CN106879166A - A kind of Printed circuit board and manufacturing methods with hot pipe cooling structure - Google Patents
A kind of Printed circuit board and manufacturing methods with hot pipe cooling structure Download PDFInfo
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- CN106879166A CN106879166A CN201710128108.2A CN201710128108A CN106879166A CN 106879166 A CN106879166 A CN 106879166A CN 201710128108 A CN201710128108 A CN 201710128108A CN 106879166 A CN106879166 A CN 106879166A
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- heat pipe
- printed circuit
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 41
- 238000001816 cooling Methods 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 claims abstract description 48
- 238000009833 condensation Methods 0.000 claims abstract description 25
- 230000005494 condensation Effects 0.000 claims abstract description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 124
- 229910052802 copper Inorganic materials 0.000 claims description 115
- 239000010949 copper Substances 0.000 claims description 115
- 239000000758 substrate Substances 0.000 claims description 27
- 238000003754 machining Methods 0.000 claims description 18
- 239000006260 foam Substances 0.000 claims description 16
- 238000003466 welding Methods 0.000 claims description 16
- 239000002131 composite material Substances 0.000 claims description 15
- 230000008569 process Effects 0.000 claims description 15
- 238000005245 sintering Methods 0.000 claims description 15
- 238000001035 drying Methods 0.000 claims description 12
- 238000005516 engineering process Methods 0.000 claims description 12
- 229910000679 solder Inorganic materials 0.000 claims description 12
- 238000010276 construction Methods 0.000 claims description 10
- 238000012545 processing Methods 0.000 claims description 10
- 238000005452 bending Methods 0.000 claims description 9
- 238000002360 preparation method Methods 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 229910002804 graphite Inorganic materials 0.000 claims description 8
- 239000010439 graphite Substances 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 7
- 238000000137 annealing Methods 0.000 claims description 6
- 230000010412 perfusion Effects 0.000 claims description 6
- 230000007704 transition Effects 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 4
- 238000010008 shearing Methods 0.000 claims description 4
- 238000001514 detection method Methods 0.000 claims description 3
- 238000012805 post-processing Methods 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- 230000008901 benefit Effects 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 238000011161 development Methods 0.000 abstract description 3
- 238000004891 communication Methods 0.000 abstract description 2
- 230000008092 positive effect Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 8
- 238000012546 transfer Methods 0.000 description 5
- 230000005855 radiation Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 241001124569 Lycaenidae Species 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 235000014987 copper Nutrition 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005213 imbibition Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of printed circuit board (PCB) with hot pipe cooling structure, tellite including multilayer, the heat pipe module being embedded on the tellite, the heat pipe module includes heat sink, hot plate and the interior heat pipe for setting liquid-sucking core, and the condensation segment and evaporator section of the heat pipe are connected with the heat sink, hot plate respectively.The invention also discloses a kind of manufacture method of the printed circuit board (PCB) with hot pipe cooling structure.The present invention has simple structure, quality light and handy, radiating effect is obvious, stability is high, the advantage conducted heat without external drive, there is superior radiating effect especially for heat flow density CPU heat dissipation problems higher, there is positive effect and well value in the development of 5G communications, while, manufacturing process is simple, can be applied to and produce manufacture in enormous quantities.
Description
Technical field
The present invention relates to microelectronic circuit technical field of heat dissipation, more particularly to a kind of printing with hot pipe cooling structure
Circuit board and its manufacture method.
Background technology
In order to ensure the functional reliability of component and life-span on PCB, it is necessary to effective radiating is carried out to component, with true
Component operating temperature is protected not over its permissive temperature.The radiating of current PCB is mainly realized by two ways once, a kind of
It is such as the Chinese patent of Application No. CN201521115555.7《A kind of heat radiation type PCB heat board》And Application No.
The Chinese invention of CN201611040364.8《A kind of printed circuit board (PCB) with excellent heat dispersion performance》Optimize unit on PCB like that
The layout of device, by heater element, especially temperature sensitive device region distribution is put with other devices, or heater element separates
Stagger arrangement, reserved air heat dissipation channel realizes the purpose of cooling；Another kind is using thermal conductivity factor material conduct higher
PCB substrate is improving PCB self-radiating abilities.The coefficient of heat transfer of both radiating modes is low, is directed to component heating work(
The rate PCB not high or little PCB of component thermal current density.However, with the high speed development of information technology, the packaging body of chip
Product is less and less, and disposal ability is but increasingly stronger, and the thing followed is that the heat flow density of chip is increasing, has been even up to several
Ten arrive W/cm up to a hundred2, now, the PCB radiating dependence traditional heat-dissipating modes for being packaged with high heat flux component are difficult to solve, meeting
Cause PCB local temperature rises too high, directly affect the normal work of component and life-span on plate.
Heat pipe is used as a kind of phase-change heat transfer element, and thermal response speed is fast；Thermal conductivity factor is high, generally thousands of to tens of thousands of W/
(m DEG C), considerably beyond the thermal conductivity factor of existing metal material；Self-driven heat transfer, without additional energy；Therefore, heat pipe heat radiation
Technology is applied in PCB radiatings, can effectively solve the radiating problem of high heat flux component on PCB.
The Chinese patent of Application No. 201610351651.4 is invented《A kind of side that heat pipe is manufactured in printed circuit board (PCB)
Method》, the patent is the structure that whole PCB is manufactured into similar heat pipe, but heat pipe manufacture needs sintering, the note by liquid-sucking core
The techniques such as liquid, vacuum, fixed length, sealing, therefore the actual enforcement difficulty of the patent is huge, and the geomery of PCB is limited to, lead
Cause the adaptation of product very weak, it is difficult to realize volume production.
The content of the invention
An object of the present invention is the shortcoming and defect for overcoming prior art, proposes that a kind of radiating is efficient, is reacted fast
The printed circuit board (PCB) with hot pipe cooling structure of speed.
The second object of the present invention is to overcome existing technical disadvantages and deficiency, proposes that a kind of manufacturing process is simple, system
Cause relatively low a, manufacture method for the production efficiency printed circuit board (PCB) with hot pipe cooling structure higher.
To reach one of above-mentioned purpose, the present invention is achieved through the following technical solutions：
A kind of printed circuit board (PCB) with hot pipe cooling structure, including multilayer tellite, be embedded in it is described printing electricity
Heat pipe module on base board, the heat pipe module includes heat sink, hot plate and the interior heat pipe for setting liquid-sucking core, the condensation of the heat pipe
Section and evaporator section are connected with the heat sink, hot plate respectively.
Further, described tellite middle part is provided with rectangle hollow slots, and the heat pipe module is inlayed completely
In in the hollow slots.
Further, only upper surface is exposed during the heat sink, hot plate is closely embedded in hollow slots, the adiabatic section of the heat pipe
It is exposed in the space of hollow slots.
Further, the heat sink and hot plate of the heat pipe module is embedded in tellite, the heat pipe it is exhausted
Hot arc is exposed in outside air and to be distributed in outside printed circuit board (PCB) side.
Further, the heat pipe is more than one, and each heat pipe integrally be arranged in parallel in concave shape, every heat pipe
Evaporator section and condensation segment are with 90 ° of round-corner transition bending.
Further, described liquid-sucking core is the double-deck copper mesh composite construction or foam copper of double-deck copper mesh sintering
The foam copper mesh composite construction sintered with copper mesh.
Further, it is described it is heat sink on be provided with heat sink through hole for assembling heat pipe condenser section, set in the hot plate
There is the hot plate through hole for assembling heat pipe evaporator section, combined by firm welding after assembling.
To reach the two of above-mentioned purpose, the present invention is achieved through the following technical solutions：
A kind of manufacture method of the printed circuit board (PCB) with hot pipe cooling structure as described, including step：
The manufacture of step 1, heat pipe, including：
(1) pretreatment of copper pipe and center bar：Shear and clean the oil of copper pipe and center bar, removal center bar and copper pipe surface
Dirt, then by copper pipe and center bar drying and processing；Center bar after drying is heat-treated, it is to avoid copper pipe is with center bar rear
Phenomenon is cohered in continuous sintering process, the service life of center bar is improved；
(2) preparation of liquid-sucking core：Liquid-sucking core is obtained by sintering processes, is then sheared the liquid-sucking core standby into strips；
(3) liquid-sucking core of strip is first penetrated into copper pipe, then center bar is inserted into copper pipe, liquid-sucking core is close to copper pipe inwall, then
It is sintered；
(4) center bar is extracted, the afterbody to copper pipe carries out solder up, and then copper pipe is made annealing treatment；
(5) sequentially copper pipe carried out working medium perfusion, vacuumize, two except fixed length, the treatment of head solder up；
(6) heat pipe subsequent treatment, including detection, surface treatment；
The manufacture of step 2, heat pipe module, including：
(1) hot plate and heat sink, hot plate and each processing hot plate through hole and heat sink through hole of heat sink difference are respectively obtained by machining；
(2) the hot plate through hole of the evaporator section of heat pipe and hot plate is carried out into shaft hole matching, then with welding procedure by heat pipe and hot plate knot
Close；The condensation segment of heat pipe and heat sink heat sink through hole are carried out into shaft hole matching, then with welding procedure by heat pipe and heat sink combination；
The manufacture of step 3, printed circuit board (PCB), including：
(1) internal substrate and outermost layer substrate of tellite are obtained by printed circuit technology, gong is obtained by machining
Band；
(2) internal substrate, outermost layer substrate, gong band and heat pipe module are carried out into process for pressing treatment under high-temperature and high-pressure conditions,
Combine it integral；
(3) gong band is removed by machining, exposes heat pipe module.
A kind of manufacture method of the printed circuit board (PCB) with hot pipe cooling structure as described, including step：
The manufacture of step 1, heat pipe, including：
(1) pretreatment of copper pipe and center bar：Shear and clean the oil of copper pipe and center bar, removal center bar and copper pipe surface
Dirt, then by copper pipe and center bar drying and processing；Center bar after drying is heat-treated, it is to avoid copper pipe is with center bar rear
Phenomenon is cohered in continuous sintering process, the service life of center bar is improved；
(2) preparation of liquid-sucking core：Liquid-sucking core is obtained by sintering processes, is then sheared the liquid-sucking core standby into strips；
(3) liquid-sucking core of strip is first penetrated into copper pipe, then center bar is inserted into copper pipe, liquid-sucking core is close to copper pipe inwall, then
It is sintered；
(4) center bar is extracted, the afterbody to copper pipe carries out solder up, and then copper pipe is made annealing treatment；
(5) sequentially copper pipe carried out working medium perfusion, vacuumize, two except fixed length, the treatment of head solder up；
(6) heat pipe post processing, including the evaporator section and condensation segment of heat pipe are carried out into 90 ° of bending, then detected, be surface-treated；
The manufacture of step 2, heat pipe module, including：
(1) hot plate and heat sink is respectively obtained by machining, hot plate and each some hot plate through holes of processing of heat sink difference and heat sink logical
Hole；
(2) the hot plate through hole of the evaporator section of heat pipe and hot plate is carried out into shaft hole matching, then with welding procedure by heat pipe and hot plate knot
Close；The condensation segment of heat pipe and heat sink heat sink through hole are carried out into shaft hole matching, then with welding procedure by heat pipe and heat sink combination；
The manufacture of step 3, printed circuit board (PCB), including：
(1) internal substrate and outermost layer substrate of tellite are obtained by printed circuit technology, gong is obtained by machining
Band；
(2) internal substrate, outermost layer substrate, gong band and heat pipe module are carried out into process for pressing treatment under high-temperature and high-pressure conditions,
Combine it integral；
(3) gong band is removed by machining, exposes heat pipe module.
Further, the step of preparation of the liquid-sucking core is specially：
Cleaning copper mesh, removes the greasy dirt of copper wire net surface；Two-layer copper mesh is pressed with two pieces of graphite blocks, and is sintered place
Reason, makes two-layer copper mesh sinter the liquid-sucking core of composite double layer copper wire web frame into；Finally shearing by the liquid-sucking core into strips；
Or
Cleaning copper mesh, removes the greasy dirt of copper wire net surface；One layer of copper mesh and one layer of foam copper are pressed with two pieces of graphite blocks,
And be sintered, one layer of copper mesh and one layer of foam copper is sintered the liquid-sucking core of foam copper mesh composite construction into；Finally
By liquid-sucking core shearing into strips.
Compared to existing technology, beneficial effects of the present invention are as follows：
(1) a kind of printed circuit board (PCB) with hot pipe cooling structure of the invention, due to the thermal conductivity ratio metal and stone of heat pipe
Ink material is high, and when CPU operating temperatures are raised, heat pipe energy quick response and heat are by other portions of diffusion profile to heat pipe module
Position, the temperature of CPU is reduced rapidly.
(2) a kind of printed circuit board (PCB) with hot pipe cooling structure of the invention, there is two kinds of situations, and a kind of situation is heat pipe
Module is completely embedded into printed circuit board (PCB), and the situation is used for that size to be smaller, the less printed circuit board (PCB) of heat flow density.Another feelings
During condition is the hot plate and heat sink embedded printed circuit board (PCB) of heat pipe module, the adiabatic section of heat pipe is exposed outside printed circuit board (PCB), should
Situation is used for the printed circuit board (PCB) that size is larger, heat flow density is larger, and the space that such case can improve printed circuit board (PCB) makes
With rate.
(3) a kind of printed circuit board (PCB) with hot pipe cooling structure of the invention, heat radiation module can be according to printed circuit
Different radiating requirements and the heat-dissipating space limitation of plate, adjust shape, size, quantity and the installation site of heat pipe, significantly carry
The rich and flexibility of circuit design high.
(4) manufacture method of a kind of printed circuit board (PCB) with hot pipe cooling structure of the invention, with simple structure, matter
Amount is light and handy, and substantially, stability is high for radiating effect, and the advantage conducted heat without external drive is higher especially for heat flow density
CPU heat dissipation problems have superior radiating effect, have positive effect and well value in the development of 5G communications.
(5) a kind of manufacture method of printed circuit board (PCB) with hot pipe cooling structure of the invention, manufacturing process is simple, energy
Enough being applied to produces manufacture in enormous quantities.
Brief description of the drawings
Fig. 1 is a kind of printed circuit board arrangement schematic diagram with hot pipe cooling structure of the embodiment of the present invention one.
Fig. 2 is the heat pipe modular structure schematic diagram of the embodiment of the present invention one.
Fig. 3 is the heat pipe axial direction cross section structure diagram of the embodiment of the present invention one.
Fig. 4 is the heat pipe radial direction cross section structure diagram of the embodiment of the present invention one.
Fig. 5 is a kind of printed circuit board arrangement schematic diagram with hot pipe cooling structure of the embodiment of the present invention two.
Fig. 6 is the heat pipe modular structure schematic diagram of the embodiment of the present invention two.
Fig. 7 is the heat pipe axial direction cross section structure diagram of the embodiment of the present invention two.
Fig. 8 is the heat pipe radial direction cross section structure diagram of the embodiment of the present invention three.
Fig. 9 is the structural representation of slotting center bar technique in the embodiment of the present invention four, five.
Figure 10 is the press fit of circuit boards artwork (small-sized circuit board) of the embodiment of the present invention four.
Figure 11 is the press fit of circuit boards artwork (large scale circuit board) of the embodiment of the present invention five.
It is shown in figure：
1-heat pipe；11-evaporator section；12-condensation segment；2-heat sink；3-hot plate；4-heat sink through hole；5-hot plate through hole；6—
Adiabatic section；7-hollow slots；8-shell；9-heat pipe cavity；10-liquid-sucking core；101-double-deck copper mesh composite construction；102—
Foam copper mesh composite construction；103- foam coppers；13-center bar；14-copper mesh；15-tellite；16-internal layer
Substrate；17-outermost layer substrate；18-gong band；19-heat pipe module.
Specific embodiment
The purpose of the present invention is described in further detail below by specific embodiment, embodiment can not herein one by one
Repeat, but therefore embodiments of the present invention are not defined in following examples.
Embodiment 1
As shown in Fig. 1 to Fig. 4, a kind of printed circuit board (PCB) with hot pipe cooling structure, including multilayer tellite 15,
The heat pipe module 19 on the tellite 15 is embedded in, the heat pipe module 19 is included in heat sink 2, hot plate 3 and one
If the heat pipe 1 of liquid-sucking core 10, a heat sink through hole 4 for assembling the condensation segment 12 of heat pipe 1 is provided with described heat sink 2, it is described
A hot plate through hole 5 for assembling the evaporator section 11 of heat pipe 1 is provided with hot plate 3, is combined by firm welding after assembling, it is described
The condensation segment 12 and evaporator section 11 of heat pipe 1 are connected with described heat sink 2, hot plate 3 respectively.The described middle part of tellite 15
Rectangle hollow slots 7 are provided with, the heat pipe module 19 is embedded in the hollow slots 7 completely.Described heat sink 2, hot plate 3 is closely inlayed
Only upper surface is exposed in being embedded in hollow slots 7, and the adiabatic section 6 of the heat pipe 1 is exposed in the space of hollow slots 7.The heat pipe mould
Heat sink 2 and hot plate 3 of group 19 are embedded in tellite 15, and the adiabatic section 6 of the heat pipe 1 is exposed in outside air
And be distributed in outside printed circuit board (PCB) side.
The heat pipe module 19 of this example is inlayed in the printed circuit boards completely, in follow-up assembling medium heat disk 3 and the CPU of circuit
Contact；Hot plate 3 and heat sink 2 only exposes a face respectively, and other faces are embedded within printed circuit board (PCB), and the adiabatic section 6 of heat pipe hangs
Be exposed between hot plate 3 and heat sink 2, it is exposed in atmosphere, formed clearance space；The structure of the present embodiment is relatively easy and size compared with
Small, circuit can pass through the hollow slots 7 of module, can be applied to that circuit is simple, the less printed circuit board (PCB) of heat flow density, while by
Much higher in the thermal conductivity ratio metal and graphite of heat pipe 1, the operating temperature of CPU can be maintained at relatively low level, therefore the work of CPU
It is improved as the life-span.When CPU work produces heat, heat is delivered to hot plate 3, then the evaporation for being delivered to heat pipe 1 by CPU
Section 11, then heat be delivered to condensation end 12, last heat transfer to heat sink 2 from the evaporator section 11 of heat pipe 1；
As shown in Figure 3 and Figure 4, in the present embodiment, heat pipe 1 includes shell 8 and the cavity 9 being opened in shell, the cavity 9
The liquid-sucking core 10 for being close to the inwall of shell 8 is inside provided with, liquid-sucking core 10 is filled with covert working medium；In this example, liquid-sucking core 10 is multiple
Double-deck copper wire web frame 101 is closed, the liquid-sucking core 10 has porosity high, the simple advantage of manufacturing process.
In the present embodiment, the size of the heat pipe 1, number can also be selected according to the limitation of heat-dissipating space and radiating requirements
With.Will not be repeated here.
Embodiment 2
A kind of tellite 15 of as shown in Figures 5 to 7, printed circuit board (PCB) with hot pipe cooling structure, including multilayer,
It is embedded in the heat pipe module 19 on the tellite 15, the heat pipe module 19 includes heat sink 2, hot plate 3 and interior sets suction
The heat pipe 1 of wick-containing 10, the heat pipe 1 is seven, and each heat pipe 1 is overall to be arranged in parallel in concave shape, the every evaporation of heat pipe 1
Section 11 and condensation segment 12 are with 90 ° of round-corner transition bending；Seven are provided with described heat sink 2 for assembling the condensation segment 12 of heat pipe 1
Heat sink through hole 4, is provided with seven hot plate through holes 5 for assembling the evaporator section 11 of heat pipe 1, by weldering after assembling in the hot plate 3
Strong bonded is connect, the condensation segment 12 and evaporator section 11 of the heat pipe 1 are connected with described heat sink 2, hot plate 3 respectively.The heat pipe
Heat sink 2 and hot plate 3 of module 19 are embedded in tellite 15, and the adiabatic section 6 of the heat pipe 1 is exposed in outside air
In and be distributed in outside printed circuit board (PCB) side.
The part heat pipe module of the present embodiment is inlayed in the printed circuit boards, and the heat pipe module includes 7 heat pipes, 1,1 piece of heat
Heavy 2,1 piece of hot plate 3.The evaporator section 11 and condensation segment 12 of heat pipe 1 90 ° of bending in the form of round-corner transition, heat pipe are in integrally " recessed "
Word shape；Contacted with the CPU of circuit in follow-up assembling medium heat disk 3；Through hole 4 axis hole of the condensation segment 12 of heat pipe 1 with heat sink 2 is matched somebody with somebody
Close, and heat pipe 1 is combined with heat sink 2 by welding procedure；The adiabatic section 6 of heat pipe is exposed in outside air, is distributed in printing
Circuit board side outside, heat sink 2 and hot plate 3 inlay in the printed circuit boards, and only expose a face respectively.The knot of the present embodiment
Structure is relative complex and size is larger, it is adaptable to complex circuit, the larger printed circuit board (PCB) of heat flow density, simultaneously because heat pipe is exhausted
Hot arc 6 is distributed in the printed circuit board (PCB) external world, can save larger space, the utilization space of increasing circuit plate.Produced when CPU works
During heat, heat is delivered to hot plate 3 by CPU, being delivered to the evaporator section 11 of heat pipe 1, then evaporator section 11 of the heat from heat pipe 1
It is delivered to condensation end 12, last heat transfer to heat sink 2；
As shown in fig. 7, in the present embodiment, in the present embodiment, heat pipe 1 includes shell 8 and the cavity 9 being opened in shell,
The liquid-sucking core 10 for being close to the inwall of shell 8 is provided with the cavity 9, liquid-sucking core 10 is filled with covert working medium；In this example, imbibition
Core 10 is composite double layer copper wire web frame 101, and the liquid-sucking core 10 has porosity high, the simple advantage of manufacturing process.
In the present embodiment, the size of heat pipe 1, number and bending shape can be according to the limitation of heat-dissipating space and radiating need
Selection is asked, such as heat pipe shape is not limited to 90 ° of round-corner transition bendings, and the quantity of heat pipe 1 is also not limited to seven, herein no longer
Repeat.
Embodiment 3
As shown in figure 8, the present embodiment is with the difference of embodiment 1, in the present embodiment, liquid-sucking core 10 is foam copper mesh
Composite construction 102, the liquid-sucking core 10 has thermal resistance small, permeability advantage high.The other structures and operation principle of the present embodiment
It is same as Example 1, will not be repeated here.
Embodiment 4
A kind of manufacture method of the printed circuit board (PCB) with hot pipe cooling structure as described in Example 1, including step：
The manufacture of step 1, heat pipe, including：
(1) pretreatment of copper pipe and center bar 13：Copper pipe and center bar 13 are sheared and cleaned, center bar 13 and copper pipe table is removed
The greasy dirt in face, then by copper pipe and the drying and processing of center bar 13；Center bar 13 after drying is heat-treated, it is to avoid copper pipe with
Center bar 13 coheres phenomenon in follow-up sintering technique, improves the service life of center bar 13；
(2) preparation of liquid-sucking core 10：Cleaning copper mesh 14, the greasy dirt on removal copper mesh 14 surface；With two pieces of graphite blocks by two-layer
Copper mesh 14 is pressed, and is sintered, and two-layer copper mesh 14 is sintered the liquid-sucking core of composite double layer copper wire web frame 12 into
10；Finally the liquid-sucking core 10 is sheared into strips；
(3) liquid-sucking core 10 of strip is first penetrated into copper pipe, then center bar 13 is inserted into copper pipe (see Fig. 9), be close to liquid-sucking core 10
Copper pipe inwall, is then sintered；
(4) center bar 13 is extracted, the afterbody to copper pipe carries out solder up, and then copper pipe is made annealing treatment；
(5) sequentially copper pipe carried out working medium perfusion, vacuumize, two except fixed length, the treatment of head solder up；
(6) heat pipe subsequent treatment, including detection, surface treatment；
The manufacture of step 2, heat pipe module, including：
(1) hot plate 3 and heat sink 2 are respectively obtained by machining, hot plate 3 and heat sink each processing hot plate through hole 5 of 2 difference and heat sink logical
Hole 4；
(2) the hot plate through hole 5 of the evaporator section 11 of heat pipe 1 and hot plate 3 is carried out into shaft hole matching, then with welding procedure by the He of heat pipe 1
Hot plate 3 is combined；The condensation segment 12 of heat pipe 1 and heat sink 2 heat sink through hole 4 are carried out into shaft hole matching, then with welding procedure by heat pipe
With heat sink combination；
The manufacture of step 3, printed circuit board (PCB), including：
(1) internal substrate 16 and outermost layer substrate 17 of tellite 15 are obtained by printed circuit technology, by machining
Obtain gong band 18；
(2) internal substrate 16, outermost layer substrate 17, gong band 18 and heat pipe module 19 are carried out into pressing work under high-temperature and high-pressure conditions
Skill treatment, combines it integral, and gong band plays a part of to protect heat pipe module 19 in 18 aftertreatment technologys after process for pressing
(see Figure 10)；
(3) gong band 18 is removed by machining, exposes heat pipe module.
Embodiment 5
A kind of manufacture method of the printed circuit board (PCB) with hot pipe cooling structure as described in Example 2, including step：
The manufacture of step 1, heat pipe, including：
(1) pretreatment of copper pipe and center bar 13：Copper pipe and center bar 13 are sheared and cleaned, center bar 13 and copper pipe surface is removed
Greasy dirt, then by copper pipe and the drying and processing of center bar 13；Center bar 13 after drying is heat-treated, it is to avoid copper pipe is with
Axle 13 coheres phenomenon in follow-up sintering technique, improves the service life of center bar 13；
(2) preparation of liquid-sucking core 10：Cleaning copper mesh 14, the greasy dirt on removal copper mesh 14 surface；With two pieces of graphite blocks by two-layer
Copper mesh 14 is pressed, and is sintered, and two-layer copper mesh 14 is sintered the liquid-sucking core of composite double layer copper wire web frame 101 into
10；Finally the liquid-sucking core 10 is sheared into strips；
(3) liquid-sucking core 10 of strip is first penetrated into copper pipe, then center bar 13 is inserted into copper pipe (see Fig. 9), be close to liquid-sucking core 10
Copper pipe inwall, is then sintered；
(4) center bar 13 is extracted, the afterbody to copper pipe carries out solder up, and then copper pipe is made annealing treatment；
(5) sequentially copper pipe carried out working medium perfusion, vacuumize, two except fixed length, the treatment of head solder up；
(6) heat pipe post processing, including the evaporator section and condensation segment of heat pipe are carried out into 90 ° of bending, then detected, be surface-treated；
The manufacture of step 2, heat pipe module, including：
(1) hot plate 3 and heat sink 2, hot plate 3 and each some hot plate through holes 5 of processing of heat sink 2 difference and heat are respectively obtained by machining
Heavy through hole 4；
(2) the hot plate through hole 5 of the evaporator section 11 of heat pipe 1 and hot plate 3 is carried out into shaft hole matching, then with welding procedure by the He of heat pipe 1
Hot plate 3 is combined；The condensation segment 12 of heat pipe 1 and heat sink 2 heat sink through hole 4 are carried out into shaft hole matching, then with welding procedure by heat pipe 1
Combined with heat sink 2；
The manufacture of step 3, printed circuit board (PCB), including：
(1) internal substrate 16 and outermost layer substrate 17 of tellite 15 are obtained by printed circuit technology, by machining
Obtain gong band 18；
(2) internal substrate 16, outermost layer substrate 17, gong band 18 and heat pipe module 19 are carried out into pressing work under high-temperature and high-pressure conditions
Skill treatment, combines it integral；Gong is with playing protection heat pipe module 19 in 18 aftertreatment technologys after process for pressing
(see Figure 11).
(3) gong band 18 is removed by machining, exposes heat pipe module.
Embodiment 6
The present embodiment is with the difference of embodiment 4 or 5：The step of preparation of the liquid-sucking core 10, is specially：Cleaning copper mesh
14, the greasy dirt on removal copper mesh 14 surface；One layer of copper mesh 14 and one layer of foam copper 103 are pressed with two pieces of graphite blocks, is gone forward side by side
Row sintering processes, make one layer of copper mesh 14 and one layer of foam copper 103 sinter the liquid-sucking core of foam copper mesh composite construction 102 into
10；Finally the liquid-sucking core 10 is sheared into strips；
The above embodiment of the present invention is only intended to clearly illustrate example of the present invention, and is not to reality of the invention
Apply the restriction of mode.For those of ordinary skill in the field, other can also be made on the basis of the above description
The change or variation of multi-form.There is no need and unable to be exhaustive to all of implementation method.It is all in spirit of the invention
With any modification, equivalent and the improvement made within principle etc., should be included in the protection domain of the claims in the present invention
Within.
Claims (10)
1. a kind of tellite (15) of printed circuit board (PCB) with hot pipe cooling structure, including multilayer, be embedded in it is described
Heat pipe module on tellite (15), the heat pipe module includes heat sink (2), hot plate (3) and interior sets liquid-sucking core (10)
Heat pipe (1), the condensation segment (12) and evaporator section (11) of the heat pipe (1) are connected with heat sink (2), hot plate (3) respectively.
2. the printed circuit board (PCB) with hot pipe cooling structure according to claim 1, it is characterised in that：Described printing electricity
Base board (15) middle part is provided with rectangle hollow slots (7), and the heat pipe module is embedded in the hollow slots (7) completely.
3. the printed circuit board (PCB) with hot pipe cooling structure according to claim 2, it is characterised in that：Heat sink (2),
Only upper surface is exposed during hot plate (3) is closely embedded in hollow slots (7), and the adiabatic section (6) of the heat pipe (1) is exposed in hollow slots
(7) in space.
4. the printed circuit board (PCB) with hot pipe cooling structure according to claim 1, it is characterised in that：The heat pipe module
Heat sink (2) and hot plate (3) be embedded in tellite (15), the adiabatic section (6) of the heat pipe (1) is exposed in the external world
In air and it is distributed in outside printed circuit board (PCB) side.
5. the printed circuit board (PCB) with hot pipe cooling structure according to claim 4, it is characterised in that：The heat pipe (1)
It is more than one, each heat pipe integrally be arranged in parallel in concave shape, the every evaporator section (11) and condensation segment (12) of heat pipe (1)
With round-corner transition bending (90) °.
6. the printed circuit board (PCB) with hot pipe cooling structure according to claim 1, it is characterised in that：Described liquid-sucking core
It is the double-deck copper mesh composite construction (101) of double-deck copper mesh sintering or the foam copper of foam copper and copper mesh sintering
Silk screen composite construction (102).
7. the printed circuit board (PCB) with hot pipe cooling structure according to claim 1, it is characterised in that：Heat sink (2)
On be provided with heat sink through hole (4) for assembling heat pipe (1) condensation segment (12), be provided with for assembling heat on the hot plate (3)
The hot plate through hole (5) of pipe (1) evaporator section (11), is combined after assembling by firm welding.
8. one kind has the manufacturer of the printed circuit board (PCB) of hot pipe cooling structure as any one of claim 1 ~ 3,6 ~ 7
Method, it is characterised in that including step：
Step (1), the manufacture of heat pipe, including：
(1) pretreatment of copper pipe and center bar (13)：Shear and clean copper pipe and center bar (13), removal center bar (13) and copper
The greasy dirt of pipe surface, then by copper pipe and center bar (13) drying and processing；Center bar (13) after drying is heat-treated, is kept away
Exempt from copper pipe and phenomenon is cohered in follow-up sintering technique with center bar (13), improve the service life of center bar (13)；
(2) preparation of liquid-sucking core (10)：Liquid-sucking core (10) is obtained by sintering processes, the liquid-sucking core (10) is then cut into bar
Shape is standby；
(3) liquid-sucking core (10) of strip is first penetrated into copper pipe, then center bar (13) is inserted into copper pipe, liquid-sucking core (10) is close to copper
Inside pipe wall, is then sintered；
(4) center bar (13) is extracted, the afterbody to copper pipe carries out solder up, then copper pipe is made annealing treatment；
(5) sequentially copper pipe carried out working medium perfusion, vacuumize, two except fixed length, the treatment of head solder up；
(6) heat pipe subsequent treatment, including detection, surface treatment；
The manufacture of step 2, heat pipe module, including：
(1) hot plate (3) and heat sink (2) is respectively obtained by machining, hot plate (3) and heat sink (2) are distinguished and each process hot plate through hole
And heat sink through hole (4) (5)；
(2) the hot plate through hole (5) of the evaporator section (11) of heat pipe (1) and hot plate (3) is carried out into shaft hole matching, then will with welding procedure
Heat pipe (1) and hot plate (3) are combined；The heat sink through hole (4) of the condensation segment (12) of heat pipe (1) and heat sink (2) is carried out into shaft hole matching,
Again with welding procedure by heat pipe and heat sink combination；
The manufacture of step 3, printed circuit board (PCB), including：
(1) internal substrate (16) and outermost layer substrate (17) of tellite (15) are obtained by printed circuit technology, is passed through
Machining obtains gong band (18)；
(2) internal substrate (16), outermost layer substrate (17), gong band (18) and heat pipe module are pressed under high-temperature and high-pressure conditions
PROCESS FOR TREATMENT is closed, combines it integral；
(3) gong band (18) is removed by machining, exposes heat pipe module.
9. one kind has the manufacture method of the printed circuit board (PCB) of hot pipe cooling structure as any one of claim 1,4 ~ 7,
It is characterised in that it includes step：
The manufacture of step 1, heat pipe, including：
(1) pretreatment of copper pipe and center bar (13)：Shear and clean copper pipe and center bar (13), removal center bar (13) and copper
The greasy dirt of pipe surface, then by copper pipe and center bar (13) drying and processing；Center bar (13) after drying is heat-treated, is kept away
Exempt from copper pipe and phenomenon is cohered in follow-up sintering technique with center bar (13), improve the service life of center bar (13)；
(2) preparation of liquid-sucking core (10)：Liquid-sucking core (10) is obtained by sintering processes, the liquid-sucking core (10) is then cut into bar
Shape is standby；
(3) liquid-sucking core (10) of strip is first penetrated into copper pipe, then center bar (13) is inserted into copper pipe, liquid-sucking core (10) is close to copper
Inside pipe wall, is then sintered；
(4) center bar (13) is extracted, the afterbody to copper pipe carries out solder up, then copper pipe is made annealing treatment；
(5) sequentially copper pipe carried out working medium perfusion, vacuumize, two except fixed length, the treatment of head solder up；
(6) heat pipe post processing, including the evaporator section and condensation segment of heat pipe are carried out into 90 ° of bending, then detected, be surface-treated；
The manufacture of step 2, heat pipe module, including：
(1) hot plate (3) and heat sink (2) is respectively obtained by machining, hot plate (3) and heat sink (2) are distinguished and each process some hot plates
Through hole (5) and heat sink through hole (4)；
(2) the hot plate through hole (5) of the evaporator section (11) of heat pipe (1) and hot plate (3) is carried out into shaft hole matching, then will with welding procedure
Heat pipe (1) and hot plate (3) are combined；The heat sink through hole (4) of the condensation segment (12) of heat pipe (1) and heat sink (2) is carried out into shaft hole matching,
Heat pipe (1) and heat sink (2) are combined with welding procedure again；
The manufacture of step 3, printed circuit board (PCB), including：
(1) internal substrate (16) and outermost layer substrate (17) of tellite (15) are obtained by printed circuit technology, is passed through
Machining obtains gong band (18)；
(2) internal substrate (16), outermost layer substrate (17), gong band (18) and heat pipe module (19) are entered under high-temperature and high-pressure conditions
The treatment of row process for pressing, combines it integral；
(3) gong band (18) is removed by machining, exposes heat pipe module (19).
10. manufacture method according to claim 8 or claim 9, it is characterised in that：The step of preparation of the liquid-sucking core (10), has
Body is：
Cleaning copper mesh (14), removes the greasy dirt on copper mesh (14) surface；Two-layer copper mesh (14) is pressed with two pieces of graphite blocks,
And be sintered, two-layer copper mesh (14) is sintered the liquid-sucking core (10) of composite double layer copper wire web frame (101) into；Finally
By the liquid-sucking core (10) shearing into strips；
Or,
Cleaning copper mesh (14), removes the greasy dirt on copper mesh (14) surface；With two pieces of graphite blocks by one layer of copper mesh (14) and one
Layer foam copper (103) pressing, and be sintered, one layer of copper mesh (14) and one layer of foam copper (103) is sintered foam into
The liquid-sucking core (10) of copper mesh composite construction (102)；Finally shearing by the liquid-sucking core (10) into strips.
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| CN201710128108.2A CN106879166A (en) | 2017-03-06 | 2017-03-06 | A kind of Printed circuit board and manufacturing methods with hot pipe cooling structure |
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