CN213244730U - Vapor chamber and electronic apparatus - Google Patents
Vapor chamber and electronic apparatus Download PDFInfo
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- CN213244730U CN213244730U CN202022066586.5U CN202022066586U CN213244730U CN 213244730 U CN213244730 U CN 213244730U CN 202022066586 U CN202022066586 U CN 202022066586U CN 213244730 U CN213244730 U CN 213244730U
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Abstract
The application discloses soaking board and electronic equipment. The soaking plate comprises a first plate body and a second plate body, the first plate body comprises a first main body and a plurality of first forming portions arranged on the first main body at intervals, a first flow channel is formed between the adjacent first forming portions, the second plate body comprises a second main body and a plurality of second forming portions arranged on the second main body at intervals, a second flow channel is formed between the adjacent second forming portions, the first plate body and the second plate body are connected, and therefore the first forming portions are in butt joint with the second forming portions, and the first flow channels are communicated with the second flow channels. This application forms the second runner through forming first runner in first main part and in the second main part, forms the cavity that has capillary force jointly, has greatly compressed the thickness of soaking plate, is favorable to the frivolousization of soaking plate, and the setting of first main part and second main part is favorable to preventing the oxidation of soaking plate simultaneously.
Description
Technical Field
The application relates to the technical field of heat dissipation, in particular to a vapor chamber and an electronic device.
Background
With the coming of the 5G communication era, the processing capacity of the mobile phone chip is larger and larger, and the power consumption and the heat productivity are higher and higher, which puts higher requirements on a mobile phone heat dissipation system. From various heat dissipation schemes, the vapor chamber is gradually becoming the standard of a 5G mobile phone heat dissipation system with its excellent heat dissipation effect.
The capillary core of the traditional soaking plate mainly comprises a porous inner wall or a copper mesh and a complex body thereof, wherein the porous inner wall or the copper mesh is formed by sintering, the structure needs two capillary core layers and a middle cavity layer besides an upper cover plate and a lower cover plate, the thickness of the whole structure is large, the thinning of the soaking plate is not facilitated, and meanwhile, the cover plate made of copper materials can generate an oxidation phenomenon after being used for a long time under the action of hot oxygen, so that the heat dissipation effect of the cover plate is influenced.
How to realize the ultra-thin of the soaking plate and prevent the oxidation of the soaking plate should be the research and development direction in the industry.
SUMMERY OF THE UTILITY MODEL
The application provides a vapor chamber, a manufacturing method thereof and electronic equipment, and solves the problems of excessive thickness and easy oxidation of the vapor chamber by arranging a first main body, a second main body (made of inert metal), a first flow channel and a second flow channel.
In a first aspect, the present application provides a method for manufacturing a vapor chamber, comprising: providing a first plate body, wherein the first plate body comprises a first main body and a first forming layer which are arranged in a stacked mode; etching the first forming layer to obtain a plurality of first forming parts, and forming a first flow channel between the adjacent first forming parts; providing a second plate body comprising a second body and a second formation layer arranged in a stack; etching the second forming layer to obtain a plurality of second forming parts, and forming a second flow channel between the adjacent second forming parts; and jointing the first plate body and the second plate body, so that the first molding part is butted with the second molding part, and the first flow passage and the second flow passage are communicated.
This application is through forming first runner and forming the second runner in the second main part in first main part, first runner communicates with each other and forms the cavity that has capillary force jointly with the second runner, greatly compressed the thickness of soaking plate, avoided traditional soaking plate except two-layer apron, still need two-layer capillary sandwich layer and cavity, be favorable to the frivolousization of soaking plate, the setting of first main part and second main part is favorable to preventing the oxidation of first shaping portion and second shaping portion simultaneously.
Specifically, taking the first plate body as an example, the etching solution for etching the first forming layer cannot etch the first main body, so that the depth of the formed first flow channel is the thickness of the first forming layer, the depth consistency of the first flow channel is ensured, the consistency of capillary force and heat dissipation effect is realized, and the problem of evaporation dryness caused by the fact that working media (the working media can be water and the like) in part of the flow channels cannot flow back in time due to uneven capillary force is prevented. The first body and the second body may be inert metal which is not easily oxidized, for example, the first body and the second body may be one or more of metals such as titanium, nickel and aluminum, or an alloy of copper and titanium, nickel and aluminum, or an alloy of gold, silver and titanium, nickel and aluminum, or a stainless steel alloy, etc., the first forming layer and the second forming layer may be copper which is easily etched, and the first body and the second body which are not easily oxidized avoid oxidation generated by direct contact of the first forming part and the second forming part inside with oxygen in the environment.
In a possible implementation manner, a direction in which the plurality of first forming portions are arranged is a first direction, a direction perpendicular to a plane in which the first plate body is located is a second direction, a width of the first flow channel is a dimension in the first direction, a depth of the first flow channel is a dimension in the second direction, and the depth of the first flow channel is greater than or equal to the width of the first flow channel. The depth of the first flow channel is larger than or equal to the width of the first flow channel, so that the capillary force is improved, the heat absorption rate and the heat release rate of the working medium are improved (namely, the reflux rate of the working medium is improved), and the heat dissipation effect is enhanced.
Specifically, the width of first runner is 5um-200um, the degree of depth of first runner is 10um-400 um. The width of the first flow channel is less than 5um, the process is difficult to realize, the width of the first flow channel is more than 200um, the width is too large, the capillary force is small, and the heat dissipation capability of the vapor chamber is limited; the degree of depth of first runner is less than 10um, and the degree of depth undersize, capillary force is less, and the heat-sinking capability of vapor chamber is limited, and the degree of depth of first runner is greater than 400um, and the thickness of first shaping portion is too big promptly for the holistic thickness of vapor chamber is great, is unfavorable for the frivolousization of vapor chamber.
The width and depth of the second flow channel are set with reference to the first flow channel, and are not described in detail herein.
In one possible embodiment, the first forming layer includes a first region and a second region, the second region surrounds the first region, the etching of the first forming layer further includes etching the first region to form a first cavity region, the second forming layer includes a third region and a fourth region, the fourth region surrounds the third region, the etching of the second forming layer further includes forming a second cavity region in the third region, and the fixing of the first plate and the second plate, the first cavity region is in contact with and in communication with the second cavity region. The arrangement of the first cavity area and the second cavity area is favorable for the exchange of heat energy of different runners and the heat energy to be quickly conducted to the cold end from the hot end of the soaking plate, so that a better heat dissipation effect is realized.
In one possible embodiment, the first cavity region includes a first side end and a second side end opposite to each other, and the number of the first forming portions adjacent to the first side end is smaller than the number of the first forming portions adjacent to the second side end. The small number of the first forming parts (namely, the large number of the first forming layers are etched) adjacent to the first side end is beneficial to fast diffusing the heat-absorbing gasified working medium to the first cavity area, and the large number of the first forming parts adjacent to the second side end is beneficial to increasing the contact area of the gasified working medium and the first forming parts and is beneficial to condensing and radiating the gasified working medium.
In one possible embodiment, the first cavity region includes a first side end and a second side end opposite to each other, and a portion obtained by etching the first forming layer extends to the first cavity region adjacent to the first forming portion of the second side end. The size of the first forming part adjacent to the second side end is increased by extending part of the first forming part adjacent to the second side end to the first cavity area, so that condensation and heat dissipation of the gasified working medium are facilitated.
The second forming portions adjacent to the two opposite side ends of the second cavity region are referred to the first forming portions adjacent to the two opposite side ends of the first cavity region, and are not described herein again.
In one possible embodiment, a first groove is formed in the first forming portion, a width of the first groove is a dimension in an extending direction of the first forming portion, a direction in which the plurality of first forming portions are arranged is a first direction, a width of the first flow channel is a dimension in the first direction, and the width of the first groove is smaller than the width of the first flow channel. In order to avoid untimely evaporation and back-supplement of the working media of the adjacent channels, the first forming part can be provided with the grooves, so that the working media of the adjacent first channels can be mutually back-supplemented through the grooves, and the drying is avoided. The width of the first groove is smaller than that of the first flow channel, so that the capillary force of the first groove is increased, and the exchange of working media in the adjacent first grooves is facilitated.
The second forming part is provided with a second groove, and the arrangement of the second groove is referred to the first groove, which is not described in detail herein.
In a second aspect, the application provides a soaking plate, including first plate body and second plate body, first plate body include first main part and a plurality of interval set up in first shaping portion in the first main part, it is adjacent form first runner between the first shaping portion, the second plate body include second main part and a plurality of interval set up in second shaping portion in the second main part, it is adjacent form the second runner between the second shaping portion, it is fixed first plate body with the second plate body makes first shaping portion with the butt joint of second shaping portion just first runner with the second runner communicates with each other.
This application is through forming first runner and forming the second runner in the second main part in first main part, and first runner communicates with each other and form the cavity that has capillary force jointly with the second runner, has greatly compressed the thickness of soaking plate, is favorable to the frivolousization of soaking plate, and the setting of first main part and second main part is favorable to preventing the oxidation of first shaping portion and second shaping portion simultaneously.
In one possible embodiment, the direction in which the plurality of first molding portions are arranged is a first direction, the width of the first flow channel is a dimension in the first direction, and the width of each of the first flow channels is equal. The width of each first flow channel is equal, so that the consistency of capillary force and heat dissipation effects of different flow channels is realized, and the problem of dryness of working media in partial flow channels caused by different capillary forces is avoided.
In one possible embodiment, a direction in which the plurality of first molding portions are arranged is a first direction, a width of the first molding portion is a dimension in the first direction, and the width of the first molding portion located at an edge of the first body is larger than the width of the first molding portion located inside the first body. The first forming part at the edge of the first main body is exposed in the environment, if the width of the first forming part at the edge of the first main body is too small, the first forming part is easy to be oxidized and can influence the heat dissipation inside the soaking plate, and the first forming part at the edge exposed in the environment is not easy to be completely oxidized by setting the width of the first forming part at the edge of the first main body to be larger than the width of the first forming part positioned at the inner side of the first main body, so that the influence on the heat dissipation inside the soaking plate is avoided.
The width of the second flow channel and the width of the second forming part are set as the first flow channel and the first forming part, and the detailed description is omitted.
In a third aspect, the present application provides an electronic apparatus comprising a heat generating member and the vapor chamber of the second aspect, wherein the heat generating member is attached to the vapor chamber.
Drawings
FIG. 1 is a schematic diagram of an application environment of a vapor chamber provided in one implementation of the present application;
FIG. 2 is a flow chart of a method of fabricating a vapor chamber provided in one implementation of the present application;
fig. 3a to 3e are schematic structural views of the soaking plate after the steps in fig. 2 are performed;
FIG. 4 is a schematic view of a prior art vapor chamber;
fig. 5a is a schematic structural diagram of a first plate provided in an implementation manner of the present application;
fig. 5b is a schematic structural diagram of a second plate provided in an implementation manner of the present application;
FIG. 6a is a top view of an etched first formed layer provided in one implementation of the present application;
fig. 6b is a top view of the etched first formed layer as provided in another implementation of the present application;
fig. 7 is a schematic structural diagram of a first trench provided in an implementation manner of the present application.
Detailed Description
The following description of the embodiments of the present application will be made with reference to the accompanying drawings.
The application provides a soaking plate, a manufacturing method thereof and electronic equipment. The electronic equipment can be mobile phones, tablet computers, notebooks, intelligent home terminals and other electronic equipment. As shown in fig. 1, fig. 1 is a schematic view of an application environment of a vapor chamber. The electronic device 10 includes a heat generating member 20 and a heat spreader 30, the electronic device 10 may be a mobile phone, a computer, or the like, the heat generating member 20 may be a component that generates heat energy such as a battery or a chip, and the heat generating member 20 is attached to the heat spreader 30 (specifically, for example, the mobile phone, the heat spreader 30 is in contact with the chip to dissipate heat from the chip).
First, the present application provides a method for manufacturing a vapor chamber, and as shown in fig. 2, the method for manufacturing a vapor chamber in one embodiment specifically includes the steps of:
t10, providing a first plate body, and forming a first flow passage on the first plate body.
Referring to fig. 3a and 3b, the first plate 31 includes a first main body 311 and a first forming layer 312, which are stacked, the first forming layer 311 is etched to obtain a plurality of first forming portions 313, and a first flow channel 314 is formed between adjacent first forming portions 313.
Specifically, the first forming layer 312 may be plated on the surface of the first body 311 by electroplating, and in other embodiments, the first body 311 and the first forming layer 312 may be fixedly combined by hot pressing to form the first plate 31.
In the etching process, a photoresist is coated on a portion of the first formation layer 312 that is not to be etched as a mask, and then exposure is performed, and the etching solution etches only the first formation layer 312 that is not coated with the photoresist to obtain a plurality of first formation portions 313.
And T20, providing a second plate body, and forming a second flow passage on the second plate body.
Referring to fig. 3c and 3d, the second plate body 32 includes a second body 321 and a second formation layer 322 stacked, the second formation layer 322 is etched to obtain a plurality of second formation portions 323, and a second flow channel 324 is formed between adjacent second formation portions 323.
The combination manner of the second body 321 and the second forming layer 322 and the specific operation of etching to form the second forming portion 323 refer to the first plate 31, and are not described herein.
T30, fixed first plate and second plate.
Referring to fig. 3e, the first plate 31 and the second plate 32 are fixed such that the first molding portion 313 is butted against the second molding portion 323 and the first flow passage 314 and the second flow passage 314 are communicated.
It can be understood that the first plate body 31 and the second plate body 32 can be fixedly connected by brazing or diffusion welding, in the welding process, a liquid injection port is reserved, working medium is injected through the liquid injection port after welding, and then the liquid injection port is sealed to form the soaking plate 30.
The thickness of the soaking plate 30 is greatly compressed by forming the first flow channel 314 on the first body 311 and forming the second flow channel 324 on the second body 321, wherein the first flow channel 314 is communicated with the second flow channel 324 and forms a cavity with capillary force together. Specifically, referring to fig. 4, the conventional vapor chamber 30 requires two capillary core layers 42 and a cavity 43 in addition to two cover plates 41, which greatly increases the overall thickness of the vapor chamber 30. The cavity 43 does not need to be separately arranged, the first flow channel 314 and the second flow channel 324 are directly pressed to form the cavity, so that the light and thin vapor chamber 30 is facilitated, and meanwhile, the first main body 311 and the second main body 321 are arranged to facilitate the prevention of the oxidation of the first forming part 313 and the second forming part 323.
The first flow channels 314 disposed on the first plate 31 and the second flow channels 324 of the second plate 32 together form the capillary groove 33 having capillary force, and specifically, for example, when the first flow channels 314 are formed, in the process of etching the first plate 31, the etching solution etching the first formation layer 312 does not etch the first main body 311, so that the depth of the formed first flow channels 314 is the thickness of the first formation layer 312, and the depth consistency of the different first flow channels 314 is ensured, thereby achieving the consistency of the capillary force and the heat dissipation effect, and preventing the evaporation dryness problem caused by the fact that the working medium in some of the flow channels cannot flow back in time due to the uneven capillary force.
The first body 311 and the second body 321 protect the soaking plate 30 from oxidation in the environment, the first body 311 and the second body 321 may be an inert metal that is not easily oxidized, for example, the first body 311 and the second body 321 may be one or more of metals such as titanium, nickel, aluminum, or the like, or an alloy of copper and titanium, nickel, aluminum, or an alloy of gold, silver and titanium, nickel, aluminum, or a stainless steel alloy, or the like, the first forming layer 312 and the second forming layer 322 may be copper that is easily etched, and the first body 311 and the second body 321 that are not easily oxidized are located outside the first forming part 313 and the second forming part 323, thereby preventing the first forming part 313 and the second forming part 323 from being directly contacted with oxygen in the environment to generate oxidation.
As can be understood, the soaking plate 30 completes the circulation of the working medium through the capillary force of the first flow channel 314 and the second flow channel 324 which are communicated with each other to realize the absorption and release of the heat energy generated by the heat generating component, the magnitude of the capillary force is related to the size of the first flow channel 314 and the second flow channel 324, referring to fig. 3b, taking the first flow channel 314 as an example, the direction in which the plurality of first forming portions 313 are arranged is a first direction X1, the direction perpendicular to the plane of the first plate body 31 is a second direction X2, the width of the first flow channel 314 is a size in the first direction X1, the depth of the first flow channel 314 is a size in the second direction X2, and the depth of the first flow channel 314 is greater than or equal to the width of the first flow channel 314. The depth of the first flow channel 314 is greater than or equal to the width of the first flow channel 314, which is beneficial to improving the capillary force, improving the heat absorption and release rates of the working medium and enhancing the heat dissipation effect. Specifically, the width of the first flow channel 314 is 5um to 200um, and the depth of the first flow channel 314 is 10um to 400 um. The width of the first flow channel 314 is less than 5um, the process is difficult to realize, the width of the first flow channel 314 is more than 200um, the width is too large, the capillary force is small, and the heat dissipation capability of the soaking plate 30 is limited; the depth of the first flow channel 314 is less than 10um, the depth is too small, the capillary force is small, the heat dissipation capability of the soaking plate 30 is limited, the depth of the first flow channel 314 is greater than 400um, that is, the thickness of the first forming portion 313 is too large, so that the overall thickness of the soaking plate 30 is large, and the thinning of the soaking plate 30 is not facilitated. The dimension of the second channel 324 is set with reference to the first channel 314, and will not be described in detail here.
Referring to fig. 3e, the cross-section of the first flow passage 314 (the cross-section formed along the first direction X1) may be rectangular, oval, circular, or triangular, which is not limited in the present application.
The thickness of the first body 311 is a dimension in the second direction X2, and the thickness of the first body 311 is 20um-200 um. The thickness of the first main body 311 is less than 20um, the first main body 311 is too thin, the strength is not enough, the soaking plate 30 is easy to deform in the process of vacuumizing and using, the thickness of the first main body 311 is greater than 200um, the first main body 311 is too thick, and the whole lightening and thinning of the soaking plate 30 are not facilitated. The thickness of the second body 321 is referred to the first body 311, and will not be described herein.
As shown in fig. 5a and 5b, the first forming layer 312 includes a first region 3121 and a second region 3122, the second region 3122 surrounds the first region 3121, during the etching of the first forming layer 312, the etching of the first region 3121 forms a first cavity region 3123 (i.e., copper of the first region 3121 is etched away), the second forming layer 322 includes a third region 3221 and a fourth region 3222, the fourth region 3222 surrounds the third region 3221, during the etching of the second forming layer 322, the etching of the third region 3221 forms a second cavity region 3223 (i.e., copper of the third region 3221 is etched away), and during the fixing of the first plate 31 and the second plate 32, the first cavity region 3123 is abutted and communicated with the second cavity region 3223. It can be understood that the first flow channel 314 is mainly located in the second area 3122, the second flow channel 324 is mainly located in the fourth area 3222, and the arrangement of the first cavity area 3123 and the second cavity area 3223 facilitates the exchange of heat energy of different flow channels and the rapid conduction of heat energy from the hot end to the cold end of the soaking plate 30, so as to achieve better heat dissipation effect.
As shown in fig. 6a and 6b, the first formation layer 312 is etched as an example, and fig. 6a and 6b are plan views after the first formation layer 312 is etched. The first cavity region 3123 includes a first side end 3124 and a second side end 3125 opposite to each other, a heat generating member (not shown) is disposed at the first side end 3124, and heat generated by the heat generating member is conducted from the first side end 3124 to the second side end 3125.
In one possible embodiment, referring to fig. 6a, the number of the first forming portions 313 adjacent to the first side end 3124 may be the same as the number of the first forming portions 313 adjacent to the second side end 3125, that is, the first forming portions 313 adjacent to the first side end 3124 are correspondingly disposed with the first forming portions 313 adjacent to the second side end 3125.
In one possible embodiment, referring to fig. 6b, the number of the first molding portions 313 adjacent to the first side end 3124 is smaller than the number of the first molding portions 313 adjacent to the second side end 3125. The small number of the first forming portions 323 adjacent to the first side end 3124 (i.e., the large number of the first forming layers 312 are etched) is beneficial to fast diffusion of the heat-absorbing gasified working medium to the first cavity region 3123, and the large number of the first forming portions 323 adjacent to the second side end 3125 is beneficial to increase the contact area between the gasified working medium and the first forming portions 323, and is beneficial to condensation and heat dissipation of the gasified working medium.
In other embodiments, during the etching of the first forming layer 312, the obtained portion of the first forming portion 313 adjacent to the second side end 3125 extends to the first cavity region 3123. The extension of a portion of the first forming portion 313 adjacent to the second side end 3125 to the first cavity region 3123 increases the size of the first forming portion 313 adjacent to the second side end 3125, which facilitates the condensation heat dissipation of the vaporized working medium.
The provision of the second cavity region 3223 formed by etching the second formation layer 322 is referred to the first cavity region 3123 and will not be described in detail herein.
As shown in fig. 7, in order to avoid that the working medium in the adjacent flow channels is not dried and reflows in time, grooves are provided on the first molding portion 313 and the second molding portion 323, taking the first molding portion 313 as an example, a first groove 3131 is provided on the first molding portion 313, the width of the first groove 3131 is a dimension in an extending direction of the first molding portion 313, the width of the first flow channel 314 is a dimension in a first direction X1, and the width of the first groove 3131 is smaller than the width of the first flow channel 314. In order to avoid that the working media of the adjacent channels are not dried and fed back timely, the first forming portion 313 may be provided with the first groove 3131, so that the working media of the adjacent first channels 314 can be fed back through the grooves, and drying is avoided. The width of first groove 3131 being smaller than the width of first flow channel 314 increases the capillary force of first groove 3131, facilitating the exchange of working substance in the adjacent first flow channel 314 through first groove 3131. It is understood that the first grooves 3131 may be mainly disposed at one end of the first molding portion 313 adjacent to the heat generating member, and the number of the first grooves 3131 on each first molding portion 313 may be one, two, three, etc., and the present application is not limited thereto and may be disposed as needed.
The second forming portion 323 has a second groove, and the arrangement of the second groove is referred to the first groove 3131, which is not described herein, and the second groove and the first groove 3131 may be correspondingly arranged (i.e., the second groove is communicated with the first groove 3131), or may be arranged in a staggered manner.
As can be understood, referring to fig. 3e and fig. 6a, the heat generating member (not shown) is located at the first side end 3124, the heat generating member generates heat energy during operation, the working medium (the working medium may be water, etc.) in the soaking plate 30 is gasified after being heated in a vacuum environment, absorbs the heat energy and expands rapidly in volume, the gasified working medium quickly fills the whole capillary groove 33 (formed by the first flow channel 314 and the second flow channel 324), when the gasified working medium contacts the second side end 3125 with a lower temperature, a condensation heat release phenomenon occurs, the gasified working medium is condensed into a liquid state, the condensed working medium flows back to the heat generating member through the capillary force of the capillary groove 33, and the heat is dissipated repeatedly through phase change in the inner circumference of the soaking plate 30, thereby achieving a good heat dissipation effect of the soaking plate 30.
Next, the present application provides a soaking plate, as shown in fig. 3e and fig. 6a, wherein fig. 3e is a sectional view taken along a-a direction in fig. 6a, and the soaking plate in one embodiment has the following specific structure:
the soaking plate 30 includes a first plate 31 and a second plate 32, the first plate 31 includes a first body 311 and a plurality of first forming portions 313 spaced apart from each other on the first body 311, a first flow channel 314 is formed between adjacent first forming portions 313, the second plate 32 includes a second body 321 and a plurality of second forming portions 323 spaced apart from each other on the second body 321, a second flow channel 324 is formed between adjacent second forming portions 323, and the first plate 31 and the second plate 32 are fixed such that the first forming portions 313 are in abutment with the second forming portions 323 and the first flow channels 314 are in communication with the second flow channels 324.
The width of each first flow channel 314 is equal, and the width of each first flow channel 314 is equal, so that the consistency of capillary force and heat dissipation effect of different flow channels is realized, and the problem of drying of working media in partial flow channels caused by different capillary forces is avoided. In other embodiments, the width of each first flow channel 314 may also be different, and the application is not limited thereto.
The width of the first molding part 313 is a dimension in the first direction X1, and the width of the first molding part 313 located at the edge of the first body 311 is greater than the width of the first molding part 313 located inside the first body 311. The first forming portion 313 at the edge of the first body 311 is exposed to the environment, if the width of the first forming portion 313 at the edge of the first body 311 is too small, it is easily oxidized and it may affect the heat dissipation inside the soaking plate 30, and by setting the width of the first forming portion 313 at the edge of the first body 311 to be larger than the width of the first forming portion 313 at the inner side of the first body 311, the first forming portion 313 at the edge exposed to the environment is not easily completely oxidized, and it is prevented from affecting the heat dissipation inside the soaking plate 30.
The first flow channel 314 is formed on the first body 311, the second flow channel 324 is formed on the second body 321, the first flow channel 314 is communicated with the second flow channel 324, and a cavity with capillary force is formed together, so that the thickness of the soaking plate 30 is greatly reduced, and meanwhile, the arrangement of the first body 311 and the second body 321 (which are made of inert metal) is beneficial to preventing the oxidation of the first forming part 313 and the second forming part 323.
The above embodiments and embodiments of the present application are only examples and embodiments, and the scope of the present application is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present application, and all the changes or substitutions should be covered within the scope of the present application.
Claims (10)
1. The utility model provides a soaking plate, its characterized in that includes first plate body and second plate body, first plate body include first main part and a plurality of interval set up in first shaping portion in the first main part, it is adjacent form first runner between the first shaping portion, the second plate body include second main part and a plurality of interval set up in second shaping portion in the second main part, it is adjacent form the second runner between the second shaping portion, the joint first plate body with the second plate body makes first shaping portion with the butt joint of second shaping portion just first runner with the second runner communicates with each other.
2. The soaking plate according to claim 1, wherein a direction in which the plurality of first forming portions are arranged is a first direction, a width of the first flow channel is a dimension in the first direction, and the width of each of the first flow channels is equal.
3. The soaking plate according to claim 1, wherein a direction in which the plurality of first forming portions are arranged is a first direction, a width of the first forming portions is a dimension in the first direction, and the width of the first forming portions located at the edge of the first body is larger than the width of the first forming portions located inside the first body.
4. The soaking plate according to claim 1, wherein the direction in which the plurality of first forming portions are arranged is a first direction, the direction perpendicular to the plane of the first plate body is a second direction, the width of the first flow channel is a dimension in the first direction, the depth of the first flow channel is a dimension in the second direction, and the depth of the first flow channel is greater than or equal to the width of the first flow channel.
5. The soaking plate according to claim 1, wherein a first groove having a width in a dimension in an extending direction of the first forming portion is provided on the first forming portion, a direction in which the plurality of first forming portions are arranged is a first direction, a width of the first flow channel is a dimension in the first direction, and the width of the first groove is smaller than the width of the first flow channel.
6. The vapor chamber of claim 1, wherein the first body and the second body are inert metals.
7. The soaking plate according to claim 1, wherein the first and second forming portions are copper.
8. The vapor chamber of claim 1, wherein the thickness of the first body is 20um to 200 um.
9. An electronic apparatus comprising a heat generating member and the heat equalizing plate according to any one of claims 1 to 8, wherein the heat generating member is attached to the heat equalizing plate.
10. The electronic device of claim 9, wherein the electronic device is a mobile phone, the heat generating member is a chip of the mobile phone, and the heat spreader is in contact with the chip for dissipating heat from the chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022066586.5U CN213244730U (en) | 2020-09-18 | 2020-09-18 | Vapor chamber and electronic apparatus |
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| CN202022066586.5U CN213244730U (en) | 2020-09-18 | 2020-09-18 | Vapor chamber and electronic apparatus |
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| CN213244730U true CN213244730U (en) | 2021-05-18 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113453500A (en) * | 2021-06-08 | 2021-09-28 | 江西展耀微电子有限公司 | Vapor chamber and electronic equipment |
| WO2023005807A1 (en) * | 2021-07-27 | 2023-02-02 | 华为技术有限公司 | Liquid cooling plate, liquid cooling system and electronic device |
-
2020
- 2020-09-18 CN CN202022066586.5U patent/CN213244730U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113453500A (en) * | 2021-06-08 | 2021-09-28 | 江西展耀微电子有限公司 | Vapor chamber and electronic equipment |
| CN113453500B (en) * | 2021-06-08 | 2023-04-14 | 江西新菲新材料有限公司 | Vapor chamber and electronic equipment |
| WO2023005807A1 (en) * | 2021-07-27 | 2023-02-02 | 华为技术有限公司 | Liquid cooling plate, liquid cooling system and electronic device |
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Address after: Room 422, 4th floor, building 1, Linrui youth apartment, 955 rulehu street, Airport Economic Zone, Nanchang City, Jiangxi Province 330000 Patentee after: Jiangxi zhanyao Microelectronics Co.,Ltd. Address before: 330013, Nanchang, Jiangxi, north of the Economic Development Zone Huang Jia Hu West Road, the ophelion Technology Park. Patentee before: NANCHAGN OFILM DISPLAY TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20220506 Address after: Room 1020, 2nd floor, Yangke Road, Xinchang District, Xinjiang District, Jiangxi Province Patentee after: Jiangxi Xinfei New Material Co.,Ltd. Address before: Room 422, 4th floor, building 1, Linrui youth apartment, 955 rulehu street, Airport Economic Zone, Nanchang City, Jiangxi Province 330000 Patentee before: Jiangxi zhanyao Microelectronics Co.,Ltd. |