JP2001352006A - Substrate for mounting electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate for mounting electronic components that increases the wiring density of the circumference of a recessed part for mounting, and at the same time easily carries out wire bonding. SOLUTION: In a substrate 40 for mounting electronic components, that has a recessed part 5 for mounting that is formed in a recessed shape on an insulating board 4 for mounting an electronic component 59, at least two strip patterns are provided. The strip patterns are arranged on the same plane of the insulating board 4, along the circumference of the recessed part 5 for mounting. At least one of the strip patterns is a first strip pattern 11 for connecting to a via hole 12, that is open in the strip pattern. At least the other is a second strip pattern 21 for connecting to a wall-surface pattern 22 that is formed on the wall surface of the recessed part 5 for mounting.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate for mounting electronic components, and more particularly to a peripheral structure of a mounting recess for mounting electronic components.

[0002]

2. Description of the Related Art In recent years, there has been a trend toward higher-density wiring at the periphery of a concave portion for mounting an electronic component in an electronic component mounting substrate. For this reason, various contrivances have been made to the wiring pattern on the periphery of the concave portion. Conventionally, as such an electronic component mounting board, for example, as shown in FIG.
A mounting recess 97 for mounting the mounting pattern 79 is provided.
31 is formed. A wall pattern 96 is provided on a wall surface of the mounting concave portion 97, and one end thereof is connected to a bonding pad 95. Other bonding pad 9
35 is connected to the conductor pattern 931.

Since the wall surface pattern 96 is formed widely on the wall surface of the mounting concave portion 97, it can be used for a power supply circuit or a ground circuit requiring stable electric characteristics. Therefore, the peripheral structure of the mounting concave portion 97 can be used at a high density while maintaining stable electric characteristics. However, there is a demand that the peripheral edge of the mounting concave portion 97 be used more effectively. There is also a demand for easy wire bonding and a desire to increase the yield.

[0004]

SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic component mounting board which has a high wiring density at the periphery of the mounting recess and which can be easily wire-bonded.

[0005]

According to a first aspect of the present invention, there is provided an electronic component mounting board having a mounting concave portion formed in a concave shape for mounting an electronic component, wherein the peripheral edge of the mounting concave portion is provided. Is provided with two or more band-shaped patterns arranged on the same plane of the insulating substrate along the periphery of the mounting concave portion, and at least one of the two or more band-shaped patterns is The first band-shaped pattern connected to the via hole opened in the pattern.
At least one of the above-mentioned band-shaped patterns is a second band-shaped pattern connected to a wall pattern formed on a wall surface of the mounting concave portion, and is an electronic component mounting substrate.

The electronic component mounting substrate of the present invention is provided with a strip pattern along the periphery of the mounting recess. Since the band-shaped pattern is arranged wide in a band shape along the periphery of the mounting concave portion, wire bonding can be reliably performed even if a position where a bonding wire is bonded is shifted.

In addition, a first strip pattern connected to the via hole and a second strip pattern connected to the wall pattern are provided on the same plane of the insulating substrate. For this reason, the first band-shaped pattern and the second band-shaped pattern can be separate circuits. Further, it is possible to create a wire bonding space on the same plane of the insulating substrate where various types of electrical connections can be made to electronic components.

One of the first belt-shaped patterns is connected to a via hole opened therein, and the other second belt-shaped pattern is connected to a wall pattern formed on a wall surface of the mounting recess. For this reason, high density utilization of the peripheral structure of the mounting concave portion can be realized. Therefore, according to the present invention, it is possible to provide an electronic component mounting board in which the wiring density at the periphery of the mounting recess is increased and wire bonding is easy.
In the present invention, the first band-shaped pattern refers to a band-shaped pattern connected to the via hole at the periphery of the mounting recess, and the second band-shaped pattern refers to a band-shaped pattern connected to the wall surface pattern at the periphery of the mounting recess.

Preferably, the first band-shaped pattern and the second band-shaped pattern have different potentials. As a result, it is possible to create a belt-like pattern having various types of potentials, and it is possible to achieve high-density wiring around the mounting recess.

Since the first belt-like pattern and the second belt-like pattern have different potentials, there are circuits having at least two types of potentials as a whole of the belt-like pattern.
Each of the first band-shaped pattern and the second band-shaped pattern may have two or more potentials. For this purpose, a plurality of first band patterns and a plurality of wall patterns may be formed, and a plurality of second band patterns and a plurality of via holes may be formed.

The first and second strip patterns can be used as bonding pads.
According to a third aspect of the present invention, at least one of the first band-shaped pattern and the second band-shaped pattern may have a bonding pad connected to a peripheral edge of the substrate. In the latter case, it is preferable that the first and second strip-shaped patterns connect adjacent bonding pads. Thereby, the opening step of the mounting concave portion is further reinforced.

The bonding pad generally has a long shape composed of straight lines, but preferably has a curved portion like a protruding portion described later. This is to alleviate local stress concentration and suppress crack generation. It is preferable that at least a connection portion of the bonding pad connected to the first band-shaped pattern is a curved portion. It is preferable that the connection portion is formed of a curved portion that is gradually enlarged by a curve toward the first band-shaped pattern. Preferably, the bonding pad is semicircular or semielliptical. The bonding pad may be composed of a curved portion located on the side of the first band-shaped pattern and gradually expanding by a curve toward the first band-shaped pattern, and a straight line portion located on the side opposite to the first band-shaped pattern. preferable.

Preferably, the first band-shaped pattern or the second band-shaped pattern is a power supply circuit or a ground circuit. It is preferable that the power supply circuit and the ground circuit have a wide area in order to secure stable electric characteristics. Since the strip pattern is a wide area circuit,
By using this as a power supply circuit or a ground circuit, the electrical characteristics of the electronic component mounting board are improved. Further, the first and second belt-shaped patterns may be signal circuits.

In addition, among the two or more belt-shaped patterns, there may be any one connected to a wall pattern or a via hole, such as a first belt-shaped pattern or a second belt-shaped pattern. You do not need to be connected to That is, some of the strip patterns may not be connected to any of the wall patterns and the via holes.

The width M of the strip pattern is 5 to 700 μm.
m is preferable. If it is less than 5 μm, pattern erosion may occur at the step of the mounting recess, and if it exceeds 700 μm, high-density wiring around the mounting recess may be hindered.

The strip pattern can be formed by a semi-additive method, an additive method, a subtractive method, or the like. The strip pattern can be formed, for example, together with a bonding pad or a wall pattern.

According to a fifth aspect of the present invention, the electronic component mounting substrate is formed by laminating a plurality of insulating substrates, and at least one of the insulating substrates includes the first band-shaped pattern and the second band-shaped substrate. It is preferable to have a pattern. This results in a high-performance electronic component mounting substrate.

More preferably, all of the laminated insulating substrates have the first band-shaped pattern and the second band-shaped pattern. As a result, high-density wire bonding can be performed. Further, only one insulating substrate may have both the first band-shaped pattern and the second band-shaped pattern, and the other insulating substrate may have one of the first band-shaped pattern and the second band-shaped pattern.

According to a second aspect of the present invention, there is provided an electronic component mounting board having a mounting concave portion formed in a concave shape for mounting an electronic component, wherein the mounting concave portion has a peripheral edge. Along the periphery of the mounting recess, two or more band-shaped patterns arranged on the same plane of the insulating substrate are provided, and at least one of the two or more band-shaped patterns is provided with a via hole. A first band-shaped pattern having a projection and functioning as a bonding pad. At least one of the two or more band-shaped patterns is connected to a wall surface pattern formed on a wall surface of the mounting recess. An electronic component mounting substrate, which is a second belt-shaped pattern.

The electronic component mounting board of the second invention has a first band-shaped pattern connected to the projection, and a via hole is opened in the projection, and no via hole is arranged in the first band-shaped pattern. For this reason, the entire first belt-shaped pattern can be effectively used as a bonding pad, and there is no risk of wire bonding to the via hole by mistake. Therefore, wire bonding to the first strip pattern can be easily performed. Further, since the position of the bonding pad approaches the electronic component, the length of the bonding pad can be reduced. Also, in the second invention, similarly to the first invention, the wiring density at the periphery of the mounting concave portion can be increased, and wire bonding can be easily performed.

It is preferable that the second band-shaped pattern itself is a bonding pad. This facilitates wire bonding similarly to the first belt-shaped pattern of the present invention, and can reduce the length of the bonding pad.

Preferably, the protrusion has a curved portion. The curved portion refers to a portion where the outer shape of the protrusion is a curve. In the curved portion, stress is less likely to be concentrated on a local portion than in a straight portion having a straight outer shape. For this reason, cracks due to stress concentration are less likely to occur at the protrusions. Also, the thermal shock resistance is improved. Therefore, the electrical connection between the protrusion and the first band-shaped pattern is further ensured. The outer shape of the projection may be entirely curved or only part of it may be curved.

[0023] As described in claim 8, it is preferable that at least a connecting portion of the protruding portion connected to the first band-shaped pattern is a curved portion. The connection portion is a portion where stress tends to concentrate. By making this portion a curve, stress concentration can be alleviated, and generation of cracks can be suppressed.

According to a ninth aspect of the present invention, it is preferable that the connecting portion of the projection connected to the first band-shaped pattern is formed by a curved portion gradually expanding by a curve toward the first band-shaped pattern. . Thereby, the concentrated stress at the connection portion can be reduced, and the generation of cracks can be effectively suppressed.

According to a tenth aspect of the present invention, the protrusion is preferably a semicircle or a semiellipse. The semicircle is
The shape is cut in half by a straight line passing through the center of the circle. A semi-ellipse is a shape cut in half by either the short axis or the long axis of the ellipse. When the protrusion is semicircular or semi-elliptical, not only the part of the protrusion connected to the first band-shaped pattern, but also the entire protrusion is formed by a curve, so that the entire protrusion has cracks. It becomes a shape that is difficult to do. The generation of cracks in the entire protrusion can be effectively suppressed.

According to a twelfth aspect of the present invention, the projecting portion is located on the side of the first band-shaped pattern and is gradually enlarged by a curve toward the first band-shaped pattern; It is preferable to include a pattern and a linear portion located on the opposite side. Thereby, the stress concentration at the connection portion between the protrusion and the first band-shaped pattern can be reduced, and the occurrence of cracks can be suppressed.

[0027] According to a twelfth aspect of the present invention, the projecting portion may be a straight portion. Also in this case, the wiring density at the periphery of the mounting concave portion is increased, and wire bonding can be easily performed.

According to a thirteenth aspect, it is preferable that the first band-shaped pattern and the second band-shaped pattern have different potentials. As a result, it is possible to create a belt-like pattern having various types of potentials, and it is possible to achieve high-density wiring around the mounting recess. Preferably, the first band-shaped pattern or the second band-shaped pattern is a power supply circuit or a ground circuit. It is preferable that the power supply circuit and the ground circuit have a wide area in order to secure stable electric characteristics. Further, the first and second belt-shaped patterns may be signal circuits. According to a fifteenth aspect, the electronic component mounting substrate is formed by stacking a plurality of insulating substrates, and at least one of the insulating substrates has the first band-shaped pattern and the second band-shaped pattern. Is preferred. This results in a high-performance electronic component mounting substrate.

[0029]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 An electronic component mounting board according to an embodiment of the present invention will be described.
This will be described with reference to FIGS. As shown in FIG. 1, the electronic component mounting board 40 of the present embodiment has a mounting concave portion 5 formed in a concave shape on the insulating substrate 4 for mounting an electronic component 59 thereon. Along the periphery of the mounting recess 5, first and second strip-shaped patterns 11, 21 arranged on the same plane of the insulating substrate 4 are provided along the periphery.

As shown in FIGS. 2 and 3, the first strip pattern 11 is connected to a via hole 12 opened in the strip pattern 11. The via hole 12 is connected to a wide pattern 13 and the like formed inside the insulating substrate 4.
The first strip pattern 11, the via hole 12, the wide pattern 13, and the like constitute a power supply circuit. The first strip-shaped pattern 11 is arranged on each side of the mounting concave portion 5 opened in a square shape.

As shown in FIGS. 2 and 4, the second band-shaped pattern 21 is also insulated adjacent to the first band-shaped pattern 11,
One is provided on each side of the mounting concave portion 5. These second band-shaped patterns 21 are connected to wall surface patterns 22 formed on the entire wall surface of the mounting recess 5. The wall pattern 22 is connected to a wide pattern 23 formed inside the insulating substrate 4. The second band-like pattern 21, the wall pattern 22, the wide pattern 23, and the like constitute a ground circuit. First and second belt-shaped patterns 11,
Reference numeral 21 is connected to a plurality of bonding pads 10 and 20 provided on the periphery of the substrate.

As shown in FIG. 2, the widths m and M of the first and second band-shaped patterns 11 and 21 are 200 μm and 250 μm. The width of the bonding pads 10 and 20 is 80 μm.
It has a strip shape with a length of 250 μm and a pitch of 150 μm.
They are provided at intervals of μm.

On the surface of the insulating substrate 4, bonding pads 1 connected to the first and second belt-shaped patterns 11 and 21 are provided.
In addition to 0 and 20, a bonding pad 35 connected to the conductor pattern 34 is provided. The bonding pad 35 is arranged between the bonding pads 10 and 20. The conductor pattern 34 is a signal circuit. FIG.
As shown in the figure, the electronic component 59 mounted in the mounting recess 5
Are electrically connected to bonding pads 5 and 35 by bonding wires 8.

Next, a method of manufacturing the electronic component mounting board will be described. First, as shown in FIG. 5A, two resin substrates 41 and 43 made of glass epoxy resin and having a copper foil adhered to the surface are prepared. An opening 53 for forming a mounting recess is formed in the upper resin substrate 43, and the wall surface pattern 22 is formed on the entire wall surface by plating. The wide pattern 23 is formed by etching the copper foil on the inner side.

On the upper surface side of the lower resin substrate 41,
The concave portion 51 for forming the mounting concave portion is formed, and the copper foil on the inner side is etched to form the wide pattern 13. Also, an opening 52 for forming a mounting recess is formed in the prepreg 42.
To form Next, the resin substrate 43 is laminated on the resin substrate 41 via the prepreg 42, and these are thermocompression-bonded. Thus, a multilayer insulating substrate 4 having the mounting concave portion 5 is obtained.

As shown in FIG. 5B, via holes 12 and 32 are formed in the insulating substrate 4 by using a drill or a laser. Next, as shown in FIG. 5C, plating is applied to the via holes 12 and 32. Next, the copper foil on the surface of the insulating substrate 4 is etched and the bonding pads 10,
20, 35, first and second strip-shaped patterns 11, 21 and conductor patterns 34 are formed. After that, post-processing such as solder resist coating and bonding of a heat sink is performed. From the above,
The electronic component mounting board 40 of this example is obtained. Further, by using a heat radiating plate made of copper or the like instead of the resin substrate 41, heat generated from electronic components or the like can be efficiently removed.

The operation and effect of this embodiment will be described. Since the first and second band-shaped patterns 11 and 21 are arranged in a band along the periphery of the mounting concave portion 5, even if the position where the bonding wire 50 is bonded is shifted, wire bonding can be performed reliably. . In addition, on the same plane of the insulating substrate 4, there are a first strip pattern 11 connected to the via hole 12 and a second strip pattern 21 connected to the wall pattern 22. For this reason, the degree of freedom in design such that the first band-shaped pattern 11 can be used as a power supply circuit and the second band-shaped pattern 12 can be used as a ground circuit is improved. Therefore, a wire bonding space that can connect various kinds of electricity to the electronic component 59 can be created on the same plane. In addition, high density utilization of the peripheral structure of the mounting concave portion 5 can be realized.

Embodiment 2 In this embodiment, as shown in FIGS. 6 and 7, two insulating substrates 40 are provided.
In this example, the first band-shaped pattern 11 connected to the via hole 12 is provided on the lower insulating substrate 401. A via hole 12 is opened in the first strip-shaped pattern 11 provided on the lower insulating substrate 401. The first band-shaped pattern 11 is connected to a number of elongated bonding pads 10. These constitute a ground circuit.

The upper insulating substrate 402 is provided with a first band-shaped pattern 401 and a second band-shaped pattern 402 similarly to the insulating substrate 4 of the first embodiment. Upper insulating substrate 402
A conductor pattern 34 is formed on the upper surface, and wide patterns 13 and 23 are formed on the inner and lower surfaces. Wide patterns 36, 13, and 23 are formed on the upper surface, the inside, and the lower surface of the lower insulating substrate 401. A radiator plate 8 is adhered below the laminated insulating substrates 401 and 402. The space between them is adhesively fixed with an adhesive 89. Other configurations are the same as those of the first embodiment.

In this example, two insulating substrates 401,
Since the layers 402 are stacked, high performance can be achieved. Further, similarly to the first embodiment, since the first band-shaped pattern 11 connected to the via hole 12 and the second band-shaped pattern 21 connected to the wall surface pattern 22 are provided, the vicinity of the mounting recess 5 can be increased in density. Wire bonding is easy. In this example, the lower insulating substrate 401
Although the first band-shaped pattern 11 is provided, a second band-shaped pattern can also be provided.

Embodiment 3 As shown in FIGS. 8 and 9, the present embodiment employs a lower insulating substrate 40.
1, a second strip pattern 2 connected to the wall pattern 22
1 is provided. The second band-shaped pattern 21 provided on the lower insulating substrate 401 has a long bonding pad 20. The upper insulating substrate 402 has the first band-shaped pattern 11 and the second band-shaped pattern 21 as in the second embodiment. Others are the same as the second embodiment. In this example, the same effect as in the second embodiment can be exhibited.

Embodiment 4 As shown in FIG. 10, this embodiment is an example in which the second band-shaped pattern 21 provided on the lower insulating substrate 401 itself is a bonding pad. A hooking wire 50 is connected to the second band-shaped pattern 21. Others are the same as the second embodiment. In this example, the same effect as in the second embodiment can be exhibited.

Embodiment 5 In this embodiment, as shown in FIGS. 11 and 12, the first belt-shaped pattern 11 itself serves as a bonding pad, to which a projection 19 is connected. The protrusion 19 has a semicircular shape, is located on the side of the first band-shaped pattern 11, and is gradually enlarged toward the first band-shaped pattern 11 by a curve. The via hole 12 is opened in the protrusion 19. The second band-shaped pattern 21 itself functions as a bonding pad and is connected to the wall pattern 22. Others
This is the same as the first embodiment.

In the present embodiment, the via holes 12 are not arranged in the first belt-shaped
Has been placed. Therefore, the entire first band pattern 11 can be effectively used as a bonding pad. Therefore, wire bonding can be performed without considering how the via holes are arranged. Further, since the second band-shaped pattern 21 itself is used as a bonding pad, the degree of freedom of the wire bonding position is improved.

Further, since the entire outer shape of the projection 19 is formed by a curve, cracks are less likely to occur. In particular, the connecting portion 18 of the protruding portion 19 connected to the first band-shaped pattern 11 is a portion where cracks easily occur. However, since the connecting portion 18 is formed by a curve, stress concentration can be reduced and cracks can be prevented. it can. In addition, in this embodiment, the same effects as those of the first embodiment can be exhibited.

Embodiment 6 In this embodiment, as shown in FIG. 13, the shape of the projection 19 is a semi-elliptical shape. The protrusion 19 has a shape cut in half by the short axis of the ellipse. Others are the same as the fifth embodiment. In this example, the same effects as in the fifth embodiment can be exhibited.

Embodiment 7 In this embodiment, as shown in FIG. 14, the projection 19 is composed of a semicircular curved portion 191 and an elongated straight portion 192. The curved portion 191 is connected to the first band-shaped pattern 11, and gradually expands along the curve toward the first band-shaped pattern 11. The via hole 12 is opened in the curved portion 191. The straight portion 192 is located on the side opposite to the first band-shaped pattern 11. Others are the same as the fifth embodiment.

In this embodiment, since the connecting portion 18 of the projection 19 is formed of a curved line, the occurrence of cracks in the connecting portion 18 can be suppressed. In addition, in this example, the same effect as in the fifth embodiment can be exhibited.

Eighth Embodiment As shown in FIG. 15, this embodiment is an example in which the outer shape of the projection 19 is constituted by a straight line. The protruding portion 19 is formed of a long linear portion. Others are the same as the fifth embodiment. In the present embodiment, the via holes 12 are formed in the protrusions 19 as in the seventh embodiment.
Since the first band-shaped pattern 11 is opened, the first band-shaped pattern 11 can be effectively used as a bonding pad. Therefore, the wiring density at the periphery of the mounting recess 5 is increased, and wire bonding is easy.

[0050]

According to the present invention, it is possible to provide an electronic component mounting substrate in which the wiring density at the periphery of the mounting recess is increased and wire bonding is easy.

[Brief description of the drawings]

FIG. 1 is a plan view of an electronic component mounting board according to a first embodiment.

FIG. 2 is a perspective view of an electronic component mounting board according to the first embodiment.

FIG. 3 is a sectional view taken along line AA in FIG. 2;

FIG. 4 is a sectional view taken along line BB in FIG. 2;

5A to 5C are diagrams illustrating a method of manufacturing the electronic component mounting board according to the first embodiment.

FIG. 6 is a sectional view of an electronic component mounting board according to a second embodiment.

FIG. 7 is a plan view of an electronic component mounting board according to a second embodiment.

FIG. 8 is a sectional view of an electronic component mounting board according to a third embodiment.

FIG. 9 is a plan view of an electronic component mounting board according to a third embodiment.

FIG. 10 is a plan view of an electronic component mounting board according to a fourth embodiment.

FIG. 11 is an enlarged plan view of a main part of an electronic component mounting board according to a fifth embodiment.

FIG. 12 is an enlarged perspective view of a main part of an electronic component mounting board according to a fifth embodiment.

FIG. 13 is an enlarged perspective view of a main part of an electronic component mounting board according to a sixth embodiment.

FIG. 14 is an enlarged perspective view of a main part of an electronic component mounting board according to a seventh embodiment.

FIG. 15 is an enlarged perspective view of a main part of an electronic component mounting board according to an eighth embodiment.

FIG. 16 is a perspective view of a conventional electronic component mounting board.

[Explanation of symbols]

 10, 20, 35. . . Bonding pad, 11. . . First band-shaped pattern, 12, 32. . . Via holes, 13, 23. . . Wide pattern, 18. . . Connection part, 19. . . Protrusion, 191. . . Curve section, 192. . . Straight section, 21. . . Second band-like pattern, 22. . . Wall pattern, 34. . . Conductor pattern, 4,401,402. . . Insulating substrate, 40. . . 4. Electronic component mounting board, . . Mounting recess, 59. . . Electronic components, 50. . . 7. bonding wire; . . Heat sink, 89. . . adhesive,

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 3/46 H01L 23/12 WE (72) Inventor Tsuneo Minoura 3-200 Kawamacho, Ogaki City, Gifu Prefecture IBIDEN Corporation Kawama Factory (72) Inventor Fumiki Takagi 3-200 Kawamacho, Ogaki City, Gifu Prefecture Ibiden Kawama Factory (72) Inventor Eiji Yanagi 3-200 Kawamacho, Ogaki City, Gifu Prefecture Ibi F-term (reference) in Kawama Plant of Den Corporation

Claims (15)

[Claims] An electronic component mounting board having a mounting recess formed in a concave shape for mounting an electronic component.
Two or more belt-shaped patterns arranged on the same plane of the insulating substrate are provided on the periphery of the mounting recess along the periphery of the mounting recess, and at least one of the two or more belt-shaped patterns is provided. The band-shaped pattern is a first band-shaped pattern connected to a via hole opened in the band-shaped pattern, and at least one of the two or more band-shaped patterns is formed on a wall surface of the mounting recess. An electronic component mounting board, wherein the board is a second band-shaped pattern connected to a wall pattern. 2. The electronic component mounting board according to claim 1, wherein the first band-shaped pattern and the second band-shaped pattern have different potentials. 3. The electronic component according to claim 1, wherein at least one of the first band-shaped pattern and the second band-shaped pattern has a bonding pad connected to a periphery of the substrate. Mounting substrate. 4. The method according to claim 1, wherein:
The electronic component mounting board, wherein the first band-shaped pattern or the second band-shaped pattern is a power circuit or a ground circuit. 5. The method according to claim 1, wherein:
The electronic component mounting board is formed by laminating a plurality of insulating substrates, and at least one of the insulating substrates has the first band-shaped pattern and the second band-shaped pattern. Substrate. 6. An electronic component mounting board having a mounting recess formed in a concave shape for mounting an electronic component,
Two or more belt-shaped patterns arranged on the same plane of the insulating substrate are provided on the periphery of the mounting recess along the periphery of the mounting recess, and at least one of the two or more belt-shaped patterns is provided. The band-shaped pattern is a first band-shaped pattern having a projection in which a via hole is arranged and functioning as a bonding pad. At least one of the two or more band-shaped patterns is a wall surface of the mounting recess. An electronic component mounting substrate, characterized in that the substrate is a second band-shaped pattern connected to a wall pattern formed on the substrate. 7. The electronic component mounting board according to claim 6, wherein the projection has a curved portion. 8. The electronic component mounting board according to claim 6, wherein at least a connection portion of the protrusion connected to the first band-shaped pattern is a curved portion. 9. The method according to claim 6, wherein:
The electronic component mounting board, wherein a connecting portion of the protrusion connected to the first band-shaped pattern is formed by a curved portion gradually expanding by a curve toward the first band-shaped pattern. 10. The electronic component mounting board according to claim 6, wherein the protrusion is a semicircle or a semiellipse. 11. The curved portion according to claim 6, wherein the protrusion is located on the side of the first band-shaped pattern and gradually expands by a curve toward the first band-shaped pattern. And a linear portion located on the opposite side of the first band-shaped pattern. 12. The electronic component mounting board according to claim 6, wherein the protrusion comprises a linear portion. 13. The electronic component mounting board according to claim 6, wherein the first band-shaped pattern and the second band-shaped pattern have different potentials. 14. The method according to claim 6, wherein the first band-shaped pattern or the second band-shaped pattern is:
An electronic component mounting substrate, which is a power supply circuit or a ground circuit. 15. The electronic component mounting board according to claim 6, wherein a plurality of insulating boards are laminated, and at least one of the insulating boards is the first strip-shaped insulating board. A substrate for mounting electronic components, comprising a pattern and the second band-shaped pattern.