JP4535004B2 - Double-sided cooling type semiconductor device - Google Patents

Description

The present invention relates to a double-sided cooling type semiconductors device for cooling the semiconductor module from both sides.

  In order to improve the cooling performance, a double-sided cooling type semiconductor device that cools a semiconductor module from both sides is disclosed (for example, see Patent Document 1). In this double-sided cooling type semiconductor device, a pair of insulating plates and a pair of thermally conductive spacers are disposed on both sides of the semiconductor module, and the pair of insulating plates and the pair of thermally conductive spacers are disposed between cooling tubes. It consists of the structure to do.

In such a double-sided cooling type semiconductor device, a semiconductor module and an insulating plate are sandwiched between a pair of cooling tubes. This improves the adhesion between the cooling tube and the member that contacts the cooling tube (in the above, the thermally conductive spacer), and ensures sufficient cooling performance.
JP 2001-352023 A

  Here, the contact area of the member that contacts the cooling tube is much larger than the area of both surfaces of the semiconductor module. Certainly, by increasing the contact area of the member that contacts the cooling tube, the cooling performance can be improved by improving the thermal conductivity.

  However, the cooling performance of the double-sided cooling type semiconductor device is influenced by the adhesion between the cooling tube and the member that contacts the cooling tube, in addition to sufficiently securing the contact area of the member that contacts the cooling tube.

  The present invention has been made in view of such circumstances, and improves the cooling performance by improving the adhesion between the cooling tube and the member that contacts the cooling tube. The purpose is to provide.

The double-sided cooling type semiconductor device of the present invention includes an electronic component having a semiconductor element, and a pair of cooling tubes that are arranged so as to sandwich the electronic component and allow a cooling medium to flow inside. The electronic component is arranged so as to sandwich the semiconductor element, the semiconductor element, and the pair of heat sinks having the second convex portions on the outer surfaces of both sides, and the outside of the pair of heat sinks. And a pair of insulating members arranged in contact with the respective second convex portions and having the first convex portions on the outer surfaces of the both sides. The pair of cooling tubes are disposed so as to abut against the first convex portion, form a concave portion corresponding to the first convex portion, and sandwich the outside of the pair of insulating members. The first convex portion is formed in the same shape as the second convex portion when one surface of the semiconductor element is viewed from the front.

  The double-sided cooling type semiconductor device of the present invention is different from the conventional device in that a portion that mainly contacts the cooling tube is formed in a convex shape. Thus, when the electronic component has the first convex portion, the contact area between the electronic component and the cooling tube is reduced.

By the way, in the double-sided cooling type semiconductor device, the electronic component side is clamped by the cooling tube in order to securely contact the electronic component and the cooling tube. In this case, as described above, since the electronic component has the first convex portion, the first convex portion and the cooling tube are pressed against each other. And when the force which an electronic component and a cooling tube mutually press is equivalent to the past, by having a 1st convex-shaped part like this invention, the stress which an electronic component and a cooling tube press mutually is the conventional Larger than That is, the adhesion between the electronic component and the cooling tube is improved. As a result, the cooling performance is improved.

The electronic component described above includes a semiconductor module having a semiconductor element, and a pair of insulating members that are arranged so as to sandwich the semiconductor module and have a first convex portion. That is, the cooling performance can be improved while ensuring sufficient insulation by the insulating member .

  Here, when the electronic component includes a semiconductor module and an insulating member, the heat generated by the semiconductor element is transmitted to the cooling tube via the insulating member. Therefore, the contact area between the semiconductor module and the insulating member and the contact area between the insulating member and the cooling tube greatly affect the cooling performance. More specifically, the area of the overlapping range of the contact surface between the semiconductor module and the insulating member and the contact surface between the insulating member and the cooling tube greatly affects the cooling performance.

Then, for example, the semiconductor module has a second convex portions on both sides, the insulation member is in the case of having a first convex portion is overlapped with the convex surface and the convex surface of the first convex portion of the second convex portion The area of the range affects the cooling performance.

Therefore, the first convex portion is formed in the same shape as the second convex portion when one surface of the semiconductor element is viewed from the front . In particular, in this case, the convex surfaces of the first convex portion and the second convex portion are formed in a rectangular shape, and the respective contour side lengths of the convex surfaces of the first convex portion are the respective convex surfaces of the second convex portion. It may be equivalent to the contour side length. Thereby, the heat transmitted from the semiconductor module to the insulating member is sufficiently transmitted to the cooling tube. That is, even if the contact area with the cooling tube is reduced because the insulating member has the first convex portion, the cooling performance can be reliably improved by satisfying the above condition .

According to the double-sided cooling type semiconductor device of the present invention, the cooling performance can be further improved by improving the adhesion between the electronic component and the cooling tube.

  Next, the present invention will be described in more detail with reference to embodiments. A double-sided cooling type semiconductor device 1 according to the present embodiment will be described with reference to FIGS. FIG. 1 shows a front view of a double-sided cooling type semiconductor device 1. FIG. 2 is a right side view of the double-sided cooling type semiconductor device 1. Hereinafter, unless otherwise specified, the vertical direction means the vertical direction in FIGS. 1 and 2, and the horizontal direction means the horizontal direction (lateral direction) in FIGS. 1 and 2. And the refrigerant | coolant distribution direction means the left-right direction of FIG. 1 (front-back direction of FIG. 2), and the tube width direction means the front-back direction of FIG. 1 (left-right direction of FIG. 2).

  As shown in FIGS. 1 and 2, the double-sided cooling type semiconductor device 1 includes a semiconductor module 10, a pair of insulating members 20 and 30, a pair of cooling tubes 40 and 50, and heat radiation greases 61 to 64. The

  The semiconductor module 10 includes a flat rectangular resin case 11, a semiconductor element 12, a plurality of terminals 13... 13, and a pair of heat sinks 14 and 15. The semiconductor element 12 has a flat rectangular shape, and is, for example, an IGBT element that constitutes a power conversion circuit. The semiconductor element 12 is disposed inside the resin case 11. The plurality of terminals 13... 13 are electrically connected to the semiconductor element 12. The plurality of terminals 13... 13 extend horizontally from the left and right side surfaces of the resin case 12 in FIG. These terminals 13,... 13 are connected to other electrical components.

  The pair of heat radiation plates 14 and 15 (the first heat radiation plate 14 and the second heat radiation plate 15) are each made of metal and have a flat rectangular shape smaller than the resin case 11. Specifically, the width of the heat radiating plates 14 and 15 in the refrigerant flow direction (contour side length in the present invention) is Ha1, and the width of the heat radiating plates 14 and 15 in the tube width direction (contour side in the present invention). Long) is Ha2.

  The pair of heat sinks 14 and 15 are arranged so as to sandwich the upper and lower surfaces of the semiconductor element 12. That is, the first heat sink 14 is disposed in contact with the upper surface of the semiconductor element 12. Furthermore, the upper surface side of the first heat radiating plate 14 projects upward from the upper surface of the resin case 11. The second heat dissipation plate 15 is disposed in contact with the lower surface of the semiconductor element 12. Furthermore, the lower surface side of the second heat radiating plate 15 protrudes below the lower surface of the resin case 11. That is, when it sees as the semiconductor module 10 whole, it has the shape which has a convex part (2nd convex part in this invention) on the upper side and the lower side. The upper convex portion is formed by the first heat radiating plate 14, and the lower convex portion is formed by the second heat radiating plate 15. The contour side lengths of the rectangular convex surfaces of these convex portions are Ha1 and Ha2.

  The pair of insulating members 20 and 30 (the first insulating member 20 and the second insulating member 30) are made of a plate and have a material having electrical insulation and good thermal conductivity, for example, a resin such as ceramics or epoxy. The material is diamond-like carbon (DLC). The pair of insulating members 20 and 30 are disposed so as to sandwich the semiconductor element 12 and the pair of heat sinks 14 and 15 from above and below. Each of the pair of insulating members 20 and 30 includes a substrate portion 21 and an insulating convex portion 22.

  The board | substrate part 21 consists of a rectangular flat plate shape. The substrate portion 21 has a size substantially equal to the upper surface of the resin case 11. The lower surface side of the substrate portion 21 of the first insulating member 20 is in contact with the upper surface side of the first heat radiating plate 14. However, a small amount of heat radiation grease 61 is interposed between the lower surface of the substrate portion 21 and the upper surface of the first heat radiation plate 14. Further, the upper surface side of the substrate portion 21 of the second insulating member 30 is in contact with the lower surface side of the second heat radiating plate 15. However, a small amount of heat radiation grease 62 is interposed between the upper surface of the substrate portion 21 and the lower surface of the second heat radiation plate 15.

  The insulating convex portion 22 has a rectangular flat plate shape smaller than the substrate portion 21. That is, the width of the insulating convex portion 22 in the refrigerant flow direction and the width in the tube width direction are smaller than the width of the substrate portion 21 in the refrigerant flow direction and the width in the tube width direction. Specifically, the width of the insulating convex portion 22 in the refrigerant flow direction (contour side length in the present invention) is Hb1, and the width of the insulating convex portion 22 in the tube width direction (contour side length in the present invention) is Hb2. . The width Hb1 of the insulating protrusion 22 in the refrigerant flow direction is substantially equal to the width Ha1 of the pair of heat sinks 14 and 15 in the refrigerant flow direction. More specifically, the width Hb1 of the insulating protrusion 22 in the refrigerant flow direction is included in a range of ± 5% with respect to the width Ha1 of the pair of heat sinks 14 and 15 in the refrigerant flow direction. Further, the width Hb2 of the insulating protrusion 22 in the tube width direction is substantially equal to the width Ha2 of the pair of heat sinks 14 and 15 in the tube width direction. More specifically, the width Hb2 of the insulating protrusion 22 in the tube width direction is included within a range of ± 5% with respect to the width Ha2 of the pair of heat sinks 14 and 15 in the tube width direction.

  In the first insulating member 20, the insulating convex portion 22 is disposed on the upper surface side of the substrate portion 21. That is, when it sees as the 1st insulating member 20 whole, it has the shape which has a convex-shaped part (1st convex-shaped part in this invention) on the upper side. And this upper convex part is formed of the insulating convex part 22, and the respective contour side lengths of the rectangular convex surface of the convex part are Hb1 and Hb2. Furthermore, the refrigerant | coolant distribution direction position and tube width direction position of the insulation convex part 22 of this 1st insulating member 20 are arrange | positioned so that it may correspond substantially with the refrigerant | coolant distribution direction position and tube width direction position of the 1st heat sink 14. ing. That is, the insulating convex portion 22 is located immediately above the first heat radiating plate 14. This means that the insulating protrusion 22 of the first insulating member 20 is located immediately above the semiconductor element 12.

  In the second insulating member 30, the insulating convex portion 22 is disposed on the lower surface side of the substrate portion 21. That is, when it sees as the 2nd insulating member 30 whole, it has the shape which has a convex-shaped part (1st convex-shaped part in this invention) on the lower side. And this lower convex part is formed of the insulating part convex part 22, and each contour side length of the rectangular convex surface of the said convex part is Hb1 and Hb2. Further, the refrigerant flow direction position and the tube width direction position of the insulating projection 22 of the second insulating member 30 are arranged so as to substantially coincide with the refrigerant flow direction position and the tube width direction position of the second heat radiating plate 15. ing. That is, the insulating convex portion 22 is located directly below the second heat radiating plate 15. This means that the insulating protrusion 22 of the second insulating member 30 is located directly below the semiconductor element 12.

  The pair of cooling tubes 40 and 50 (the first cooling tube 40 and the second cooling tube 50) are flat and long bodies made of aluminum. The pair of cooling tubes 40, 50 are arranged so as to sandwich the semiconductor element 12, the pair of heat sinks 14, 15, and the pair of insulating members 20, 30 from above and below.

  In the cooling tubes 40 and 50, a plurality of flow paths 41 and 51 for circulating the cooling medium in the longitudinal direction (left and right direction in FIG. 1) are formed in parallel in the tube width direction. That is, the cooling tubes 40 and 50 are formed from a very thin plate member. Furthermore, concave portions 42 and 52 corresponding to the insulating convex portions 22 of the insulating members 20 and 30 are formed in the cooling tubes 40 and 50.

  Specifically, a first concave portion 42 corresponding to the insulating convex portion 22 of the first insulating member 20 is formed on the lower surface side of the first cooling tube 40. Then, the insulating convex portion 22 of the first insulating member 20 is fitted in the first concave portion 42. Further, the convex surface of the insulating convex portion 22 of the first insulating member 20 is in contact with the concave surface of the first concave portion 42. However, a slight amount of heat radiation grease 63 is interposed between the concave surface of the first concave portion 42 and the convex surface of the insulating convex portion 22 of the first insulating member 20.

  A second concave portion 52 corresponding to the insulating convex portion 22 of the second insulating member 30 is formed on the lower surface side of the second cooling tube 50. Then, the insulating convex portion 22 of the second insulating member 30 is fitted in the second concave portion 52. Further, the convex surface of the insulating convex portion 22 of the second insulating member 30 is in contact with the concave surface of the second concave portion 52. However, slight heat radiation grease 64 is interposed between the concave surface of the second concave portion 52 and the convex surface of the insulating convex portion 22 of the second insulating member 30.

  Here, a method of manufacturing the double-sided cooling type semiconductor device 1 having the above-described configuration will be described with reference to FIGS. The manufacturing method described here is a manufacturing method related to joining of the semiconductor module 10 and the pair of insulating members 20 and 30 integrally joined in advance and the pair of cooling tubes 40 and 50. Here, FIG. 3 is a diagram for explaining the first manufacturing method. FIG. 3A shows a state before the joining, and FIG. 3B shows a state after the joining. FIG. 4 is a diagram for explaining the second manufacturing method. FIG. 4A shows a state before the joining, and FIG. 4B shows a state after the joining. 3 and 4, the first insulating member 20 and the first cooling tube 40 are not shown.

  As shown in FIG. 3A, the lower surface of the first cooling tube 40 and the upper surface of the second cooling tube 50 are both flat surfaces. That is, at this stage, the cooling tubes 40 and 50 are not formed with the first concave portion 42 and the second concave portion 52 described above.

  And the 2nd insulating member 30 is pressed on the upper surface of the 2nd cooling tube 50 (pressurization process in this invention). Moreover, although not shown in figure, the 1st insulating member 20 is pressed on the lower surface of the 1st cooling tube 40 (pressurization process in this invention). Here, the cooling tubes 40 and 50 are formed of a very thin plate-like member, and the flow path 51 is formed inside, so that the rigidity is lower than that of the insulating members 20 and 30. Therefore, by pressing the second insulating member 30 against the upper surface of the second cooling tube 50, a second concave portion 52 is formed on the upper surface of the second cooling tube 50 as shown in FIG. Is done. Although not shown, the first insulating member 20 is pressed against the lower surface of the first cooling tube 40, whereby the first concave portion 42 is formed on the lower surface of the first cooling tube 40.

  Then, by pressing the first insulating member 20 against the lower surface of the first cooling tube 40, the adhesion between the first insulating member 20 and the first cooling tube 40 becomes very high. Further, by pressing the second insulating member 30 against the lower surface of the second cooling tube 50, the adhesion between the second insulating member 30 and the second cooling tube 50 becomes very high. This is because the stress with which the insulating members 20 and 30 press the cooling tubes 40 and 50 is larger than when the insulating members 20 and 30 do not have a convex portion. Therefore, the thermal conductivity from the first insulating member 20 to the first cooling tube 40 and from the second insulating member 30 to the second cooling tube 50 is very good.

  The heat generated by the semiconductor element 12 is transmitted to the pair of cooling tubes 40 and 50 through the pair of heat sinks 14 and 15 and the pair of insulating members 20 and 30. That is, in heat transfer from the semiconductor element 12 to the first cooling tube 40, the contact area between the first heat radiating plate 14 and the first insulating member 20, and the first insulating member 20 and the first cooling member. The larger the overlapping range with the contact area with the tube 40, the better the thermal conductivity. On the other hand, in heat transfer from the semiconductor element 12 to the second cooling tube 50, the contact area between the second heat radiating plate 15 and the second insulating member 30, the second insulating member 30, and the second cooling member. The larger the overlapping range with the contact area with the tube 50, the better the thermal conductivity.

  And the refrigerant | coolant distribution direction position and tube width direction position of the insulation convex part 22 of a pair of insulating member 20 and 30 are substantially corresponded to the refrigerant | coolant distribution direction position and tube width direction position of a pair of heat sinks 14 and 15. Therefore, the overlapping range of the contact area between the heat sinks 14 and 15 and the insulating members 20 and 30 and the contact area between the heat insulating plates 20 and 30 and the cooling tubes 40 and 50 is the rectangular shape of the heat sinks 14 and 15. It is almost equal to the area of the convex surface. Thereby, since sufficient heat transfer area is ensured, sufficient cooling performance can be secured from this point.

  Next, the second manufacturing method will be described with reference to FIGS. As shown to Fig.4 (a), the 1st basic | foundation recessed part 53 is previously formed in the upper surface of the 2nd cooling tube 50 (basic recessed part formation process in this invention). The depth of the first basic concave portion 53 is shallower than the second concave portion 52 described above. Moreover, although not shown in figure, the 2nd basic | foundation recessed part is previously formed in the lower surface of the 1st cooling tube 40 (basic recessed part formation process in this invention). The depth of the second basic concave portion is made shallower than the first concave portion 42 described above. Further, the first and second basic concave portions 53 have shapes corresponding to the insulating convex portions 22 of the first and second insulating members 20 and 30. That is, the width in the refrigerant flow direction and the width in the tube width direction are substantially equal to Hb1 and Hb2.

  And it positions so that the insulation convex part 22 of the 2nd insulation member 30 may be fitted to the 2nd basic | foundation concave part 53. FIG. Moreover, it positions so that the insulation convex part 22 of the 1st insulating member 20 may be fitted to a 1st basic | foundation concave part.

  Then, the 2nd insulating member 30 is pressed on the upper surface of the 2nd cooling tube 50 (pressurization process in this invention). Moreover, although not shown in figure, the 1st insulating member 20 is pressed on the lower surface of the 1st cooling tube 40 (pressurization process in this invention). In this way, by pressing the second insulating member 30 against the upper surface of the second cooling tube 50, the second basic concave portion is formed on the upper surface of the second cooling tube 50 as shown in FIG. A second concave portion 52 having a depth deeper than 53 is formed. Although not shown, the first insulating member 20 is pressed against the lower surface of the first cooling tube 40, whereby the first lower depth of the first cooling tube 40 is deeper than the first basic concave portion. A concave portion 42 is formed.

Thus, by forming the 1st, 2nd basic | foundation recessed part 53 in the cooling tubes 40 and 50 previously, when pressing the insulation members 20 and 30 to the cooling tubes 40 and 50, both are positioned. Can do. Therefore, it is possible to prevent the occurrence of displacement due to pressing. In addition, since the rigidity of the cooling tubes 40 and 50 varies depending on the position, the adhesion due to pressing the insulating members 20 and 30 against the cooling tubes 40 and 50 may vary depending on the position. However, by positioning as described above, both can be brought into contact with each other at a position where the adhesiveness is reliably increased. Therefore, the cooling performance is improved.

  In the above embodiment, the semiconductor module 10 has a shape having a convex portion in the vertical direction when viewed as a whole. This is because the pair of heat sinks 14 and 15 are formed in a rectangular shape smaller than the resin case. Therefore, when the resin members 71 and 72 are arranged around the heat radiating plates 14 and 15 and viewed as the semiconductor module 10 as a whole, a flat rectangular shape having no convex portion may be used.

  In addition, in the said embodiment, the structure which does not have a pair of insulating members 20 and 30 may be sufficient.

The front view of the double-sided cooling type semiconductor device 1 is shown. The right view of the double-sided cooling type semiconductor device 1 is shown. 2 is a diagram illustrating a first manufacturing method of the double-sided cooling type semiconductor device 1. FIG. It is a figure explaining the 2nd manufacturing method of the double-sided cooling type semiconductor device. It is a figure which shows the double-sided cooling type semiconductor device of other embodiment.

Explanation of symbols

1: Double-sided cooling type semiconductor device,
10: Semiconductor module, 11: Resin case, 12: Semiconductor element,
13: terminal, 14, 15: heat sink,
20, 30: insulating member, 21: substrate part, 22: insulating convex part,
40, 50: cooling tube, 41, 51: flow path, 42, 52: concave portion,
53: Fundamental concave part 61-64: Heat radiation grease 71, 72: Resin member

Claims (2)

An electronic component having a semiconductor element;
A pair of cooling tubes disposed so as to sandwich the electronic component and circulating a cooling medium therein;
A double-sided cooling type semiconductor device comprising:
The electronic component is
The semiconductor element;
A pair of heat sinks disposed so as to sandwich the semiconductor element and having second convex portions on the outer surfaces of both sides;
A pair of insulating members disposed so as to sandwich the outer sides of the pair of heat sinks and in contact with the second convex portions, and having first convex portions on the outer surfaces of both sides;
With
The pair of cooling tubes are disposed so as to contact the first convex portion and form a concave portion corresponding to the first convex portion, and sandwich the outside of the pair of insulating members,
The double-sided cooling type semiconductor device, wherein the first convex part is formed in the same shape as the second convex part when one surface of the semiconductor element is viewed in front. The convex surfaces of the first convex portion and the second convex portion are rectangular,
2. The double-sided cooling type semiconductor device according to claim 1 , wherein each contour side length of the convex surface of the first convex portion is equal to each contour side length of the convex surface of the second convex portion.

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