CN201294223Y - Low thermal resistance connected structure of radiator and power element - Google Patents
Low thermal resistance connected structure of radiator and power element Download PDFInfo
- Publication number
- CN201294223Y CN201294223Y CNU2008200904881U CN200820090488U CN201294223Y CN 201294223 Y CN201294223 Y CN 201294223Y CN U2008200904881 U CNU2008200904881 U CN U2008200904881U CN 200820090488 U CN200820090488 U CN 200820090488U CN 201294223 Y CN201294223 Y CN 201294223Y
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- Prior art keywords
- low thermal
- thermal resistance
- radiator
- metal
- power component
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Abstract
The utility model relates to a low thermal resistance connected structure between a radiator and a power device, and a solderable metal heat conducting layer is plated on the joint face of the radiator and the power device, and the material of the heat conducting layer can be gold, silver, tin and the like, wherein tin is generally selected. Low thermal-resistance metal solder is coated on the solderable metal heat conducting layer, and the solder can be tin paste and silver paste, or other high heat conducting materials which can be solidified and reduced to be metal through high temperature. The power device (including a metal substrate) is placed on a low thermal resistance metal solder coating layer, and the low thermal resistance metal solder is solidified and reduced to be low thermal resistance metal through a proper heating technique, the power device and the radiator are welded together, low thermal resistance joint of the power device and the heat radiator is achieved, and a high-efficiency heat conducing channel from a heat radiating substrate of the power device to the radiator through the low thermal resistance metal and the solderable metal heat conducting layer is formed. The low thermal resistance connected structure has simple structure and high heat conducting efficiency, and can effectively improve the reliability of the power device.
Description
(1) technical field
The utility model relates to the low thermal resistance connected structure of a kind of radiator and power component, specially refer in spreader surface and electroplate solderability metal heat-conducting layer, use the low thermal resistance brazing metal, power component and radiator are welded together, so that make the heat that is produced in the power component work conduct structure by low thermal resistance metal, solderability metal heat-conducting layer in time to radiator, the low thermal resistance metallization heat conduction between having realized from the power component to the radiator.
(2) background technology
Along with the continuous progress of electronic technology, electronic devices and components are miniaturization day by day, and integrated level is more and more higher, and the heat that is produced in the electronic devices and components work is also more and more concentrated, total amount is also more and more higher.If the radiating mode that neither one is good in time conducts the heat that is produced in the electronic devices and components work, the electronic devices and components temperature inside will raise gradually, overheated, its inner stress will increase, performance will reduce, life-span will shorten, even can be because overheated and burn.So the heat dissipation problem of electronic devices and components, especially power component is a problem that can not be ignored.
Traditional hot conduction connected structure between radiator and the power component is to adopt heat-conducting silicone grease, that is, the contact surface coating heat-conducting silicone grease between radiator and power component is so as to improving the heat conduction efficiency between power component and the radiator.The shortcoming of this structure is, the coefficient of heat conduction of heat-conducting silicone grease is also on the low side, has only 1.5-4.5W/mK, be accompanied by improving constantly of electronic devices and components integrated level, the heat that its unit volume produced is also more and more higher, more and more concentrated, conduct heat by heat-conducting silicone grease, can't satisfy the needs of electronic devices and components practical application.
Therefore, improving the heat conduction efficiency between power component and the radiator, is problem demanding prompt solution.
The utility model is exactly at this problem, a kind of radiator that proposes through constantly testing, improving and the new low thermal resistance connected structure between the power component.
(3) summary of the invention
The purpose of this utility model is, a kind of power component that the heat that is produced in the power component work can be conducted fast and the low thermal resistance connected structure between the radiator are provided.
The purpose of this utility model is achieved in that
It comprises that surface electrical is coated with the radiator of solderability metal heat-conducting layer, low thermal resistance brazing metal.Electroplate solderability metal heat-conducting layer on the composition surface of radiator and power component, this metal heat-conducting layer can be gold, silver, tin etc., selects tin usually; Volume as radiator is excessive, and the utility model can adopt inserts, and only powering at inserts plates the solderability metal heat-conducting layer of stating; Coating low thermal resistance brazing metal on solderability metal heat-conducting layer, this low thermal resistance brazing metal can be tin cream (conductive coefficient＞50W/mK), silver slurry (conductive coefficients＞10W/mK), or other can solidify the highly heat-conductive material that is reduced to metal through heating; Power component (comprising the bottom metal substrate) is positioned on the low thermal resistance brazing metal overlay, then, heating cure, power component and radiator are welded together, realized that heat dissipation metal substrate from power component is to the low thermal resistance metal, pass through the path of low thermal resistance of solderability metal heat-conducting layer to metal heat sink again.
Advantage of the present utility model is: method is simple, reasonable in design, with low cost, is suitable for large-scale production.
(4) description of drawings:
Fig. 1 the utility model front view;
Fig. 2 the utility model vertical view;
Fig. 3 the utility model adopts the front view of inserts;
Fig. 4 the utility model adopts the vertical view of inserts.
(5) embodiment:
For a more detailed description to the utility model for example below in conjunction with accompanying drawing:
In conjunction with Fig. 1 to Fig. 2, the utility model is a radiator 1, and surface electrical is coated with solderability metal heat-conducting layer 2, scribbles low thermal resistance brazing metal 3 on the solderability metal heat-conducting layer 2, and power component (comprising the bottom metal substrate) 4 is positioned over low thermal resistance brazing metal 3 surfaces.Through after certain technical process of heating, power component (comprising the bottom metal substrate) is welded together with radiator.
In conjunction with Fig. 3 to Fig. 4, if the volume of radiator is excessive, the utility model can adopt inserts 5, it is radiator 1, inserts 5 places in the radiator 1, and be coated with solderability metal heat-conducting layer 2 in surface electrical, and solderability metal heat-conducting layer 2 surface scribble low thermal resistance brazing metal 3, and power component (comprising the bottom metal substrate) 4 is positioned over low thermal resistance metal 3 solder surfaces.Through after certain technical process of heating, power component and radiator are welded together.
Claims (5)
1. the low thermal resistance connected structure of radiator and power component, by radiator (1), solderability metal heat-conducting layer (2), low thermal resistance brazing metal (3), power component (4), inserts (5) is formed, it is characterized in that: be electroplate with solderability metal heat-conducting layer (2) on the composition surface of radiator (1) and power component (4), go up coating low thermal resistance brazing metal (3) at solderability metal heat-conducting layer (2) and on low thermal resistance brazing metal (3) overlay, place power component (4), adopt suitable heating process that low thermal resistance brazing metal (3) is solidified and be reduced to metal, power component (4) and radiator (1) are welded together.
2. according to the low thermal resistance connected structure of described radiator of claim 1 and power component, it is characterized in that: if the volume of radiator (1) is excessive, can adopt embedded structure, to electroplate solderability metal heat-conducting layer as claimed in claim 1 (2) in advance on the composition surface of inserts (5) and power component (4), and then be embedded in (1) on the radiator.
3. according to the low thermal resistance connected structure of described radiator of claim 1 and power component, it is characterized in that: the material of described solderability metal heat-conducting layer (2) can be selected tin usually for gold, silver, tin etc.
4. according to the low thermal resistance connected structure of described radiator of claim 1 and power component, it is characterized in that: described low thermal resistance brazing metal (3) can be a tin cream, heat conduction silver starches or other can solidify the highly heat-conductive material that is reduced to metal through high temperature.
5. according to the low thermal resistance connected structure of described radiator of claim 1 and power component, it is characterized in that: described power component (4) can be one, also can be a plurality of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200904881U CN201294223Y (en) | 2008-07-24 | 2008-07-24 | Low thermal resistance connected structure of radiator and power element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200904881U CN201294223Y (en) | 2008-07-24 | 2008-07-24 | Low thermal resistance connected structure of radiator and power element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201294223Y true CN201294223Y (en) | 2009-08-19 |
Family
ID=41007705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200904881U Expired - Fee Related CN201294223Y (en) | 2008-07-24 | 2008-07-24 | Low thermal resistance connected structure of radiator and power element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201294223Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109936971A (en) * | 2019-04-18 | 2019-06-25 | 成都智明达电子股份有限公司 | It is a kind of for reducing the method for thermal contact resistance, structure and component heat dissipation equipment |
-
2008
- 2008-07-24 CN CNU2008200904881U patent/CN201294223Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109936971A (en) * | 2019-04-18 | 2019-06-25 | 成都智明达电子股份有限公司 | It is a kind of for reducing the method for thermal contact resistance, structure and component heat dissipation equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090819 Termination date: 20160724 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |