CN215421313U

CN215421313U - Vapor chamber and electronic apparatus

Info

Publication number: CN215421313U
Application number: CN202120865916.9U
Authority: CN
Inventors: 周金东; 揭海欢
Original assignee: Jiangxi Zhanyao Microelectronics Co ltd
Current assignee: Jiangxi Zhanyao Microelectronics Co ltd
Priority date: 2021-04-25
Filing date: 2021-04-25
Publication date: 2022-01-04
Anticipated expiration: 2031-04-25

Abstract

The utility model relates to a vapor chamber and an electronic device. The soaking plate comprises a first cover plate, a substrate and a second cover plate which are arranged in a stacked mode and connected in sequence; the surface of the substrate, which is jointed with the first cover plate, is a first surface, the surface of the first cover plate, which is jointed with the substrate, is a second surface, one of the first surface and the second surface is provided with a first concave cavity and a first capillary channel, and the area, which is jointed with the first concave cavity and the first capillary channel, of the other one of the first surface and the second surface is a plane; the one side that joins with the second apron on the base plate is the third face, and the one side that joins with the base plate on the second apron is the fourth face, and one face in third face and the fourth face is formed with second cavity, second capillary channel, and the region that another face in third face and the fourth face and second cavity, second capillary channel joined is the plane, and first cavity and second cavity intussuseption are filled with working medium. The utility model can solve the problem of dislocation or blockage of the capillary channel of the soaking plate caused by welding deviation.

Description

Vapor chamber and electronic apparatus

Technical Field

The utility model relates to the technical field of vapor chambers, in particular to a vapor chamber and electronic equipment.

Background

The soaking plate has the advantages of higher appearance adaptability, capability of transferring high heat flux density and the like, is favorable for radiating a concentrated heat source, and has unprecedented development in the radiating field along with the coming of the 5G era.

In the correlation technique, the vapor chamber is in the manufacture process, and there is welding error in the upper cover plate of vapor chamber and apron down when being connected, easily leads to upper cover plate and apron down to take place the dislocation, is difficult to make and holds chamber and capillary channel district's size and keep invariable, and the condition that capillary channel district dislocation or capillary channel district blockked up appears easily, influences the backward flow of working medium.

SUMMERY OF THE UTILITY MODEL

The application discloses soaking plate, this soaking plate's cavity and capillary channel size are invariable, and difficult capillary channel dislocation or the problem of capillary channel jam appear.

In a first aspect, the present application discloses a vapor chamber comprising: the first cover plate, the base plate and the second cover plate are arranged in a stacked mode and connected in sequence;

one surface of the base plate, which is jointed with the first cover plate, is a first surface, one surface of the first cover plate, which is jointed with the base plate, is a second surface, one surface of the first surface and the second surface is provided with a first concave cavity and a first capillary channel, the joint area of the other surface of the first surface and the second surface, the first concave cavity and the first capillary channel is a plane, and the first concave cavity is filled with a working medium;

one surface of the substrate, which is connected with the second cover plate, is a third surface, one surface of the second cover plate, which is connected with the substrate, is a fourth surface, one surface of the third surface and the fourth surface is provided with a second cavity and a second capillary channel, the other surface of the third surface and the fourth surface is connected with the second cavity and the second capillary channel, the area is a plane, and the second cavity is filled with the working medium.

Specifically, one of the first face and the second face is formed with a first cavity and a first capillary channel, the first cavity is filled with a working medium, heat dissipation can be performed through the cooperation of the first cavity, the first capillary channel and the working medium, one of the third face and the fourth face is formed with a second cavity and a second capillary channel, the second cavity is filled with the working medium, and heat dissipation can be performed through the cooperation of the second cavity, the second capillary channel and the working medium.

When the first cover plate, the substrate and the second cover plate are arranged in a stacked mode and connected together, the area where the other face of the first face and the second face is connected with the first cavity and the first capillary channel is a plane, and the area where the other face of the third face and the fourth face is connected with the second cavity and the second capillary channel is a plane, so that when errors exist in connection of the first cover plate and the substrate or connection of the second cover plate and the substrate, such as connection of the first cover plate and the substrate, or slight dislocation of connection of the second cover plate and the substrate, the sizes of the cavities and the capillary channels can be kept constant, heat dissipation work is stably carried out, and meanwhile, the situation that the capillary channels are dislocated or the capillary channels are blocked is not prone to occurring.

Further, the first cavity and the first capillary channel are formed on the first surface, and the area where the second surface is connected with the first cavity and the first capillary channel is a plane; the second cavity and the second capillary channel are formed on the third surface, and the area where the fourth surface is connected with the second cavity and the second capillary channel is a plane.

The first concave cavity, the first capillary channel, the second concave cavity and the second capillary channel are all located on the substrate, so that the first concave cavity, the first capillary channel, the second concave cavity and the second capillary channel are formed on the substrate only by processing, the concave cavity and the capillary channel are prevented from being formed on the first cover plate and the second cover plate by processing, the processing steps are optimized, and the production efficiency is improved. Meanwhile, the specific surface area of the capillary channel can be improved by the joint of the first capillary channel and the second surface of the first cover plate and the joint of the second capillary channel and the fourth surface of the second cover plate, so that the conveying performance of the capillary channel is improved, and the heat dissipation efficiency of the soaking plate can be improved. In addition, compare in double-deck soaking board, need etch cavity and capillary channel on first apron, and etch cavity and capillary channel on the second apron, consequently first apron and second apron thickness are all thicker, thereby it is whole thicker to lead to double-deck soaking board, the three-deck soaking board structure of this application only etches cavity and capillary channel on the base plate, the thickness of base plate satisfies the etching requirement can, and first apron and second apron thickness as long as the centre gripping base plate can, also be very thin that first apron and second apron thickness can be designed, thereby be convenient for reduce the whole thickness of soaking board.

Further, along a direction perpendicular to the first surface, the second cavity is arranged opposite to the first capillary channel, and the first cavity is arranged opposite to the second capillary channel.

Because the second concave cavity is arranged opposite to the first capillary channel and the first concave cavity is arranged opposite to the second capillary channel, the first concave cavity can be close to the first capillary channel and the second capillary channel at the same time, and the second concave cavity can be close to the first capillary channel and the second capillary channel at the same time, so that the concave cavities and the capillary channels are matched with each other, working media are conveyed into the concave cavities by the capillary channels, and the heat dissipation performance of the soaking plate is improved.

Further, the first cavity and the second cavity are oppositely arranged and penetrate in the direction perpendicular to the first surface.

Wherein, first cavity and second cavity link up and set up relatively and link up, also the first cavity runs through the base plate and has merged the second cavity, because the both sides of first cavity respectively with first apron, second apron joint this moment, also the degree of depth of first cavity equals with the base plate thickness promptly, be convenient for carry out etching process to the base plate, also can make first cavity reach the biggest in soaking plate thickness direction simultaneously, be convenient for fill more working medium to increase heat dissipation space. In addition, the first concave cavity reaches the maximum in the thickness direction of the soaking plate, and the matching area of the first concave cavity, the first capillary channel and the second capillary channel is increased, so that the efficiency of the capillary channels for conveying working media is improved, and the heat dissipation efficiency of the soaking plate is improved conveniently.

Further, the first capillary channel is disposed opposite the second capillary channel in a direction perpendicular to the first face.

The first capillary channel and the second capillary channel are arranged oppositely, so that the first capillary channel and the second capillary channel are both arranged close to the first concave cavity, and the capillary channels are convenient to transport working media. In addition, the first capillary channel and the second capillary channel are arranged oppositely, so that the structure in the soaking plate is convenient to tighten, and the volume of the soaking plate is convenient to miniaturize.

Further, the first cover plate and the second cover plate are both of flat plate structures.

When the first cover plate and the second cover plate are both of flat plate structures, the surfaces of the first cover plate and the second cover plate are both flat surfaces, and when the connection between the first cover plate and the base plate and the connection between the second cover plate and the base plate have large errors, the sizes of the concave cavities and the capillary channels can be kept constant, and meanwhile, the first cover plate and the second cover plate can be conveniently processed.

Further, the substrate includes a plurality of capillary channel regions, any of the capillary channel regions has a plurality of the first capillary channels, and the plurality of the first cavities and the plurality of the capillary channel regions are distributed in a staggered manner.

The substrate is provided with a plurality of capillary channel regions, and the capillary channel regions and the first concave cavities are distributed in a staggered mode, so that the heat dissipation efficiency of the soaking plate is improved. On one hand, the plurality of capillary channel regions and the plurality of first concave cavities are distributed in a staggered mode, so that the capillary channel regions can be close to the first concave cavities on two sides of the capillary channel regions at the same time, the capillary channel regions can convey working media to the first concave cavities on two sides of the capillary channel regions at the same time, and conveying efficiency is improved; on the other hand, the plurality of capillary channel regions and the plurality of first concave cavities are distributed in a staggered mode, the first concave cavities can be simultaneously close to the capillary channel regions on the two sides of the first concave cavities, and the capillary channel regions on the two sides of the first concave cavities can convey working media to the first concave cavities at the same time.

Further, the width of any capillary channel region is D, the width of any first cavity is E, and D is more than or equal to 0.5: e is less than or equal to 3. Wherein, when the ratio of the width of the capillary channel region to the width of the first concave cavity is 0.5 to 3, the soaking plate can have better heat dissipation performance.

Wherein, when the ratio of the width of the capillary channel region to the width of the first concave cavity is 1 to 2, the soaking plate can have better heat dissipation performance.

Furthermore, E is more than or equal to 500 mu m and less than or equal to 5000 mu m. When the width of the first concave cavity is 500-5000 microns, the first concave cavity can be filled with more working media, and the first concave cavity cannot be larger, so that the soaking plate can have good heat dissipation performance, and the size of the soaking plate cannot be too large.

Furthermore, the thickness of the first cover plate is A, and A is more than or equal to 10 mu m and less than or equal to 100 mu m; and/or the thickness of the second cover plate is B, and B is more than or equal to 10 mu m and less than or equal to 100 mu m; and/or the thickness of the substrate is C, wherein C is more than or equal to 100 mu m and less than or equal to 1000 mu m.

When the thickness of the substrate is within the interval of 100-1000 μm, the thickness of the substrate can be as small as possible, and the first cavity can meet the heat dissipation requirement of the soaking plate after being filled with working media. When the thickness of the first cover plate is 10-100 mu m and/or the thickness of the second cover plate is 10-100 mu m, the thickness of the whole soaking plate is small, and the first cover plate and the second cover plate have good strength and do not deform.

In a second aspect, the present application also discloses an electronic device, comprising: the soaking plate according to the first aspect.

The soaking plate has good heat dissipation performance and small thickness, and is arranged in the electronic equipment, so that the electronic equipment is convenient to dissipate heat and the electronic equipment is convenient to miniaturize.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic view showing the structure of a soaking plate in the embodiment of the present application;

FIG. 2 is a schematic structural diagram of a substrate according to an embodiment of the present disclosure;

FIG. 3 is a cross-sectional view taken at G-G of FIG. 1;

FIG. 4 is an exploded view of the structure of FIG. 3;

FIG. 5 is a schematic view of the structure of a variation of the vapor chamber in the embodiment of the present application;

fig. 6 is a schematic structural view of another modification of the soaking plate in the embodiment of the present application;

fig. 7 is a schematic structural view of still another modification of the soaking plate in the embodiment of the present application;

FIG. 8 is a schematic structural view of a soaking plate modified based on FIG. 3;

FIG. 9 is a schematic structural view of another soaking plate modified based on FIG. 3;

fig. 10 is an exploded view of the structure according to fig. 9.

Reference numerals: 1-a first cover plate, 1 a-a second surface, 2-a base plate, 2 a-a first surface, 2 b-a third surface, 21-a first concave cavity, 22-a capillary channel region, 221-a first capillary channel, 222-a second capillary channel, 23-a second concave cavity, 3-a second cover plate, 3 a-a fourth surface and 4-working medium.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "center", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate an orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are used primarily to better describe the utility model and its embodiments and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.

Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meanings of these terms in the present invention can be understood by those skilled in the art as appropriate.

Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.

Furthermore, the terms "first," "second," and the like, are used primarily to distinguish one device, element, or component from another (the specific nature and configuration may be the same or different), and are not used to indicate or imply the relative importance or number of the indicated devices, elements, or components. "plurality" means two or more unless otherwise specified.

Before explaining the technical scheme of the present application, an application scenario related to the embodiment of the present application is explained.

Generally, the vapor chamber is installed in an electronic device such as a notebook computer or a mobile phone, so as to dissipate heat from a heat source (e.g., an electronic component) in the electronic device. When heat is conducted to the soaking plate from the heat source, working media (namely cooling liquid) in the cavity in the soaking plate are heated and evaporated to form gas-phase working media, the whole cavity is rapidly filled with the gas-phase working media, and the gas-phase working media are condensed when contacting a relatively cold region (namely the part of the soaking plate far away from the heat source). The heat accumulated in the evaporation process is released by the condensation phenomenon, the condensed working medium can return to the evaporation heat source by virtue of the capillary channel of the microstructure, and the process is repeated in the cavity, so that the heat source in the electronic equipment is radiated.

The technical solution of the present application will be further described with reference to the following embodiments and accompanying drawings.

Referring to fig. 1 to 6, in particular, the present embodiment discloses a vapor chamber, which includes: the first cover plate 1, the base plate 2 and the second cover plate 3 are arranged in a stacked mode and connected in sequence; the surface, which is connected with the first cover plate 1, of the base plate 2 is a first surface 2a, the surface, which is connected with the base plate 2, of the first cover plate 1 is a second surface 1a, one of the first surface 2a and the second surface 1a is provided with a first cavity 21 and a first capillary channel 221, the area, which is connected with the first cavity 21 and the first capillary channel 221, of the other one of the first surface 2a and the second surface 1a is a plane, and the first cavity 21 is filled with a working medium 4; the surface of the substrate 2, which is connected with the second cover plate 3, is a third surface 2b, the surface of the second cover plate 3, which is connected with the substrate 2, is a fourth surface 3a, one of the third surface 2b and the fourth surface 3a is provided with a second cavity 23 and a second capillary channel 222, the region, which is connected with the second cavity 23 and the second capillary channel 222, of the other of the third surface 2b and the fourth surface 3a is a plane, and the second cavity 23 is filled with the working medium 4.

Specifically, a first concave cavity 21 and a first capillary channel 221 are formed on one of the first face 2a and the second face 1a, working medium 4 is filled in the first concave cavity 21, heat dissipation can be performed through the cooperation of the first concave cavity 21, the first capillary channel 221 and the working medium 4, a second concave cavity 23 and a second capillary channel 222 are formed on one of the third face 2b and the fourth face 3a, working medium 4 is filled in the second concave cavity 23, and heat dissipation can be performed through the cooperation of the second concave cavity 23, the second capillary channel 222 and the working medium 4. When the first cover plate 1, the base plate 2 and the second cover plate 3 are stacked and connected together, since the region where the other of the first surface 2a and the second surface 1a is joined to the first cavity 21 and the first capillary channel 221 is a flat surface, and the region where the other of the third surface 2b and the fourth surface 3a is joined to the second cavity 23 and the second capillary channel 222 is a flat surface, when there is an error in the connection between the first cover plate 1 and the base plate 2 or the connection between the second cover plate 3 and the base plate 2, such as the connection between the first cover plate 1 and the base plate 2, or when the connection between the second cover plate 3 and the base plate 2 is slightly misaligned, the sizes of the cavities and the capillary channels can be kept constant, heat dissipation work can be stably performed, and the situation of capillary channel misalignment or capillary channel blockage is not easily caused.

In addition, the first cavity 21 and the first capillary channel 221 are located between the first cover plate 1 and the substrate 2, and can preferentially dissipate heat from a heat source in contact with the first cover plate 1, and the second cavity 23 and the second capillary channel 222 are located between the second cover plate 3 and the substrate 2, and can preferentially dissipate heat from a heat source in contact with the second cover plate 3, so that the soaking plate has a good heat dissipation effect on heat sources located above and below the soaking plate.

The first cover plate 1, the substrate 2, or the second cover plate 3 may be formed with a cavity and a capillary channel by etching, mechanical engraving, or the like, and the formation method of the cavity and the capillary channel is not particularly limited in the present application. The first cover plate 1, the base plate 2, and the second cover plate 3 may be connected by welding, bonding, or the like, as long as the first cover plate 11, the base plate 22, and the second cover plate 3 are firmly connected together.

It should be noted that each cavity and each capillary channel is a plurality, and since each cavity and each capillary channel is a microstructure, a certain number of cavities and capillary channels are shown in the drawings for the sake of understanding the vapor chamber structure.

In some embodiments, with continued reference to fig. 3 and 4, the first face 2a is formed with a first cavity 21 and a first capillary channel 221, a region where the second face 1a is joined to the first cavity 21 and the first capillary channel 221 is a plane, the third face 2b is formed with a second cavity 23 and a second capillary channel 222, and a region where the fourth face 3a is joined to the second cavity 23 and the second capillary channel 222 is a plane.

It can be seen that the first cavity 21, the first capillary channel 221, the second cavity 23, and the second capillary channel 222 are all located on the substrate 2, so only the substrate 2 is processed, the processing steps are optimized, the production efficiency is improved, meanwhile, only the cavity and the capillary channel are etched on the substrate 2, the thickness of the substrate 2 meets the etching requirement, and the thicknesses of the first cover plate 1 and the second cover plate 3 only need to clamp the substrate 2, that is, the thicknesses of the first cover plate 1 and the second cover plate 3 can be designed to be very thin, so that the overall thickness of the soaking plate is convenient to reduce. In addition, compared with the vapor chamber structure of the double-layer plate, the capillary channels in the vapor chamber of the double-layer plate are oppositely arranged, the capillary channels are formed on the two plates of the double-layer plate, the respective capillary channels on the two plates are installed in an aligned mode, and the specific surface area of the capillary channels of the vapor chamber structure of the double-layer plate is only composed of the capillary channels on the two plates; in the present embodiment, the first capillary channel 221 is connected to the first cover plate 1, and the second capillary channel 222 is connected to the second cover plate 3, and the specific surface area of the capillary channel is composed of the surface area of the first capillary channel 221, the surface area of the region of the first cover plate 1 opposite to the first capillary channel 221, the surface area of the second capillary channel 222, and the surface area of the region of the second cover plate 3 opposite to the second capillary channel 222.

It should be noted that the specific surface area of the capillary channel refers to the inner surface area enclosed by the capillary channel and the capillary channel, or the inner surface area enclosed by the capillary channel and the cover plate, and the specific surface area may reflect the magnitude of the capillary force of the capillary channel, that is, the transport performance of the capillary channel to the working medium. When the specific surface area is larger, the working medium entering the capillary channel is more, so the conveying performance of the capillary channel is stronger.

In other embodiments, with reference to fig. 5, the second surface 1a is formed with a first cavity 21 and a first capillary channel 221, the region where the first surface 2a is connected to the first cavity 21 and the first capillary channel 221 is a plane, the fourth surface 3a is formed with a second cavity 23 and a second capillary channel 222, and the region where the third surface 2b is connected to the second cavity 23 and the second capillary channel 222 is a plane. In this embodiment, the substrate 2 of the soaking plate functions to seal the concave cavity and the capillary channel, and thus can be designed to be thinner.

In still other embodiments, with reference to fig. 6, the second surface 1a is formed with a first cavity 21 and a first capillary channel 221, a region where the first surface 2a is joined to the first cavity 21 and the first capillary channel 221 is a plane, the third surface 2b is formed with a second cavity 23 and a second capillary channel 222, and a region where the fourth surface 3a is joined to the second cavity 23 and the second capillary channel 222 is a plane. In this embodiment the second cover plate 3 of the soaking plate acts as a sealing for the cavity and the capillary channels and can therefore be designed thinner.

In still other embodiments, with reference to fig. 7, the first face 2a is formed with a first cavity 21 and a first capillary channel 221, the region where the second face 1a is connected to the first cavity 21 and the first capillary channel 221 is a plane, the fourth face 3a is formed with a second cavity 23 and a second capillary channel 222, and the region where the third face 2b is connected to the second cavity 23 and the second capillary channel 222 is a plane. In this embodiment, the first cover plate 1 of the soaking plate serves to seal the cavity and the capillary channel and can therefore be designed to be thinner.

Further, referring to fig. 8, in a direction perpendicular to the first surface 2a (i.e., up and down direction in fig. 8), the second cavity 23 is disposed opposite to the first capillary channel 221, and the first cavity 21 is disposed opposite to the second capillary channel 222.

Because the second cavity 23 is arranged opposite to the first capillary channel 221, and the first cavity 21 is arranged opposite to the second capillary channel 222, the first cavity 21 can be close to the first capillary channel 221 and the second capillary channel 222 at the same time, and the second cavity 23 can be close to the first capillary channel 221 and the second capillary channel 222 at the same time, so that the cavities and the capillary channels can be matched with each other conveniently, the capillary channels can transport the working medium 4 to the cavities, and the heat dissipation performance of the heat spreader can be improved.

Referring to fig. 9, the first cavity 21 and the second cavity 23 are disposed opposite to each other and penetrate in a direction perpendicular to the first surface 2a (i.e., in the up-down direction in fig. 9), that is, the first cavity 21 penetrates through the substrate 2 and merges with the second cavity 23. Specifically, because first cavity 21 runs through base plate 2, and the both sides of first cavity 21 respectively with first apron 1, second apron 3 combines, the degree of depth that also is first cavity 21 equals with base plate 2's thickness, compare in first cavity 21 when not running through base plate 2, need the certain thickness of reservation between first cavity 21 and base plate 2's lower plate 2b, this thickness need not be reserved in this embodiment, consequently be convenient for carry out etching to base plate 2, and do benefit to and improve the utilization ratio that sets up first cavity 21 on base plate 2, thereby reduce base plate 2's thickness, do benefit to the whole frivolousization of soaking plate. Meanwhile, the first concave cavity 21 penetrates through the substrate 2, so that more working medium 4 can be conveniently filled in the first concave cavity 21, and more working medium 4 can be transported by the first capillary channel 221 and the second capillary channel 222, thereby increasing the heat dissipation performance of the vapor chamber.

With reference to fig. 9, the first capillary channel 221 and the second capillary channel 222 are disposed opposite to each other along a direction perpendicular to the first surface 2a (i.e., a vertical direction in fig. 9). On one hand, the first capillary channel 221 and the second capillary channel 222 are both arranged close to the first cavity 21, so that each capillary channel can transport the working medium 4; on the other hand, the structure in the soaking plate is convenient to be compact, and the volume of the soaking plate is miniaturized.

In the present embodiment, the first cover plate 1 is a flat plate structure, and the second cover plate 3 is a flat plate structure. Wherein, because first apron 1 and second apron 3 are the flat structure, consequently first apron 1 and the surface of second apron 3 are the plane, when first apron 1 is connected with base plate 2, second apron 3 has great error with being connected of base plate 2, also can guarantee that each cavity and each capillary channel's size keeps invariable, also is convenient for process first apron 1 and second apron 3 simultaneously.

Referring to fig. 10, the substrate 2 includes a plurality of capillary channel regions 22, each of the capillary channel regions 22 has a plurality of first capillary channels 221 formed therein, and the plurality of first cavities 21 are distributed in a staggered manner with respect to the plurality of capillary channel regions 22.

The substrate 2 is provided with a plurality of capillary channel regions 22, the capillary channel regions 22 and the first concave cavities 21 are distributed in a staggered manner, and the capillary channels and the first concave cavities 21 exchange working media 4 with each other, so that the heat dissipation efficiency of the vapor chamber can be improved. Specifically, the plurality of capillary channel regions 22 and the plurality of first cavities 21 are distributed in a staggered manner, so that the capillary channel regions 22 can be simultaneously close to the first cavities 21 on the two sides of the capillary channel regions, and the capillary channel regions 22 can simultaneously convey the working medium 4 to the first cavities 21 on the two sides of the capillary channel regions, so that the conveying efficiency is improved; meanwhile, the plurality of capillary channel regions 22 and the plurality of first concave cavities 21 are distributed in a staggered manner, so that the first concave cavities 21 can be simultaneously close to the capillary channel regions 22 on the two sides of the first concave cavities 21, and the capillary channel regions 22 on the two sides of the first concave cavities 21 can conveniently convey the working medium 4 to the first concave cavities 21 at the same time.

Further, the width of any capillary channel region 22 is D, the width of any first cavity 21 is E, and D is greater than or equal to 0.5: e is less than or equal to 3. When the ratio of the width of the capillary channel region 22 to the width of the first concave cavity 21 is 0.5 to 3, the capillary channel region 22 can have better transportation efficiency for the working medium 4 in the first concave cavity 21, so that the vapor chamber has better heat dissipation performance. Specifically, D: e can be 0.5, 1, 1.5, 2, 2.5, 3, etc.

In addition, when the ratio of the width of the capillary channel region 22 to the width of the first cavity 21 is 1 to 2, the heat spreader can have better heat dissipation performance. Specifically, D.E can be 1, 1.25, 1.5, 1.75, 2, etc.

Furthermore, E is more than or equal to 500 mu m and less than or equal to 5000 mu m. When the width of the first concave cavity 21 ranges from 500 micrometers to 5000 micrometers, the first concave cavity 21 can be ensured to be filled with more working mediums 4, and the first concave cavity 21 cannot be larger, so that the soaking plate not only has better heat dissipation performance, but also cannot be too large in size. Specifically, E may be 500. mu.m, 750. mu.m, 1000. mu.m, 1250. mu.m, 1500. mu.m, 2000. mu.m, 2500. mu.m, 3000. mu.m, 3500. mu.m, 4000. mu.m, 4500. mu.m, 5000. mu.m, or the like.

Further, the thickness of the first cover plate 1 is a, and when a is not less than 10 μm and not more than 100 μm, the first cover plate 1 can be as thin as possible on the basis of ensuring the strength of the first cover plate, and meanwhile, an external heat source can transfer heat into the first cavity 21 through the first cover plate 1. Specifically, a may be 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, etc., and the specific thickness of the first cover plate 1 is not limited herein.

Similarly, the thickness of the second cover plate 3 is B, and when B is not less than 10 μm and not more than 100 μm, the second cover plate 3 can be as thin as possible while ensuring its strength, and an external heat source can rapidly transfer heat into the second cavity 23 through the second cover plate 3. Specifically, B may be 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, or the like, and the specific thickness of the second cover plate 3 is not limited herein.

In addition, when the thickness of the first cover plate 1 is A, A is more than or equal to 10 microns and less than or equal to 100 microns, the thickness of the second cover plate 3 is B, and B is more than or equal to 10 microns and less than or equal to 100 microns, the first cover plate 1 and the second cover plate 3 are both light and thin, so that the overall light and thin soaking plate is convenient. For example, the thickness of the first cover plate 1 is 10 μm and the thickness of the second cover plate 3 is 10 μm, the thickness of the first cover plate 1 is 20 μm and the thickness of the second cover plate 3 is 100 μm, the thickness of the first cover plate 1 is 100 μm and the thickness of the second cover plate 3 is 10 μm, and the like, which are not listed herein.

Further, the thickness of the substrate 2 is C, 100 μm C1000 μm. When the thickness of the substrate 2 is within the interval of 100-1000 μm, the thickness of the substrate 2 can be as small as possible, and the first cavity 21 can meet the heat dissipation requirement of the soaking plate after being filled with the working medium 4. Specifically, C may be 100 μm, 200 μm, 300 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, 900 μm, 1000 μm, or the like, and the specific thickness of the substrate 2 is not limited herein.

There is also provided in an embodiment of the present application an electronic device, including: a soaking plate as described in any of the above. Because the soaking plate has better heat dissipation performance and smaller thickness, the soaking plate is arranged in the electronic equipment, so that the electronic equipment is convenient to dissipate heat and the electronic equipment is convenient to miniaturize. Specifically, the electronic device may be an electronic device such as a notebook computer, a tablet computer, a mobile phone, a family education machine, or a handheld computer, or may be an electronic device such as a desktop computer, as long as the electronic device needs to be equipped with a vapor chamber, and the electronic device is not limited herein.

The vapor chamber and the electronic device disclosed in the embodiments of the present invention are described in detail, and the principle and the embodiments of the present invention are explained in detail by applying specific examples, and the description of the embodiments is only used to help understanding the present invention and the core idea thereof; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.

Claims

1. A vapor chamber, comprising: the first cover plate, the base plate and the second cover plate are arranged in a stacked mode and connected in sequence;

2. The vapor chamber according to claim 1, wherein said first cavity and said first capillary channel are formed on said first face, and a region where said second face is joined to said first cavity and said first capillary channel is a flat surface;

the second cavity and the second capillary channel are formed on the third surface, and the area where the fourth surface is connected with the second cavity and the second capillary channel is a plane.

3. The vapor chamber of claim 2, wherein the second cavity is disposed opposite the first capillary channel and the first cavity is disposed opposite the second capillary channel in a direction perpendicular to the first face.

4. The soaking plate according to claim 2, wherein the first cavity and the second cavity are opposed to each other in a direction perpendicular to the first surface and penetrate therethrough.

5. The vapor chamber of claim 4, wherein the first capillary channel is disposed opposite the second capillary channel in a direction perpendicular to the first face.

6. The soaking plate according to any one of claims 2 to 5, wherein the first cover plate and the second cover plate are each of a flat plate structure.

7. The vapor chamber according to any one of claims 2 to 5, comprising a plurality of capillary channel regions on said substrate, wherein a plurality of said first capillary channels are formed in any one of said capillary channel regions, and wherein a plurality of said first cavities are staggered with respect to a plurality of said capillary channel regions.

8. The heat spreader of claim 7, wherein the width of any one of said capillary channel regions is D, the width of any one of said first cavities is E, 0.5 ≦ D: e is less than or equal to 3.

9. The soaking plate according to any one of claims 2 to 5, wherein the thickness of the first cover plate is A, 10 μm. ltoreq.A. ltoreq.100 μm; and/or the thickness of the second cover plate is B, and B is more than or equal to 10 mu m and less than or equal to 100 mu m; and/or the thickness of the substrate is C, wherein C is more than or equal to 100 mu m and less than or equal to 1000 mu m.

10. An electronic device, comprising: the soaking plate according to any one of claim 1 to claim 9.