CN202310282U - Heat radiation structure of PCB (Printed Circuit Board) - Google Patents
Heat radiation structure of PCB (Printed Circuit Board) Download PDFInfo
- Publication number
- CN202310282U CN202310282U CN 201120419157 CN201120419157U CN202310282U CN 202310282 U CN202310282 U CN 202310282U CN 201120419157 CN201120419157 CN 201120419157 CN 201120419157 U CN201120419157 U CN 201120419157U CN 202310282 U CN202310282 U CN 202310282U
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- copper foil
- heat radiation
- pcb
- layer copper
- lower layer
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Abstract
The utility model provides a heat radiation structure of a PCB (Printed Circuit Board), comprising a dielectric substrate, an upper layer copper foil and a lower layer copper foil, wherein the upper layer copper foil is arranged on the dielectric substrate and the lower layer copper foil is arranged beneath the dielectric substrate; the heat radiation structure is further provided with metal through holes penetrating through the upper layer copper foil, the dielectric substrate and the lower layer copper foil; the upper layer copper foil is connected with the lower layer copper foil through the metal through holes; and heat radiation tin discs are arranged on the lower layer copper foil, and soldering resisting oil is coated on the upper layer copper foil. According to the heat radiation structure of the PCB, provided by the utility model, the upper layer copper foil and the lower layer copper foil are connected into a whole because the metal through holes penetrate through a dielectric layer of the PCB, so that temperatures of upper and lower surfaces of the PCB can be rapidly balanced and the heat can be rapidly radiated. Meanwhile, the heat radiation tin discs are arranged on a lower layer of the PCB printed circuit board. In a process of welding elements on the PCB by the heat radiation tin discs, a heat radiation tin stack is automatically formed on the circular tin discs, so that the area of the lower layer copper foil of the PCB is increased and the heat radiation capability of a bottom layer is improved.
Description
Technical field
The utility model relates to pcb board and makes field, particularly a kind of radiator structure with pcb board of great heat radiation effect.
Background technology
In electronic device and systems technology; The PCB role is more and more important; The trend of dwindling along with system bulk; The IC encapsulation technology is constantly to thinner littler connection and volume development, and the PCB that connects the role as system is under the trend of high power, microminiaturization, the centralization of assembly high density, and its radiating effect has become the stability of its product of decision and the key factor of reliability.At present; Traditional P CB printed circuit board is as shown in Figure 1; Generally by levels assembly welding oil 1,11; Levels Copper Foil 2,21 and medium substrate 3 constitute, and traditional P CB heat-sinking capability is very limited, and its heat conduction and heat radiation function mainly relies on the sheet material of PCB or relies on adheres to radiator fan and fin above that.But the microminiaturization with system equipment is a contradiction with low cost like this, because will satisfy the heat conduction and heat radiation requirement, just must strengthen PCB or add other radiating element.
Summary of the invention
This practical new purpose is through designing a kind of pcb board radiator structure method, increase the area of dissipation of PCB, improve PCB capacity of heat transmission and heat-sinking capability, especially can reducing around the high-power die fast and local temperature.
The utility model is that the technical scheme that its goal of the invention of realization is adopted is; A kind of radiator structure of pcb board; Comprise medium substrate; Be arranged on upper strata Copper Foil above the described medium substrate, be arranged on the lower floor's Copper Foil below the medium substrate, also be provided with the metal throuth hole of Copper Foil, medium substrate, lower floor's Copper Foil through described upper strata, described upper strata Copper Foil is connected through described metal throuth hole with the lower floor Copper Foil; Heat radiation tin dish is set on described lower floor Copper Foil, on the Copper Foil of said upper strata, coats the resistance solder paste.
Further, in the radiator structure of above-mentioned a kind of pcb board: described heat radiation tin dish is the cima shape heat radiation Xi Dui that described lower floor Copper Foil stretches out, and its bottom is tangent to each other with described metal throuth hole.
The utility model is because metal throuth hole penetrates the dielectric layer of PCB, and Copper Foil is connected to an integral body up and down, makes quick balance of PCB upper and lower surfaces temperature and quick heat radiating.Simultaneously, the lower floor at the PCB printed circuit board is provided with heat radiation tin dish.Heat radiation tin dish pastes in the weldering element process at PCB, can form heat radiation Xi Dui automatically on the circular tin dish, has increased the area of lower floor's Copper Foil of pcb board, has improved the heat-sinking capability of bottom.
Below in conjunction with accompanying drawing and embodiment the utility model is at length explained.
Description of drawings
Fig. 1: be present PCB profile.
Fig. 2: the utility model profile.
Fig. 3: the utility model front view.
Fig. 4: the utility model instance graph.
Among the figure: 1, upper layer group solder paste, 11, lower floor assembly welding oil 1,2, upper strata Copper Foil, 21, lower floor's Copper Foil, 3, medium substrate, 4, metal throuth hole, 5, heat radiation tin dish, 6, euthermic chip.
Embodiment
Like Fig. 4, euthermic chip 6 directly is close on the upper strata Copper Foil 2, is connected with corresponding electronic circuit, and upper strata resistance solder paste 1 is enclosed in around the euthermic chip 6.Circular metal connection metal throuth hole 4 is positioned at its below, and evenly distributed.Be distributed in to be pasted on the circle heat radiation tin dish 5 on lower floor's Copper Foil 21 and be welded into cima shape heat radiation Xi Dui.Cima shape heat radiation tin heap bottom is tangent to each other with circular metal connecting hole 4, has effectively enlarged the surface area of lower metal Copper Foil 21, forms a small-sized radiator.
The radiating principle of present embodiment structure is: the heat that euthermic chip 6 work produce a wherein part is direct through the outside space heat elimination of thermal-radiating mode through cylindrical metal connecting hole 4; Wherein another part is through outside upper strata Copper Foil 2 heat loss through radiation; Also heat is directly passed on the cima shape heat radiation Xi Dui through medium substrate 3, lower floor's Copper Foil 21 with the mode of conduction simultaneously through upper strata Copper Foil 2; Be radiated the space, reduce the temperature of chip in the short time.
Claims (2)
1. the radiator structure of a pcb board; Comprise medium substrate; Be arranged on upper strata Copper Foil above the described medium substrate, be arranged on the lower floor's Copper Foil below the medium substrate; It is characterized in that: the metal throuth hole (4) that is provided with through described upper strata Copper Foil (2), medium substrate (3), lower floor's Copper Foil (21); Described upper strata Copper Foil (2) is connected through described metal throuth hole (4) with lower floor's Copper Foil (21), and heat radiation tin dish (5) is set on described lower floor Copper Foil (21), on said upper strata Copper Foil (2), coats resistance solder paste (1).
2. the radiator structure of a kind of pcb board according to claim 1 is characterized in that: the cima shape heat radiation Xi Dui that described heat radiation tin dish (5) stretches out for described lower floor Copper Foil (21), its bottom is tangent to each other with described metal throuth hole (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120419157 CN202310282U (en) | 2011-10-28 | 2011-10-28 | Heat radiation structure of PCB (Printed Circuit Board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120419157 CN202310282U (en) | 2011-10-28 | 2011-10-28 | Heat radiation structure of PCB (Printed Circuit Board) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202310282U true CN202310282U (en) | 2012-07-04 |
Family
ID=46379088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120419157 Expired - Lifetime CN202310282U (en) | 2011-10-28 | 2011-10-28 | Heat radiation structure of PCB (Printed Circuit Board) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202310282U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103824831A (en) * | 2014-02-20 | 2014-05-28 | 清华大学 | Package substrate and manufacturing method thereof |
| CN104302122A (en) * | 2013-07-15 | 2015-01-21 | 深圳市共进电子股份有限公司 | Method for preventing shedding of welding rings in printed circuit board and printed circuit board |
| CN105472861A (en) * | 2014-09-05 | 2016-04-06 | 深南电路有限公司 | Printed circuit board radiating via hole manufacturing method and printed circuit board |
| CN106609739A (en) * | 2015-10-21 | 2017-05-03 | 浙江三花汽车零部件有限公司 | Electronic pump |
| CN107027264A (en) * | 2015-06-24 | 2017-08-08 | 碁鼎科技秦皇岛有限公司 | Fin and preparation method thereof and electronic equipment |
-
2011
- 2011-10-28 CN CN 201120419157 patent/CN202310282U/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104302122A (en) * | 2013-07-15 | 2015-01-21 | 深圳市共进电子股份有限公司 | Method for preventing shedding of welding rings in printed circuit board and printed circuit board |
| CN104302122B (en) * | 2013-07-15 | 2018-09-07 | 深圳市共进电子股份有限公司 | Prevent the method and printed circuit board that weld-ring falls off in printed circuit board |
| CN103824831A (en) * | 2014-02-20 | 2014-05-28 | 清华大学 | Package substrate and manufacturing method thereof |
| CN105472861A (en) * | 2014-09-05 | 2016-04-06 | 深南电路有限公司 | Printed circuit board radiating via hole manufacturing method and printed circuit board |
| CN105472861B (en) * | 2014-09-05 | 2018-05-29 | 深南电路有限公司 | A kind of method and printed circuit board of the manufacture of printed circuit board dissipating vias |
| CN107027264A (en) * | 2015-06-24 | 2017-08-08 | 碁鼎科技秦皇岛有限公司 | Fin and preparation method thereof and electronic equipment |
| CN107027264B (en) * | 2015-06-24 | 2019-04-16 | 碁鼎科技秦皇岛有限公司 | Cooling fin and preparation method thereof and electronic equipment |
| CN106609739A (en) * | 2015-10-21 | 2017-05-03 | 浙江三花汽车零部件有限公司 | Electronic pump |
| CN106609739B (en) * | 2015-10-21 | 2020-06-30 | 浙江三花汽车零部件有限公司 | Electronic pump |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120704 |
|
| CX01 | Expiry of patent term |