although not shown,
At this time, through holes are also drilled.
【００２４】次に，図６に示すごとく，ホール９００内
に金属メッキにより側壁回路１０を形成する。また，絶
縁基板９２の表面に側壁回路１０の接続用端子１００，
信号用の配線回路５２及びパッド５１を形成する。ま
た，図７，図３に示すごとく，絶縁基板９２の裏面に
は，電源用回路１１及びグランド用回路１２を形成す
る。また，スルーホール９９の内部に金属メッキ１９を
施す。Next, as shown in FIG. 6, the side wall circuit 10 is formed in the hole 900 by metal plating. Further, on the surface of the insulating substrate 92, the connection terminals 100 of the sidewall circuit 10,
A wiring circuit 52 for signals and a pad 51 are formed. Further, as shown in FIGS. 7 and 3, the power supply circuit 11 and the ground circuit 12 are formed on the back surface of the insulating substrate 92. Further, metal plating 19 is applied to the inside of the through hole 99.
【００２５】次に，図８，図９に示すごとく，打ち抜き
又はルーター加工等により，上記各ホール９００の間
を，図８に点線９０９で示すごとく切断し，絶縁基板９
２に搭載用凹部９を穿設する。これにより，上層となる
絶縁基板９２を得る。また，下層とする他の絶縁基板９
１を準備する。該絶縁基板９１に，上記絶縁基板９２の
スルーホールと同位置にスルーホールを穿設する。そし
て，スルーホールの内部に金属メッキ１９を施す。次
に，上記上層となる絶縁基板９２と上記他の絶縁基板９
１とを積層し，熱圧着する。これにより，上記図１〜図
３に示した電子部品搭載用基板が得られる。Next, as shown in FIGS. 8 and 9, the spaces between the holes 900 are cut by punching or router processing as shown by dotted lines 909 in FIG.
2 is provided with a mounting recess 9. In this way, the upper insulating substrate 92 is obtained. Also, another insulating substrate 9 serving as a lower layer
Prepare 1. A through hole is formed in the insulating substrate 91 at the same position as the through hole of the insulating substrate 92. Then, metal plating 19 is applied to the inside of the through hole. Next, the upper insulating substrate 92 and the other insulating substrate 9
1 and are laminated and thermocompression bonded. As a result, the electronic component mounting substrate shown in FIGS. 1 to 3 is obtained.
【００２６】次に，本発明の作用効果について説明す
る。本例の電子部品搭載用基板は，図１，図３に示すご
とく，搭載用凹部９の壁面９０に４つの側壁回路１０を
設けている。そのため，各側壁回路１０は，それぞれ単
独の電位を持つことができ，電源用回路１１又はグラン
ド用回路１２のいずれかにそれぞれ自由に接続すること
ができる。Next, the function and effect of the present invention will be described. In the electronic component mounting board of this example, as shown in FIGS. 1 and 3, four side wall circuits 10 are provided on the wall surface 90 of the mounting recess 9. Therefore, each side wall circuit 10 can have its own potential and can be freely connected to either the power supply circuit 11 or the ground circuit 12.
【００２７】また，これに対応して，１枚の絶縁基板９
２の裏面には，電源用回路１１及びグランド用回路１２
の双方を形成している。それ故，多数枚の絶縁基板を積
層する必要がない。従って，電子部品搭載用基板の薄層
化を図ることができる。また，絶縁基板の内部，即ち絶
縁基板９２の裏面に，電源用回路１１及びグランド用回
路１２を形成しているので，配線の自由度が高い。Correspondingly, one insulating substrate 9
On the back side of 2, the power supply circuit 11 and the ground circuit 12
Form both sides. Therefore, it is not necessary to stack a large number of insulating substrates. Therefore, it is possible to reduce the thickness of the electronic component mounting substrate. Further, since the power supply circuit 11 and the ground circuit 12 are formed inside the insulating substrate, that is, on the back surface of the insulating substrate 92, the degree of freedom of wiring is high.
【００２８】実施例２ 本例の電子部品搭載用基板においては，図１０に示すご
とく，搭載用凹部９の側壁９０に，多数の半円状の断面
スルーホール９０２が形成されている。該断面スルーホ
ール９０２には，側壁回路が形成されている。各側壁回
路１０は，表面縁部に接続用端子１００を有している。
各接続用端子１００の間には，送信用配線回路５２のパ
ッド５１が形成されている。Embodiment 2 In the electronic component mounting board of this embodiment, as shown in FIG. 10, a large number of semicircular through holes 902 are formed in the side wall 90 of the mounting recess 9. A sidewall circuit is formed in the cross-section through hole 902. Each side wall circuit 10 has a connecting terminal 100 on the surface edge.
Pads 51 of the transmission wiring circuit 52 are formed between the connection terminals 100.
【００２９】本例の電子部品搭載用基板を作製するに当
たっては，まず，図１１に示すごとく，上層用の絶縁基
板９２に搭載用凹部９の穿設位置に，１２個の円筒状の
ホール９００を穿設する。その後，実施例１と同様にし
てホール９００内に金属メッキにより側壁回路１０を形
成する。また，絶縁基板９２の表面には接続用端子１０
０，送信用配線回路５２及びパッド５１を，絶縁基板９
２の裏面にはグランド用回路及び電源用回路を形成す
る。また，スルーホール９９の内部に金属メッキ１９を
施す。In producing the electronic component mounting substrate of this example, first, as shown in FIG. 11, twelve cylindrical holes 900 are formed in the upper insulating substrate 92 at the positions where the mounting recesses 9 are formed. To drill. After that, the sidewall circuit 10 is formed in the hole 900 by metal plating in the same manner as in the first embodiment. In addition, on the surface of the insulating substrate 92, the connecting terminals 10
0, the wiring circuit 52 for transmission and the pad 51,
A ground circuit and a power circuit are formed on the back surface of 2. Further, metal plating 19 is applied to the inside of the through hole 99.
【００３０】次に，ルーター加工等により，上記各ホー
ル９００の間を，図１１に点線９０９で示すごとく切断
し，絶縁基板９２に搭載用凹部９を形成する。これによ
り，上層用の絶縁基板９２を得る。また，下層用の絶縁
基板９１に，内部に金属メッキを施したスルーホールを
形成する。次に，この絶縁基板９１の上に上記絶縁基板
９２を積層し，熱圧着する。これにより，図１０に示す
電子部品搭載用基板が得られる。その他は，実施例１と
同様である。Next, the holes 900 are cut by a router process or the like as shown by dotted lines 909 in FIG. 11 to form the mounting recesses 9 in the insulating substrate 92. As a result, the insulating substrate 92 for the upper layer is obtained. Further, a through hole having a metal plated inside is formed in the lower insulating substrate 91. Next, the insulating substrate 92 is laminated on the insulating substrate 91 and thermocompression bonded. As a result, the electronic component mounting board shown in FIG. 10 is obtained. Others are the same as in the first embodiment.
【００３１】本例においては，搭載用凹部９に多数の側
壁回路１０を設けてある。そのため，各側壁回路１０は
それぞれ電源用回路，グランド用回路のいずれかに接続
することができ，電源用回路，グランド用回路を任意の
位置に配置することができる。なお，上記側壁回路１０
は，電源用回路，グランド用回路の他に送信用回路５２
に接続することもできる。また，本例によれば，実施例
１と同様の効果を得ることができる。In this example, a large number of sidewall circuits 10 are provided in the mounting recess 9. Therefore, each sidewall circuit 10 can be connected to either the power supply circuit or the ground circuit, and the power supply circuit and the ground circuit can be arranged at arbitrary positions. The side wall circuit 10
In addition to the power supply circuit and the ground circuit, the transmission circuit 52
You can also connect to. Further, according to this example, the same effect as that of the first embodiment can be obtained.
【図１】実施例１の電子部品搭載用基板の平面図。FIG. 1 is a plan view of an electronic component mounting board according to a first embodiment.
【図２】実施例１の電子部品搭載用基板の断面図。FIG. 2 is a cross-sectional view of the electronic component mounting board according to the first embodiment.
【図３】図２のＡ−Ａ線矢視線断面図。FIG. 3 is a sectional view taken along the line AA of FIG.
【図４】実施例１の電子部品搭載用基板の製造方法を示
す説明図。FIG. 4 is an explanatory view showing a method for manufacturing an electronic component mounting substrate according to the first embodiment.
【図５】図４に続く説明図。FIG. 5 is an explanatory diagram following FIG. 4;
【図６】図５に続く説明図。FIG. 6 is an explanatory diagram following FIG. 5;
【図７】図６に続く説明図。FIG. 7 is an explanatory diagram following FIG. 6;
【図８】図７に続く説明図。FIG. 8 is an explanatory diagram following FIG. 7.
【図９】図８に続く説明図。FIG. 9 is an explanatory diagram following FIG. 8;
【図１０】実施例２の電子部品搭載用基板の要部拡大斜
視図。FIG. 10 is an enlarged perspective view of an essential part of the electronic component mounting board according to the second embodiment.
【図１１】実施例２の電子部品搭載用基板の製造方法を
示す説明図。FIG. 11 is an explanatory view showing a method for manufacturing an electronic component mounting substrate according to a second embodiment.
【図１２】従来例の電子部品搭載用基板の断面図。FIG. 12 is a sectional view of a conventional electronic component mounting substrate.
【図１３】図１２のＢ−Ｂ線矢視線断面図。13 is a cross-sectional view taken along the line BB of FIG.
【図１４】他の従来例の多層電子部品搭載用基板の断面
図。FIG. 14 is a cross-sectional view of another conventional multilayer electronic component mounting substrate.
１０．．．側壁回路， １００．．．接続用端子， １１．．．電源用回路， １２．．．グランド用回路， ７．．．電子部品， ９．．．搭載用凹部， ９０．．．側壁， ９００．．．ホール， ９０１，９０２．．．断面スルーホール， ９１，９２．．．絶縁基板， 10. ． ． Sidewall circuit, 100. ． ． Connection terminal, 11. ． ． Power supply circuit, 12. ． ． Circuit for ground, 7. ． ． Electronic components, 9. ． ． Mounting recess, 90. ． ． Side wall, 900. ． ． Hall, 901,902. ． ． Cross-section through hole, 91, 92. ． ． Insulating substrate,
Claims (4)
品を搭載するための搭載用凹部と，上記絶縁基板の内部
に設けた電源用回路及びグランド用回路とを有する電子
部品搭載用基板であって， 上記搭載用凹部の側壁には複数の側壁回路を形成してな
り，かつ上記各側壁回路は上記電源用回路又はグランド
用回路に接続されていることを特徴とする電子部品搭載
用基板。1. An electronic component mounting substrate having an insulating substrate, a mounting recess for mounting an electronic component provided on the insulating substrate, and a power supply circuit and a ground circuit provided inside the insulating substrate. A plurality of side wall circuits are formed on the side wall of the mounting recess, and each side wall circuit is connected to the power supply circuit or the ground circuit. substrate.
載用凹部の側壁に形成された断面スルーホールであるこ
とを特徴とする電子部品搭載用基板。2. The electronic component mounting board according to claim 1, wherein the side wall circuit is a through hole having a cross section formed in a side wall of a mounting recess.
は，絶縁基板の表側面に形成された表面回路，絶縁基板
の裏側面に形成された裏面回路，又は絶縁基板の内部に
形成された内部回路の少なくとも１つの回路と接続され
ていることを特徴とする電子部品搭載用基板。3. The side wall circuit according to claim 1, wherein the side wall circuit is formed on a front side surface of the insulating substrate, a back side circuit formed on a back side surface of the insulating substrate, or inside the insulating substrate. An electronic component mounting board, which is connected to at least one circuit of an internal circuit.
回路は，上記電源用回路又はグランド用回路に接続され
ていることを特徴とする電子部品搭載用基板。4. The electronic component mounting board according to claim 1, wherein the side wall circuit is connected to the power supply circuit or the ground circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5188941A JPH0786752A (en) | 1993-06-30 | 1993-06-30 | Substrate for electronic component mounting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5188941A JPH0786752A (en) | 1993-06-30 | 1993-06-30 | Substrate for electronic component mounting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0786752A true JPH0786752A (en) | 1995-03-31 |
Family
ID=16232591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5188941A Pending JPH0786752A (en) | 1993-06-30 | 1993-06-30 | Substrate for electronic component mounting |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0786752A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001352006A (en) * | 2000-04-05 | 2001-12-21 | Ibiden Co Ltd | Substrate for mounting electronic component |
| EP1351296A1 (en) * | 1995-12-22 | 2003-10-08 | Ibiden Co.,Ltd. | Electronic parts mounting substrate and process for manufacturing the same |
| JP2007048797A (en) * | 2005-08-08 | 2007-02-22 | Sumitomo Metal Electronics Devices Inc | Ceramic multilayer substrate and manufacturing method therefor |
| WO2011058879A1 (en) * | 2009-11-12 | 2011-05-19 | 日本電気株式会社 | Substrate with built-in functional element, manufacturing method of substrate with built-in functional element, and circuit board |
-
1993
- 1993-06-30 JP JP5188941A patent/JPH0786752A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1351296A1 (en) * | 1995-12-22 | 2003-10-08 | Ibiden Co.,Ltd. | Electronic parts mounting substrate and process for manufacturing the same |
| JP2001352006A (en) * | 2000-04-05 | 2001-12-21 | Ibiden Co Ltd | Substrate for mounting electronic component |
| JP4560970B2 (en) * | 2000-04-05 | 2010-10-13 | イビデン株式会社 | Electronic component mounting board |
| JP2007048797A (en) * | 2005-08-08 | 2007-02-22 | Sumitomo Metal Electronics Devices Inc | Ceramic multilayer substrate and manufacturing method therefor |
| WO2011058879A1 (en) * | 2009-11-12 | 2011-05-19 | 日本電気株式会社 | Substrate with built-in functional element, manufacturing method of substrate with built-in functional element, and circuit board |
| JP5617846B2 (en) * | 2009-11-12 | 2014-11-05 | 日本電気株式会社 | Functional element built-in substrate, functional element built-in substrate manufacturing method, and wiring board |
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