CN207802506U - Printed circuit board and (PCC) power - Google Patents
Printed circuit board and (PCC) power Download PDFInfo
- Publication number
- CN207802506U CN207802506U CN201820066397.8U CN201820066397U CN207802506U CN 207802506 U CN207802506 U CN 207802506U CN 201820066397 U CN201820066397 U CN 201820066397U CN 207802506 U CN207802506 U CN 207802506U
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- Prior art keywords
- conductive pattern
- pattern layer
- circuit board
- printed circuit
- substrate
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- 239000002184 metal Substances 0.000 claims abstract description 57
- 229910052751 metal Inorganic materials 0.000 claims abstract description 57
- 239000000758 substrate Substances 0.000 claims abstract description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 238000009826 distribution Methods 0.000 abstract description 2
- 238000002360 preparation method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 238000000265 homogenisation Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The utility model discloses a kind of printed circuit board and (PCC) power, which includes substrate and is embedded in the metal component of substrate, and the upper surface of substrate is formed with the first conductive pattern layer, and lower surface is formed with the second conductive pattern layer；Metal component includes metal base and multiple boss for being formed on metal base, and as through the substrate heat conduction and conductive channel；The (PCC) power includes multiple power devices for being respectively arranged at multiple boss.The utility model has excellent heat dissipation performance, and uniform electric current distribution can be realized between multiple power devices.
Description
Technical field
The utility model is related to a kind of printed circuit board and (PCC) powers, more particularly, to a kind of print of embedded metal component
Printed circuit board and (PCC) power including the circuit board.
Background technology
Such as IGBT (insulated gate bipolar transistor), MOSFET (Metal-Oxide Semiconductor field-effect transistor), crystalline substance
Brake tube, GTO (gate level turn-off thyristor), GTR (power transistor), BJT (bipolar junction transistor) or UJT (single-crystal mass
Pipe) etc. power electronic device be widely used in various electronic/electrical power equipment.As electronic/electrical power product is to lightness, small
Type direction is developed, and to the various performances of wherein power electronic device, more stringent requirements are proposed, such as igbt chip is required to hold
By higher electric current etc., but with current-carrying increase is held, the heat that power device generates when working also is continuously increased, if
Heat caused by power device cannot be distributed in time, the work of other electronic devices in power device and product will be seriously affected
Make.It is therefore desirable to which the printed circuit board of load power device has good heat dissipation performance.
Chinese patent literature CN105744726A discloses a kind of printed circuit board and (PCC) power, the printed circuit board packet
It includes：Substrate；Thermally conductive and electrically insulating radiator is arranged in the substrate and runs through the substrate；Positioned at the first table of printed circuit board
Surface side and include heater element installation position the first conductive pattern；The second conductive pattern positioned at printed circuit board second surface side
Case.Wherein, at least part of the first conductive pattern is continuously extended to the first surface of radiator by the first surface of substrate,
And at least part of heater element installation position is arranged on the first surface of radiator；At least part of second conductive pattern
The second surface of radiator is continuously extended to by the second surface of substrate.Pass through the embedded radiator through substrate, this print
Not only heat dissipation performance is splendid for printed circuit board and (PCC) power, but also has good thermal stability and long life.
However, in above-mentioned printed circuit board, it is limited to the thickness (current carrying area) of conductive pattern, the resistance of conducting wire
It is usually larger, therefore when installing multiple parallel arrangement of power devices on a printed circuit, institute between these power devices
The electric current flowed through is actually non-uniform.
Therefore, it is necessary to be improved to existing printed circuit board and (PCC) power.
Invention content
First purpose of the utility model, which is to provide, a kind of having excellent heat dispersion performance and can be multiple parallel arrangement of
The printed circuit board of electric current homogenization is realized between power device.
Second purpose of the utility model is to provide a kind of (PCC) power including above-mentioned printed circuit board.
In order to realize that the first above-mentioned purpose, the first aspect of the utility model provide a kind of printed circuit board, including
Substrate and the metal component for being embedded in substrate；Wherein, the upper surface of substrate is formed with the first conductive pattern layer, and lower surface is formed with
Second conductive pattern layer；Metal component includes metal base and multiple boss for being formed on metal base, and as through base
The heat conduction of plate and conductive channel.
Preferably, metal component is copper component, to reach more preferably heat dissipation and conductive effect.
The upper surface of a kind of specific implementation mode according to the present utility model, boss and the first conductive pattern layer is concordantly set
It sets, in order to the preparation of printed circuit board.
Preferably, the upper surface of boss is formed with the metal cap body of covering boss upper surface, metal cap body and the first conduction
The upper surface of pattern layer is concordantly arranged.Such to be advantageous in that, the area of metal cap body can be according to the power device that will be assembled
It neatly controls, and convenient for realizing the electrical connection between boss and first conductive pattern layer if necessary.
The lower surface of another specific implementation mode according to the present utility model, metal base and the second conductive pattern layer is preferred
Concordant setting, in order to the preparation of printed circuit board.
In order to realize that the second above-mentioned purpose, the utility model additionally provide a kind of (PCC) power, including printed circuit board
With multiple power devices；Wherein, printed circuit board has substrate and metal component；The upper surface of the substrate is formed with the first conduction
Pattern layer, lower surface are formed with the second conductive pattern layer；The metal component includes metal base and is formed on metal base
Multiple boss, multiple power devices are respectively arranged at multiple boss；Metal component is embedded in substrate, and as leading through substrate
Heat and conductive channel.
In above-mentioned technical proposal, metal component is preferably copper component.
In above-mentioned technical proposal, the upper surface of boss and the first conductive pattern layer is preferably concordantly arranged, in order to print electricity
The preparation of road plate and the welding assembly of power device.
Preferably, the upper surface of boss is formed with the metal cap body of covering boss upper surface, metal cap body and the first conduction
The upper surface of pattern layer is concordantly arranged；Power device is arranged in metal cap body.
In above-mentioned technical proposal, the lower surface of metal base and the second conductive pattern layer is preferably concordantly arranged, in order to print
The preparation of printed circuit board and the welding assembly of (PCC) power.
In the utility model, on the one hand, metal component, can be to being arranged on boss as the passage of heat through substrate
Power device carries out rapid cooling, excellent heat dissipation performance；On the other hand, metal component also as through substrate conductive channel, by
There is the characteristic that current carrying area is big, resistance is small in metal component, therefore be respectively arranged at multiple parallel powers on multiple boss
There is the electric current distribution of homogenization between device.
It is below in conjunction with the accompanying drawings and specific real in order to more clearly illustrate the purpose of this utility model, technical solution and advantage
Applying mode, the utility model is described in further detail.
Description of the drawings
Fig. 1 is the utility model printed circuit board and the structural schematic diagram of (PCC) power embodiment 1；
Fig. 2 is the utility model printed circuit board and the structural schematic diagram of (PCC) power embodiment 2.
Specific implementation mode
Embodiment 1
Referring to Fig. 1, the printed circuit board of the present embodiment includes substrate 1 and is embedded in the metal component 2 of substrate 1；Wherein, base
The upper surface of plate 1 is formed with the first conductive pattern layer 11, and lower surface is formed with the second conductive pattern layer 12；First conductive pattern layer
11 and second conductive pattern layer 12 be formed with the conducting wire pattern including pad (not shown) etc., and the first conductive pattern layer
11 and second conductive pattern layer 12 be electrically connected by conductive via 13.Substrate 1 include two layers of insulating substrate 101 (such as FR4) and
Solidification articulamentum 102 positioned there between (such as prepreg hot pressing and formed).In other embodiments, insulating substrate
101 can be set as desired with the number of plies for curing articulamentum 102.
Metal component 2 is copper component, including metal base 21 and multiple boss 22 for being formed on metal base 21.Its
In, the upper surface of boss 22 and the first conductive pattern layer 11 is concordantly arranged, under metal base 21 and the second conductive pattern layer 12
Flush is arranged.
In the utility model, metal component 2 is as the heat conduction and conductive channel for running through substrate 1, such as MOSFET (metals-
Oxide semiconductor field effect transistor) power device 3 be directly welded on boss 22.Specifically, for MOSFET,
Its pole D (drain electrode) can be soldered to boss 22, and its pole S (source electrode) is soldered to 11 corresponding electrode of the first conductive pattern layer
Pad.
Embodiment 2
Referring to Fig. 2, embodiment 2 difference from example 1 is that：
(1) the upper surface of boss 22 is formed with the metal cap body 221 of 22 upper surface of covering boss, metal cap body 211 and first
The upper surface of conductive pattern layer 11 is concordantly arranged；
(2) the lower surface of metal base 21 is formed with the metal cap body 211 of 21 lower surface of covering metal base, metal cap body
211 and second the lower surface of conductive pattern layer 12 be concordantly arranged；
(3) substrate 1 further includes the inner layer conductive pattern layer 14 being arranged inside substrate 1.
Metal cap body 211 and 221 can be and right by carrying out whole plate plating (such as electro-coppering) to printed circuit board surface
Electroplated layer is etched and is formed.The other parts structure of embodiment 2 is same as Example 1, and details are not described herein.
It should be noted that in the utility model, using term " upper surface " and " lower surface " only for the purposes of description sheet
Utility model, and it is not intended to limit its true bearing.
Although the utility model is disclosed above with specific embodiment, it is not limited to the model of the utility model implementation
It encloses.Any those skilled in the art improve in the invention scope for not departing from the utility model when can make a little,
I.e. every same improvement done according to the utility model, should be the scope of protection of the utility model and is covered.
Claims (10)
1. the upper surface of a kind of printed circuit board, including substrate, the substrate is formed with the first conductive pattern layer, lower surface is formed
There is the second conductive pattern layer；It is characterized in that：
Metal component, including metal base and multiple boss for being formed on the metal base；The metal component is embedded in
The substrate, and as through the substrate heat conduction and conductive channel.
2. printed circuit board as described in claim 1, it is characterised in that：The metal component is copper component.
3. printed circuit board as described in claim 1, it is characterised in that：The boss and first conductive pattern layer it is upper
Flush is arranged.
4. printed circuit board as described in claim 1, it is characterised in that：It is described convex that the upper surface of the boss is formed with covering
The metal cap body of platform upper surface, the metal cap body is concordant with the upper surface of the first conductive pattern layer to be arranged.
5. printed circuit board as described in claim 1, it is characterised in that：The metal base and second conductive pattern layer
Lower surface be concordantly arranged.
6. a kind of (PCC) power, including printed circuit board and multiple power devices；The printed circuit board has substrate, the base
The upper surface of plate is formed with the first conductive pattern layer, and lower surface is formed with the second conductive pattern layer；It is characterized in that：
Metal component, including metal base and the multiple boss being formed on the metal base, the multiple power device point
It is not set to the multiple boss；The metal component is embedded in the substrate, and as through the substrate heat conduction and lead
Electric channel.
7. (PCC) power as claimed in claim 6, it is characterised in that：The metal component is copper component.
8. (PCC) power as claimed in claim 6, it is characterised in that：The upper table of the boss and first conductive pattern layer
Face is concordantly arranged.
9. (PCC) power as claimed in claim 6, it is characterised in that：The upper surface of the boss is formed with the covering boss
The metal cap body of upper surface, the metal cap body is concordant with the upper surface of the first conductive pattern layer to be arranged；The power device
Part is arranged in the metal cap body.
10. (PCC) power as claimed in claim 6, it is characterised in that：The metal base and second conductive pattern layer
Lower surface be concordantly arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820066397.8U CN207802506U (en) | 2018-01-16 | 2018-01-16 | Printed circuit board and (PCC) power |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820066397.8U CN207802506U (en) | 2018-01-16 | 2018-01-16 | Printed circuit board and (PCC) power |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207802506U true CN207802506U (en) | 2018-08-31 |
Family
ID=63271830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820066397.8U Active CN207802506U (en) | 2018-01-16 | 2018-01-16 | Printed circuit board and (PCC) power |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207802506U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109561572A (en) * | 2018-11-30 | 2019-04-02 | 景旺电子科技(龙川)有限公司 | A kind of more boss types partly insertion copper billet printed board and preparation method thereof |
| CN110996501A (en) * | 2019-12-30 | 2020-04-10 | 乐健科技（珠海）有限公司 | Circuit board and power module with through type conductive and heat dissipation component |
| CN114641122A (en) * | 2020-12-16 | 2022-06-17 | 深南电路股份有限公司 | Circuit board and preparation method thereof |
-
2018
- 2018-01-16 CN CN201820066397.8U patent/CN207802506U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109561572A (en) * | 2018-11-30 | 2019-04-02 | 景旺电子科技(龙川)有限公司 | A kind of more boss types partly insertion copper billet printed board and preparation method thereof |
| CN110996501A (en) * | 2019-12-30 | 2020-04-10 | 乐健科技（珠海）有限公司 | Circuit board and power module with through type conductive and heat dissipation component |
| CN114641122A (en) * | 2020-12-16 | 2022-06-17 | 深南电路股份有限公司 | Circuit board and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Hengqin Financial Investment International Finance Leasing Co.,Ltd. Assignor: RAYBEN TECHNOLOGIES (ZHUHAI) Ltd. Contract record no.: X2022980020419 Denomination of utility model: Printed circuit board and power assembly Granted publication date: 20180831 License type: Exclusive License Record date: 20221108 |
|
| EE01 | Entry into force of recordation of patent licensing contract | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Printed circuit board and power assembly Effective date of registration: 20221111 Granted publication date: 20180831 Pledgee: Hengqin Financial Investment International Finance Leasing Co.,Ltd. Pledgor: RAYBEN TECHNOLOGIES (ZHUHAI) Ltd. Registration number: Y2022980021699 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| EC01 | Cancellation of recordation of patent licensing contract |
Assignee: Hengqin Financial Investment International Finance Leasing Co.,Ltd. Assignor: RAYBEN TECHNOLOGIES (ZHUHAI) Ltd. Contract record no.: X2022980020419 Date of cancellation: 20240118 |
|
| EC01 | Cancellation of recordation of patent licensing contract | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20180831 Pledgee: Hengqin Financial Investment International Finance Leasing Co.,Ltd. Pledgor: RAYBEN TECHNOLOGIES (ZHUHAI) Ltd. Registration number: Y2022980021699 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |