CN105764239B - A kind of great-power electronic component lines plate of high heat dispersion and preparation method thereof - Google Patents
A kind of great-power electronic component lines plate of high heat dispersion and preparation method thereof Download PDFInfo
- Publication number
- CN105764239B CN105764239B CN201510928152.2A CN201510928152A CN105764239B CN 105764239 B CN105764239 B CN 105764239B CN 201510928152 A CN201510928152 A CN 201510928152A CN 105764239 B CN105764239 B CN 105764239B
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- China
- Prior art keywords
- great
- power electronic
- cooling fin
- electronic element
- wiring board
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
Abstract
The invention discloses a kind of great-power electronic component lines plates of high heat dispersion, including wiring board, great-power electronic element, cooling fin and heat-conducting layer；The both ends of the identical two great-power electronic elements of polarity are arranged in the cooling fin, and cover great-power electronic element surface.The invention also discloses a kind of production methods of the great-power electronic component lines plate of high heat dispersion.The present invention has simple for structure, the heat generated in the electric current and order wire circuit that the fixed circuit in diverting route plate in the both ends of the identical great-power electronic element of two polarity in the circuit board generates, increase the contact area of cooling fin and air, improves heat dissipation performance；Cooling fin is covered on the surface of great-power electronic element, changes traditional radiating mode, reduces space in cooling fin busy line plate, improve the utilization rate in space in wiring board, and cooling fin can complete assembly using machine patch, improve production efficiency, reduce production cost.
Description
Technical field
The invention belongs to wiring board technical field of heat dissipation, and in particular to a kind of great-power electronic element line of high heat dispersion
Road plate and preparation method thereof.
Background technique
With the rapid development of science and technology, the quick raising of electronic circuit technology is promoted.In current applications of electronic circuitry,
Some great-power electronic elements are usually mounted on wiring board, and these great-power electronic elements generate a large amount of heat at work
Can, if the thermal energy generated cannot shed from wiring board and great-power electronic element in time, leads to thermal energy buildup, be easy to appear line
Road plate or electronic component temperature are excessively high, influence the performance of wiring board, and great-power electronic element or damage wiring board are damaged when serious.
Therefore, some high power devices needs installed in the circuit board consider the problems of heat dissipation, avoid the thermal energy buildup in wiring board.
Currently, solving the common practice of the heat dissipation problem of the great-power electronic element in wiring board is after making Special heat dissipating piece,
Screw or rivet by way of cooling fin is fixed on to the package surface of great-power electronic element (such as FET, transistor),
And heat dissipation grease of silicone fluid is coated in seam crossing.This heat dissipating method generally requires to occupy very large space, and assembly efficiency is low, cost
It is high.It is unfavorable for the micromation of product, reduces the profit of enterprise.Therefore, heat dissipation present in existing wiring board how to be overcome to ask
Topic improves assembly efficiency, reduces production cost, and increasing practicability becomes the key problems-solving of enterprise.
Summary of the invention
In view of this, the technical problem to be solved by the present invention is to a kind of height small in size, high-efficient, at low cost and rapid heat dissipation
Great-power electronic component lines plate of heat dissipation performance and preparation method thereof.
In order to solve the above-mentioned technical problem, the present invention is realized using following scheme: a kind of high-power electricity of high heat dispersion
Subcomponent wiring board including wiring board, fixed great-power electronic element in the circuit board, is covered on great-power electronic element
Cooling fin and the gap that is arranged between great-power electronic element and cooling fin in fill and fill out one layer of heat-conducting layer；Described dissipates
The both ends of the identical two great-power electronic elements of polarity are arranged in backing, and cover great-power electronic element surface.
Wherein, the identical two great-power electronic elements of the polarity are one group, and quantity is one group or more.
Wherein, the cooling fin is by after electroplating processes and Heat Conduction Material that thermal conductivity is strong is made.
Wherein, the cooling fin with a thickness of 0.1~3mm.
Wherein, the wiring board is equipped with through-hole and/or welding resistance opens a window.
Wherein, the spacing between the great-power electronic element and cooling fin is 0.1~5mm.
Wherein, the heat-conducting layer using thermally conductive grease of silicone fluid or heat-conducting glue filling fill out great-power electronic element and cooling fin it
Between formed.
The production method of the great-power electronic component lines plate of high heat dispersion described in more than one, including wiring board,
Great-power electronic element, cooling fin and heat-conducting glue, specific production step are as follows:
S1. wiring board is made；
S2. great-power electronic element is welded and fixed in assist side；
S3. cooling fin is assembled in the circuit board using patch device, and covers great-power electronic element, then by wiring board
Progress Reflow Soldering in solder reflow device is put into fix；
S4. it is filled between great-power electronic element and cooling fin and fills out thermally conductive grease of silicone fluid or heat-conducting glue, wiring board is made.
Wherein, the wiring board is equipped with through-hole and/or welding resistance opens a window.
Compared with prior art, the present invention has simple for structure, the identical high-power electricity of two polarity in the circuit board
The heat generated in the electric current and order wire circuit that the fixed circuit in diverting route plate in the both ends of subcomponent generates, increases heat dissipation
The contact area of piece and air improves heat dissipation performance；Cooling fin is covered on the surface of great-power electronic element, changes traditional
Radiating mode reduces space in cooling fin busy line plate, the utilization rate in space in wiring board is improved, so that manufactured product is micro-
Type, and cooling fin can complete assembly using machine patch, improve production efficiency, reduce production cost, facilitate popularization and use,
Increase the practicability of product.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the invention.
Fig. 2 is the face the A-A cross-sectional view in Fig. 1.
Fig. 3 is the structural schematic diagram of cooling fin of the present invention.
1 wiring board；2 great-power electronic elements 2；3 cooling fins；4 heat-conducting layers.
Specific embodiment
In order to allow those skilled in the art to more fully understand technical solution of the present invention, with reference to the accompanying drawing to the present invention
It is further elaborated.
As depicted in figs. 1 and 2, the great-power electronic component lines plate of a kind of high heat dispersion, including wiring board 1, fixation
Great-power electronic element 2 in the circuit board, the cooling fin 3 being covered on great-power electronic element 2 and it is arranged high-power
It is filled in gap between electronic component 2 and cooling fin 3 and fills out one layer of heat-conducting layer 4.It is equipped with route in the wiring board 1 and is used for
Weld the pad of great-power electronic element and cooling fin.Wiring board is when being patterned design to route, by two of same polarity
Great-power electronic element designs side by side and position is close, so that the welding foot of the identical high-power components of two polarity is parallel, side
Just cooling fin is welded and fixed, and saves board space.The identical two great-power electronic elements 2 of the polarity are one group,
Its quantity is one group or more, is laid out according to the wire structures of wiring board.The cooling fin is laminated structure.Cooling fin 3
By increasing the capacity of heat transmission of cooling fin, improving heat conduction efficiency after electroplating processes and Heat Conduction Material that thermal conductivity is strong is made.
The Heat Conduction Material is the materials such as metallic copper, aluminium alloy.In order to improve welding effect, the surface of cooling fin is carried out at plating
Reason improves welding performance.Wherein the cooling fin 3 is made of radiating part and fixed part, and is structure as a whole, fixed part and heat dissipation
The both ends in portion connect, and outward bending.Radiating part is parallel with wiring board, and the lower end of fixed part is parallel with wiring board.It is described
Cooling fin 3 with a thickness of in 0.1~3mm any value realize thickness it is reasonable, perfect heat-dissipating.The cooling fin 3
The both ends of the identical two great-power electronic elements 2 of polarity are set, and cover great-power electronic element surface.
Great-power electronic element is damaged when being welded and fixed in assist side in order to avoid cooling fin, is welded on PCB surface
Cooling fin radiating part lower end surface away from the spacing of the upper surface of great-power electronic element 2 be 0.1~5mm in any value
, it is ensured that there are certain spacing between cooling fin and great-power electronic element, and spacing is suitble to, and avoids spacing excessive, drop
Low heat emission performance.In order to improve the heat transfer between cooling fin and great-power electronic element, in the lower end of the radiating part of cooling fin
One layer of heat-conducting layer 4 is equipped between face and the upper surface of great-power electronic element 2.The heat-conducting layer injects heat dissipation by way of filling and filling out
Between piece and great-power electronic element, wherein the material of heat-conducting layer uses heat conductive silica gel rouge or heat-conducting glue.When work, high-power electricity
The thermal energy that subcomponent generates is conducted by heat conductive silica gel rouge or heat-conducting glue to cooling fin, and quickly reduces big function by cooling fin
The thermal energy of rate electronic component improves heat dissipation performance.
Meanwhile in order to further improve the heat dissipation performance of wiring board, the heat of PCB surface is avoided to squeeze, in route
Plate surface through-hole and welding resistance windowing, increase the airflow of wiring board plate face by through-hole, the thermal energy band that wiring board is generated
It walks, increases heat dissipation performance；By increasing welding resistance windowing, the thermal energy for avoiding wiring board from generating is stopped by solder mask, increases line
The thermal diffusivity of road plate plate face enables thermal energy to take away the thermal energy of wiring board plate face by air circulation, reduces wiring board
Heat.
PCB surface described in above embodiments opens a window in addition to being equipped with face through-hole and welding resistance simultaneously, can also be provided only with
The effect to open a window with PCB surface through-hole and welding resistance, again elaboration not for example also may be implemented in through-hole or welding resistance windowing.
A kind of production method of the great-power electronic component lines plate of above-mentioned high heat dispersion, comprising the following steps: first
Make above-described wiring board；On then pad that great-power electronic element is welded to assist side, then machinery will be passed through and pasted
The mode of piece is assembled on the cooling fin pad fixed bit of assist side；By the cooling fin pad of the tentatively fixed assist side of cooling fin
On, then wiring board is put into solder reflow device and carries out reflow soldering, so that cooling fin securely welds in the circuit board, finally adopt
The gap filled out between cooling fin and great-power electronic element is filled with heat conductive silica gel or heat-conducting glue, so that great-power electronic element
The thermal energy generated when work can quickly be conducted to cooling fin in time, and the heat of great-power electronic element is reduced by cooling fin
Can, thermal conduction effect is improved, the heat dissipation performance of wiring board and great-power electronic element is improved.
Above-described embodiment is only wherein specific implementation of the invention, and the description thereof is more specific and detailed, but can not
Therefore limitations on the scope of the patent of the present invention are interpreted as.It should be pointed out that for those of ordinary skill in the art,
Without departing from the inventive concept of the premise, various modifications and improvements can be made, these obvious alternative forms are equal
It belongs to the scope of protection of the present invention.
Claims (2)
1. a kind of great-power electronic component lines plate of high heat dispersion, which is characterized in that including wiring board (1), fix online
Great-power electronic element (2) on the plate of road, the cooling fin (3) being covered on great-power electronic element (2) and it is arranged in big function
It is filled in gap between rate electronic component (2) and cooling fin (3) and fills out one layer of heat-conducting layer (4)；The cooling fin (3) is arranged in pole
The both ends of the identical two great-power electronic elements (2) of property, and cover great-power electronic element surface；
The identical two great-power electronic elements (2) of the polarity are one group, and quantity is one group or more；
The cooling fin (3) is by after electroplating processes and Heat Conduction Material that thermal conductivity is strong is made；
The cooling fin (3) with a thickness of 0.1~3mm；
The wiring board (1) is equipped with through-hole and/or welding resistance opens a window；
Spacing between the great-power electronic element (2) and cooling fin (3) is 0.1~5mm；
The heat-conducting layer (4) using thermally conductive grease of silicone fluid or heat-conducting glue filling fill out great-power electronic element (2) and cooling fin (3) it
Between formed.
2. a kind of production method of the great-power electronic component lines plate of high heat dispersion described in claim 1, feature exist
In, including wiring board (1), great-power electronic element (2), cooling fin (3) and heat-conducting glue (4), specific production step is as follows:
S1. wiring board (1) is made；
S2. great-power electronic element (2) is welded and fixed in assist side (1)；
S3. cooling fin (3) are assembled on assist side (1) using patch device, and covers great-power electronic element (2), then will
Wiring board is put into progress Reflow Soldering in solder reflow device and fixes；
S4. it is filled between great-power electronic element (2) and cooling fin (3) and fills out thermally conductive grease of silicone fluid or heat-conducting glue, wiring board is made；
The wiring board is equipped with through-hole and/or welding resistance opens a window.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510928152.2A CN105764239B (en) | 2015-12-15 | 2015-12-15 | A kind of great-power electronic component lines plate of high heat dispersion and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510928152.2A CN105764239B (en) | 2015-12-15 | 2015-12-15 | A kind of great-power electronic component lines plate of high heat dispersion and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105764239A CN105764239A (en) | 2016-07-13 |
| CN105764239B true CN105764239B (en) | 2019-04-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510928152.2A Active CN105764239B (en) | 2015-12-15 | 2015-12-15 | A kind of great-power electronic component lines plate of high heat dispersion and preparation method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN105764239B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109922598A (en) * | 2017-04-01 | 2019-06-21 | 奇酷互联网络科技（深圳）有限公司 | Printed circuit board machining process |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104716113A (en) * | 2013-12-13 | 2015-06-17 | 华为技术有限公司 | Radiator and cooling system |
| CN205179511U (en) * | 2015-12-15 | 2016-04-20 | 惠州市蓝微电子有限公司 | Power electronic component circuit board of high heat dissipating ability |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101575127B1 (en) * | 2014-08-20 | 2015-12-07 | 주식회사 엘리텍 | Metal core printed circuit board and method for manufacturing the same |
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2015
- 2015-12-15 CN CN201510928152.2A patent/CN105764239B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104716113A (en) * | 2013-12-13 | 2015-06-17 | 华为技术有限公司 | Radiator and cooling system |
| CN205179511U (en) * | 2015-12-15 | 2016-04-20 | 惠州市蓝微电子有限公司 | Power electronic component circuit board of high heat dissipating ability |
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| Publication number | Publication date |
|---|---|
| CN105764239A (en) | 2016-07-13 |
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