CN206759802U - A kind of printed circuit board (PCB) with hot pipe cooling structure - Google Patents
A kind of printed circuit board (PCB) with hot pipe cooling structure Download PDFInfo
- Publication number
- CN206759802U CN206759802U CN201720213034.8U CN201720213034U CN206759802U CN 206759802 U CN206759802 U CN 206759802U CN 201720213034 U CN201720213034 U CN 201720213034U CN 206759802 U CN206759802 U CN 206759802U
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- heat pipe
- heat
- pcb
- printed circuit
- circuit board
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Abstract
The utility model discloses a kind of printed circuit board (PCB) with hot pipe cooling structure, tellite including multilayer, the heat pipe module being embedded on the tellite, the heat pipe module includes heat sink, hot plate and the interior heat pipe for setting liquid-sucking core, and the condensation segment and evaporator section of the heat pipe are connected with the heat sink, hot plate respectively.The utility model has that simple in construction, quality is light and handy, radiating effect is obvious, stability is high, the advantages of heat transfer is without external drive, there is superior radiating effect especially for the higher CPU heat dissipation problems of heat flow density, there is positive effect and well value in the development of 5G communications, simultaneously, manufacturing process is simple, can be applied to produce manufacture in enormous quantities.
Description
Technical field
Microelectronic circuit technical field of heat dissipation is the utility model is related to, more particularly to a kind of with hot pipe cooling structure
Printed circuit board (PCB).
Background technology
In order to ensure the functional reliability of component and life-span on PCB, it is necessary to component is effectively radiated, with true
Component operating temperature is protected not over its permissive temperature.PCB radiating at present is mainly realized by two ways once, a kind of
It is such as Application No. CN201521115555.7 Chinese patent《A kind of heat radiation type PCB heat board》And Application No.
CN201611040364.8 Chinese utility model《A kind of printed circuit board (PCB) with excellent heat dispersion performance》Optimize PCB like that
The layout of upper component, heater element and the especially temperature sensitive device region distribution of other devices are put, or heater element
Separate arrangement of staggering, air heat dissipation channel is reserved, to realize the purpose of cooling；Another kind is using the higher material of thermal conductivity factor
As PCB substrate to improve PCB self-radiating abilities.The coefficient of heat transfer of both radiating modes is low, is sent out for component
The not high PCB of the thermal power or little PCB of component thermal current density.However, the with the rapid development of information technology, envelope of chip
It is less and less to fill volume, disposal ability is but increasingly stronger, and the thing followed is that the heat flow density of chip is increasing, even up to
Tens to hundreds of W/cm2, now, the PCB radiating dependence traditional heat-dissipating modes for being packaged with high heat flux component are difficult to solve
Certainly, PCB local temperature rises can be caused too high, directly affects the normal work of component and life-span on plate.
Heat pipe is fast as a kind of phase-change heat transfer element, thermal response speed；Thermal conductivity factor is high, generally thousands of to arrive tens of thousands of W/
(m DEG C), considerably beyond the thermal conductivity factor of existing metal material；Self-driven heat transfer, without additional energy；Therefore, heat pipe heat radiation
Technology is applied in PCB radiatings, can effectively solve the radiating problem of high heat flux component on PCB.
The Chinese patent utility model of Application No. 201610351651.4《One kind manufactures heat pipe in printed circuit board (PCB)
Method》, the patent is that whole PCB is manufactured into the structure of similar heat pipe, but heat pipe manufacture need the sintering by liquid-sucking core,
The techniques such as fluid injection, vacuum, fixed length, sealing, therefore the actual enforcement difficulty of the patent is huge, and PCB geomery is limited to,
Cause the adaptation of product very weak, it is difficult to realize volume production.
Utility model content
The shortcomings that the purpose of this utility model is to overcome prior art and deficiency, propose that a kind of radiating is efficient, reaction is fast
The printed circuit board (PCB) with hot pipe cooling structure of speed.
To reach one of above-mentioned purpose, the utility model is achieved through the following technical solutions：
A kind of printed circuit board (PCB) with hot pipe cooling structure, including the tellite of multilayer, it is embedded in the print
Heat pipe module in brush circuit substrate, the heat pipe module include heat sink, hot plate and the interior heat pipe for setting liquid-sucking core, the heat pipe
Condensation segment and evaporator section are connected with the heat sink, hot plate respectively.
Further, rectangle hollow slots are provided with the middle part of described tellite, the heat pipe module is inlayed completely
In in the hollow slots.
Further, the heat sink, hot plate is closely embedded in hollow slots that only upper surface is exposed, the adiabatic section of the heat pipe
It is exposed in the space of hollow slots.
Further, the heat sink and hot plate of the heat pipe module is embedded in tellite, the heat pipe it is exhausted
Hot arc is exposed in outside air and to be distributed in outside printed circuit board (PCB) side.
Further, the heat pipe is more than one, and each heat pipe integrally be arranged in parallel in concave shape, every heat pipe
Evaporator section and condensation segment are with 90 ° of round-corner transition bending.
Further, described liquid-sucking core is double-deck the copper mesh composite construction or foam copper that double-deck copper mesh sintering forms
The foam copper mesh composite construction formed with copper mesh sintering.
Further, it is described it is heat sink on be provided with heat sink through hole for assembling heat pipe condenser section, set in the hot plate
There is the hot plate through hole for assembling heat pipe evaporator section, combined after assembling by firm welding.
Compared with prior art, the beneficial effects of the utility model are as follows：
(1) a kind of printed circuit board (PCB) with hot pipe cooling structure of the present utility model, due to the thermal conductivity ratio of heat pipe
Metal and graphite material are high, when CPU operating temperatures raises, heat pipe energy quick response simultaneously heat by diffusion profile to heat pipe module
Other positions, CPU temperature reduces rapidly.
(2) a kind of printed circuit board (PCB) with hot pipe cooling structure of the present utility model, there is two kinds of situations, and a kind of situation is
Heat pipe module is completely embedded into printed circuit board (PCB), and the situation is used for that size to be smaller, the less printed circuit board (PCB) of heat flow density.It is another
Kind situation is that the adiabatic section of heat pipe is exposed outside printed circuit board (PCB) in the hot plate and heat sink embedded printed circuit board (PCB) of heat pipe module
Face, the situation are used for the printed circuit board (PCB) that size is larger, heat flow density is larger, and such case can improve the sky of printed circuit board (PCB)
Between utilization rate.
(3) a kind of printed circuit board (PCB) with hot pipe cooling structure of the present utility model, heat radiation module can be according to printing
Different radiating requirements and the heat-dissipating space limitation of circuit board, adjust shape, size, quantity and the installation site of heat pipe, larger
Ground improves the rich and flexibility of circuit design.
(4) manufacture method of a kind of printed circuit board (PCB) with hot pipe cooling structure of the present utility model, there is structure letter
It is single, quality is light and handy, radiating effect is obvious, and stability is high, the advantages of heat transfer without external drive, especially for heat flow density compared with
High CPU heat dissipation problems have superior radiating effect, have positive effect and well value in the development of 5G communications.
(5) manufacture method of a kind of printed circuit board (PCB) with hot pipe cooling structure of the present utility model, manufacturing process letter
It is single, it can be applied to produce manufacture in enormous quantities.
Brief description of the drawings
Fig. 1 is a kind of printed circuit board arrangement schematic diagram with hot pipe cooling structure of the utility model embodiment one.
Fig. 2 is the heat pipe modular structure schematic diagram of the utility model embodiment one.
Fig. 3 is the heat pipe axial direction cross section structure diagram of the utility model embodiment one.
Fig. 4 is the heat pipe radial direction cross section structure diagram of the utility model embodiment one.
Fig. 5 is a kind of printed circuit board arrangement schematic diagram with hot pipe cooling structure of the utility model embodiment two.
Fig. 6 is the heat pipe modular structure schematic diagram of the utility model embodiment two.
Fig. 7 is the heat pipe axial direction cross section structure diagram of the utility model embodiment two.
Fig. 8 is the heat pipe radial direction cross section structure diagram of the utility model embodiment three.
Fig. 9 is the structural representation that center bar technique is inserted in the utility model embodiment four, five.
Figure 10 is the press fit of circuit boards artwork (small-sized circuit board) of the utility model embodiment four.
Figure 11 is the press fit of circuit boards artwork (large scale circuit board) of the utility model embodiment five.
It is shown in figure：
1-heat pipe；11-evaporator section；12-condensation segment；2-heat sink；3-hot plate；4-heat sink through hole；5-hot plate is led to
Hole；6-adiabatic section；7-hollow slots；8-shell；9-heat pipe cavity；10-liquid-sucking core；101-double-deck copper mesh composite junction
Structure；102-foam copper mesh composite construction；103- foam coppers；13-center bar；14-copper mesh；15-tellite；
16-internal substrate；17-outermost layer substrate；18-gong band；19-heat pipe module.
Embodiment
The purpose of this utility model is described in further detail below by specific embodiment, embodiment can not be herein
Repeat one by one, but therefore embodiment of the present utility model is not defined in following examples.
Embodiment 1
As shown in Fig. 1 to Fig. 4, a kind of printed circuit board (PCB) with hot pipe cooling structure, include the printed circuit base of multilayer
Plate 15, the heat pipe module 19 being embedded on the tellite 15, the heat pipe module 19 include heat sink 2, hot plate 3 and one
The heat pipe 1 of liquid-sucking core 10 is set in root, a heat sink through hole 4 for being used to assemble the condensation segment 12 of heat pipe 1 is provided with described heat sink 2,
A hot plate through hole 5 for being used to assemble the evaporator section 11 of heat pipe 1 is provided with the hot plate 3, is combined after assembling by firm welding,
The condensation segment 12 and evaporator section 11 of the heat pipe 1 are connected with described heat sink 2, hot plate 3 respectively.Described tellite 15
Middle part is provided with rectangle hollow slots 7, and the heat pipe module 19 is embedded in the hollow slots 7 completely.Described heat sink 2, hot plate 3 is tight
Close to be embedded in that only upper surface in hollow slots 7 is exposed, the adiabatic section 6 of the heat pipe 1 is exposed in the space of hollow slots 7.The heat
Heat sink 2 and hot plate 3 of pipe die group 19 are embedded in tellite 15, and the adiabatic section 6 of the heat pipe 1 is exposed extraneous empty
In gas and it is distributed in outside printed circuit board (PCB) side.
The heat pipe module 19 of this example is inlayed in the printed circuit boards completely, in the CPU of subsequently assembling medium heat disk 3 and circuit
Contact；Hot plate 3 and heat sink 2 only exposes a face respectively, and other faces are embedded within printed circuit board (PCB), and the adiabatic section 6 of heat pipe is outstanding
Be exposed between hot plate 3 and heat sink 2, it is exposed in atmosphere, formed clearance space；The structure of the present embodiment is relatively easy and size compared with
Small, circuit can pass through the hollow slots 7 of module, can be applied to that circuit is simple, the less printed circuit board (PCB) of heat flow density, while by
Much higher in the thermal conductivity ratio metal and graphite of heat pipe 1, CPU operating temperature can be maintained at relatively low level, therefore CPU work
It is improved as the life-span.When CPU, which works, produces heat, heat is delivered to hot plate 3 by CPU, then is delivered to the evaporation of heat pipe 1
Section 11, then heat be delivered to condensation end 12, last heat transfer to heat sink 2 from the evaporator section 11 of heat pipe 1；
As shown in Figure 3 and Figure 4, in the present embodiment, heat pipe 1 includes shell 8 and the cavity 9 being opened in shell, described
The liquid-sucking core 10 for being close to the inwall of shell 8 is provided with cavity 9, liquid-sucking core 10 is filled with covert working medium；In this example, liquid-sucking core 10
It is composite double layer copper wire web frame 101, the liquid-sucking core 10 has the advantages of porosity is high, and manufacturing process is simple.
In the present embodiment, the size of the heat pipe 1, number can also be selected according to the limitation of heat-dissipating space and radiating requirements
With.It will not be repeated here.
Embodiment 2
As shown in Figures 5 to 7, a kind of printed circuit board (PCB) with hot pipe cooling structure, the printed circuit base of multilayer is included
Plate 15, the heat pipe module 19 being embedded on the tellite 15, the heat pipe module 19 include heat sink 2, hot plate 3 and interior
If the heat pipe 1 of liquid-sucking core 10, the heat pipe 1 is seven, and each heat pipe 1 is overall to be arranged in parallel in concave shape, every heat pipe 1
Evaporator section 11 and condensation segment 12 are with 90 ° of round-corner transition bending；Seven are provided with described heat sink 2 to be used to assemble the condensation segment of heat pipe 1
12 heat sink through hole 4, seven hot plate through holes 5 for being used to assemble the evaporator section 11 of heat pipe 1 are provided with the hot plate 3, are led to after assembling
Firm welding combination is crossed, the condensation segment 12 and evaporator section 11 of the heat pipe 1 are connected with described heat sink 2, hot plate 3 respectively.It is described
Heat sink 2 and hot plate 3 of heat pipe module 19 are embedded in tellite 15, and the adiabatic section 6 of the heat pipe 1 is exposed in the external world
In air and it is distributed in outside printed circuit board (PCB) side.
The part heat pipe module of the present embodiment is inlayed in the printed circuit boards, and the heat pipe module includes 7 heat pipes, 1,1 piece of heat
Heavy 2,1 pieces of hot plates 3.The evaporator section 11 and condensation segment 12 of heat pipe 1 90 ° of bending in the form of round-corner transition, heat pipe are in integrally " recessed "
Word shape；Contacted in subsequently assembling medium heat disk 3 with the CPU of circuit；The condensation segment 12 of heat pipe 1 is matched somebody with somebody with heat sink 2 axis hole of through hole 4
Close, and combined heat pipe 1 with heat sink 2 by welding procedure；The adiabatic section 6 of heat pipe is exposed in outside air, is distributed in printing
Outside circuit board side, heat sink 2 and hot plate 3 inlay in the printed circuit boards, and only expose a face respectively.The knot of the present embodiment
Structure is relative complex and size is larger, suitable for complex circuit, the larger printed circuit board (PCB) of heat flow density, simultaneously because heat pipe is exhausted
Hot arc 6 is distributed in the printed circuit board (PCB) external world, can save larger space, the utilization space of increasing circuit plate.Produced when CPU works
During heat, heat is delivered to hot plate 3 by CPU, is being delivered to the evaporator section 11 of heat pipe 1, then evaporator section 11 of the heat from heat pipe 1
It is delivered to condensation end 12, last heat transfer to heat sink 2；
As shown in fig. 7, in the present embodiment, in the present embodiment, heat pipe 1 includes shell 8 and the sky being opened in shell
Chamber 9, the liquid-sucking core 10 for being close to the inwall of shell 8 is provided with the cavity 9, liquid-sucking core 10 is filled with covert working medium；In this example,
Liquid-sucking core 10 is composite double layer copper wire web frame 101, and the liquid-sucking core 10 has the advantages of porosity is high, and manufacturing process is simple.
In the present embodiment, the limitation and radiating need that the size of heat pipe 1, number and bending shape can be according to heat-dissipating spaces
Selection is asked, as heat pipe shape is not limited to 90 ° of round-corner transition bendings, the quantity of heat pipe 1 is also not limited to seven, herein no longer
Repeat.
Embodiment 3
As shown in figure 8, the present embodiment and the difference of embodiment 1 are, in the present embodiment, liquid-sucking core 10 is foam copper
Silk screen composite construction 102, the liquid-sucking core 10 have the advantages of thermal resistance is small, and permeability is high.The other structures of the present embodiment and work
Principle is same as Example 1, will not be repeated here.
Embodiment 4
A kind of manufacture method of the printed circuit board (PCB) with hot pipe cooling structure as described in Example 1, including step：
The manufacture of step 1, heat pipe, including：
(1) pretreatment of copper pipe and center bar 13：Shear and clean copper pipe and center bar 13, remove center bar 13 and copper
The greasy dirt of pipe surface, then by copper pipe and the drying and processing of center bar 13；Center bar 13 after drying is heat-treated, avoids copper
Pipe coheres phenomenon with center bar 13 in follow-up sintering technique, improves the service life of center bar 13；
(2) preparation of liquid-sucking core 10：Copper mesh 14 is cleaned, removes the greasy dirt on the surface of copper mesh 14；Will with two pieces of graphite blocks
Two layers of copper mesh 14 presses, and is sintered, and two layers of copper mesh 14 is sintered the suction of composite double layer copper wire web frame 12 into
Wick-containing 10；Finally the liquid-sucking core 10 is sheared into strips；
(3) liquid-sucking core 10 of strip is first penetrated into copper pipe, then center bar 13 is inserted into copper pipe (see Fig. 9), make liquid-sucking core 10
It is close to copper pipe inwall, is then sintered；
(4) center bar 13 is extracted, solder up is carried out to the afterbody of copper pipe, then copper pipe made annealing treatment；
(5) working medium perfusion is sequentially carried out to copper pipe, is vacuumized, two except fixed length, the processing of head solder up；
(6) heat pipe subsequent treatment, including detect, be surface-treated；
The manufacture of step 2, heat pipe module, including：
(1) hot plate 3 and heat sink 2, hot plate 3 and each processing hot plate through hole 5 of heat sink 2 difference and heat are respectively obtained by machining
Heavy through hole 4；
(2) the hot plate through hole 5 of the evaporator section 11 of heat pipe 1 and hot plate 3 is subjected to shaft hole matching, then with welding procedure by heat pipe
1 and hot plate 3 combine；The condensation segment 12 of heat pipe 1 and heat sink 2 heat sink through hole 4 are subjected to shaft hole matching, then with welding procedure by heat
Pipe and heat sink combination；
The manufacture of step 3, printed circuit board (PCB), including：
(1) internal substrate 16 and outermost layer substrate 17 of tellite 15 are obtained by printed circuit technology, passes through machine
Processing obtains gong band 18；
(2) internal substrate 16, outermost layer substrate 17, gong band 18 and heat pipe module 19 are pressed under high-temperature and high-pressure conditions
PROCESS FOR TREATMENT is closed, combines it integral, gong band 18 plays protection heat pipe module 19 in the aftertreatment technology after process for pressing
Effect is (see Figure 10)；
(3) gong band 18 is removed by machining, exposes heat pipe module.
Embodiment 5
A kind of manufacture method of the printed circuit board (PCB) with hot pipe cooling structure as described in Example 2, including step：
The manufacture of step 1, heat pipe, including：
(1) pretreatment of copper pipe and center bar 13：Shear and clean copper pipe and center bar 13, remove center bar 13 and copper pipe
The greasy dirt on surface, then by copper pipe and the drying and processing of center bar 13；Center bar 13 after drying is heat-treated, avoids copper pipe
Phenomenon is cohered in follow-up sintering technique with center bar 13, improves the service life of center bar 13；
(2) preparation of liquid-sucking core 10：Copper mesh 14 is cleaned, removes the greasy dirt on the surface of copper mesh 14；Will with two pieces of graphite blocks
Two layers of copper mesh 14 presses, and is sintered, and two layers of copper mesh 14 is sintered the suction of composite double layer copper wire web frame 101 into
Wick-containing 10；Finally the liquid-sucking core 10 is sheared into strips；
(3) liquid-sucking core 10 of strip is first penetrated into copper pipe, then center bar 13 is inserted into copper pipe (see Fig. 9), make liquid-sucking core 10
It is close to copper pipe inwall, is then sintered；
(4) center bar 13 is extracted, solder up is carried out to the afterbody of copper pipe, then copper pipe made annealing treatment；
(5) working medium perfusion is sequentially carried out to copper pipe, is vacuumized, two except fixed length, the processing of head solder up；
(6) heat pipe is post-processed, including the evaporator section of heat pipe and condensation segment are carried out into 90 ° of bending, then is detected, at surface
Reason；
The manufacture of step 2, heat pipe module, including：
(1) hot plate 3 and heat sink 2, hot plate 3 and each some hot plate through holes 5 of processing of heat sink 2 difference are respectively obtained by machining
With heat sink through hole 4；
(2) the hot plate through hole 5 of the evaporator section 11 of heat pipe 1 and hot plate 3 is subjected to shaft hole matching, then with welding procedure by heat pipe
1 and hot plate 3 combine；The condensation segment 12 of heat pipe 1 and heat sink 2 heat sink through hole 4 are subjected to shaft hole matching, then with welding procedure by heat
Pipe 1 and heat sink 2 combines；
The manufacture of step 3, printed circuit board (PCB), including：
(1) internal substrate 16 and outermost layer substrate 17 of tellite 15 are obtained by printed circuit technology, passes through machine
Processing obtains gong band 18；
(2) internal substrate 16, outermost layer substrate 17, gong band 18 and heat pipe module 19 are pressed under high-temperature and high-pressure conditions
PROCESS FOR TREATMENT is closed, combines it integral；Gong band 18 plays protection heat pipe module 19 in the aftertreatment technology after process for pressing
Effect is (see Figure 11).
(3) gong band 18 is removed by machining, exposes heat pipe module.
Embodiment 6
The present embodiment and the difference of embodiment 4 or 5 are：The step of preparation of the liquid-sucking core 10 is specially：Clean copper
Silk screen 14, remove the greasy dirt on the surface of copper mesh 14；One layer of copper mesh 14 and one layer of foam copper 103 are pressed with two pieces of graphite blocks,
And be sintered, one layer of copper mesh 14 and one layer of foam copper 103 is sintered the imbibition of foam copper mesh composite construction 102 into
Core 10；Finally the liquid-sucking core 10 is sheared into strips；
Above-described embodiment of the present utility model is only intended to clearly illustrate the utility model example, and is not
Restriction to embodiment of the present utility model.For those of ordinary skill in the field, on the basis of described above
On can also make other changes in different forms.There is no necessity and possibility to exhaust all the enbodiments.
All made within spirit of the present utility model and principle all any modification, equivalent and improvement etc., should be included in this reality
Within new scope of the claims.
Claims (7)
1. a kind of printed circuit board (PCB) with hot pipe cooling structure, including the tellite (15) of multilayer, be embedded in it is described
Heat pipe module on tellite (15), the heat pipe module include heat sink (2), hot plate (3) and interior set liquid-sucking core (10)
Heat pipe (1), the condensation segment (12) and evaporator section (11) of the heat pipe (1) are connected with heat sink (2), hot plate (3) respectively.
2. the printed circuit board (PCB) according to claim 1 with hot pipe cooling structure, it is characterised in that：Described printing electricity
Rectangle hollow slots (7) are provided with the middle part of base board (15), the heat pipe module is embedded in the hollow slots (7) completely.
3. the printed circuit board (PCB) according to claim 2 with hot pipe cooling structure, it is characterised in that：Heat sink (2),
Hot plate (3) is closely embedded in that only upper surface in hollow slots (7) is exposed, and the adiabatic section (6) of the heat pipe (1) is exposed in hollow slots
(7) in space.
4. the printed circuit board (PCB) according to claim 1 with hot pipe cooling structure, it is characterised in that：The heat pipe module
Heat sink (2) and hot plate (3) be embedded in tellite (15), the adiabatic section (6) of the heat pipe (1) is exposed in the external world
In air and it is distributed in outside printed circuit board (PCB) side.
5. the printed circuit board (PCB) according to claim 4 with hot pipe cooling structure, it is characterised in that：The heat pipe (1)
For more than one, each heat pipe integrally be arranged in parallel in concave shape, the evaporator section (11) and condensation segment (12) of every heat pipe (1)
With round-corner transition bending (90) °.
6. the printed circuit board (PCB) according to claim 1 with hot pipe cooling structure, it is characterised in that：Described liquid-sucking core
The foam copper that the double-deck copper mesh composite construction (101) formed for double-deck copper mesh sintering or foam copper and copper mesh sintering form
Silk screen composite construction (102).
7. the printed circuit board (PCB) according to claim 1 with hot pipe cooling structure, it is characterised in that：Heat sink (2)
On be provided with for assembling the heat sink through hole (4) of heat pipe (1) condensation segment (12), be provided with the hot plate (3) for assembling heat
The hot plate through hole (5) of (1) evaporator section (11) is managed, is combined after assembling by firm welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720213034.8U CN206759802U (en) | 2017-03-06 | 2017-03-06 | A kind of printed circuit board (PCB) with hot pipe cooling structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720213034.8U CN206759802U (en) | 2017-03-06 | 2017-03-06 | A kind of printed circuit board (PCB) with hot pipe cooling structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206759802U true CN206759802U (en) | 2017-12-15 |
Family
ID=60609757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720213034.8U Expired - Fee Related CN206759802U (en) | 2017-03-06 | 2017-03-06 | A kind of printed circuit board (PCB) with hot pipe cooling structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206759802U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106879166A (en) * | 2017-03-06 | 2017-06-20 | 华南理工大学 | A kind of Printed circuit board and manufacturing methods with hot pipe cooling structure |
| CN108617081A (en) * | 2018-06-11 | 2018-10-02 | Oppo广东移动通信有限公司 | A kind of electronic device and a kind of circuit board assemblies |
-
2017
- 2017-03-06 CN CN201720213034.8U patent/CN206759802U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106879166A (en) * | 2017-03-06 | 2017-06-20 | 华南理工大学 | A kind of Printed circuit board and manufacturing methods with hot pipe cooling structure |
| CN108617081A (en) * | 2018-06-11 | 2018-10-02 | Oppo广东移动通信有限公司 | A kind of electronic device and a kind of circuit board assemblies |
| CN108617081B (en) * | 2018-06-11 | 2019-09-20 | Oppo广东移动通信有限公司 | A kind of electronic device and a kind of circuit board assemblies |
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| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171215 Termination date: 20180306 |
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| CF01 | Termination of patent right due to non-payment of annual fee |