CN110996501A - Circuit board and power module with through type conductive and heat dissipation component - Google Patents
Circuit board and power module with through type conductive and heat dissipation component Download PDFInfo
- Publication number
- CN110996501A CN110996501A CN201911394239.0A CN201911394239A CN110996501A CN 110996501 A CN110996501 A CN 110996501A CN 201911394239 A CN201911394239 A CN 201911394239A CN 110996501 A CN110996501 A CN 110996501A
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- CN
- China
- Prior art keywords
- circuit board
- conductive
- main body
- base material
- insulating base
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
Abstract
The invention discloses a circuit board and a power module with a through type conductive and radiating component, wherein the circuit board comprises: the insulating substrate, two relative surfaces of the insulating substrate have conducting circuits; the penetrating type metal conducting and radiating part is arranged in the insulating base material and penetrates through the insulating base material to be electrically connected with the conducting circuits on the two opposite surfaces of the insulating base material; the penetrating type metal conducting and radiating component is provided with a main body part embedded in the insulating base material and a plurality of protruding parts arranged on two opposite surfaces of the main body part, and a device mounting pad for mounting a power device is formed on each protruding part; the conductive circuit is used for loading relatively small current, and the penetrating type metal conductive and heat dissipation part is used for loading relatively large current. The circuit board has the advantages of flexible wiring and convenience for miniaturization, and can effectively reduce or prevent the problem of board explosion caused by arranging the penetrating metal conductive and radiating part in the insulating substrate.
Description
Technical Field
The invention relates to a circuit board with a through type conductive and radiating component and a power module adopting the circuit board.
Background
The circuit board for mounting the power device usually needs to be configured with a relatively thick conductive circuit to carry a large current, and the thickness of the conductive circuit can reach more than 100 micrometers, and the thickness of the conductive circuit required by some power devices such as an IGBT can even reach several millimeters.
Chinese patent application CN201820066397.8 discloses a printed circuit board and a power assembly, the printed circuit board includes a substrate and a metal member embedded in the substrate, a first conductive pattern layer is formed on the upper surface of the substrate, and a second conductive pattern layer is formed on the lower surface of the substrate; the metal component comprises a metal base and a plurality of bosses formed on one side of the metal base, and the metal component is used as a heat conduction and electric conduction channel penetrating through the substrate; the power assembly comprises a plurality of power devices which are respectively arranged on the bosses.
In the prior art, the metal member penetrating through the substrate is used as the heat conducting and electricity conducting channel, the power devices arranged on the bosses can be quickly radiated, the heat radiation performance is good, the uniform current distribution is realized among the parallel power devices arranged on the bosses, but the circuit board is easy to warp due to the asymmetrical structure because the bosses are only arranged on one side of the metal base.
In addition, the copper foil layer for balancing stress is not designed inside the circuit board, so that the design size of the metal component is limited, and when the size of the metal component is larger, the problem of board explosion caused by overlarge stress deviation when the substrate resin and the metal component are heated (such as reflow soldering) due to large CTE deviation is easily caused.
Disclosure of Invention
The invention mainly aims to provide a circuit board with a through type conductive and radiating component, which can effectively reduce or prevent the problems of warping and/or board explosion caused by arranging the metal conductive and radiating component in an insulating base material. Another object of the present invention is to provide a power module including the circuit board.
In order to achieve the above-mentioned primary object, a first aspect of the present invention provides a circuit board having a through conductive and heat dissipating member, comprising:
the insulating substrate, two relative surfaces of the insulating substrate have conducting circuits;
the penetrating type metal conducting and radiating part is arranged in the insulating base material and penetrates through the insulating base material to be electrically connected with the conducting circuits on the two opposite surfaces of the insulating base material;
the penetrating type metal conducting and radiating component is provided with a main body part embedded in the insulating base material and a plurality of protruding parts arranged on two opposite surfaces of the main body part, and a device mounting pad for mounting a power device is formed on each protruding part; the conductive circuit is used for loading relatively small current, and the penetrating type metal conductive and heat dissipation part is used for loading relatively large current.
In the technical scheme, the metal conductive and radiating part is provided with a main body part embedded in the insulating base material and a plurality of protruding parts arranged on two opposite surfaces of the main body part, and the upper side and the lower side of the circuit board are provided with symmetrical structures, so that the warping problem caused by asymmetrical structures is avoided; the conductive circuits on the two opposite surfaces of the insulating substrate are electrically connected through the metal conductive and radiating parts, so that the circuit board has the advantages of flexible wiring and convenience in miniaturization, conductive through holes do not need to be arranged in the insulating substrate, and the circuit board structure and the manufacturing process are simplified. The metal conductive and radiating parts form a radiating channel penetrating through the insulating base material, so that the circuit board has better radiating performance.
In a preferred embodiment of the present invention, the insulating base material includes inner core plates and outer core plates, the outer core plates being disposed at upper and lower sides of the main body portion, the inner core plates being disposed between the outer core plates; the surface of the outer core plate adjacent to the main body part is provided with a copper foil layer. According to an embodiment of the present invention, the copper foil layer is formed at least on a surface area of the outer core panel facing the main body portion, and a covering area thereof is preferably at least 60%, more preferably at least 80%, of a surface area of a single side of the outer core panel, and further preferably the copper foil layer completely covers a surface of the outer core panel adjacent to the main body portion.
In the technical scheme, the copper foil layer is arranged on the surface of the outer core plate adjacent to the main body part, particularly the copper foil layer is formed on the surface area of the outer core plate facing the main body part, so that the problem of plate cracking caused by CTE difference between the metal conductive and heat dissipation part and the base resin when the metal conductive and heat dissipation part is heated (such as reflow soldering) can be well balanced. Wherein, the larger the coverage area of the copper foil layer is, the better the stress balance effect is.
According to an embodiment of the present invention, the conductive traces on two opposite surfaces of the insulating substrate have a thickness of 0.07 mm to 0.2 mm, and the thickness of the conductive traces is smaller than the height of the protrusions.
According to an embodiment of the present invention, the thickness of the main body portion is 1 mm to 5 mm, and the height of the protrusion portion is 0.1 mm to 1 mm. Preferably, the protrusions located on both opposite surfaces of the main body have the same height.
According to an embodiment of the present invention, a large-current terminal for inputting/outputting a relatively large current is also formed on the convex portion.
In a preferred embodiment of the present invention, a metal conductive member is further disposed in the insulating base material, the metal conductive member includes a metal base and a plurality of second bosses formed on one side of the metal base, the metal base is embedded in the insulating base material, the second bosses protrude from the insulating base material, and the second bosses are also provided with device mounting pads. Preferably, the metal base and the main body have the same thickness, and the second boss and the protrusion located on the same side of the second boss have the same height. The manufacturing difficulty of the circuit board can be simplified by the arrangement.
In order to achieve another object described above, a second aspect of the present invention provides a heat dissipation assembly including any one of the circuit boards described above and a power device, wherein the power device is disposed on a device mounting pad of the circuit board.
To more clearly illustrate the objects, technical solutions and advantages of the present invention, the present invention will be further described in detail with reference to the accompanying drawings and detailed description.
Drawings
FIG. 1 is a schematic structural diagram of a circuit board of embodiment 1 of the present invention;
FIG. 2 is a schematic structural diagram of a circuit board of embodiment 2 of the present invention;
fig. 3 is a schematic structural diagram of a circuit board embodiment 3 of the present invention.
Detailed Description
Example 1
Referring to fig. 1, the circuit board of embodiment 1 includes an insulating substrate 10 having conductive traces 20 formed on two opposite surfaces thereof, and a penetrating metal conductive and heat dissipating member 31 disposed in the insulating substrate 10, wherein the metal conductive and heat dissipating member 31 is made of copper and penetrates through the insulating substrate 10 to electrically connect the conductive traces 20 on the two opposite surfaces of the insulating substrate 10. The conductive traces 20 on two opposite surfaces of the insulating substrate 10 have a thickness of 0.07 mm to 0.2 mm, for example, about 0.1 mm; the conductive line 20 is used to carry a relatively small current, and the metal conductive and heat dissipation member 31 is formed as a thick copper line for carrying a relatively large current. In other words, the conductive line 20 carries a smaller current than the metal conductive and heat dissipating member 31. The number of the penetrating metal conductive and heat dissipation members 31 may be one or more, for example, two as shown in fig. 1.
The metal conductive and heat dissipating member 31 has a main body portion 311 embedded in the insulating base material 10 and a plurality of protruding portions 312 provided on both opposite surfaces of the main body portion 311, and device mounting pads 21 for mounting a power device are formed on the protruding portions 312. The thickness (dimension in the thickness direction of the circuit board) of the body portion 311 is 1 mm to 5 mm, for example, about 2 mm; the height (dimension in the thickness direction of the circuit board) of the convex portion is 0.1 mm to 1 mm, for example, about 0.5 mm, and the convex portions 312 located on both opposite surfaces of the main body portion 311 have the same height. The large-current terminals 22 for inputting/outputting a relatively large current are also formed on the corresponding bosses 312, and in two metal conductive and heat-dissipating members 31 shown in fig. 1, for example, one large-current terminal 22 is provided on each boss 312.
The insulating base material 10 is, for example, an FR-4 base material, and includes a plurality of layers of inner core boards 11 (two layers shown in fig. 1, for example) and outer core boards 12, the outer core boards 12 being disposed on the upper and lower sides of the main body portion 311, the inner core boards 11 being disposed between the outer core boards 12; the adjacent core boards and the penetrating metal conductive and heat dissipating member 31 and the insulating base material 10 are connected together by hot-pressing the prepreg 13. The insulating substrate 10 is provided with solder resist layers 40 on both opposite surfaces thereof, and the solder resist layers 40 expose the device mounting pads 21 and the large-current terminals 22.
Example 2
Referring to fig. 2, the difference between the embodiment 2 and the embodiment 1 is that the surface of the outer core 12 adjacent to the main body 311 is provided with a copper foil layer 14. The copper foil layer 14 is formed at least in the surface area of the outer core 12 facing the body portion 311. Preferably, the copper foil layer 14 covers at least 60%, more preferably at least 80%, and even more preferably completely covers the surface of the outer core panel 12 adjacent the body portion 311, of the surface area of one side of the outer core panel.
Example 3
Referring to fig. 3, embodiment 3 is different from embodiment 1 in that a metal conductive member 32 is further disposed in the insulating substrate 10 in embodiment 3, and the material of the metal conductive member 32 is preferably copper, which can form a thick copper circuit and is also used for carrying a relatively large current.
The metal conductive member 32 includes a metal base 321 and a plurality of second bosses 322 formed at one side of the metal base 321, the metal base 321 having the same thickness as the body portion 311, the second bosses 322 having the same height as the protrusion portion 312. The metal base 321 is embedded in the insulating base material 10, the second bosses 322 protrude from the insulating base material 10, and the device mounting pads 21 are also disposed on the second bosses 322.
An embodiment of the present invention also provides a power module including the circuit board according to any one of embodiments 1 to 3 and a power device, wherein the power device is disposed on the device mounting pad of the circuit board. The power devices are IGBT devices or MOSFET devices, and the power devices arranged on the bosses of the same metal conducting and radiating component are mutually connected in parallel.
Although the present invention has been described with reference to specific embodiments, these embodiments are not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that various changes/substitutions may be made without departing from the scope of the invention, and it is intended that all equivalent changes and modifications made in accordance with the present invention shall be embraced by the scope of the invention.
Claims (10)
1. A circuit board having through conductive and heat dissipating components, comprising:
the conductive circuit comprises an insulating substrate, wherein conductive circuits are formed on two opposite surfaces of the insulating substrate;
the penetrating type metal conducting and radiating part is arranged in the insulating base material and penetrates through the insulating base material to be electrically connected with the conducting circuits on two opposite surfaces of the insulating base material;
the penetrating type metal conductive and radiating component is provided with a main body part embedded in the insulating base material and a plurality of protruding parts arranged on two opposite surfaces of the main body part, and device mounting pads for mounting a power device are formed on the protruding parts; the conductive circuit is used for loading relatively small current, and the penetrating type metal conductive and heat dissipation part is used for loading relatively large current.
2. The circuit board according to claim 1, wherein the insulating base material includes an inner core board and an outer core board, the outer core boards being disposed on upper and lower sides of the main body portion, the inner core board being disposed between the outer core boards; and a copper foil layer is arranged on the surface of the outer core plate adjacent to the main body part.
3. The circuit board of claim 2, wherein the copper foil layer is formed at least in a surface area of the outer core board facing the main body portion.
4. The circuit board of claim 1, wherein the conductive traces on two opposite surfaces of the insulating substrate have a thickness of 0.07 mm to 0.2 mm, and the conductive traces have a thickness less than the height of the protrusions.
5. The circuit board of claim 1, wherein the body portion has a thickness of 1 mm to 5 mm, and the height of the protrusion is 0.1 mm to 1 mm.
6. The circuit board of claim 1, wherein the protruding portions on both opposite surfaces of the main body portion have the same height.
7. The circuit board according to claim 1, wherein a large-current terminal for inputting/outputting a relatively large current is formed on the boss portion.
8. The circuit board of claim 1, wherein a metal conductive member is further disposed in the insulating substrate, the metal conductive member comprises a metal base and a plurality of second bosses formed on one side of the metal base, the metal base is embedded in the insulating base, the second bosses protrude from the insulating base, and device mounting pads are also disposed on the second bosses.
9. The circuit board of claim 8, wherein the metal base has the same thickness as the main body portion, and the second bosses have the same height as the bosses on the same side thereof.
10. A power module comprising the circuit board of any one of claims 1 to 9 and a power device, wherein the power device is disposed on a device mounting pad of the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911394239.0A CN110996501A (en) | 2019-12-30 | 2019-12-30 | Circuit board and power module with through type conductive and heat dissipation component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911394239.0A CN110996501A (en) | 2019-12-30 | 2019-12-30 | Circuit board and power module with through type conductive and heat dissipation component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110996501A true CN110996501A (en) | 2020-04-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911394239.0A Pending CN110996501A (en) | 2019-12-30 | 2019-12-30 | Circuit board and power module with through type conductive and heat dissipation component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110996501A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113966067A (en) * | 2020-07-20 | 2022-01-21 | 宏恒胜电子科技（淮安）有限公司 | Circuit board and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101686611A (en) * | 2008-09-28 | 2010-03-31 | 华为技术有限公司 | Multilayer circuit board, manufacture method thereof and communication equipment |
| US20170141744A1 (en) * | 2015-11-13 | 2017-05-18 | Samsung Electro-Mechanics Co., Ltd. | Front end module |
| CN207802506U (en) * | 2018-01-16 | 2018-08-31 | 乐健科技（珠海）有限公司 | Printed circuit board and (PCC) power |
| CN109561572A (en) * | 2018-11-30 | 2019-04-02 | 景旺电子科技(龙川)有限公司 | A kind of more boss types partly insertion copper billet printed board and preparation method thereof |
-
2019
- 2019-12-30 CN CN201911394239.0A patent/CN110996501A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101686611A (en) * | 2008-09-28 | 2010-03-31 | 华为技术有限公司 | Multilayer circuit board, manufacture method thereof and communication equipment |
| US20170141744A1 (en) * | 2015-11-13 | 2017-05-18 | Samsung Electro-Mechanics Co., Ltd. | Front end module |
| CN207802506U (en) * | 2018-01-16 | 2018-08-31 | 乐健科技（珠海）有限公司 | Printed circuit board and (PCC) power |
| CN109561572A (en) * | 2018-11-30 | 2019-04-02 | 景旺电子科技(龙川)有限公司 | A kind of more boss types partly insertion copper billet printed board and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113966067A (en) * | 2020-07-20 | 2022-01-21 | 宏恒胜电子科技（淮安）有限公司 | Circuit board and manufacturing method thereof |
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| PB01 | Publication | ||
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Application publication date: 20200410 |